KR860008604A - 반도체의 비등 냉각 장치 - Google Patents

반도체의 비등 냉각 장치 Download PDF

Info

Publication number
KR860008604A
KR860008604A KR1019860002728A KR860002728A KR860008604A KR 860008604 A KR860008604 A KR 860008604A KR 1019860002728 A KR1019860002728 A KR 1019860002728A KR 860002728 A KR860002728 A KR 860002728A KR 860008604 A KR860008604 A KR 860008604A
Authority
KR
South Korea
Prior art keywords
cooling
semiconductor
boiling
conductor
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1019860002728A
Other languages
English (en)
Korean (ko)
Inventor
히로시 이따하나
요시노리 우스이
Original Assignee
미다 가쓰시게
가부시기 가이샤 히다찌 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미다 가쓰시게, 가부시기 가이샤 히다찌 세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR860008604A publication Critical patent/KR860008604A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1019860002728A 1985-04-10 1986-04-10 반도체의 비등 냉각 장치 Abandoned KR860008604A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP74283 1985-04-10
JP60074283A JPS61234059A (ja) 1985-04-10 1985-04-10 半導体素子の沸謄冷却装置

Publications (1)

Publication Number Publication Date
KR860008604A true KR860008604A (ko) 1986-11-17

Family

ID=13542635

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860002728A Abandoned KR860008604A (ko) 1985-04-10 1986-04-10 반도체의 비등 냉각 장치

Country Status (7)

Country Link
US (1) US4694323A (https=)
JP (1) JPS61234059A (https=)
KR (1) KR860008604A (https=)
CN (1) CN1003026B (https=)
AU (1) AU561322B2 (https=)
BR (1) BR8601580A (https=)
DE (1) DE3611811A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3719637A1 (de) * 1987-06-12 1988-12-29 Asea Brown Boveri Siedekuehleinrichtung fuer halbleiterelemente
JPH0724293B2 (ja) * 1987-09-30 1995-03-15 株式会社日立製作所 沸騰冷却装置
US4864385A (en) * 1987-12-29 1989-09-05 Hitachi, Ltd. Power semiconductors connected antiparallel via heatsinks
JP2741255B2 (ja) * 1989-08-18 1998-04-15 株式会社日立製作所 沸騰冷却用伝熱体
AU618203B2 (en) * 1989-09-29 1991-12-12 Mitsubishi Denki Kabushiki Kaisha Boiling type cooler device for power semiconductor switching elements
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5106451A (en) * 1990-11-15 1992-04-21 International Business Machines Corporation Heat sink and method of attachment
US5448108A (en) * 1993-11-02 1995-09-05 Hughes Aircraft Company Cooling of semiconductor power modules by flushing with dielectric liquid
US6357517B1 (en) 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
JP3487382B2 (ja) * 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
DE19709934B4 (de) 1996-03-14 2008-04-17 Denso Corp., Kariya Kühlgerät zum Sieden und Kondensieren eines Kältemittels
DE19905980C2 (de) * 1999-02-12 2001-02-08 Fraunhofer Ges Forschung Kühlvorrichtung und Kühlverfahren
DE10211568B4 (de) * 2002-03-15 2004-01-29 Siemens Ag Kälteanlage für zu kühlende Teile einer Einrichtung
US6604571B1 (en) * 2002-04-11 2003-08-12 General Dynamics Land Systems, Inc. Evaporative cooling of electrical components
JP4305406B2 (ja) * 2005-03-18 2009-07-29 三菱電機株式会社 冷却構造体
US20070023169A1 (en) * 2005-07-29 2007-02-01 Innovative Fluidics, Inc. Synthetic jet ejector for augmentation of pumped liquid loop cooling and enhancement of pool and flow boiling
US20080173427A1 (en) * 2007-01-23 2008-07-24 Richard Schumacher Electronic component cooling
JP2009135142A (ja) * 2007-11-28 2009-06-18 Toyota Industries Corp 沸騰冷却装置
JP5401419B2 (ja) * 2010-08-31 2014-01-29 株式会社日立製作所 鉄道車両用電力変換装置
US8797739B2 (en) * 2011-06-23 2014-08-05 Delphi Technologies, Inc. Self circulating heat exchanger
CN102975843B (zh) * 2012-11-13 2016-01-13 浙江海洋学院 大型船舶主机尾气余热利用装置
US20150022975A1 (en) * 2013-07-19 2015-01-22 General Electric Company Method and system for an immersion boiling heat sink
CN108801012B (zh) * 2014-08-28 2020-10-23 阿威德热合金有限公司 具有一体式部件的热虹吸装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE250511C (https=) *
SE337263B (https=) * 1969-03-24 1971-08-02 Asea Ab
JPS5046079A (https=) * 1973-08-28 1975-04-24
US4028723A (en) * 1975-02-24 1977-06-07 Mitsubishi Denki Kabushiki Kaisha Cooling device for heat generation member
JPS5267978A (en) * 1975-12-03 1977-06-06 Mitsubishi Electric Corp Boiling-cooling type semiconductor unit
JPS53138677A (en) * 1977-05-10 1978-12-04 Mitsubishi Electric Corp Vapor cooling type semiconductor device
JPS5541734A (en) * 1978-09-20 1980-03-24 Hitachi Ltd Boiling water cooling-type semiconductor stack
JPS5568662A (en) * 1978-11-17 1980-05-23 Hitachi Ltd Semiconductor cooler
JPS55129462U (https=) * 1979-03-08 1980-09-12

Also Published As

Publication number Publication date
JPH0363825B2 (https=) 1991-10-02
JPS61234059A (ja) 1986-10-18
AU5568686A (en) 1986-10-16
DE3611811A1 (de) 1986-10-16
CN1003026B (zh) 1989-01-04
CN86102472A (zh) 1986-10-15
DE3611811C2 (https=) 1990-06-13
US4694323A (en) 1987-09-15
AU561322B2 (en) 1987-05-07
BR8601580A (pt) 1986-12-09

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PC1902 Submission of document of abandonment before decision of registration

St.27 status event code: N-1-6-B10-B11-nap-PC1902

SUBM Surrender of laid-open application requested
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000