KR900007948A - 전자부품 밀봉용 수지 조성물 및 밀봉 전자부품 - Google Patents

전자부품 밀봉용 수지 조성물 및 밀봉 전자부품 Download PDF

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KR900007948A
KR900007948A KR1019890016213A KR890016213A KR900007948A KR 900007948 A KR900007948 A KR 900007948A KR 1019890016213 A KR1019890016213 A KR 1019890016213A KR 890016213 A KR890016213 A KR 890016213A KR 900007948 A KR900007948 A KR 900007948A
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weight
weight part
polyarylene
resin composition
minutes
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KR1019890016213A
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KR930003696B1 (ko
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도시따까 고오야마
게이이찌로 스즈끼
도시오 에노끼
야스오 사까구찌
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고따마 슌 이찌로
구레하 가가꾸 고오교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0243—Silica-rich compounds, e.g. silicates, cement, glass
    • C09K2200/0247—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/068—Containing also other elements than carbon, oxygen or nitrogen in the polymer main chain
    • C09K2200/0682—Containing sulfur
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)

Abstract

내용 없음

Description

전자부품 밀봉용 수지 조성물 및 밀봉 전자부품
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. (A)폴리아릴렌티오에테르 케톤 100 ∼10중량%와 폴리아릴렌술피드 0 ∼ 90중량%로서 이루어진 열가소성 수지 40 ~ 25중량부, (B)무기충전제 60 ~75중량부, 및 (C)실리콘 오일을 , 상기 열가소성 수지(A)와 무기 충전제 (B)의 합계((A) + (B)) 100중량부에 대하여 1.5 ∼5중량부를 함유함을 특징으로 하는 전자부품 밀봉용 수지 조성물.
  2. (A)폴리아릴렌티오에테르 케톤 100 ∼10중량%와 폴리아릴렌술피드 0 ∼ 90중량%로서 이루어진 열가소성 수지 40 ∼25중량부, (B) 무기충전재 60 ∼75 중량부, 및 (C) 실리콘 고무를 , 상기 열가소성 수지(A)와 무기 충전재 (B)의 합계 ((A) + (B)) 100중량부에 대해서 10 ∼15중량부를 함유함을 특징으로 하는 전자 부품 밀봉용 수지 조성물.
  3. (A)폴리아릴렌티오에테르 케톤 100 ∼10중량%와 폴리아릴렌술피드 0 ∼ 90중량%로서 이루어진 열가소성 수지 40 ∼25중량부, (B)무기충전제 60 ∼75중량부,및(C)상기 열가소성 수지(A)와 무기 충전제(B)의 합계 ((A)+ (B)) 100중량부에 대해서, 실리콘 오일 0.5 ∼3중량부와 실리콘 고무 5 ∼13중량부를 함유함을 특징으로 하는 전자부품 밀봉용 수지 조성물.
  4. 제1항 내지 제3항중 어느 한항에 있어서, 상기 폴리아릴렌티오에테르 케톤이 하기 (가) ~(다) 의 물성을 가지는 것을 특징으로 하는 전자부품 밀봉용 수지 조성물.
    (가) 융점 Tm이 310 ∼380°C 일 것.
    (나)용융결정화 온도 Tmc(420°C/10분)가 210°C 이상이며, 그 때의 잔류 용융 결정화 엔탈피-ΔHmc (420°C/10분)가 10J/g 이상일것[단 ,Tmc (420°C/ 10분) 및 △Hmc(420°C/ 10분)는, 시차 주사 열량계로 폴리아릴렌티오에테르에 케톤을 불활성 가스 분위기하에서, 50°C 로 5분간 유지 후, 75°C/분의 속도로 420°C까지 가열시켜, 420°C에서 10분간 유지한 다음, 10°C/분의 속도로 냉각하였을때의 용융 결정화의 피크시의 온도와 피크 면적으로 계산되는 용융 결정화 엔탈피이다.]
    (다) 환원 점도 nred(98%황산중에서, 농도 0.5g/dl, 25°C 에서 측정)가 0.2 ∼ 2 dl/g일것.
  5. 제1항 내지 제4항중 어느 한항에 있어서, 상기 열가소성 수지가 폴리아릴렌티오에테르 케톤 100~30중량%와 폴리아릴렌술피드 0 ∼ 70중량%로서 이루어진 전자부품 밀봉용 수지 조성물.
  6. 제1항 내지 제4항중 어느 한 항에 있어서, 상기 열가소성 수지가 폴리아릴렌티오에테르 케톤 100 ∼50중량%와 폴리아릴렌술피드 0 ~50중량%로서 이루어진 전자부품 밀봉용 수지 조성물.
  7. 제1항 내지 제4항중 어느 한 항에 있어서, 상기 열가소성 수지가 폴리아릴렌티오에테르 케톤 50 ∼10중량%와 폴리아릴렌술피드 50 ∼90중량%로서 이루어진 전자부품 밀봉용 수지 조성물.
  8. 제1항 내지 제7항의 어느 한 항 기재의 전자부품 밀봉용수지 조성물을 사용하여 밀봉한 것을 특징으로 하는 밀봉 전자부품.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890016213A 1988-11-12 1989-11-09 전자부품 밀봉용 수지 조성물 및 밀봉 전자부품 KR930003696B1 (ko)

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Application Number Priority Date Filing Date Title
JP88-284836 1988-11-12
JP28483688 1988-11-12
JP284836 1988-11-12
JP1248087A JPH02229858A (ja) 1988-11-12 1989-09-26 電子部品封止用樹脂組成物および封止電子部品
JP248087 1989-09-26
JP89-248087 1989-09-26

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KR900007948A true KR900007948A (ko) 1990-06-02
KR930003696B1 KR930003696B1 (ko) 1993-05-08

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US (2) US5332770A (ko)
EP (1) EP0369652B1 (ko)
JP (1) JPH02229858A (ko)
KR (1) KR930003696B1 (ko)
DE (1) DE68909175T2 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011088151A1 (de) 2011-08-16 2013-02-21 Cj Cheil Jedang Corp. Mikroorganismus mit erhöhter L-Valin Produktivität und Verfahren zur Herstellung von L-Valin unter Verwendung desselben
KR102281360B1 (ko) * 2021-01-26 2021-07-22 씨제이제일제당 (주) 신규한 atp 포스포리보실트랜스퍼라제 변이체 및 이를 이용한 l-발린 생산 방법

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2792114B2 (ja) * 1989-06-20 1998-08-27 大日本インキ化学工業株式会社 樹脂組成物
JP3237757B2 (ja) * 1989-12-28 2001-12-10 呉羽化学工業株式会社 電子部品封止用樹脂組成物および封止電子部品
JP3417079B2 (ja) * 1994-08-31 2003-06-16 ソニー株式会社 半導体装置の製造方法
US5891754A (en) * 1997-02-11 1999-04-06 Delco Electronics Corp. Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant
EP1190374B1 (en) * 1999-06-17 2003-05-02 Nissha Printing Co., Ltd. High-reliability touch panel
JP4946262B2 (ja) * 2006-08-18 2012-06-06 富士通セミコンダクター株式会社 半導体素子の実装方法及び半導体装置の製造方法
US20100255482A1 (en) * 2007-11-06 2010-10-07 Siemens Healthcare Diagnostics Inc. Hepatitis B Virus (HBV) Specific Oligonucleotide Sequences
DE102009000884B3 (de) * 2009-02-16 2010-10-07 Semikron Elektronik Gmbh & Co. Kg Halbleitermodul mit Gehäuse aus präkeramischem Polymer
DE102009000885A1 (de) * 2009-02-16 2010-08-26 Semikron Elektronik Gmbh & Co. Kg Halbleitermodul
US20140210111A1 (en) * 2013-01-25 2014-07-31 Apple Inc. Embedded package on package systems
HUE051760T2 (hu) * 2014-06-18 2021-03-29 Heraeus Deutschland Gmbh & Co Kg Eljárás félvezetõ modul elõállítására

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3929708A (en) * 1974-08-15 1975-12-30 Phillips Petroleum Co Arylene sulfide polymers comprising silicone fluids
JPS6010548B2 (ja) * 1978-04-14 1985-03-18 保土谷化学工業株式会社 ポリフエニレンサルフアイド樹脂組成物
US4395527A (en) * 1978-05-17 1983-07-26 M & T Chemicals Inc. Siloxane-containing polymers
SU977080A1 (ru) * 1979-03-07 1982-11-30 Предприятие П/Я А-7697 Стан мокрого волочени проволоки без скольжени
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS6028392B2 (ja) * 1980-07-16 1985-07-04 信越化学工業株式会社 電子部品封止用樹脂組成物
JPS5740557A (en) * 1980-08-22 1982-03-06 Hitachi Ltd Resin composition for sealing electronic part and sealing method of electronic part
JPS58126375A (ja) * 1982-01-22 1983-07-27 東邦レーヨン株式会社 炭素繊維及びその樹脂組成物
JPS5920911A (ja) * 1982-07-28 1984-02-02 住友ベークライト株式会社 Ｐｐｓ組成物及び封止電子部品
JPS5920910A (ja) * 1982-07-28 1984-02-02 住友ベークライト株式会社 Ｐｐｓ組成物及び封止電子部品
CA1260174A (en) * 1984-06-29 1989-09-26 Kureha Chemical Ind Co Ltd PARA-PHENYLENE SULPHIDE COPOLYMERS; METHOD OF PREPARATION AND USE
JP2615550B2 (ja) * 1985-09-17 1997-05-28 大日本インキ化学工業株式会社 樹脂封止電子部品
JPS62127347A (ja) * 1985-11-26 1987-06-09 Dainippon Ink & Chem Inc 電子部品封止用ポリアリ−レンスルフイド樹脂組成物
US4703075A (en) * 1985-12-11 1987-10-27 Ntn-Rulon Industries Co., Ltd. Resinous compositions having lubricity
JPH075836B2 (ja) * 1986-02-24 1995-01-25 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物
US4797448A (en) * 1986-06-18 1989-01-10 Phillips Petroleum Company Additive for arylene sulfide polymers of improved impact strength
JPS63146963A (ja) * 1986-12-10 1988-06-18 Kureha Chem Ind Co Ltd 封止用ポリアリ−レンチオエ−テル組成物および成形物
JPH0826220B2 (ja) * 1987-02-24 1996-03-13 大日本インキ化学工業株式会社 ポリアリ−レンスルフイド樹脂組成物及びそれを用いた電子部品
JPH0834271B2 (ja) * 1987-03-09 1996-03-29 住友ベークライト株式会社 Ｐｐｓ封止電子部品
JPH0834270B2 (ja) * 1987-03-09 1996-03-29 住友ベークライト株式会社 Ｐｐｓ封止電子部品
JPS63219145A (ja) * 1987-03-09 1988-09-12 Sumitomo Bakelite Co Ltd Ｐｐｓ封止電子部品
JPS63268740A (ja) * 1987-04-27 1988-11-07 Toray Ind Inc 電子部品封止用ポリアリ−レンスルフイド樹脂
US4895893A (en) * 1987-05-15 1990-01-23 Kureha Kagaku Kogyo K.K. Heat-resistant resin compositions, and heat-resistant molded or formed articles and production process thereof
US4895892A (en) * 1987-05-15 1990-01-23 Kureha Kagaku Kogyo K.K. Melt-stable poly(arylene thioether-ketone) compositions
JPH0822632B2 (ja) * 1992-07-16 1996-03-06 フジプラ株式会社 貼り合わせプラスチックカード

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011088151A1 (de) 2011-08-16 2013-02-21 Cj Cheil Jedang Corp. Mikroorganismus mit erhöhter L-Valin Produktivität und Verfahren zur Herstellung von L-Valin unter Verwendung desselben
KR102281360B1 (ko) * 2021-01-26 2021-07-22 씨제이제일제당 (주) 신규한 atp 포스포리보실트랜스퍼라제 변이체 및 이를 이용한 l-발린 생산 방법
WO2022163923A1 (ko) * 2021-01-26 2022-08-04 씨제이제일제당 (주) 신규한 atp 포스포리보실트랜스퍼라제 변이체 및 이를 이용한 l-발린 생산 방법

Also Published As

Publication number Publication date
DE68909175T2 (de) 1994-01-20
EP0369652A2 (en) 1990-05-23
KR930003696B1 (ko) 1993-05-08
EP0369652B1 (en) 1993-09-15
US5474828A (en) 1995-12-12
US5332770A (en) 1994-07-26
DE68909175D1 (de) 1993-10-21
JPH02229858A (ja) 1990-09-12
EP0369652A3 (en) 1990-08-16

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