KR890007145A - 웨이퍼 위치 결정 장치 - Google Patents

웨이퍼 위치 결정 장치 Download PDF

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Publication number
KR890007145A
KR890007145A KR1019880013623A KR880013623A KR890007145A KR 890007145 A KR890007145 A KR 890007145A KR 1019880013623 A KR1019880013623 A KR 1019880013623A KR 880013623 A KR880013623 A KR 880013623A KR 890007145 A KR890007145 A KR 890007145A
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KR
South Korea
Prior art keywords
wafer
optical position
position detectors
circumference
optical
Prior art date
Application number
KR1019880013623A
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English (en)
Other versions
KR910007106B1 (ko
Inventor
가즈오 시마네
노부오 이지마
다쯔로오 가와바다
Original Assignee
야마모도 다꾸마
후지쓰 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마모도 다꾸마, 후지쓰 가부시끼가이샤 filed Critical 야마모도 다꾸마
Publication of KR890007145A publication Critical patent/KR890007145A/ko
Application granted granted Critical
Publication of KR910007106B1 publication Critical patent/KR910007106B1/ko

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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D3/00Control of position or direction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/137Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Abstract

내용 없음

Description

웨이퍼 위치결정장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 바람직한 실시예를 채용한 장치의 평면도.
제3a도는 운송로보트의 아암이 호옴(home)위치에 있는 제1도와 제2도 장치에 사용되는 운송로보트(11)의 평면도.
제3b도는 아암이 축소상태에 있는 운송로보트의 측면도.
제3c도는 아암이 신장 상태에 있는 운송로보트의 평면도.
제5a도 내지 5d도는 트랜스프오리엔테이션(transpi orientation) 로보트를 도시한 도면.

Claims (5)

  1. 웨이퍼의 원주부를 검파하며, 웨이퍼의 직경과 동일한 직경을 갖는 원의 원주상에 배설된 제1, 제2 및 제3광위치검파기; 웨이퍼를 지지하고, 제1 내지 제3광위치 검파기에 관하여 지지된 웨이퍼를 이동하는 운송수단; 및 제1 내지 제3광위치 검파기 모두가 동시에 웨이퍼의 원주부를 검파하도록 제1 내지 제3광위치 검파기의 출력 신호에 따라 운송수단을 제어하는 제어수단으로 구송되는 웨이퍼 위치결정장치.
  2. 제1항에 있어서, 웨이퍼의 원주를 검파하며 원의 원주상에 배설된 제4광위치 검파기를 더욱 포함하며, 제어수단이 제1 내지 제4광위치 검파기를 제어하여, 4광위치 검파기중에서 임의의 3광위치 검파기가 동시에 웨이퍼의 원주부를 검파하도록 하는 웨이퍼 위치결정장치.
  3. 제2항에 있어서, 제1 내지 제4광위치 검파기가 균등한 간격으로 배치되어 있는 광위치결정 검파기.
  4. 제3항에 있어서, 원의 중심과 인접한 광위치 검파기를 연결하는 선에 의하여 형성된 각이 웨이퍼의 중심과 웨이퍼의 결정 오리엔테이션 플랫부가 편평하게 유지되는 2단을 접속하는 선에 의하여 형성된 각보다 더 큰 것을 특징으로 하는 웨이퍼 위치결정장치.
  5. 제1항에 있어서, 운송수단은 시계방향 및 반시계방향으로 회전되며 신장 또는 축소되는 아암을 갖춘 운송로보트로 구성되며, 아암은 흡입에 의하여 웨이퍼를 지지하기 위한 그의 단부에 흡입구멍을 갖춘 것을 특징으로 하는 웨이퍼 위치결정장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880013623A 1987-10-20 1988-10-19 웨이퍼 위치결정장치 KR910007106B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62-262736 1987-10-20
JP62262736A JPH0620097B2 (ja) 1987-10-20 1987-10-20 ウエハ位置決め装置

Publications (2)

Publication Number Publication Date
KR890007145A true KR890007145A (ko) 1989-06-19
KR910007106B1 KR910007106B1 (ko) 1991-09-18

Family

ID=17379870

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880013623A KR910007106B1 (ko) 1987-10-20 1988-10-19 웨이퍼 위치결정장치

Country Status (5)

Country Link
US (1) US4955780A (ko)
EP (1) EP0313466B1 (ko)
JP (1) JPH0620097B2 (ko)
KR (1) KR910007106B1 (ko)
DE (1) DE3855324T2 (ko)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JPH04298060A (ja) * 1991-03-26 1992-10-21 Tokyo Electron Ltd ウエハの位置合わせ装置
JP2986121B2 (ja) * 1991-03-26 1999-12-06 東京エレクトロン株式会社 ロードロック装置及び真空処理装置
TW201364B (ko) * 1991-04-09 1993-03-01 Ito Co Ltd
DE69329269T2 (de) * 1992-11-12 2000-12-28 Applied Materials Inc System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
US5443358A (en) * 1993-04-30 1995-08-22 Burton Industries, Inc. Indexing part loader
US6624433B2 (en) * 1994-02-22 2003-09-23 Nikon Corporation Method and apparatus for positioning substrate and the like
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
US5768125A (en) * 1995-12-08 1998-06-16 Asm International N.V. Apparatus for transferring a substantially circular article
JPH09321102A (ja) * 1996-05-31 1997-12-12 Tokyo Electron Ltd 検査装置
US6007292A (en) * 1998-02-11 1999-12-28 Crandell; Rod Work piece transfer apparatus
WO1999052686A1 (en) * 1998-04-16 1999-10-21 Genmark Automation, Inc. Substrate prealigner
US6298280B1 (en) * 1998-09-28 2001-10-02 Asyst Technologies, Inc. Method for in-cassette wafer center determination
US6188323B1 (en) * 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system
US6300644B1 (en) 1998-12-21 2001-10-09 Microtool, Inc. Tool for aligning a robot arm to a cassette for holding semiconductor wafers
US6075334A (en) * 1999-03-15 2000-06-13 Berkeley Process Control, Inc Automatic calibration system for wafer transfer robot
US6332751B1 (en) * 1999-04-02 2001-12-25 Tokyo Electron Limited Transfer device centering method and substrate processing apparatus
US6275742B1 (en) 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
US6516244B1 (en) 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
US6591161B2 (en) 2001-01-31 2003-07-08 Wafermasters, Inc. Method for determining robot alignment
US7008802B2 (en) 2001-05-29 2006-03-07 Asm America, Inc. Method and apparatus to correct water drift
JP4260423B2 (ja) * 2002-05-30 2009-04-30 ローツェ株式会社 円盤状物の基準位置教示方法、位置決め方法および搬送方法並びに、それらの方法を使用する円盤状物の基準位置教示装置、位置決め装置、搬送装置および半導体製造設備
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
KR101015778B1 (ko) * 2003-06-03 2011-02-22 도쿄엘렉트론가부시키가이샤 기판 처리장치 및 기판 수수 위치의 조정 방법
EP1489425B1 (de) * 2003-06-20 2007-02-14 Tecan Trading AG Vorrichtung und Verfahren zum Positionieren von Funktionselementen und/oder Behältern auf dem Arbeitsfeld eines Labormanipulators mittels zweier sich kreuzender Lichtschranken
US8041450B2 (en) 2007-10-04 2011-10-18 Asm Japan K.K. Position sensor system for substrate transfer robot
KR101489963B1 (ko) 2007-12-13 2015-02-04 한국에이에스엠지니텍 주식회사 박막 증착 장치 및 이를 이용한 증착 방법
US8273178B2 (en) 2008-02-28 2012-09-25 Asm Genitech Korea Ltd. Thin film deposition apparatus and method of maintaining the same
US7963736B2 (en) 2008-04-03 2011-06-21 Asm Japan K.K. Wafer processing apparatus with wafer alignment device
US9196518B1 (en) 2013-03-15 2015-11-24 Persimmon Technologies, Corp. Adaptive placement system and method
KR102469258B1 (ko) 2014-11-18 2022-11-22 퍼시몬 테크놀로지스 코포레이션 엔드 이펙터 위치 추정을 위한 로봇의 적응형 배치 시스템
US10145672B2 (en) 2017-01-24 2018-12-04 Lithoptek LLC Detection of position, orientation and scale of work pieces using retroreflective surfaces

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU474435A1 (ru) * 1973-04-12 1975-06-25 Государственный Научно-Исследовательский Институт Машиноведения Очувствленный робот
US3820647A (en) * 1973-09-14 1974-06-28 Texas Instruments Inc Slice pre aligner
US4024944A (en) * 1975-12-24 1977-05-24 Texas Instruments Incorporated Semiconductor slice prealignment system
US4376581A (en) * 1979-12-20 1983-03-15 Censor Patent- Und Versuchs-Anstalt Method of positioning disk-shaped workpieces, preferably semiconductor wafers
US4483654A (en) * 1981-02-13 1984-11-20 Lam Research Corporation Workpiece transfer mechanism
JPS5946026A (ja) * 1982-09-09 1984-03-15 Toshiba Corp 試料位置測定方法
US4633419A (en) * 1983-03-07 1986-12-30 Asahi Kogaku Kogyo K.K. Angle measuring device
JPS59172244A (ja) * 1983-03-22 1984-09-28 Nippon Telegr & Teleph Corp <Ntt> 円板形状体の切欠検出方法
JPS6085536A (ja) * 1983-10-17 1985-05-15 Hitachi Ltd ウエハ位置決め装置
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
JPS61184841A (ja) * 1985-02-13 1986-08-18 Canon Inc ウエハの位置決め方法および装置
JPS6220343A (ja) * 1985-07-19 1987-01-28 Hitachi Ltd ウエハ位置決め装置
JPS6276643A (ja) * 1985-09-30 1987-04-08 Mitaka Koki Kk ウエハの非接触位置決め装置
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer

Also Published As

Publication number Publication date
US4955780A (en) 1990-09-11
DE3855324T2 (de) 1996-10-10
EP0313466A2 (en) 1989-04-26
JPH01106440A (ja) 1989-04-24
DE3855324D1 (de) 1996-07-04
KR910007106B1 (ko) 1991-09-18
EP0313466A3 (en) 1990-09-05
JPH0620097B2 (ja) 1994-03-16
EP0313466B1 (en) 1996-05-29

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