KR900004014A - 게이트 어레이 - Google Patents

게이트 어레이 Download PDF

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Publication number
KR900004014A
KR900004014A KR1019890011807A KR890011807A KR900004014A KR 900004014 A KR900004014 A KR 900004014A KR 1019890011807 A KR1019890011807 A KR 1019890011807A KR 890011807 A KR890011807 A KR 890011807A KR 900004014 A KR900004014 A KR 900004014A
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KR
South Korea
Prior art keywords
conductor layer
same time
impurity regions
substrate
insulating films
Prior art date
Application number
KR1019890011807A
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English (en)
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KR920010436B1 (ko
Inventor
요시히로 오쿠노
요우이찌 구라미쯔
Original Assignee
시기 모리야
미쯔시비뎅끼 가부시끼가이샤
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Application filed by 시기 모리야, 미쯔시비뎅끼 가부시끼가이샤 filed Critical 시기 모리야
Publication of KR900004014A publication Critical patent/KR900004014A/ko
Application granted granted Critical
Publication of KR920010436B1 publication Critical patent/KR920010436B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11803—Masterslice integrated circuits using field effect technology
    • H01L27/11807—CMOS gate arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

내용 없음.

Description

게이트 어레이
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 이 발명에 관한 게이트 아이소레이션(gate isolation)을 사용한 SOG 방식의 마스터칩(master chip)를 표시하는 평면도.
제2a도는 게이트 아이소레이션을 사용한 SOG 방식의 마스터칩 상에 3NAND 게이트의 회로를 구성한 경우의 마스크 패턴(mask patterm)도.
제2b도는 제2a도의 ⅡB-ⅡB선으로 표시하는 부분의 단면도.
제2c도는 제2a도의 ⅡC-ⅡC선으로 표시하는 부분의 단면도.
제3도는 논리회로가 구성된 SOG의 실제의 레이아웃패턴을 매트로(macro)적으로 본 평면도.

Claims (1)

  1. 기판과 상기 기판의 주표면상에 간격을 두고 제1의 방향에 연재(延在)하여 형성되고 동시에 소정의 폭을 가지는 복수의 제1도전형의 불순물 영역과, 상기 복수의 제1도 전형의 불순물 영역이 형성되지 않는 영역에서 동시에 상기 기판의 주표면상에 상기 제1의 방향에 연재하여 형성되어, 동시에 소정의 폭을 가지는 복수의 제2도 전형의 불순물영역과 상기 제1도전형의 불순물 영역상에 절연막을 끼워 동시에 상호간격을 두고 상기 제1의 방향에 형성된 복수의 제1도체층과, 상기 제2도전형의 불순물 여역상에 절연막을 끼워 동시에 상호간격을 두고 상기 제1의 방향에 형성된 복수의 제2도체층과, 상기 제1의도체층과 상기 제2의 도체층은 상기 제1방향과 교차하는 제2의 방향에 정열하여 형성되어 인접하여 형성된 상기 제1의 도체층과 상기 제2의 도체층 및 상기 제1 및 제2의 도체층의 양측에 설정된 제1 및 제2의 불순물영역과는 1개의 유닛을 구성하고 각각이 상기 유닛을 포함하는 북수의 논리 셀 유닛과, 상기 논리셀 유닛은 적어도 상기 제2의 방향에 연속하여 형성되고, 상기 복수의 논리셀 유닛간을 상호접속하기 위해 상기 제2의 방향에 연속하여 형성된 도체층을 포함하는 게이트 어레이.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890011807A 1988-08-18 1989-08-18 게이트 어레이(gate array) KR920010436B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63205571A JPH0254576A (ja) 1988-08-18 1988-08-18 ゲートアレイ
JP88-205571 1988-08-18
JP63-205571 1988-08-18

Publications (2)

Publication Number Publication Date
KR900004014A true KR900004014A (ko) 1990-03-27
KR920010436B1 KR920010436B1 (ko) 1992-11-27

Family

ID=16509097

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890011807A KR920010436B1 (ko) 1988-08-18 1989-08-18 게이트 어레이(gate array)

Country Status (4)

Country Link
US (1) US4999698A (ko)
JP (1) JPH0254576A (ko)
KR (1) KR920010436B1 (ko)
DE (1) DE3927143C2 (ko)

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US5367208A (en) 1986-09-19 1994-11-22 Actel Corporation Reconfigurable programmable interconnect architecture
JPH02222572A (ja) * 1989-02-23 1990-09-05 Sharp Corp 半導体集積回路装置
US5073729A (en) * 1990-06-22 1991-12-17 Actel Corporation Segmented routing architecture
JPH06509911A (ja) * 1992-06-10 1994-11-02 アスペック　テクノロジー　インコーポレイテッド 連続基板タップを備えた対称な多層金属論理アレイ
US5384472A (en) * 1992-06-10 1995-01-24 Aspec Technology, Inc. Symmetrical multi-layer metal logic array with continuous substrate taps and extension portions for increased gate density
US5308798A (en) * 1992-11-12 1994-05-03 Vlsi Technology, Inc. Preplacement method for weighted net placement integrated circuit design layout tools
JP3488735B2 (ja) * 1994-03-03 2004-01-19 三菱電機株式会社 半導体装置
IL111708A (en) * 1994-11-21 1998-03-10 Chip Express Israel Ltd Array mapping goes
JP3432963B2 (ja) * 1995-06-15 2003-08-04 沖電気工業株式会社 半導体集積回路
US7389487B1 (en) 1998-04-28 2008-06-17 Actel Corporation Dedicated interface architecture for a hybrid integrated circuit
JP4279955B2 (ja) * 1998-12-08 2009-06-17 富士通マイクロエレクトロニクス株式会社 半導体集積回路装置及びその製造方法
US6856022B2 (en) * 2003-03-31 2005-02-15 Matsushita Electric Industrial Co., Ltd. Semiconductor device
JP4543061B2 (ja) * 2007-05-15 2010-09-15 株式会社東芝 半導体集積回路
JP2010177268A (ja) * 2009-01-27 2010-08-12 Asahi Kasei Electronics Co Ltd 接合型ｆｅｔ、半導体装置およびその製造方法
US11290109B1 (en) * 2020-09-23 2022-03-29 Qualcomm Incorporated Multibit multi-height cell to improve pin accessibility

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843905B2 (ja) * 1979-07-31 1983-09-29 富士通株式会社 半導体集積回路の製造方法
JPS5720447A (en) * 1980-07-11 1982-02-02 Nippon Telegr & Teleph Corp <Ntt> Semiconductor integrated circuit device
DE3143565A1 (de) * 1981-11-03 1983-05-11 International Microcircuits Inc., 95051 Santa Clara, Calif. Integrierte schaltung
JPS5972742A (ja) * 1982-10-20 1984-04-24 Hitachi Ltd マスタスライスｌｓｉのマスタ方法
JPS6056292A (ja) * 1983-09-08 1985-04-01 財団法人電力中央研究所 高速増殖炉
EP0154346B1 (en) * 1984-03-08 1991-09-18 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device
EP0177336B1 (en) * 1984-10-03 1992-07-22 Fujitsu Limited Gate array integrated device
JPS61100947A (ja) * 1984-10-22 1986-05-19 Toshiba Corp 半導体集積回路装置
JPH0628305B2 (ja) * 1986-05-14 1994-04-13 三菱電機株式会社 マスタスライスｌｓｉ
US4884118A (en) * 1986-05-19 1989-11-28 Lsi Logic Corporation Double metal HCMOS compacted array
JPH0831578B2 (ja) * 1986-06-19 1996-03-27 日本電気株式会社 マスタ−スライス方式のゲ−トアレ−半導体集積回路装置

Also Published As

Publication number Publication date
DE3927143A1 (de) 1990-02-22
KR920010436B1 (ko) 1992-11-27
DE3927143C2 (de) 1994-03-10
US4999698A (en) 1991-03-12
JPH0254576A (ja) 1990-02-23

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