DE68925688D1 - Trennfolie aus einem Laminat - Google Patents
Trennfolie aus einem LaminatInfo
- Publication number
- DE68925688D1 DE68925688D1 DE68925688T DE68925688T DE68925688D1 DE 68925688 D1 DE68925688 D1 DE 68925688D1 DE 68925688 T DE68925688 T DE 68925688T DE 68925688 T DE68925688 T DE 68925688T DE 68925688 D1 DE68925688 D1 DE 68925688D1
- Authority
- DE
- Germany
- Prior art keywords
- laminate
- film made
- separating film
- interlayer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31913—Monoolefin polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31928—Ester, halide or nitrile of addition polymer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32900888A JP2619034B2 (ja) | 1988-12-28 | 1988-12-28 | 積層体からなる離型フィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68925688D1 true DE68925688D1 (de) | 1996-03-28 |
DE68925688T2 DE68925688T2 (de) | 1996-07-11 |
Family
ID=18216574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1989625688 Expired - Lifetime DE68925688T2 (de) | 1988-12-28 | 1989-12-27 | Trennfolie aus einem Laminat |
Country Status (7)
Country | Link |
---|---|
US (1) | US5080979A (de) |
EP (1) | EP0376681B1 (de) |
JP (1) | JP2619034B2 (de) |
KR (1) | KR930000144B1 (de) |
AT (1) | ATE134173T1 (de) |
CA (1) | CA2006708C (de) |
DE (1) | DE68925688T2 (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5492767A (en) * | 1992-07-07 | 1996-02-20 | Mitsubishi Chemical Corporation | Laminated resin film |
US5877940A (en) * | 1993-12-02 | 1999-03-02 | Teledyne Industries Inc. | Fabrication multilayer combined rigid/flex printed circuit board |
JP2978086B2 (ja) * | 1995-06-30 | 1999-11-15 | 住友ベークライト株式会社 | 積層体 |
DE19609590A1 (de) * | 1996-03-12 | 1997-09-18 | Kontron Elektronik | Verfahren und Vorrichtung zur Beschichtung von Substraten, vorzugsweise Leiterplatten |
US5817386A (en) * | 1996-03-28 | 1998-10-06 | Norton Performance Plastics Corporation | Silicone-free release films |
US5858550A (en) * | 1997-02-06 | 1999-01-12 | Alliedsignal Inc. | High temperature release films |
US6062271A (en) * | 1998-05-22 | 2000-05-16 | Markel Corporation | Polymethylpentene cable liner |
WO2000018555A1 (en) * | 1998-10-01 | 2000-04-06 | Airtech International, Inc. | Method of molding or curing a resin material at high temperatures using a multilayer release film |
US6270909B1 (en) | 1999-04-07 | 2001-08-07 | Honeywell International Inc. | High temperature release films |
JP2002079630A (ja) * | 2000-06-28 | 2002-03-19 | Sumitomo Bakelite Co Ltd | 離型多層フィルム及びカバーレイ成形方法 |
EP1264685A4 (de) * | 2000-09-20 | 2003-05-21 | Mitsui Chemicals Inc | Mehrschichtiger 4-methyl-1-penten-copolymerfilm sowie verfahren zu dessen herstellung |
JP4130300B2 (ja) * | 2000-11-29 | 2008-08-06 | 三井化学株式会社 | 合成皮革製造用離型紙 |
US7776446B2 (en) | 2001-06-04 | 2010-08-17 | Saint-Gobain Performance Plastics Corporation | Multi-layer release films |
CN100464966C (zh) * | 2003-03-28 | 2009-03-04 | 三井化学株式会社 | 延伸薄膜及其制造方法 |
TWI476103B (zh) * | 2003-07-01 | 2015-03-11 | Sumitomo Bakelite Co | A release film and a method of manufacturing a flexible printed wiring board using the release film |
KR100808763B1 (ko) * | 2003-09-30 | 2008-02-29 | 세키스이가가쿠 고교가부시키가이샤 | 다층 시트 |
US20050100695A1 (en) * | 2003-11-12 | 2005-05-12 | Holbert Victor P. | Low surface energy blends useful in the manufacture of ovenable containers |
JP2005178323A (ja) * | 2003-12-24 | 2005-07-07 | Sumitomo Bakelite Co Ltd | 離型フィルムとその製造方法及びそれを用いたフレキの製造方法 |
AU2003296144A1 (en) | 2003-12-26 | 2005-08-12 | Sekisui Chemical Co., Ltd. | Mold release film |
JP2006130796A (ja) * | 2004-11-05 | 2006-05-25 | Daicel Chem Ind Ltd | ポリメチルペンテン系樹脂層を含む積層体及びその製造方法 |
JP2006212954A (ja) * | 2005-02-04 | 2006-08-17 | Mitsui Chemicals Inc | 離型フィルム |
CN101175637B (zh) * | 2005-05-13 | 2012-07-25 | 三井化学株式会社 | 含有4-甲基-1-戊烯类聚合物的层合体及由其构成的脱模膜 |
US7776428B2 (en) | 2006-02-13 | 2010-08-17 | Saint-Gobain Performance Plastics Corporation | Multi-layer release films |
US20070206364A1 (en) * | 2006-03-02 | 2007-09-06 | Saint-Gobain Performance Plastics Corporation | Methods of forming a flexible circuit board |
KR101084879B1 (ko) * | 2006-04-19 | 2011-11-21 | 소마 가부시기가이샤 | 열프레스용 이형시트 및 이를 이용하여 플렉시블 프린트 배선판을 제조하는 방법 |
CN101479327B (zh) * | 2006-06-27 | 2012-05-30 | 三井化学株式会社 | 膜及脱模膜 |
KR20090035591A (ko) * | 2006-07-24 | 2009-04-09 | 가부시키가이샤 구라레 | 프린트 배선판 제조용 이형 필름 |
JP5368054B2 (ja) * | 2008-10-15 | 2013-12-18 | 日本メクトロン株式会社 | フレキシブル回路基板の製造方法及びフレキシブル回路基板 |
JP5970377B2 (ja) | 2010-12-27 | 2016-08-17 | 株式会社クラレ | 回路基板およびその製造方法 |
JP5765018B2 (ja) * | 2011-03-31 | 2015-08-19 | 住友ベークライト株式会社 | 離型フィルム |
CN102294864A (zh) * | 2011-07-01 | 2011-12-28 | 刘烈新 | 复合耐高温离型膜 |
CN102523690B (zh) * | 2011-12-26 | 2014-08-06 | 深圳市星河电路有限公司 | 一种盲槽内含有ic脚的pcb板制作方法 |
CN102573339A (zh) * | 2012-01-18 | 2012-07-11 | 四会富士电子科技有限公司 | 一种埋盲孔结构的pcb板的压合工艺 |
JP6271320B2 (ja) * | 2014-03-28 | 2018-01-31 | アキレス株式会社 | 離型フィルム |
CN104853546B (zh) * | 2015-05-18 | 2017-09-05 | 惠州市金百泽电路科技有限公司 | 一种挠性板在外层的刚挠结合板覆盖膜压合方法 |
WO2017125810A1 (ja) * | 2016-01-21 | 2017-07-27 | 王子ホールディングス株式会社 | 剥離性フィルム |
JP6620694B2 (ja) * | 2016-07-22 | 2019-12-18 | 王子ホールディングス株式会社 | 剥離性フィルム |
JP6677155B2 (ja) * | 2016-01-21 | 2020-04-08 | 王子ホールディングス株式会社 | 剥離性フィルム |
CN106042553B (zh) * | 2016-06-13 | 2018-06-26 | 昆山致信天城电子材料有限公司 | 一种耐高温离型膜及制造工艺 |
WO2018110361A1 (ja) | 2016-12-16 | 2018-06-21 | 東レフィルム加工株式会社 | 離型フィルムおよび保護フィルム |
JP2018167458A (ja) * | 2017-03-29 | 2018-11-01 | 日本メクトロン株式会社 | 離型フィルムおよびフレキシブルプリント基板の製造方法 |
JPWO2018181696A1 (ja) * | 2017-03-30 | 2020-02-06 | 日本ゼオン株式会社 | 光学フィルム、その製造方法、偏光板、及び液晶表示装置 |
CN111993734A (zh) * | 2019-05-27 | 2020-11-27 | 宁波长阳科技股份有限公司 | 一种耐高温离型膜及其制备方法 |
WO2023170022A1 (de) | 2022-03-10 | 2023-09-14 | Loparex Germany Gmbh & Co. Kg | Tiefziehfähige trennfolie für faserverbundkunststoff-bauteile |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5815952B2 (ja) * | 1980-03-31 | 1983-03-28 | 日立化成工業株式会社 | 接着剤被覆積層板の製造法 |
JPS6028442A (ja) * | 1983-07-26 | 1985-02-13 | Mitsui Petrochem Ind Ltd | ポリ4−メチル−1−ペンテンフイルム |
CA1298451C (en) * | 1985-08-02 | 1992-04-07 | Hiromi Shigemoto | Surface-roughened film and sheet, and process for production and use thereof |
US4876156A (en) * | 1987-05-15 | 1989-10-24 | Shell Oil Company | Film and sheet capable of forming retortable and easy-open packagings |
JP2659404B2 (ja) * | 1988-07-13 | 1997-09-30 | 住友ベークライト株式会社 | 離型多層フィルム |
JP2571271B2 (ja) * | 1988-10-17 | 1997-01-16 | 三井石油化学工業株式会社 | 積層体 |
-
1988
- 1988-12-28 JP JP32900888A patent/JP2619034B2/ja not_active Expired - Lifetime
-
1989
- 1989-12-27 CA CA002006708A patent/CA2006708C/en not_active Expired - Fee Related
- 1989-12-27 AT AT89313592T patent/ATE134173T1/de active
- 1989-12-27 DE DE1989625688 patent/DE68925688T2/de not_active Expired - Lifetime
- 1989-12-27 EP EP19890313592 patent/EP0376681B1/de not_active Expired - Lifetime
- 1989-12-28 KR KR1019890019784A patent/KR930000144B1/ko not_active IP Right Cessation
- 1989-12-28 US US07/458,423 patent/US5080979A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE68925688T2 (de) | 1996-07-11 |
JP2619034B2 (ja) | 1997-06-11 |
KR900011359A (ko) | 1990-07-11 |
EP0376681A2 (de) | 1990-07-04 |
CA2006708C (en) | 2001-10-16 |
US5080979A (en) | 1992-01-14 |
JPH02175247A (ja) | 1990-07-06 |
EP0376681A3 (de) | 1991-03-27 |
EP0376681B1 (de) | 1996-02-14 |
CA2006708A1 (en) | 1990-06-28 |
KR930000144B1 (ko) | 1993-01-09 |
ATE134173T1 (de) | 1996-02-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: MITSUI CHEMICALS, INC., TOKIO/TOKYO, JP |