JPS6412538A - Film carrier and manufacture thereof - Google Patents
Film carrier and manufacture thereofInfo
- Publication number
- JPS6412538A JPS6412538A JP62167896A JP16789687A JPS6412538A JP S6412538 A JPS6412538 A JP S6412538A JP 62167896 A JP62167896 A JP 62167896A JP 16789687 A JP16789687 A JP 16789687A JP S6412538 A JPS6412538 A JP S6412538A
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- alloy
- lead section
- annealed
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE:To prepare a film carrier for enhanced integration and heatwithstanding capability by a method wherein a lead section of the film carrier for electronic components is formed of a specified copper foil cold-rolled, annealed, and then is laminated with a resin-made base film before etching. CONSTITUTION:The Cu alloy to constitute a lead section of a film carrier for an electronic component such as a semiconductor chip is to contain 0.005-1.5 weight % of one or more elements selected out of those named in the attached table. For the formation of the lead section, the oxygen present in the Cu alloy should be 50ppm or less, the rest being the Cu alloy including inevitable impurities. The Cu alloy, after the final cold rolling process, is annealed for the removal of stress, laminated with a resin-made base film, and then etched into a desired pattern. This design results in a film carrier lead ready for use in enhanced-integration and high-temperature environments.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62167896A JPH0616523B2 (en) | 1987-07-07 | 1987-07-07 | Film carrier and manufacturing method thereof |
US07/160,479 US4908275A (en) | 1987-03-04 | 1988-02-25 | Film carrier and method of manufacturing same |
EP19880102929 EP0281038B1 (en) | 1987-03-04 | 1988-02-26 | Film carrier and method of manufacturing same |
DE8888102929T DE3860618D1 (en) | 1987-03-04 | 1988-02-26 | FILM CARRIER AND METHOD FOR THE PRODUCTION THEREOF. |
KR1019880002230A KR910001420B1 (en) | 1987-03-04 | 1988-03-04 | Film carrier and method of manufacturing same |
US07/444,575 US5004520A (en) | 1987-03-04 | 1989-12-01 | Method of manufacturing film carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62167896A JPH0616523B2 (en) | 1987-07-07 | 1987-07-07 | Film carrier and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6412538A true JPS6412538A (en) | 1989-01-17 |
JPH0616523B2 JPH0616523B2 (en) | 1994-03-02 |
Family
ID=15858071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62167896A Expired - Lifetime JPH0616523B2 (en) | 1987-03-04 | 1987-07-07 | Film carrier and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0616523B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003064431A (en) * | 2001-08-20 | 2003-03-05 | Nippon Mining & Metals Co Ltd | Copper alloy foil for laminate sheet |
JP2007016260A (en) * | 2005-07-06 | 2007-01-25 | Sumitomo Kinzoku Kozan Shindo Kk | Copper alloy rolled foil |
JP2007217792A (en) * | 2007-02-02 | 2007-08-30 | Hitachi Cable Ltd | Copper alloy material, method for producing copper alloy conductor using the same, copper alloy conductor obtained by the method and cable using the same |
JP2012214894A (en) * | 2011-03-31 | 2012-11-08 | Nippon Steel Chem Co Ltd | Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate |
JP2014077192A (en) * | 2012-09-20 | 2014-05-01 | Jx Nippon Mining & Metals Corp | Copper alloy and connector terminal material for high current |
US8845829B2 (en) | 2003-10-24 | 2014-09-30 | Hitachi Metals, Ltd. | Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62189738A (en) * | 1986-02-17 | 1987-08-19 | Furukawa Electric Co Ltd:The | Tape for semiconductor lead |
-
1987
- 1987-07-07 JP JP62167896A patent/JPH0616523B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62189738A (en) * | 1986-02-17 | 1987-08-19 | Furukawa Electric Co Ltd:The | Tape for semiconductor lead |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003064431A (en) * | 2001-08-20 | 2003-03-05 | Nippon Mining & Metals Co Ltd | Copper alloy foil for laminate sheet |
US8845829B2 (en) | 2003-10-24 | 2014-09-30 | Hitachi Metals, Ltd. | Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor |
JP2007016260A (en) * | 2005-07-06 | 2007-01-25 | Sumitomo Kinzoku Kozan Shindo Kk | Copper alloy rolled foil |
JP2007217792A (en) * | 2007-02-02 | 2007-08-30 | Hitachi Cable Ltd | Copper alloy material, method for producing copper alloy conductor using the same, copper alloy conductor obtained by the method and cable using the same |
JP2012214894A (en) * | 2011-03-31 | 2012-11-08 | Nippon Steel Chem Co Ltd | Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate |
JP2014077192A (en) * | 2012-09-20 | 2014-05-01 | Jx Nippon Mining & Metals Corp | Copper alloy and connector terminal material for high current |
Also Published As
Publication number | Publication date |
---|---|
JPH0616523B2 (en) | 1994-03-02 |
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