KR860007996A - 고상의 땜질 재료 몸체의 형성방법 - Google Patents

고상의 땜질 재료 몸체의 형성방법 Download PDF

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Publication number
KR860007996A
KR860007996A KR1019860002633A KR860002633A KR860007996A KR 860007996 A KR860007996 A KR 860007996A KR 1019860002633 A KR1019860002633 A KR 1019860002633A KR 860002633 A KR860002633 A KR 860002633A KR 860007996 A KR860007996 A KR 860007996A
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KR
South Korea
Prior art keywords
soldering
solid
solvent
dry
solder
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Application number
KR1019860002633A
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English (en)
Inventor
미들스태트 루이스
디. 힉손 로버트
Original Assignee
톰 데이빗슨
크램코 솔더 얼로이즈 리미티드
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Application filed by 톰 데이빗슨, 크램코 솔더 얼로이즈 리미티드 filed Critical 톰 데이빗슨
Publication of KR860007996A publication Critical patent/KR860007996A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

내용 없음

Description

고상의 땜질 재료 몸체의 형성방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 원통형상인 고상의 땜질 재료 몸체의 개략도,
제2도는 플랫링 형상인 고상의 땜질 재료 몸체의 개략도,
제5도는 제1도의 고상 몸체의 제조 방법을 도시한 프레스의 측단면도.
도면의 주요부분에 대한 부호의 설명
(10),(20),(30),(40): 고상의 몸체 (50): 프레스 (54): 포스트 (58): 원통상 통로 (60): 압축실 (70): 혼합물

Claims (11)

  1. 고상의 땜질 재료 몸체를 형성하는 방법에 있어서, 건조한 금속 미립자 형태인 소정량의 땜납을 건조한 입자형태의 소정량의 땜납용제와 혼합하여 균질한 혼합물을 형성하는 단계, 상기 균질한 혼합물의 일정량을 압축함으로써 선정된 형상을 갖는 고상의 몸체를 형성하는 단계를 포함하는 것을 특징으로 하는 고상의 땜질재료 몸체의 형성방법.
  2. 제1항에 있어서, 상기 금속 미립자는 건조한 분말 형태이고 그리고 상기 용제도 건조한 분말 형태인 것을 특징으로 하는 고상의 땜질 재료 몸체의 형성방법.
  3. 제2항에 있어서, 상기 건조한 땜납분말은 80내지 300미합중국 표준 메쉬 범위내의 입자크기인 것을 특징으로 하는 고상의 땜질 재료 몸체의 형성방법.
  4. 제2항에 있어서, 상기 건조한 분말 용제는 80내지 300미합중국 표준 메쉬 범위내의 입자크기인 것을 특징으로 하는 고상의 땜질 재료 몸체의 형성방법.
  5. 제1항에 있어서, 상기 고상의 몸체를 형성한 후, 그의 형상을 변화시켜줌에 의해 선정된 형상의 구조강도가 증가되도록 상기 고상의 몸체를 가공시켜 주는 것을 특징으로 하는 고상의 땜질재료 몸체의 형성 방법.
  6. 제5항에 있어서, 긴 땜질 재료의 스트랩을 형성하기 위하여 상기 고상의 몸체를 압출하는 단계, 땜질재료의 얇은 리본을 형성하도록 두께가 감소되게끔 상기 스트랩을 로울링하는 단계 그리고 상기 얇은 리본으로부터 땜질 요소를 펀칭하는 단계를 포함하는 것을 특징으로 하는 고상의 땜질 재료 몸체의 형성방법.
  7. 제2항에 있어서, 상기 납땜용제는 상기 납땜의 0.25내지 30중량%의 양으로 들어있는 것을 특징으로 하는 고상의 땜질 재질 재료 몸체의 형성방법.
  8. 납땜 혼합물과 용제입자의 균질한 혼합물을 포함하는 것을 특징으로 하는 고상의 땜질 재료 몸체.
  9. 땜질할 요소의 대향면에 위치된 선정된 형상의 땜질 자리사이의 계면에 땜질 접속부를 형성시키는 방법에 있어서, 균질한 혼합물을 형성하기 위해 소정량의 건조한 금속 미립자를 건조한 입자 형태인 소정량의 납땜 용제로 혼합시키는 단계, 상기 납땜 자리의 선정된 형상과 어울리는 형상을 갖는 고상의 몸체를 형성하기 위해 상기 균질한 혼합물의 일정량을 압축시키는 단계, 상기 고상의 몸체를 상기의 계면에 위치시키는 단계, 그리고 상기 땜질할 요소를 상기 계면에서 땜질시켜 주기 위해 상기 고상의 몸체를 가열하는 단계를 포함하는 것을 특징으로 하는 선정된 형상의 땜질 자리 사이의 계면에 땜질 접속부를 형성하는 방법.
  10. 제9항에 있어서, 상기 금속 미립자는 건조한 분말 형태이고 그리고 상기 용제도 건조한 분말 형태인 것을 특징으로 하는 선정된 형상의 땜질 자리 사이의 계면에 땜질 접속부를 형성하는 방법.
  11. 제9항에 있어서, 상기 땜질 자리는 상기 땜질할 요소와 상기 납땜 몸체 사이에 관형의 슬리브 형태와 같은 환형 통로를 형성하는 형상인 것을 특징으로 하는 선정된 형상의 땜질 자리사이의 계면에 땜질 접속부를 형성하는 방법.
    ※참고사항: 최초출원 내용에 의하여 공개하는 것임.
KR1019860002633A 1985-04-09 1986-04-08 고상의 땜질 재료 몸체의 형성방법 KR860007996A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA478676 1985-04-09
CA478676 1985-04-09

Publications (1)

Publication Number Publication Date
KR860007996A true KR860007996A (ko) 1986-11-10

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ID=4130220

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860002633A KR860007996A (ko) 1985-04-09 1986-04-08 고상의 땜질 재료 몸체의 형성방법

Country Status (4)

Country Link
US (1) US4645545A (ko)
EP (1) EP0202008A1 (ko)
JP (1) JPS61283494A (ko)
KR (1) KR860007996A (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2696546B2 (ja) * 1988-12-28 1998-01-14 株式会社徳力本店 銀ろう粒の製造方法
JP2696545B2 (ja) * 1988-12-28 1998-01-14 株式会社徳力本店 金ろう粒の製造方法
JP2584926B2 (ja) * 1991-12-27 1997-02-26 昭和アルミニウム株式会社 フラックス含有Ａｌ合金ろう材及びその製造方法
IT1255080B (it) * 1992-04-01 1995-10-18 Whirlpool Italia Metodo per realizzare elementi preformati di forme e dimensioni voluteper la saldatura, in particolare la saldobrasatura, di componenti metallici ed elementi cosi' ottenuti
JP2714361B2 (ja) * 1994-07-22 1998-02-16 昭和アルミニウム株式会社 フラックス含有Ａｌ合金ろう材の製造方法
JP2714358B2 (ja) * 1994-10-11 1998-02-16 昭和アルミニウム株式会社 フラックス含有Ａｌ合金ろう材およびその製造方法
CZ9902562A3 (en) * 1999-07-19 2001-06-13 Diafrikt Soldering rings and process for producing thereof
FR2855085B1 (fr) * 2003-05-23 2006-05-26 Fp Soudage Procede de fabrication d'un produit de brasage, produit de brasage ainsi obtenu et son utilisation
DE102005040819A1 (de) * 2005-08-27 2007-03-08 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Lot sowie Verfahren zu dessen Anbringung
GB2447486A (en) * 2007-03-14 2008-09-17 Sandvik Osprey Ltd A brazing piece comprising a composite material including an inorganic flux
FR2938460B1 (fr) * 2008-11-19 2012-01-13 Fp Soudage Produit de brasage comprenant un melange de flux de brasage et metal d'apport et procede de fabrication

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GB1050441A (ko) * 1900-01-01
GB646377A (en) * 1947-03-11 1950-11-22 John Cockbain Briggs Improvements in and relating to soldering and brazing
FR1028795A (fr) * 1950-05-27 1953-05-27 Deutsche Edelstahlwerke Ag Produit pour la soudure tendre et dure de métaux
GB680588A (en) * 1950-08-16 1952-10-08 Metro Cutanit Ltd Improvements relating to the brazing of metals
US2833030A (en) * 1952-09-19 1958-05-06 Wall Colmonoy Corp Method of joining metal parts with flexible composite joining material
FR1266916A (fr) * 1960-09-06 1961-07-17 Baguette de soudure étain d'un mélange spécial, métaux et décapants, et ses proc'dés de fabrication
GB1141893A (en) * 1966-02-16 1969-02-05 Gunther Laubmeyer Dr Compositions for rendering tips of soldering irons reusable
US3745077A (en) * 1972-03-15 1973-07-10 Lockheed Aircraft Corp Thermit composition and method of making
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ES490073A0 (es) * 1979-04-06 1981-05-16 Johnson Matthey Co Ltd Procedimiento para la obtencion de una composicion para sol-dar.
JPS57202996A (en) * 1981-06-05 1982-12-13 Kawasaki Steel Corp Highly basic burnt type flux for submerged arc welding excellent in slag separation in narrow groove
US4487638A (en) * 1982-11-24 1984-12-11 Burroughs Corporation Semiconductor die-attach technique and composition therefor

Also Published As

Publication number Publication date
EP0202008A1 (en) 1986-11-20
JPS61283494A (ja) 1986-12-13
US4645545A (en) 1987-02-24

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