JPS5462930A - Chemical plating pretreatment method - Google Patents

Chemical plating pretreatment method

Info

Publication number
JPS5462930A
JPS5462930A JP12967577A JP12967577A JPS5462930A JP S5462930 A JPS5462930 A JP S5462930A JP 12967577 A JP12967577 A JP 12967577A JP 12967577 A JP12967577 A JP 12967577A JP S5462930 A JPS5462930 A JP S5462930A
Authority
JP
Japan
Prior art keywords
acid
pref
chemical plating
inorg
concn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12967577A
Other languages
Japanese (ja)
Other versions
JPS5949305B2 (en
Inventor
Kanji Murakami
Yoichi Matsuda
Motoyo Wajima
Mineo Kawamoto
Yasusada Morishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12967577A priority Critical patent/JPS5949305B2/en
Publication of JPS5462930A publication Critical patent/JPS5462930A/en
Publication of JPS5949305B2 publication Critical patent/JPS5949305B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To obtain a resistance film of uniform thickness by treating the surface of a substrate with a mixt. of inorg. acid and aliph. carboxylic acid prior to chemical plating in production of a printed circuit board with resistance.
CONSTITUTION: The surface of a substrate is treated with a mixt. of inorg. acid, pref. hydrochloric acid or sulfuric acid and aliph. carboxylic acid, pref. oxalic acid. When the inorg. acid is hydrochloric acid, the concn. is pref. above 10 ml/l (as 35% hydrochloric acid). In case of sulfuric acid, it is pref. used in a concn. above 30 g/l. The concn. of oxalic acie is desirable to be above 0.3 g/l.
COPYRIGHT: (C)1979,JPO&Japio
JP12967577A 1977-10-31 1977-10-31 Chemical plating pretreatment method Expired JPS5949305B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12967577A JPS5949305B2 (en) 1977-10-31 1977-10-31 Chemical plating pretreatment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12967577A JPS5949305B2 (en) 1977-10-31 1977-10-31 Chemical plating pretreatment method

Publications (2)

Publication Number Publication Date
JPS5462930A true JPS5462930A (en) 1979-05-21
JPS5949305B2 JPS5949305B2 (en) 1984-12-01

Family

ID=15015376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12967577A Expired JPS5949305B2 (en) 1977-10-31 1977-10-31 Chemical plating pretreatment method

Country Status (1)

Country Link
JP (1) JPS5949305B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193089A (en) * 1983-04-15 1984-11-01 日立コンデンサ株式会社 Method of producing printed circuit board
JPS61256689A (en) * 1985-05-06 1986-11-14 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Substrate preprocessing for attaching non-electric field metal
US5569321A (en) * 1993-04-09 1996-10-29 Hitachi Chemical Company, Ltd. Pre-treating solution for electroless plating
JP2021505774A (en) * 2017-12-12 2021-02-18 ケメタル ゲゼルシャフト ミット ベシュレンクテル ハフツング Boric acid-free composition for removing precipitates containing cliolite

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5404452B2 (en) * 2010-01-28 2014-01-29 京セラ株式会社 Wiring board manufacturing method and wiring board
JP5418336B2 (en) * 2010-03-18 2014-02-19 コニカミノルタ株式会社 Metal pattern forming method and metal pattern formed using the same
JP5375725B2 (en) * 2010-04-12 2013-12-25 コニカミノルタ株式会社 Metal pattern manufacturing method and metal pattern
JP2011222797A (en) * 2010-04-12 2011-11-04 Konica Minolta Ij Technologies Inc Catalyst pattern manufacturing method and metal pattern manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193089A (en) * 1983-04-15 1984-11-01 日立コンデンサ株式会社 Method of producing printed circuit board
JPS61256689A (en) * 1985-05-06 1986-11-14 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Substrate preprocessing for attaching non-electric field metal
JPH0325038B2 (en) * 1985-05-06 1991-04-04 Intaanashonaru Bijinesu Mashiinzu Corp
US5569321A (en) * 1993-04-09 1996-10-29 Hitachi Chemical Company, Ltd. Pre-treating solution for electroless plating
JP2021505774A (en) * 2017-12-12 2021-02-18 ケメタル ゲゼルシャフト ミット ベシュレンクテル ハフツング Boric acid-free composition for removing precipitates containing cliolite

Also Published As

Publication number Publication date
JPS5949305B2 (en) 1984-12-01

Similar Documents

Publication Publication Date Title
JPS5462930A (en) Chemical plating pretreatment method
GB1484542A (en) Electric circuit boards
JPS5241451A (en) Biological denitrating method
JPS5338377A (en) Electronic wristwatch
JPS5419663A (en) Forming method of insulating films
JPS52105573A (en) Treatment of acid washing waste liquid
SU553273A1 (en) Etching solution for printed circuit boards
JPS5426286A (en) Treating method for ion exchange membrane
JPS52145326A (en) Treatment of ammonium persulfate etching waste liquid
JPS5236495A (en) Formation of transparent conductive pattern
JPS51113464A (en) Compound electronic component manufacturing system
JPS5212248A (en) Method for treating coated substrate such as boards
SU443122A1 (en) Dimensional pickling solution for copper
JPS57155358A (en) Metalizing treatment process
Sorensen et al. Method of Producing an Alloy or a Mixture of Elements in the Surface of a Substrate
JPS53142327A (en) Ceramic substrate plating method
JPS53128986A (en) Manufacture of semiconductor device
JPS5226538A (en) Surface treatment of aluminium and aluminium alloy
JPS52300A (en) Method of manufacturing alginic acid
JPS5411030A (en) Copper plating method for carbon powder
JPS5633491A (en) Cathode for eletrolysis
JPS544935A (en) Method of controlling electrocoating bath
JPS55104494A (en) Copper pyrophosphate plating bath
JPS53102231A (en) Pickling bath for magnesium and magnesium alloy
Rimsa Treatment of Drilled Copper-Clad Thermoplastic Laminates