SE337263B - - Google Patents
Info
- Publication number
- SE337263B SE337263B SE04044/69A SE404469A SE337263B SE 337263 B SE337263 B SE 337263B SE 04044/69 A SE04044/69 A SE 04044/69A SE 404469 A SE404469 A SE 404469A SE 337263 B SE337263 B SE 337263B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
- H10W40/237—Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE04044/69A SE337263B (https=) | 1969-03-24 | 1969-03-24 | |
| CH421670A CH508983A (de) | 1969-03-24 | 1970-03-19 | Halbleiter-Bauelement |
| DE19702013684 DE2013684A1 (de) | 1969-03-24 | 1970-03-21 | Halbleiteranordnung |
| GB03907/70A GB1294532A (en) | 1969-03-24 | 1970-03-23 | Improvements in semiconductor devices |
| JP45024173A JPS4934026B1 (https=) | 1969-03-24 | 1970-03-24 | |
| FR7010526A FR2039914A5 (https=) | 1969-03-24 | 1970-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE04044/69A SE337263B (https=) | 1969-03-24 | 1969-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE337263B true SE337263B (https=) | 1971-08-02 |
Family
ID=20263401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE04044/69A SE337263B (https=) | 1969-03-24 | 1969-03-24 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS4934026B1 (https=) |
| CH (1) | CH508983A (https=) |
| DE (1) | DE2013684A1 (https=) |
| FR (1) | FR2039914A5 (https=) |
| GB (1) | GB1294532A (https=) |
| SE (1) | SE337263B (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2337694C2 (de) * | 1973-07-25 | 1984-10-25 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleitergleichrichteranordnung hoher Strombelastbarkeit |
| DE2640000C2 (de) * | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben |
| CS190866B1 (en) * | 1977-02-18 | 1979-06-29 | Petr Novak | High-capacity semiconductor detail |
| DE3010363C2 (de) * | 1980-03-14 | 1987-02-12 | Siemens AG, 1000 Berlin und 8000 München | Gerätekombination für den Bergbau mit Bauelementen der Leistungselektronik |
| JPS61234059A (ja) * | 1985-04-10 | 1986-10-18 | Hitachi Ltd | 半導体素子の沸謄冷却装置 |
| DE4131739C2 (de) * | 1991-09-24 | 1996-12-19 | Behr Industrietech Gmbh & Co | Kühleinrichtung für elektrische Bauelemente |
| DE4302816C2 (de) * | 1993-01-28 | 1996-08-08 | Aeg Westinghouse Transport | Anordnung zur Kühlung von druckkontaktierbaren Leistungs-Scheibenhalbleitern |
| EP1284503A1 (de) * | 2001-08-13 | 2003-02-19 | Abb Research Ltd. | Leistungshalbleitermodul |
| EP1672692B1 (de) * | 2004-12-16 | 2015-01-07 | ABB Research Ltd | Leistungshalbleiter-Modul |
| DE102011004541B4 (de) * | 2011-02-22 | 2014-07-17 | Infineon Technologies Bipolar Gmbh & Co. Kg | Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls |
| JP7067129B2 (ja) * | 2018-03-06 | 2022-05-16 | 富士電機株式会社 | 冷却装置、半導体モジュールおよび車両 |
| CN120834081B (zh) * | 2025-09-19 | 2025-12-05 | 武汉羿变电气有限公司 | 一种功率模块的封装结构 |
-
1969
- 1969-03-24 SE SE04044/69A patent/SE337263B/xx unknown
-
1970
- 1970-03-19 CH CH421670A patent/CH508983A/de not_active IP Right Cessation
- 1970-03-21 DE DE19702013684 patent/DE2013684A1/de active Pending
- 1970-03-23 GB GB03907/70A patent/GB1294532A/en not_active Expired
- 1970-03-24 JP JP45024173A patent/JPS4934026B1/ja active Pending
- 1970-03-24 FR FR7010526A patent/FR2039914A5/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CH508983A (de) | 1971-06-15 |
| FR2039914A5 (https=) | 1971-01-15 |
| GB1294532A (en) | 1972-11-01 |
| JPS4934026B1 (https=) | 1974-09-11 |
| DE2013684A1 (de) | 1971-02-04 |