JPS6412538A - Film carrier and manufacture thereof - Google Patents

Film carrier and manufacture thereof

Info

Publication number
JPS6412538A
JPS6412538A JP62167896A JP16789687A JPS6412538A JP S6412538 A JPS6412538 A JP S6412538A JP 62167896 A JP62167896 A JP 62167896A JP 16789687 A JP16789687 A JP 16789687A JP S6412538 A JPS6412538 A JP S6412538A
Authority
JP
Japan
Prior art keywords
film carrier
alloy
lead section
annealed
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62167896A
Other languages
Japanese (ja)
Other versions
JPH0616523B2 (en
Inventor
Hiroshi Nakayama
Masahiro Tsuji
Susumu Kawauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP62167896A priority Critical patent/JPH0616523B2/en
Priority to US07/160,479 priority patent/US4908275A/en
Priority to EP19880102929 priority patent/EP0281038B1/en
Priority to DE8888102929T priority patent/DE3860618D1/en
Priority to KR1019880002230A priority patent/KR910001420B1/en
Publication of JPS6412538A publication Critical patent/JPS6412538A/en
Priority to US07/444,575 priority patent/US5004520A/en
Publication of JPH0616523B2 publication Critical patent/JPH0616523B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To prepare a film carrier for enhanced integration and heatwithstanding capability by a method wherein a lead section of the film carrier for electronic components is formed of a specified copper foil cold-rolled, annealed, and then is laminated with a resin-made base film before etching. CONSTITUTION:The Cu alloy to constitute a lead section of a film carrier for an electronic component such as a semiconductor chip is to contain 0.005-1.5 weight % of one or more elements selected out of those named in the attached table. For the formation of the lead section, the oxygen present in the Cu alloy should be 50ppm or less, the rest being the Cu alloy including inevitable impurities. The Cu alloy, after the final cold rolling process, is annealed for the removal of stress, laminated with a resin-made base film, and then etched into a desired pattern. This design results in a film carrier lead ready for use in enhanced-integration and high-temperature environments.
JP62167896A 1987-03-04 1987-07-07 Film carrier and manufacturing method thereof Expired - Lifetime JPH0616523B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP62167896A JPH0616523B2 (en) 1987-07-07 1987-07-07 Film carrier and manufacturing method thereof
US07/160,479 US4908275A (en) 1987-03-04 1988-02-25 Film carrier and method of manufacturing same
EP19880102929 EP0281038B1 (en) 1987-03-04 1988-02-26 Film carrier and method of manufacturing same
DE8888102929T DE3860618D1 (en) 1987-03-04 1988-02-26 FILM CARRIER AND METHOD FOR THE PRODUCTION THEREOF.
KR1019880002230A KR910001420B1 (en) 1987-03-04 1988-03-04 Film carrier and method of manufacturing same
US07/444,575 US5004520A (en) 1987-03-04 1989-12-01 Method of manufacturing film carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62167896A JPH0616523B2 (en) 1987-07-07 1987-07-07 Film carrier and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPS6412538A true JPS6412538A (en) 1989-01-17
JPH0616523B2 JPH0616523B2 (en) 1994-03-02

Family

ID=15858071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62167896A Expired - Lifetime JPH0616523B2 (en) 1987-03-04 1987-07-07 Film carrier and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPH0616523B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064431A (en) * 2001-08-20 2003-03-05 Nippon Mining & Metals Co Ltd Copper alloy foil for laminate sheet
JP2007016260A (en) * 2005-07-06 2007-01-25 Sumitomo Kinzoku Kozan Shindo Kk Copper alloy rolled foil
JP2007217792A (en) * 2007-02-02 2007-08-30 Hitachi Cable Ltd Copper alloy material, method for producing copper alloy conductor using the same, copper alloy conductor obtained by the method and cable using the same
JP2012214894A (en) * 2011-03-31 2012-11-08 Nippon Steel Chem Co Ltd Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate
JP2014077192A (en) * 2012-09-20 2014-05-01 Jx Nippon Mining & Metals Corp Copper alloy and connector terminal material for high current
US8845829B2 (en) 2003-10-24 2014-09-30 Hitachi Metals, Ltd. Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62189738A (en) * 1986-02-17 1987-08-19 Furukawa Electric Co Ltd:The Tape for semiconductor lead

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62189738A (en) * 1986-02-17 1987-08-19 Furukawa Electric Co Ltd:The Tape for semiconductor lead

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064431A (en) * 2001-08-20 2003-03-05 Nippon Mining & Metals Co Ltd Copper alloy foil for laminate sheet
US8845829B2 (en) 2003-10-24 2014-09-30 Hitachi Metals, Ltd. Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor
JP2007016260A (en) * 2005-07-06 2007-01-25 Sumitomo Kinzoku Kozan Shindo Kk Copper alloy rolled foil
JP2007217792A (en) * 2007-02-02 2007-08-30 Hitachi Cable Ltd Copper alloy material, method for producing copper alloy conductor using the same, copper alloy conductor obtained by the method and cable using the same
JP2012214894A (en) * 2011-03-31 2012-11-08 Nippon Steel Chem Co Ltd Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate
JP2014077192A (en) * 2012-09-20 2014-05-01 Jx Nippon Mining & Metals Corp Copper alloy and connector terminal material for high current

Also Published As

Publication number Publication date
JPH0616523B2 (en) 1994-03-02

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