KR900003873B1 - 리드 프레임 - Google Patents

리드 프레임 Download PDF

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Publication number
KR900003873B1
KR900003873B1 KR1019870000109A KR870000109A KR900003873B1 KR 900003873 B1 KR900003873 B1 KR 900003873B1 KR 1019870000109 A KR1019870000109 A KR 1019870000109A KR 870000109 A KR870000109 A KR 870000109A KR 900003873 B1 KR900003873 B1 KR 900003873B1
Authority
KR
South Korea
Prior art keywords
inner lead
casting
lead
lead frame
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870000109A
Other languages
English (en)
Korean (ko)
Other versions
KR870008385A (ko
Inventor
겐지 이이누마
Original Assignee
신고오 덴기 고오교오 가부시끼가이샤
미쓰노브 다개기오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신고오 덴기 고오교오 가부시끼가이샤, 미쓰노브 다개기오 filed Critical 신고오 덴기 고오교오 가부시끼가이샤
Publication of KR870008385A publication Critical patent/KR870008385A/ko
Application granted granted Critical
Publication of KR900003873B1 publication Critical patent/KR900003873B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/041—Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
KR1019870000109A 1986-02-21 1987-01-09 리드 프레임 Expired KR900003873B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61-37859 1986-02-21
JP61037859A JPS62195164A (ja) 1986-02-21 1986-02-21 リードフレームの製造方法
JP37859 1986-02-21

Publications (2)

Publication Number Publication Date
KR870008385A KR870008385A (ko) 1987-09-26
KR900003873B1 true KR900003873B1 (ko) 1990-06-02

Family

ID=12509274

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870000109A Expired KR900003873B1 (ko) 1986-02-21 1987-01-09 리드 프레임

Country Status (2)

Country Link
JP (1) JPS62195164A (https=)
KR (1) KR900003873B1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729836U (ja) * 1993-11-10 1995-06-02 サンケン電気株式会社 半導体装置
KR950015736A (ko) * 1993-11-20 1995-06-17 김광호 반도체 장치용 리드프레임

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210651A (en) * 1981-06-19 1982-12-24 Toshiba Corp Lead frame and manufacture thereof

Also Published As

Publication number Publication date
JPH0366814B2 (https=) 1991-10-18
KR870008385A (ko) 1987-09-26
JPS62195164A (ja) 1987-08-27

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