KR930005176A - 일체형 히이트파이프 기술을 이용하여 멀티칩 모듈을 냉각하기 위한 방법 및 장치 - Google Patents

일체형 히이트파이프 기술을 이용하여 멀티칩 모듈을 냉각하기 위한 방법 및 장치 Download PDF

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KR930005176A
KR930005176A KR1019920015367A KR920015367A KR930005176A KR 930005176 A KR930005176 A KR 930005176A KR 1019920015367 A KR1019920015367 A KR 1019920015367A KR 920015367 A KR920015367 A KR 920015367A KR 930005176 A KR930005176 A KR 930005176A
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heat
multichip module
casing
refrigerant
module package
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KR1019920015367A
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KR100202255B1 (ko
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에스. 콘테 알프렛
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마이클 에이치. 모리스
선 마이크로시스템즈 인코오퍼레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

내용 없음.

Description

일체형 히이트파이프 기술을 이용하여 멀티칩 모듈을 냉각하기 위한 방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 기판내에 일체로 형성된 히이트 싱크를 가진 멀티칩 모듈의 단면도이고,
제2도는 일체형 히이트파이프가 히이트 싱크에 연결되어 있는 바람직한 구체예의 멀티칩 모듈의 단면도이다.

Claims (20)

  1. 복수개의 공동이 기판의 상면내에 배치되어 있는 상면 및 저면을 가진 실장기판; 기판의 저면내에 매설되어 있고, 열전도수단의 상면이 공동과 연통되도록 상면 및 저면을 갖고 있는, 기판으로부터 열을 전도해 제거하기 위한 열정도수단, 각각 상면과 저면을 갖고 있으며, 열전도수단의 상면이 칩의 저면과 밀접하도록 상기 공동내에 배치되어 있는 복수개의 반도체 칩, 기판의 상면위에 배치되어 있고 칩에 연결되어 있는 전기적 접속요소 망, 및 열전도수단의 저면과 결합하고 있고, 냉매, 증발부분, 응축부분 및 심지를 갖고있고, 열전도수단으로부터 열을 흡수하기 위한 히이트파이프를 형성하는 중공케이싱으로 구성되어 있으며, 증발부분은 열정도수단의 저면에 실질적으로 인접해 있는 케이싱의 근접영역을 확정하고, 응축부분은 증발부분으로부터 떨어진 케이싱의 원격영역을 확정하고, 심지는 증발부분으로부터 응축부분가지 케이싱내 일정길이만큼 뻗어 있으며, 열로 인해 증발부분에서 냉매가 증발하여 응측부분까지 흐르게 되고 거기서 냉매증기는 응촉하고 모세관 작용에 의해 심지를 통해 증발부분으로 흡인복귀하는 것을 특징으로 하는 멀티칩 모듈 패키지.
  2. 제1항에 있어서, 열전도수단이 제1히이트 싱크인 것을 특징으로 하는 멀티칩 모듈 패키지.
  3. 제2항에 있어서, 제2히이트 싱크가 중공케이싱의 응축부분에 부착되어 있는 것을 특징으로 하는 멀티칩 모듈 패키지.
  4. 제3항에 있어서, 케이싱이 유연한, 열전도성인 열가소성 재료에 의해 제1히이트 싱크에 결합되어 있는 것을 특징으로 하는 멀티칩 모듈 패키지.
  5. 제4항에 있어서, 유연한, 열전도성인 열가소성 재료가 칩을 히이트 싱크에 결합시키는데 사용되는 것을 특징으로 하는 멀티칩 모듈 패키지.
  6. 제5항에 있어서, 유연한, 열전도성인 열가소성 재료가 육방정의 질화붕소인 것을 특징으로 하는 멀티칩 모듈 패키지.
  7. 제6항에 있어서, 중공케이싱이, 밀봉폐쇄된, 대향하는 두 개구를 가진 구리튜브로 만들어져 있는 것을 특징으로하는 멀티칩 모듈 패키지.
  8. 제6항에 있어서, 중공케이싱이, 밀봉폐쇄된, 대향하는 두 개구를 가진 알루미늄튜브로 만들어져 있는 것을 특징으로하는 멀티칩 모듈 패키지.
  9. 제7항에 있어서, 제2히이트 싱크는 열소산을 위한 핀을 갖고 있는 것을 특징으로 하는 멀티칩 모듈 패키지.
  10. 제9항에 있어서, 심지는 폐루우프의 형으로 되어 있는 것을 특징으로 하는 멀티칩 모듈 패키지.
  11. 제10항에 있어서, 멀티칩 모듈이 역전되어 있고 전기적 접속요소가 모판에 부착되어 있는 것을 특징으로 하는 멀티칩 모듈 패키지.
  12. 제11항에 있어서, 냉매가 유전성의 탄화 플루오르인 것을 특징으로 하는 멀티칩 모듈 패키지.
  13. 제12항에 있어서, 제1히이트 싱크가 구리덩어리인 것을 특징으로 하는 멀티칩 모듈 패키지.
  14. 제13항에 있어서, 구리덩어리는 추가적으로 제3히이트 싱크에 장착되기에 적합한것을 특징으로 하는 멀티칩 모듈 패키지.
  15. 멀티칩 모듈의 실장기판의 상면내에 매설된 반도체 칩에 의해 발생한 열을 손산하기 위한 일체화된 히이트 파이프를 갖고 있으며, 칩들을 서로 접속시키는, 기판의 상면에 배치된 전기적 접속요소 망을 갖고 있는 멀티칩 모듈로서, 열전도수단이 칩과 밀접하도록 실장기판의 저면내로 일체적으로 결합된 열전도수단 및 증발부분, 응축부분, 냉매 및 심지를 갖고 있고, 열전도수단과 결합하고 히이트 파이프를 형성하는 중공케이싱을 포함하고 있으며, 증발부분은 열전도수단과 실질적으로 접촉해있고, 응축부분은 케이싱의 원격영역에 의해 형성되어 있고, 심지는 케이싱내에 수용되어 증발부분으로부터 응축부분까지 뻗쳐 있으며, 냉매는 중공케이싱을 부분적으로 충만시키며, 냉매는 증발부분에서 증발하고 응측부분으로 이동하여 응축하고 모세관 작용에 의해 심지를 통해 증발부분으로 흡인되는 것을 특징으로 하는 멀티칩 모듈.
  16. 열을 방출하는 멀티칩 모듈을 냉각하기 위해 일체화된 히이트파이프를 사용하는 방법에 있에서, 상면에 배치된 복수개의 공동을 갖고 있는 실장기판을 준비하며; 공동이 열전도수단과 연통되도록 실장기판의 저면내에 열전도수단을 통합(결합)시키며; 열전도수단이 칩과 접촉하도록 반도체 칩을 공동내에 매설하며; 히이트파이프를 형성하는 중공케이싱을 열전도수단에 부착시키며, 여기에 있어 중공케이싱은 열전도수단에 인접배치된 증발부분, 케이싱의 원격영역에 배치된 응축부분, 및 증발부분으로부터 응축부분까지 뻗어있고 중공케이싱을 부분적으로 충만시키는 냉매로 함침되어 그안에 수용되어 있는 심지를 포함하고 있으며; 열전도수단으로부터 중공케이싱내로 전달된 열을 흡수함으로씩 증발부분에 있는 냉매를 증기로 증발시켜 그 중기가 응측부분으로 이동되게 하며; 응축부분내의 증기로부터 열을 소산시키으로써 응축부분내에서 냉매를 액체로 응측시키며; 심지를 통해 모세관 작용에 의해 액상냉매를 증발부분으로 흡인하는 단계로 되어있는 것을 특징으로 하는 방법.
  17. 제16항에 있어서, 모세관 작용에 의해 액상냉매를 흡인하는 단계는 심지에 의해 행해지는 것을 특징으로 하는 방법.
  18. 제17항에 있어서, 열전도수단은 히이트싱크인 것을 특징으로 하는 방법.
  19. 제18항에 있어서, 냉매는 유전성의 탄화 플루오르인 것을 특징으로 하는 방법.
  20. 제19항에 있어서, 유연한 열전도성의 열가소성 재료를 칩과 히이트 싱크 사이에 도포하여 경화되게 하는 단계를 추가로 포함하는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920015367A 1991-08-26 1992-08-26 일체형 히이트파이프 기술을 이용하여 멀티칩 모듈을 냉각하기 위한 방법 및 장치 KR100202255B1 (ko)

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US74957591A 1991-08-26 1991-08-26
US749575 1991-08-26

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KR100202255B1 KR100202255B1 (ko) 1999-06-15

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US (1) US5268812A (ko)
EP (1) EP0529837B1 (ko)
JP (1) JPH05198713A (ko)
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DE (1) DE69211074T2 (ko)

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US5268812A (en) 1993-12-07
DE69211074T2 (de) 1996-10-02
JPH05198713A (ja) 1993-08-06
EP0529837B1 (en) 1996-05-29

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