KR930007928Y1 - 삽입형 리드프레임 - Google Patents
삽입형 리드프레임 Download PDFInfo
- Publication number
- KR930007928Y1 KR930007928Y1 KR2019900018827U KR900018827U KR930007928Y1 KR 930007928 Y1 KR930007928 Y1 KR 930007928Y1 KR 2019900018827 U KR2019900018827 U KR 2019900018827U KR 900018827 U KR900018827 U KR 900018827U KR 930007928 Y1 KR930007928 Y1 KR 930007928Y1
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- insulating material
- bonded
- leads
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011810 insulating material Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (1)
- 리드프레임에 있어서,자형 리드(1)의 저부를 절연물질(2)에 의해 서로 결합시키고, 상기 결합된 상기 리드(1)의 저면 및 내측면에 절연물질(2)을 결합형성시킨 다음, 상기 리드(1)상부에 형성된 절연물질(2) 상부면에 전도성물질(3)을 결합형성시킨 것을 특징으로 하는 삽입형 리드프레임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019900018827U KR930007928Y1 (ko) | 1990-11-30 | 1990-11-30 | 삽입형 리드프레임 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019900018827U KR930007928Y1 (ko) | 1990-11-30 | 1990-11-30 | 삽입형 리드프레임 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920010451U KR920010451U (ko) | 1992-06-17 |
KR930007928Y1 true KR930007928Y1 (ko) | 1993-11-24 |
Family
ID=19306281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019900018827U Expired - Lifetime KR930007928Y1 (ko) | 1990-11-30 | 1990-11-30 | 삽입형 리드프레임 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR930007928Y1 (ko) |
-
1990
- 1990-11-30 KR KR2019900018827U patent/KR930007928Y1/ko not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR920010451U (ko) | 1992-06-17 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
UA0108 | Application for utility model registration |
Comment text: Application for Utility Model Registration Patent event code: UA01011R08D Patent event date: 19901130 |
|
UA0201 | Request for examination |
Patent event date: 19901130 Patent event code: UA02012R01D Comment text: Request for Examination of Application |
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UG1501 | Laying open of application | ||
UG1604 | Publication of application |
Patent event code: UG16041S01I Comment text: Decision on Publication of Application Patent event date: 19931030 |
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E701 | Decision to grant or registration of patent right | ||
UE0701 | Decision of registration |
Patent event date: 19940218 Comment text: Decision to Grant Registration Patent event code: UE07011S01D |
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REGI | Registration of establishment | ||
UR0701 | Registration of establishment |
Patent event date: 19940516 Patent event code: UR07011E01D Comment text: Registration of Establishment |
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UR1002 | Payment of registration fee |
Start annual number: 1 End annual number: 3 Payment date: 19940516 |
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EXPY | Expiration of term | ||
UC1801 | Expiration of term |