KR900011359A - 적층체로된 박리필름 - Google Patents

적층체로된 박리필름

Info

Publication number
KR900011359A
KR900011359A KR1019890019784A KR890019784A KR900011359A KR 900011359 A KR900011359 A KR 900011359A KR 1019890019784 A KR1019890019784 A KR 1019890019784A KR 890019784 A KR890019784 A KR 890019784A KR 900011359 A KR900011359 A KR 900011359A
Authority
KR
South Korea
Prior art keywords
release film
laminate release
laminate
interlayer
layer
Prior art date
Application number
KR1019890019784A
Other languages
English (en)
Other versions
KR930000144B1 (ko
Inventor
히로미 시게모또
미끼오 가다기리
Original Assignee
미쓰이세끼유 가가꾸고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이세끼유 가가꾸고오교오 가부시끼가이샤 filed Critical 미쓰이세끼유 가가꾸고오교오 가부시끼가이샤
Publication of KR900011359A publication Critical patent/KR900011359A/ko
Application granted granted Critical
Publication of KR930000144B1 publication Critical patent/KR930000144B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31913—Monoolefin polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31928—Ester, halide or nitrile of addition polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1019890019784A 1988-12-28 1989-12-28 적층체로된 박리필름 KR930000144B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP88-329008 1988-12-28
JP32900888A JP2619034B2 (ja) 1988-12-28 1988-12-28 積層体からなる離型フィルム

Publications (2)

Publication Number Publication Date
KR900011359A true KR900011359A (ko) 1990-07-11
KR930000144B1 KR930000144B1 (ko) 1993-01-09

Family

ID=18216574

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890019784A KR930000144B1 (ko) 1988-12-28 1989-12-28 적층체로된 박리필름

Country Status (7)

Country Link
US (1) US5080979A (ko)
EP (1) EP0376681B1 (ko)
JP (1) JP2619034B2 (ko)
KR (1) KR930000144B1 (ko)
AT (1) ATE134173T1 (ko)
CA (1) CA2006708C (ko)
DE (1) DE68925688T2 (ko)

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* Cited by examiner, † Cited by third party
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US5492767A (en) * 1992-07-07 1996-02-20 Mitsubishi Chemical Corporation Laminated resin film
US5877940A (en) * 1993-12-02 1999-03-02 Teledyne Industries Inc. Fabrication multilayer combined rigid/flex printed circuit board
JP2978086B2 (ja) * 1995-06-30 1999-11-15 住友ベークライト株式会社 積層体
DE19609590A1 (de) * 1996-03-12 1997-09-18 Kontron Elektronik Verfahren und Vorrichtung zur Beschichtung von Substraten, vorzugsweise Leiterplatten
US5817386A (en) * 1996-03-28 1998-10-06 Norton Performance Plastics Corporation Silicone-free release films
US5858550A (en) * 1997-02-06 1999-01-12 Alliedsignal Inc. High temperature release films
US6062271A (en) * 1998-05-22 2000-05-16 Markel Corporation Polymethylpentene cable liner
AU6416399A (en) * 1998-10-01 2000-04-17 Airtech International, Inc. Method of molding or curing a resin material at high temperatures using a multilayer release film
US6270909B1 (en) 1999-04-07 2001-08-07 Honeywell International Inc. High temperature release films
JP2002079630A (ja) * 2000-06-28 2002-03-19 Sumitomo Bakelite Co Ltd 離型多層フィルム及びカバーレイ成形方法
CN1392835A (zh) * 2000-09-20 2003-01-22 三井化学株式会社 4－甲基－1－戊烯共聚物多层膜及其制备方法
JP4130300B2 (ja) * 2000-11-29 2008-08-06 三井化学株式会社 合成皮革製造用離型紙
US7776446B2 (en) 2001-06-04 2010-08-17 Saint-Gobain Performance Plastics Corporation Multi-layer release films
WO2004087401A1 (ja) * 2003-03-28 2004-10-14 Mitsui Chemicals, Inc. 延伸フィルムおよびその製造方法
TWI476103B (zh) * 2003-07-01 2015-03-11 Sumitomo Bakelite Co A release film and a method of manufacturing a flexible printed wiring board using the release film
WO2005030466A1 (ja) * 2003-09-30 2005-04-07 Sekisui Chemical Co., Ltd. 多層シート
US20050100695A1 (en) * 2003-11-12 2005-05-12 Holbert Victor P. Low surface energy blends useful in the manufacture of ovenable containers
JP2005178323A (ja) * 2003-12-24 2005-07-07 Sumitomo Bakelite Co Ltd 離型フィルムとその製造方法及びそれを用いたフレキの製造方法
JP4436803B2 (ja) 2003-12-26 2010-03-24 積水化学工業株式会社 離型フィルム
JP2006130796A (ja) * 2004-11-05 2006-05-25 Daicel Chem Ind Ltd ポリメチルペンテン系樹脂層を含む積層体及びその製造方法
JP2006212954A (ja) * 2005-02-04 2006-08-17 Mitsui Chemicals Inc 離型フィルム
JP4786657B2 (ja) * 2005-05-13 2011-10-05 三井化学株式会社 ４−メチル−１−ペンテン系重合体を含む積層体およびこれからなる離型フィルム
US7776428B2 (en) 2006-02-13 2010-08-17 Saint-Gobain Performance Plastics Corporation Multi-layer release films
US20070206364A1 (en) * 2006-03-02 2007-09-06 Saint-Gobain Performance Plastics Corporation Methods of forming a flexible circuit board
JP4890539B2 (ja) * 2006-04-19 2012-03-07 ソマール株式会社 熱プレス用離型シート及びそれを用いたフレキシブルプリント配線板の製造方法
WO2008001682A1 (fr) * 2006-06-27 2008-01-03 Mitsui Chemicals, Inc. Film et film de démoulage
KR20090035591A (ko) * 2006-07-24 2009-04-09 가부시키가이샤 구라레 프린트 배선판 제조용 이형 필름
JP5368054B2 (ja) * 2008-10-15 2013-12-18 日本メクトロン株式会社 フレキシブル回路基板の製造方法及びフレキシブル回路基板
CN105934104B (zh) 2010-12-27 2019-04-23 株式会社可乐丽 电路基板及其制造方法
JP5765018B2 (ja) * 2011-03-31 2015-08-19 住友ベークライト株式会社 離型フィルム
CN102294864A (zh) * 2011-07-01 2011-12-28 刘烈新 复合耐高温离型膜
CN102523690B (zh) * 2011-12-26 2014-08-06 深圳市星河电路有限公司 一种盲槽内含有ic脚的pcb板制作方法
CN102573339A (zh) * 2012-01-18 2012-07-11 四会富士电子科技有限公司 一种埋盲孔结构的pcb板的压合工艺
JP6271320B2 (ja) * 2014-03-28 2018-01-31 アキレス株式会社 離型フィルム
CN104853546B (zh) * 2015-05-18 2017-09-05 惠州市金百泽电路科技有限公司 一种挠性板在外层的刚挠结合板覆盖膜压合方法
JP6677155B2 (ja) * 2016-01-21 2020-04-08 王子ホールディングス株式会社 剥離性フィルム
WO2017125810A1 (ja) * 2016-01-21 2017-07-27 王子ホールディングス株式会社 剥離性フィルム
JP6620694B2 (ja) * 2016-07-22 2019-12-18 王子ホールディングス株式会社 剥離性フィルム
CN106042553B (zh) * 2016-06-13 2018-06-26 昆山致信天城电子材料有限公司 一种耐高温离型膜及制造工艺
CN110087881A (zh) 2016-12-16 2019-08-02 东丽薄膜先端加工股份有限公司 脱模膜及保护膜
JP2018167458A (ja) * 2017-03-29 2018-11-01 日本メクトロン株式会社 離型フィルムおよびフレキシブルプリント基板の製造方法
CN110418988B (zh) * 2017-03-30 2021-08-13 日本瑞翁株式会社 光学膜、光学膜的制造方法、偏振片及液晶显示装置
CN111993734A (zh) * 2019-05-27 2020-11-27 宁波长阳科技股份有限公司 一种耐高温离型膜及其制备方法
WO2023170022A1 (de) 2022-03-10 2023-09-14 Loparex Germany Gmbh & Co. Kg Tiefziehfähige trennfolie für faserverbundkunststoff-bauteile

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JPS5815952B2 (ja) * 1980-03-31 1983-03-28 日立化成工業株式会社 接着剤被覆積層板の製造法
JPS6028442A (ja) * 1983-07-26 1985-02-13 Mitsui Petrochem Ind Ltd ポリ４−メチル−１−ペンテンフイルム
CA1298451C (en) * 1985-08-02 1992-04-07 Hiromi Shigemoto Surface-roughened film and sheet, and process for production and use thereof
US4876156A (en) * 1987-05-15 1989-10-24 Shell Oil Company Film and sheet capable of forming retortable and easy-open packagings
JP2659404B2 (ja) * 1988-07-13 1997-09-30 住友ベークライト株式会社 離型多層フィルム
JP2571271B2 (ja) * 1988-10-17 1997-01-16 三井石油化学工業株式会社 積層体

Also Published As

Publication number Publication date
KR930000144B1 (ko) 1993-01-09
DE68925688T2 (de) 1996-07-11
DE68925688D1 (de) 1996-03-28
EP0376681B1 (en) 1996-02-14
JPH02175247A (ja) 1990-07-06
CA2006708A1 (en) 1990-06-28
US5080979A (en) 1992-01-14
EP0376681A2 (en) 1990-07-04
JP2619034B2 (ja) 1997-06-11
EP0376681A3 (en) 1991-03-27
CA2006708C (en) 2001-10-16
ATE134173T1 (de) 1996-02-15

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