DE3683265D1 - Polyimidfilm und verfahren zu seiner herstellung. - Google Patents

Polyimidfilm und verfahren zu seiner herstellung.

Info

Publication number
DE3683265D1
DE3683265D1 DE8686116533T DE3683265T DE3683265D1 DE 3683265 D1 DE3683265 D1 DE 3683265D1 DE 8686116533 T DE8686116533 T DE 8686116533T DE 3683265 T DE3683265 T DE 3683265T DE 3683265 D1 DE3683265 D1 DE 3683265D1
Authority
DE
Germany
Prior art keywords
producing
same
polyimide film
polyimide
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686116533T
Other languages
English (en)
Inventor
Hirosaku Nagano
Junji Takase
Hideki Kawai
Hitoshi Nojiri
Tsuneo Yamamoto
Kazuya Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Application granted granted Critical
Publication of DE3683265D1 publication Critical patent/DE3683265D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE8686116533T 1985-11-29 1986-11-28 Polyimidfilm und verfahren zu seiner herstellung. Expired - Fee Related DE3683265D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60270118A JPH0665708B2 (ja) 1985-11-29 1985-11-29 新規ポリイミドフィルム及びその製造法

Publications (1)

Publication Number Publication Date
DE3683265D1 true DE3683265D1 (de) 1992-02-13

Family

ID=17481795

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686116533T Expired - Fee Related DE3683265D1 (de) 1985-11-29 1986-11-28 Polyimidfilm und verfahren zu seiner herstellung.

Country Status (5)

Country Link
US (1) US4742099A (de)
EP (1) EP0227959B1 (de)
JP (1) JPH0665708B2 (de)
CA (1) CA1287938C (de)
DE (1) DE3683265D1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2673547B2 (ja) * 1988-07-15 1997-11-05 鐘淵化学工業株式会社 改良されたポリイミドフィルム及び該製造方法
US5227244A (en) * 1990-09-21 1993-07-13 E. I. Du Pont De Nemours And Company Polyimide film with metal salt coating resulting in improved adhesion
US6475624B1 (en) 1998-11-20 2002-11-05 Kaneka Corporation Polyimide/fluororesin laminates, producing method thereof, and insulating tape for wire-winding using the same
JP2006339164A (ja) * 1998-11-20 2006-12-14 Kaneka Corp 電線被覆用絶縁テープ
US6586081B1 (en) * 1999-03-12 2003-07-01 Kaneka Corporation Polyimide/metal laminate, and electric/electronic equipment bases, magnetic recording bases, solar battery bases, coating film for aerospace materials and filmy resistance elements with the use thereof
JP2004098570A (ja) * 2002-09-11 2004-04-02 Amt Kenkyusho:Kk フィルム状積層体およびフレキシブル回路基板
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
US20060048963A1 (en) * 2002-12-05 2006-03-09 Masaru Nishinaka Laminate, printed circuit board, and preparing method thereof
KR100742066B1 (ko) * 2002-12-13 2007-07-23 가부시키가이샤 가네카 열가소성 폴리이미드 수지 필름, 적층체 및 그것을 포함하는 인쇄 배선판의 제조 방법
JP2006119203A (ja) * 2004-10-19 2006-05-11 Nitto Denko Corp 偏光板および偏光板の製造方法、ならびに、このような偏光板を用いた液晶パネル、液晶テレビおよび液晶表示装置
US7790276B2 (en) * 2006-03-31 2010-09-07 E. I. Du Pont De Nemours And Company Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto
US20120009406A1 (en) * 2008-05-20 2012-01-12 E.I. Du Pont De Nemours And Company Thermally and dimensionally stable polyimide films and methods relating thereto
EP2501741A1 (de) 2009-11-20 2012-09-26 E. I. du Pont de Nemours and Company Deckschichtzusammensetzungen und entsprechende verfahren
US11021606B2 (en) 2017-09-13 2021-06-01 E I Du Pont De Nemours And Company Multilayer film for electronic circuitry applications
WO2020076810A1 (en) 2018-10-09 2020-04-16 Dupont Electronics, Inc. Thermal substrates
TW202110948A (zh) 2019-06-14 2021-03-16 美商杜邦電子股份有限公司 聚合物膜及電子裝置
US11643514B2 (en) 2021-04-23 2023-05-09 Dupont Electronics, Inc. Polyimide films and electronic devices

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069192A (en) * 1976-01-30 1978-01-17 Kenrich Petrochemicals, Inc. Liquid thermosetting resins containing titanate salts
JPS54129027A (en) * 1978-03-30 1979-10-06 Furukawa Electric Co Ltd:The Preparation of polyester resin for hot-melt coating
US4240941A (en) * 1978-07-11 1980-12-23 General Electric Company Coating compositions
US4277415A (en) * 1979-08-29 1981-07-07 Kenrich Petrochemicals, Inc. Pyrophosphato titanate adducts
JPH064815B2 (ja) * 1980-12-04 1994-01-19 昭和電線電纜株式会社 溶融塗装用ポリエステル系樹脂組成物
US4424294A (en) * 1981-07-15 1984-01-03 Standard Oil Company, (Indiana) Injection moldable amide-imide polymers and copolymers containing titanates
JPS5962662A (ja) * 1982-10-01 1984-04-10 Hitachi Chem Co Ltd 耐熱性樹脂組成物
JPS59179538A (ja) * 1983-03-30 1984-10-12 Maruki Kagaku Kogyo Kk 高比重熱可塑性樹脂組成物

Also Published As

Publication number Publication date
JPH0665708B2 (ja) 1994-08-24
EP0227959B1 (de) 1992-01-02
EP0227959A2 (de) 1987-07-08
JPS62129352A (ja) 1987-06-11
US4742099A (en) 1988-05-03
EP0227959A3 (en) 1989-02-01
CA1287938C (en) 1991-08-20

Similar Documents

Publication Publication Date Title
DE3686792D1 (de) Amphiphiler polyimid-vorlaeufer und verfahren zu seiner herstellung.
DE3860618D1 (de) Filmtraeger und verfahren zu seiner herstellung.
DE3688093D1 (de) Durchsichtiger gegenstand und verfahren zu seiner herstellung.
DE3784612D1 (de) Thermistor und verfahren zu seiner herstellung.
DE3875127D1 (de) Waermeschrumpfbarer verbundfilm und verfahren zu seiner herstellung.
DE3679087D1 (de) Halbleitervorrichtung und verfahren zu seiner herstellung.
DE3682021D1 (de) Polysilizium-mos-transistor und verfahren zu seiner herstellung.
DE3686976D1 (de) Bipolares halbleiterbauelement und verfahren zu seiner herstellung.
DE3682874D1 (de) Pyranoindolizinderivate und verfahren zu ihrer herstellung.
DE3581563D1 (de) Polysiloxanpfropfcopolymer und verfahren zu dessen herstellung.
DE3575289D1 (de) Kompaktes kubisches bornitrid und verfahren zu seiner herstellung.
DE3485043D1 (de) Mehrfarbige anzeigevorrichtung und verfahren zu seiner herstellung.
DE3679916D1 (de) Laminat und verfahren zu seiner herstellung.
DE3686017D1 (de) Anisotroper gleichrichter und verfahren zu seiner herstellung.
DE3675741D1 (de) Vernetzte copolyamidimide und verfahren zu deren herstellung.
DE3685346D1 (de) Magnetischer duenner film und verfahren zu seiner herstellung.
DE3667259D1 (de) Orientierte elastomerfolie und verfahren zu deren herstellung.
DE3877256D1 (de) Beschichteter gegenstand und verfahren zu seiner herstellung.
DE3668254D1 (de) Chip-widerstand und verfahren zur herstellung.
DE3681938D1 (de) Halbleitersensor und verfahren zu seiner herstellung.
DE3874372D1 (de) Polysiloxan-polyimide und verfahren zu deren herstellung.
DE3684654D1 (de) Elektrochemisches element und verfahren zu seiner herstellung.
DE3683602D1 (de) Haustierfutter und haustierfutterbestandteil und verfahren zu seiner herstellung.
DE3683265D1 (de) Polyimidfilm und verfahren zu seiner herstellung.
DE3682959D1 (de) Bipolarer transistor mit heterouebergang und verfahren zu seiner herstellung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee