DE3860618D1 - Filmtraeger und verfahren zu seiner herstellung. - Google Patents

Filmtraeger und verfahren zu seiner herstellung.

Info

Publication number
DE3860618D1
DE3860618D1 DE8888102929T DE3860618T DE3860618D1 DE 3860618 D1 DE3860618 D1 DE 3860618D1 DE 8888102929 T DE8888102929 T DE 8888102929T DE 3860618 T DE3860618 T DE 3860618T DE 3860618 D1 DE3860618 D1 DE 3860618D1
Authority
DE
Germany
Prior art keywords
production
film carrier
carrier
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8888102929T
Other languages
English (en)
Inventor
Masahiro Tsuji
Susumu Kawauchi
Hiroshi Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62047450A external-priority patent/JPH0616522B2/ja
Priority claimed from JP62167897A external-priority patent/JPH0815170B2/ja
Priority claimed from JP62167896A external-priority patent/JPH0616523B2/ja
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Application granted granted Critical
Publication of DE3860618D1 publication Critical patent/DE3860618D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
DE8888102929T 1987-03-04 1988-02-26 Filmtraeger und verfahren zu seiner herstellung. Expired - Lifetime DE3860618D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62047450A JPH0616522B2 (ja) 1987-03-04 1987-03-04 テ−プキヤリヤ用銅合金箔
JP62167897A JPH0815170B2 (ja) 1987-07-07 1987-07-07 フィルムキャリヤの製造方法
JP62167896A JPH0616523B2 (ja) 1987-07-07 1987-07-07 フィルムキャリヤ及びその製造方法

Publications (1)

Publication Number Publication Date
DE3860618D1 true DE3860618D1 (de) 1990-10-25

Family

ID=27292981

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888102929T Expired - Lifetime DE3860618D1 (de) 1987-03-04 1988-02-26 Filmtraeger und verfahren zu seiner herstellung.

Country Status (4)

Country Link
US (2) US4908275A (de)
EP (1) EP0281038B1 (de)
KR (1) KR910001420B1 (de)
DE (1) DE3860618D1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS642330A (en) * 1987-06-25 1989-01-06 Nippon Mining Co Ltd Film carrier and manufacture thereof
US5035759A (en) * 1989-09-19 1991-07-30 Andoe, Inc. Method of protecting hulls of marine vessels from fouling
AU7954491A (en) * 1990-05-14 1991-12-10 Richard Lee Schendelman Interdigitated trans-die lead construction and method of construction for maximizing population density of chip-on-board construction
JP2611867B2 (ja) * 1990-10-25 1997-05-21 富士写真フイルム株式会社 改良されたコイル導体層を備える薄膜磁気ヘッド
US5336304A (en) * 1992-07-28 1994-08-09 Cresco, Inc., Sa. Environmentally safe epoxy adhesive-copper hull coating and method
US5571312A (en) * 1992-07-28 1996-11-05 Cresco Inc., Sa. Environmentally safe epoxy adhesive-copper hull coating and method
US5486244A (en) * 1992-11-04 1996-01-23 Olin Corporation Process for improving the bend formability of copper alloys
US5370840A (en) * 1992-11-04 1994-12-06 Olin Corporation Copper alloy having high strength and high electrical conductivity
US5306465A (en) * 1992-11-04 1994-04-26 Olin Corporation Copper alloy having high strength and high electrical conductivity
US6022426A (en) * 1995-05-31 2000-02-08 Brush Wellman Inc. Multilayer laminate process
KR100232506B1 (ko) * 1995-06-27 1999-12-01 포만 제프리 엘. 전기적 접속을 제공하는 배선 구조 및 도체와 그 도체형성방법
US5681662A (en) * 1995-09-15 1997-10-28 Olin Corporation Copper alloy foils for flexible circuits
US6455937B1 (en) 1998-03-20 2002-09-24 James A. Cunningham Arrangement and method for improved downward scaling of higher conductivity metal-based interconnects
JP3856582B2 (ja) * 1998-11-17 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP3856581B2 (ja) * 1999-01-18 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2000349085A (ja) * 1999-06-01 2000-12-15 Nec Corp 半導体装置及び半導体装置の製造方法
US6241831B1 (en) 1999-06-07 2001-06-05 Waterbury Rolling Mills, Inc. Copper alloy
US6551872B1 (en) 1999-07-22 2003-04-22 James A. Cunningham Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby
US6521532B1 (en) 1999-07-22 2003-02-18 James A. Cunningham Method for making integrated circuit including interconnects with enhanced electromigration resistance
US6441492B1 (en) 1999-09-10 2002-08-27 James A. Cunningham Diffusion barriers for copper interconnect systems
US6440849B1 (en) * 1999-10-18 2002-08-27 Agere Systems Guardian Corp. Microstructure control of copper interconnects
DE10025106A1 (de) * 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leitfähiges Metallband und Steckverbinder hieraus
US6749699B2 (en) * 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy
JP4381574B2 (ja) * 2000-08-17 2009-12-09 日鉱金属株式会社 積層板用銅合金箔
KR100491385B1 (ko) * 2001-07-04 2005-05-24 닛꼬 긴조꾸 가꼬 가부시키가이샤 적층판용 구리합금박
US6808825B2 (en) * 2001-08-10 2004-10-26 Nikko Metal Manufacturing Co., Ltd. Copper alloy foil
US6835655B1 (en) 2001-11-26 2004-12-28 Advanced Micro Devices, Inc. Method of implanting copper barrier material to improve electrical performance
US7696092B2 (en) * 2001-11-26 2010-04-13 Globalfoundries Inc. Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect
US6703308B1 (en) 2001-11-26 2004-03-09 Advanced Micro Devices, Inc. Method of inserting alloy elements to reduce copper diffusion and bulk diffusion
US6703307B2 (en) 2001-11-26 2004-03-09 Advanced Micro Devices, Inc. Method of implantation after copper seed deposition
US6861349B1 (en) 2002-05-15 2005-03-01 Advanced Micro Devices, Inc. Method of forming an adhesion layer with an element reactive with a barrier layer
DE10237052A1 (de) * 2002-08-09 2004-02-19 Km Europa Metal Ag Verwendung einer niedriglegierten Kupferlegierung und hieraus hergestelltes Hohlprofilbauteil
US7169706B2 (en) * 2003-10-16 2007-01-30 Advanced Micro Devices, Inc. Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper deposition
JP4330517B2 (ja) * 2004-11-02 2009-09-16 株式会社神戸製鋼所 Ｃｕ合金薄膜およびＣｕ合金スパッタリングターゲット並びにフラットパネルディスプレイ
JP4542008B2 (ja) * 2005-06-07 2010-09-08 株式会社神戸製鋼所 表示デバイス
JP5170866B2 (ja) * 2006-10-10 2013-03-27 古河電気工業株式会社 電気・電子部品用銅合金材およびその製造方法
JP2008166141A (ja) * 2006-12-28 2008-07-17 Auto Network Gijutsu Kenkyusho:Kk 電線導体および絶縁電線
WO2009049201A1 (en) * 2007-10-10 2009-04-16 Gbc Metals, Llc Copper tin nickel phosphorus alloys with improved strength and formability
JP4992940B2 (ja) * 2009-06-22 2012-08-08 日立電線株式会社 圧延銅箔
JP4888586B2 (ja) * 2010-06-18 2012-02-29 日立電線株式会社 圧延銅箔
KR102610328B1 (ko) * 2018-12-17 2023-12-06 현대자동차주식회사 로즈골드색 구리 합금 및 이의 용도
CN113564407A (zh) * 2021-07-27 2021-10-29 中国兵器科学研究院宁波分院 一种耐热碲铜合金材料及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3728178A (en) * 1970-07-30 1973-04-17 Olin Corp Method of producing flexible copper laminate for printed circuits
JPS60206639A (ja) * 1984-03-31 1985-10-18 日東電工株式会社 ポリイミド−金属箔複合フイルムの製造方法
GB8419490D0 (en) * 1984-07-31 1984-09-05 Gen Electric Co Plc Solderable contact materials
US4764413A (en) * 1984-09-13 1988-08-16 Sharp Kabushiki Kaisha Metal-based organic film substrate
JPS61242052A (ja) * 1985-04-19 1986-10-28 Mitsubishi Shindo Kk 半導体装置用銅合金リ−ド材
JPS61284544A (ja) * 1985-06-11 1986-12-15 Mitsubishi Electric Corp 半導体素子用銅合金
US4762747A (en) * 1986-07-29 1988-08-09 Industrial Technology Research Institute Single component aqueous acrylic adhesive compositions for flexible printed circuits and laminates made therefrom

Also Published As

Publication number Publication date
US4908275A (en) 1990-03-13
EP0281038A3 (en) 1989-02-15
KR880011909A (ko) 1988-10-31
KR910001420B1 (ko) 1991-03-05
US5004520A (en) 1991-04-02
EP0281038B1 (de) 1990-09-19
EP0281038A2 (de) 1988-09-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee