KR880011909A - 필름캐리어 및 그 제조방법 - Google Patents
필름캐리어 및 그 제조방법 Download PDFInfo
- Publication number
- KR880011909A KR880011909A KR1019880002230A KR880002230A KR880011909A KR 880011909 A KR880011909 A KR 880011909A KR 1019880002230 A KR1019880002230 A KR 1019880002230A KR 880002230 A KR880002230 A KR 880002230A KR 880011909 A KR880011909 A KR 880011909A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- film carrier
- manufacturing
- rolled copper
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 필름캐리어 방식의 일예를 도시한 개략설명도.
제2도는 본 발명에 사용하는 구리합금박과 인성구리박의 각종 소둔 온도에 있어서의 항장력과 신장도를 표시한 그래프.
Claims (9)
- 수지제의 베이스 필름과, 그것에 라미네이트되는 압연구리박을 구비하고 그리고 이 압연구리박이 반도체칩등의 전자부품을 탑재하는 리이드부를 형성하는 필름캐리어에 있어서, 상기 압연구리박이 P 0.005~0.05중량%, B0.005~0.05중량% A1 0.01~0.5중량%, As 0.01~0.5중량% Cd 0.01~0.5중량%, Co 0.01~0.5중량%, Fe 0.01~0.5중량%, In 0.01~0.5중량%, Mg 0.01~0.5중량%, Mn 0.01~0.5중량%, Ni 0.01~0.5중량%, Si 0.01~0.5중량%, Sn 0.01~0.5중량%, Te 0.01~0.5중량%, Ag 0.01~1중량%, Cr 0.01~1중량%, Hf 0.01~1중량%, Zn 0.01~1중량%, Zr 0.01~1중량의 군으로부터 선택된 1종 또는 2종 이상의 성분을 0.005~1.5중량% 함유하고, 나머지부가 Cu 또는 불가피적 불순물로 이루어진 것을 특징으로 하는 필름 캐리어.
- 제1항에 있어서 In, Sn 및 Ag의 1종 이상이 선택되는 필름캐리어.
- 제1항 또는 제2항에 있어서, 산소 함유량이 50ppm이하인 필름캐리어.
- 반도체칩등의 전자부품을 탑재하는 필름캐리어의 리이드부를 P 0.005~0.5중량%, B 0.005~0.05중량%, A1 0.01~0.5중량%, As 0.01~0.5중량%, Cd 0.01~0.5중량%, Co 0.01~0.5중량%, Fe 0.01~0.5중량%, In 0.01~0.5중량%, Mg 0.01~0.5중량%, Mn 0.01~0.5중량%, Ni 0.01~0.5중량%, Si 0.01~0.5중량%, Sn 0.01~0.5중량%, Te 0.01~0.5중량%, Ag 0.01~1중량%, Cr 0.01~1중량%, Hf 0.01~1중량%, Zn 0.01~1중량%, Zr 0.01~1중량% 의 군으로부터 선택된 1종 또는 2종 이상의 성분을 0.005~1.5중량% 함유하고, 나머지부가 Cu 또는 불가피적 불순물로 이루어진 구리합금 조성으로된 압연구리 합금을 준비하고, 그것을 수지제의 베이스필름에 라미네이트 한 후, 에칭에 의해 형성하는 것을 특징으로 하는 필름캐리어의 제조방법.
- 제4항에 있어서, In, Sn 및 Ag의 1종 이상이 선택되는 필름캐리어의 제조방법.
- 제4항 또는 제5항에 있어서, 산소 함유량이 50ppm 이하인 필름캐리어의 제조방법.
- 반도체칩등의 전자부품을 탑재하는 필름캐리어 리이드부를 P 0.01~0.5중량%, B 0.01~0.5중량%, A1 0.01~0.5중량%, As 0.01~0.5중량%, Cd 0.01~0.5중량%, Co 0.01~0.5중량%, Fe 0.01~0.5중량%, In 0.01~0.5중량%, Mg 0.01~0.5중량%, Mn 0.01~0.5중량%, Ni 0.01~0.5중량%, Si 0.01~0.5중량%, Sn 0.01~0.5중량%, Te 0.01~0.5중량%, Ag 0.01~1중량%, Cr 0.01~1중량%, Hf 0.01~1중량%, Zn 0.01~1중량%, Zr 0.01~1중량%의 군으로부터 선택된 1종 또는 2종 이상의 성분을 0.005~1.5중량%함유하고, 나머지부가 Cu 또는 불가피적 불순물로 이루어진 구리합금 조성으로된 압연구리 합금을 준비하고, 그 최종 냉간 압연후 변형제거 thens을 하고, 수지제의 베이스 필름을 라미네이트 한 후, 에칭에 의해 형성하는 것을 특징으로 하는 캐리어의 제조방법.
- 제7항에 있어서, In, Sn 및 Ag의 1종 이상이 선택되는 필름캐리어의 제조방법.
- 제7항 또는 제8항에 있어서, 산소 함유량이 50ppm 이하인 필름캐리어의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-047450 | 1987-03-04 | ||
JP62047450A JPH0616522B2 (ja) | 1987-03-04 | 1987-03-04 | テ−プキヤリヤ用銅合金箔 |
JP62-47450 | 1987-03-04 | ||
JP62167897A JPH0815170B2 (ja) | 1987-07-07 | 1987-07-07 | フィルムキャリヤの製造方法 |
JP62-167896 | 1987-07-07 | ||
JP62-167897 | 1987-07-07 | ||
JP62167896A JPH0616523B2 (ja) | 1987-07-07 | 1987-07-07 | フィルムキャリヤ及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880011909A true KR880011909A (ko) | 1988-10-31 |
KR910001420B1 KR910001420B1 (ko) | 1991-03-05 |
Family
ID=27292981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880002230A KR910001420B1 (ko) | 1987-03-04 | 1988-03-04 | 필름캐리어 및 그 제조방법 |
Country Status (4)
Country | Link |
---|---|
US (2) | US4908275A (ko) |
EP (1) | EP0281038B1 (ko) |
KR (1) | KR910001420B1 (ko) |
DE (1) | DE3860618D1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200074767A (ko) * | 2018-12-17 | 2020-06-25 | 현대자동차주식회사 | 로즈골드색 구리 합금 및 이의 용도 |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4935312A (en) * | 1987-06-25 | 1990-06-19 | Nippon Mining Co., Ltd. | Film carrier having tin and indium plated layers |
US5035759A (en) * | 1989-09-19 | 1991-07-30 | Andoe, Inc. | Method of protecting hulls of marine vessels from fouling |
WO1991018416A1 (en) * | 1990-05-14 | 1991-11-28 | Richard Lee Schendelman | Interdigitated trans-die lead construction and method of construction for maximizing population density of chip-on-board construction |
JP2611867B2 (ja) * | 1990-10-25 | 1997-05-21 | 富士写真フイルム株式会社 | 改良されたコイル導体層を備える薄膜磁気ヘッド |
US5571312A (en) * | 1992-07-28 | 1996-11-05 | Cresco Inc., Sa. | Environmentally safe epoxy adhesive-copper hull coating and method |
US5336304A (en) * | 1992-07-28 | 1994-08-09 | Cresco, Inc., Sa. | Environmentally safe epoxy adhesive-copper hull coating and method |
US5370840A (en) * | 1992-11-04 | 1994-12-06 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
US5486244A (en) * | 1992-11-04 | 1996-01-23 | Olin Corporation | Process for improving the bend formability of copper alloys |
US5306465A (en) * | 1992-11-04 | 1994-04-26 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
US6022426A (en) * | 1995-05-31 | 2000-02-08 | Brush Wellman Inc. | Multilayer laminate process |
DE69637333T2 (de) * | 1995-06-27 | 2008-10-02 | International Business Machines Corp. | Kupferlegierungen für Chipverbindungen und Herstellungsverfahren |
US5681662A (en) * | 1995-09-15 | 1997-10-28 | Olin Corporation | Copper alloy foils for flexible circuits |
US6455937B1 (en) | 1998-03-20 | 2002-09-24 | James A. Cunningham | Arrangement and method for improved downward scaling of higher conductivity metal-based interconnects |
JP3856582B2 (ja) * | 1998-11-17 | 2006-12-13 | 日鉱金属株式会社 | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP3856581B2 (ja) * | 1999-01-18 | 2006-12-13 | 日鉱金属株式会社 | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP2000349085A (ja) * | 1999-06-01 | 2000-12-15 | Nec Corp | 半導体装置及び半導体装置の製造方法 |
US6241831B1 (en) | 1999-06-07 | 2001-06-05 | Waterbury Rolling Mills, Inc. | Copper alloy |
US6521532B1 (en) | 1999-07-22 | 2003-02-18 | James A. Cunningham | Method for making integrated circuit including interconnects with enhanced electromigration resistance |
US6551872B1 (en) | 1999-07-22 | 2003-04-22 | James A. Cunningham | Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby |
US6441492B1 (en) | 1999-09-10 | 2002-08-27 | James A. Cunningham | Diffusion barriers for copper interconnect systems |
US6440849B1 (en) * | 1999-10-18 | 2002-08-27 | Agere Systems Guardian Corp. | Microstructure control of copper interconnects |
DE10025106A1 (de) * | 2000-05-20 | 2001-11-22 | Stolberger Metallwerke Gmbh | Elektrisch leitfähiges Metallband und Steckverbinder hieraus |
US6749699B2 (en) * | 2000-08-09 | 2004-06-15 | Olin Corporation | Silver containing copper alloy |
JP4381574B2 (ja) * | 2000-08-17 | 2009-12-09 | 日鉱金属株式会社 | 積層板用銅合金箔 |
KR100491385B1 (ko) * | 2001-07-04 | 2005-05-24 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | 적층판용 구리합금박 |
CN1681373A (zh) * | 2001-08-10 | 2005-10-12 | 日矿金属加工株式会社 | 层叠板用铜合金箔 |
US6835655B1 (en) | 2001-11-26 | 2004-12-28 | Advanced Micro Devices, Inc. | Method of implanting copper barrier material to improve electrical performance |
US7696092B2 (en) * | 2001-11-26 | 2010-04-13 | Globalfoundries Inc. | Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect |
US6703307B2 (en) | 2001-11-26 | 2004-03-09 | Advanced Micro Devices, Inc. | Method of implantation after copper seed deposition |
US6703308B1 (en) | 2001-11-26 | 2004-03-09 | Advanced Micro Devices, Inc. | Method of inserting alloy elements to reduce copper diffusion and bulk diffusion |
US6861349B1 (en) | 2002-05-15 | 2005-03-01 | Advanced Micro Devices, Inc. | Method of forming an adhesion layer with an element reactive with a barrier layer |
DE10237052A1 (de) * | 2002-08-09 | 2004-02-19 | Km Europa Metal Ag | Verwendung einer niedriglegierten Kupferlegierung und hieraus hergestelltes Hohlprofilbauteil |
US7169706B2 (en) * | 2003-10-16 | 2007-01-30 | Advanced Micro Devices, Inc. | Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper deposition |
JP4330517B2 (ja) * | 2004-11-02 | 2009-09-16 | 株式会社神戸製鋼所 | Cu合金薄膜およびCu合金スパッタリングターゲット並びにフラットパネルディスプレイ |
JP4542008B2 (ja) * | 2005-06-07 | 2010-09-08 | 株式会社神戸製鋼所 | 表示デバイス |
JP5170866B2 (ja) * | 2006-10-10 | 2013-03-27 | 古河電気工業株式会社 | 電気・電子部品用銅合金材およびその製造方法 |
JP2008166141A (ja) * | 2006-12-28 | 2008-07-17 | Auto Network Gijutsu Kenkyusho:Kk | 電線導体および絶縁電線 |
CA2702358A1 (en) * | 2007-10-10 | 2009-04-16 | Gbc Metals, Llc | Copper tin nickel phosphorus alloys with improved strength and formability |
JP4992940B2 (ja) * | 2009-06-22 | 2012-08-08 | 日立電線株式会社 | 圧延銅箔 |
JP4888586B2 (ja) * | 2010-06-18 | 2012-02-29 | 日立電線株式会社 | 圧延銅箔 |
CN113564407A (zh) * | 2021-07-27 | 2021-10-29 | 中国兵器科学研究院宁波分院 | 一种耐热碲铜合金材料及其制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3728178A (en) * | 1970-07-30 | 1973-04-17 | Olin Corp | Method of producing flexible copper laminate for printed circuits |
JPS60206639A (ja) * | 1984-03-31 | 1985-10-18 | 日東電工株式会社 | ポリイミド−金属箔複合フイルムの製造方法 |
GB8419490D0 (en) * | 1984-07-31 | 1984-09-05 | Gen Electric Co Plc | Solderable contact materials |
US4764413A (en) * | 1984-09-13 | 1988-08-16 | Sharp Kabushiki Kaisha | Metal-based organic film substrate |
JPS61242052A (ja) * | 1985-04-19 | 1986-10-28 | Mitsubishi Shindo Kk | 半導体装置用銅合金リ−ド材 |
JPS61284544A (ja) * | 1985-06-11 | 1986-12-15 | Mitsubishi Electric Corp | 半導体素子用銅合金 |
US4762747A (en) * | 1986-07-29 | 1988-08-09 | Industrial Technology Research Institute | Single component aqueous acrylic adhesive compositions for flexible printed circuits and laminates made therefrom |
-
1988
- 1988-02-25 US US07/160,479 patent/US4908275A/en not_active Expired - Lifetime
- 1988-02-26 EP EP19880102929 patent/EP0281038B1/en not_active Expired - Lifetime
- 1988-02-26 DE DE8888102929T patent/DE3860618D1/de not_active Expired - Lifetime
- 1988-03-04 KR KR1019880002230A patent/KR910001420B1/ko not_active IP Right Cessation
-
1989
- 1989-12-01 US US07/444,575 patent/US5004520A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200074767A (ko) * | 2018-12-17 | 2020-06-25 | 현대자동차주식회사 | 로즈골드색 구리 합금 및 이의 용도 |
Also Published As
Publication number | Publication date |
---|---|
EP0281038A2 (en) | 1988-09-07 |
US4908275A (en) | 1990-03-13 |
EP0281038A3 (en) | 1989-02-15 |
DE3860618D1 (de) | 1990-10-25 |
KR910001420B1 (ko) | 1991-03-05 |
EP0281038B1 (en) | 1990-09-19 |
US5004520A (en) | 1991-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR880011909A (ko) | 필름캐리어 및 그 제조방법 | |
US6132529A (en) | Leadframe made of a high-strength, high-electroconductivity copper alloy | |
CN1688732B (zh) | 时效硬化型铜基合金及其制备工艺 | |
US4337089A (en) | Copper-nickel-tin alloys for lead conductor materials for integrated circuits and a method for producing the same | |
KR870002263A (ko) | 향상된 강도 및 전도성을 갖는 동합금 및 그 제조방법 | |
KR870004156A (ko) | 동합금 및 그 제조방법 | |
GB2181742A (en) | Copper alloy lead material for use in semiconductor device | |
JPH04231431A (ja) | 機械加工可能な鍛造用銅含有合金 | |
KR880003021A (ko) | 전자기기용 구리합금 및 그 제조방법 | |
Chandra et al. | Grain-boundary sliding and intergranular cavitation during superplastic deformation of α/β brass | |
KR840007753A (ko) | 석출경화성 구리합금 및 제조법 | |
KR860003360A (ko) | 동합금과 그 제조법 | |
KR960010146B1 (ko) | 리드프레임 및 그를 이용한 반도체 패키지 | |
JPS63109130A (ja) | 電子機器用銅合金 | |
JPS6456842A (en) | Copper alloy foil for flexible circuit board | |
JPH0372045A (ja) | 酸化膜密着性に優れた高力高導電性銅合金 | |
KR960010816B1 (ko) | 반도체장치용 Cu 합금제 리이드프레임재 | |
JPS63262448A (ja) | 錫又は錫合金めつきの耐熱剥離性に優れた銅合金の製造方法 | |
US3880678A (en) | Processing copper base alloy | |
US5205878A (en) | Copper-based electric and electronic parts having high strength and high electric conductivity | |
JPS6260838A (ja) | リ−ドフレ−ム用銅合金 | |
JPS5839912B2 (ja) | リ−ド用銅合金材の製造方法 | |
JPS6267144A (ja) | リ−ドフレ−ム用銅合金 | |
KR880004118A (ko) | 구리를 기재로한 전자부품 구조용의 금속합금 | |
JPS6412538A (en) | Film carrier and manufacture thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20070223 Year of fee payment: 17 |
|
EXPY | Expiration of term |