KR900001231B1 - 기판의 회전 건조 장치 - Google Patents

기판의 회전 건조 장치 Download PDF

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Publication number
KR900001231B1
KR900001231B1 KR1019860003137A KR860003137A KR900001231B1 KR 900001231 B1 KR900001231 B1 KR 900001231B1 KR 1019860003137 A KR1019860003137 A KR 1019860003137A KR 860003137 A KR860003137 A KR 860003137A KR 900001231 B1 KR900001231 B1 KR 900001231B1
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KR
South Korea
Prior art keywords
rotating body
drying
drying chamber
wafer cassette
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019860003137A
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English (en)
Korean (ko)
Other versions
KR860008594A (ko
Inventor
가즈오 이누다
베 아키라 와다나
Original Assignee
다이닛뽕 스쿠링 세이죠오 가부시키가이샤
이시다 도쿠지 로오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이닛뽕 스쿠링 세이죠오 가부시키가이샤, 이시다 도쿠지 로오 filed Critical 다이닛뽕 스쿠링 세이죠오 가부시키가이샤
Publication of KR860008594A publication Critical patent/KR860008594A/ko
Application granted granted Critical
Publication of KR900001231B1 publication Critical patent/KR900001231B1/ko
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
KR1019860003137A 1985-04-26 1986-04-23 기판의 회전 건조 장치 Expired KR900001231B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1985063546U JPS61178187U (enExample) 1985-04-26 1985-04-26
JP60-63546 1985-04-26

Publications (2)

Publication Number Publication Date
KR860008594A KR860008594A (ko) 1986-11-17
KR900001231B1 true KR900001231B1 (ko) 1990-03-05

Family

ID=13232331

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860003137A Expired KR900001231B1 (ko) 1985-04-26 1986-04-23 기판의 회전 건조 장치

Country Status (3)

Country Link
US (1) US4750505A (enExample)
JP (1) JPS61178187U (enExample)
KR (1) KR900001231B1 (enExample)

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US5169408A (en) * 1990-01-26 1992-12-08 Fsi International, Inc. Apparatus for wafer processing with in situ rinse
US6375741B2 (en) 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US5238503A (en) * 1991-04-09 1993-08-24 International Business Machines Corporation Device for decontaminating a semiconductor wafer container
US5375291A (en) * 1992-05-18 1994-12-27 Tokyo Electron Limited Device having brush for scrubbing substrate
US5224503A (en) * 1992-06-15 1993-07-06 Semitool, Inc. Centrifugal wafer carrier cleaning apparatus
DE69420474T2 (de) * 1993-06-30 2000-05-18 Applied Materials Inc Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum
US5608943A (en) * 1993-08-23 1997-03-11 Tokyo Electron Limited Apparatus for removing process liquid
US5475892A (en) * 1993-10-29 1995-12-19 Texas Instruments Incorporated Semiconductor wafer particle extractor
US5509431A (en) * 1993-12-14 1996-04-23 Snap-Tite, Inc. Precision cleaning vessel
US5417768A (en) * 1993-12-14 1995-05-23 Autoclave Engineers, Inc. Method of cleaning workpiece with solvent and then with liquid carbon dioxide
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
US5772784A (en) * 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
US5634978A (en) * 1994-11-14 1997-06-03 Yieldup International Ultra-low particle semiconductor method
US5849104A (en) * 1996-09-19 1998-12-15 Yieldup International Method and apparatus for cleaning wafers using multiple tanks
US5958146A (en) * 1994-11-14 1999-09-28 Yieldup International Ultra-low particle semiconductor cleaner using heated fluids
US5571337A (en) * 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
US6413436B1 (en) * 1999-01-27 2002-07-02 Semitool, Inc. Selective treatment of the surface of a microelectronic workpiece
US6350319B1 (en) 1998-03-13 2002-02-26 Semitool, Inc. Micro-environment reactor for processing a workpiece
US6264752B1 (en) 1998-03-13 2001-07-24 Gary L. Curtis Reactor for processing a microelectronic workpiece
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6318385B1 (en) 1998-03-13 2001-11-20 Semitool, Inc. Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
US20050217707A1 (en) * 1998-03-13 2005-10-06 Aegerter Brian K Selective processing of microelectronic workpiece surfaces
US6423642B1 (en) 1998-03-13 2002-07-23 Semitool, Inc. Reactor for processing a semiconductor wafer
TW452828B (en) * 1998-03-13 2001-09-01 Semitool Inc Micro-environment reactor for processing a microelectronic workpiece
US6047717A (en) * 1998-04-29 2000-04-11 Scd Mountain View, Inc. Mandrel device and method for hard disks
US6062239A (en) * 1998-06-30 2000-05-16 Semitool, Inc. Cross flow centrifugal processor
US6125863A (en) * 1998-06-30 2000-10-03 Semitool, Inc. Offset rotor flat media processor
US6432214B2 (en) 1998-07-10 2002-08-13 Semitool, Inc. Cleaning apparatus
US6511914B2 (en) 1999-01-22 2003-01-28 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US7217325B2 (en) * 1999-01-22 2007-05-15 Semitool, Inc. System for processing a workpiece
US6806194B2 (en) * 1999-01-22 2004-10-19 Semitool. Inc. Apparatus and methods for processing a workpiece
US6680253B2 (en) 1999-01-22 2004-01-20 Semitool, Inc. Apparatus for processing a workpiece
US6492284B2 (en) 1999-01-22 2002-12-10 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6548411B2 (en) 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US6216710B1 (en) 1999-02-05 2001-04-17 Caterpillar Inc. Method and apparatus for removing quench oil from a permeable metal part
JP4219562B2 (ja) 1999-04-13 2009-02-04 セミトゥール・インコーポレイテッド ワークピースを電気化学的に処理するためのシステム
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6774056B2 (en) * 1999-11-10 2004-08-10 Semitool, Inc. Sonic immersion process system and methods
US6286231B1 (en) 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
AU2001282879A1 (en) * 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
JP3662484B2 (ja) * 2000-08-09 2005-06-22 エム・エフエスアイ株式会社 ウェット処理方法及びウェット処理装置
JP2002079201A (ja) * 2000-09-07 2002-03-19 Showa Kogyosho:Kk 筒状被清掃体の清掃装置
KR100689808B1 (ko) * 2000-12-07 2007-03-08 삼성전자주식회사 반도체소자 제조용 웨트 스테이션의 스핀 드라이어
US20050061676A1 (en) * 2001-03-12 2005-03-24 Wilson Gregory J. System for electrochemically processing a workpiece
AU2002322587A1 (en) * 2001-07-16 2003-03-03 Semitool, Inc. Apparatus for processing a workpiece
AU2002343330A1 (en) * 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7396412B2 (en) 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
KR102042635B1 (ko) 2012-07-02 2019-11-08 삼성전자주식회사 매엽식 건조 장치 및 이를 포함하는 매엽식 세정 시스템
JP6625058B2 (ja) * 2014-09-30 2019-12-25 芝浦メカトロニクス株式会社 基板処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2893410A (en) * 1952-07-17 1959-07-07 Cornell Dubilier Electric Washing electrolytic capacitor sections
JPS5212576A (en) * 1975-07-21 1977-01-31 Hitachi Ltd Wafer washing drying device
WO1984004583A1 (fr) * 1980-04-23 1984-11-22 Seiichiro Aigoo Sechoir
US4316750A (en) * 1981-01-16 1982-02-23 Western Electric Company, Inc. Apparatus and method for cleaning a flux station of a soldering system
US4421131A (en) * 1982-01-19 1983-12-20 Auvil Jr Raymond G Cleaning apparatus
JPS58190031A (ja) * 1982-04-30 1983-11-05 Toshiba Corp 半導体ウエハ清浄乾燥装置
JP3464837B2 (ja) * 1995-02-06 2003-11-10 株式会社日立ユニシアオートモティブ 自動変速機の変速動作開始時期検出装置

Also Published As

Publication number Publication date
KR860008594A (ko) 1986-11-17
US4750505A (en) 1988-06-14
JPS61178187U (enExample) 1986-11-06

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