JPS6412540A - Manufacture of film carrier - Google Patents
Manufacture of film carrierInfo
- Publication number
- JPS6412540A JPS6412540A JP16789887A JP16789887A JPS6412540A JP S6412540 A JPS6412540 A JP S6412540A JP 16789887 A JP16789887 A JP 16789887A JP 16789887 A JP16789887 A JP 16789887A JP S6412540 A JPS6412540 A JP S6412540A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- cold rolling
- copper foil
- rolling process
- reduced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE:To protect a copper foil from shrinkage or deformation by a method wherein a lead section of a film carrier to be mounted with an electronic component is formed of a pure copper foil which is, after the final cold rolling process, annealed for the removal of stress, laminated with a resin-made base film, and then etched into a desired pattern. CONSTITUTION:An oxygen-free copper ingot is dissolved and cast in a high-frequency furnace, the product is formed into a 8mm-thick sheet at 900 deg.C in a hot rolling process and then is reduced into a 1mm-thick sheet in a cold rolling process. A 1-hour annealing process follows at 500 deg.C, after which the sheet is reduced to 0.2mm in thickness in a cold rolling process. The thickness will further be reduced to 0.025mm after 1-hour annealing and cold rolling. Stress is removed from the resultant copper sheet in an annealing process that continues for one minute at 200 deg.C. A pure copper foil after such processes is laminated with a long resin-made base film 2 provided with sprocket holes 1, which is then subjected to photoetching for the formation of a copper-made inner lead 3 and a copper-made outer lead 4. This design protects the copper foil from shrinkage or deformation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16789887A JPS6412540A (en) | 1987-07-07 | 1987-07-07 | Manufacture of film carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16789887A JPS6412540A (en) | 1987-07-07 | 1987-07-07 | Manufacture of film carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6412540A true JPS6412540A (en) | 1989-01-17 |
Family
ID=15858101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16789887A Pending JPS6412540A (en) | 1987-07-07 | 1987-07-07 | Manufacture of film carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6412540A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02183550A (en) * | 1989-01-10 | 1990-07-18 | Hitachi Cable Ltd | Film carrier substrate of semiconductor device |
| JPH03276738A (en) * | 1990-03-27 | 1991-12-06 | Hitachi Cable Ltd | Tape carrier for tab and manufacture thereof |
-
1987
- 1987-07-07 JP JP16789887A patent/JPS6412540A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02183550A (en) * | 1989-01-10 | 1990-07-18 | Hitachi Cable Ltd | Film carrier substrate of semiconductor device |
| JPH03276738A (en) * | 1990-03-27 | 1991-12-06 | Hitachi Cable Ltd | Tape carrier for tab and manufacture thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1430692A (en) | Method of producing grain oriented electrical steel sheet | |
| GB944571A (en) | Improvements in or relating to glass-ceramics and their production and to devices comprising glass-ceramics | |
| DE50010769D1 (en) | Method for producing wear-resistant edge layers on components made of precipitation-hardenable metallic material | |
| JPS6412540A (en) | Manufacture of film carrier | |
| SE7908610L (en) | SET TO MAKE CORN-ORIENTED SILICONE STYLES FROM STRENGTHEN PLATES | |
| SE8006840L (en) | PROCEDURE AND DEVICE FOR HEATING OF METALS TENDED TO CRACK UNDER COLLECTION | |
| JPS6412539A (en) | Manufacture of film carrier | |
| JPS6412538A (en) | Film carrier and manufacture thereof | |
| JPS55122603A (en) | Manufacture of aluminum foil | |
| JPS5591839A (en) | Production of electronic parts | |
| RU98108610A (en) | METHOD AND DEVICE FOR PRODUCING A CELL WITH A CELL STRUCTURE FROM A THERMAL PROCESSED TWO-LAYERED OR MULTI-LAYERED FOIL | |
| JP2004516944A (en) | Production method of laminated metal product slab and laminated metal product slab | |
| KR890003972A (en) | How to use copper alloy | |
| JPS5619942A (en) | Production of sheet metal parts for watch | |
| JPS55138022A (en) | Method of annealing directional silicon steel plate for decarburization | |
| JPH01309922A (en) | Production of grain-oriented magnetic steel sheet having low iron loss | |
| JPH0438860A (en) | Manufacture method of semiconductor device lead frame | |
| JPS5650758A (en) | Production of metal mold | |
| JPS6461981A (en) | Manufacture of wiring board | |
| JPS6484649A (en) | Manufacture of semiconductor package | |
| JPS5672124A (en) | Manufacture of case hardening steel | |
| KR900010029A (en) | Copper base shape memory alloy and manufacturing method | |
| RU2020187C1 (en) | Method of thermally processing workpieces fabricated from titanium alloys | |
| JPS649884A (en) | Insert ceramics | |
| SU1461770A1 (en) | Method of producing large forgings and rolled blanks |