ATE194533T1 - Zinn-wismuth-lötpaste und deren verwendung - Google Patents
Zinn-wismuth-lötpaste und deren verwendungInfo
- Publication number
- ATE194533T1 ATE194533T1 AT94932155T AT94932155T ATE194533T1 AT E194533 T1 ATE194533 T1 AT E194533T1 AT 94932155 T AT94932155 T AT 94932155T AT 94932155 T AT94932155 T AT 94932155T AT E194533 T1 ATE194533 T1 AT E194533T1
- Authority
- AT
- Austria
- Prior art keywords
- tin
- solder
- paste
- bismuth
- soldering paste
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/069,640 US5389160A (en) | 1993-06-01 | 1993-06-01 | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties |
PCT/US1994/003730 WO1994027777A1 (en) | 1993-06-01 | 1994-04-05 | Tin-bismuth solder paste and method of use |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE194533T1 true ATE194533T1 (de) | 2000-07-15 |
Family
ID=22090278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT94932155T ATE194533T1 (de) | 1993-06-01 | 1994-04-05 | Zinn-wismuth-lötpaste und deren verwendung |
Country Status (8)
Country | Link |
---|---|
US (2) | US5389160A (de) |
EP (1) | EP0655961B1 (de) |
JP (1) | JP3476464B2 (de) |
KR (1) | KR100213695B1 (de) |
AT (1) | ATE194533T1 (de) |
CA (1) | CA2140253C (de) |
DE (1) | DE69425224T2 (de) |
WO (1) | WO1994027777A1 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5569433A (en) * | 1994-11-08 | 1996-10-29 | Lucent Technologies Inc. | Lead-free low melting solder with improved mechanical properties |
US5573602A (en) * | 1994-12-19 | 1996-11-12 | Motorola, Inc. | Solder paste |
DE19542043A1 (de) * | 1995-01-31 | 1996-08-01 | Hewlett Packard Co | Bleifreie Niedertemperaturlegierung und Verfahren zur Bildung einer mechanisch überlegenen Verbindung unter Verwendung dieser Legierung |
DE19538992A1 (de) * | 1995-04-28 | 1996-10-31 | Hewlett Packard Co | Wismut-Zinn-Lötmittel-Verbindungen mit verbesserten mechanischen Eigenschaften |
CN1040303C (zh) * | 1995-06-30 | 1998-10-21 | 三星电机株式会社 | 通用无铅焊料 |
JP3220635B2 (ja) | 1996-02-09 | 2001-10-22 | 松下電器産業株式会社 | はんだ合金及びクリームはんだ |
TW369451B (en) * | 1996-05-10 | 1999-09-11 | Ford Motor Co | Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substrates |
US6330967B1 (en) | 1997-03-13 | 2001-12-18 | International Business Machines Corporation | Process to produce a high temperature interconnection |
US5928404A (en) * | 1997-03-28 | 1999-07-27 | Ford Motor Company | Electrical solder and method of manufacturing |
US6027575A (en) * | 1997-10-27 | 2000-02-22 | Ford Motor Company | Metallic adhesive for forming electronic interconnects at low temperatures |
GB9903552D0 (en) | 1999-02-16 | 1999-04-07 | Multicore Solders Ltd | Reflow peak temperature reduction of solder alloys |
US6451127B1 (en) | 1999-06-01 | 2002-09-17 | Motorola, Inc. | Conductive paste and semiconductor component having conductive bumps made from the conductive paste |
US6210290B1 (en) * | 1999-06-11 | 2001-04-03 | Callaway Golf Company | Golf club and weighting system |
US20010048888A1 (en) * | 2000-03-24 | 2001-12-06 | Rong-Fong Huang | Anti-scavenging solders for silver metallization and method |
JP2002231564A (ja) * | 2001-01-31 | 2002-08-16 | Tdk Corp | セラミックコンデンサ |
KR100700233B1 (ko) * | 2001-05-28 | 2007-03-26 | 허니웰 인터내셔날 인코포레이티드 | 고온 무연 땜납용 조성물, 방법 및 소자 |
US6740544B2 (en) * | 2002-05-14 | 2004-05-25 | Freescale Semiconductor, Inc. | Solder compositions for attaching a die to a substrate |
JP2004179618A (ja) * | 2002-10-04 | 2004-06-24 | Sharp Corp | 太陽電池およびその製造方法、太陽電池用インターコネクター、ストリングならびにモジュール |
JP2004146464A (ja) * | 2002-10-22 | 2004-05-20 | Sharp Corp | 太陽電池およびその製造方法、太陽電池用インターコネクター、ストリングならびにモジュール |
US20050069725A1 (en) * | 2003-07-03 | 2005-03-31 | Boaz Premakaran T. | Lead-free solder composition for substrates |
US20060147337A1 (en) * | 2003-07-03 | 2006-07-06 | Antaya Technologies Corporation | Solder composition |
US7074627B2 (en) * | 2004-06-29 | 2006-07-11 | Freescale Semiconductor, Inc. | Lead solder indicator and method |
DE102004034035A1 (de) * | 2004-07-13 | 2006-02-09 | W.C. Heraeus Gmbh | Bleifreie Lotpasten mit erhöhter Zuverlässigkeit |
TW200730288A (en) * | 2005-08-11 | 2007-08-16 | Senju Metal Industry Co | Lead free solder paste and application thereof |
WO2007055308A1 (ja) * | 2005-11-11 | 2007-05-18 | Senju Metal Industry Co., Ltd. | ソルダペーストとはんだ継手 |
WO2007075763A1 (en) * | 2005-12-19 | 2007-07-05 | Honeywell International, Inc. | Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof |
KR100790978B1 (ko) * | 2006-01-24 | 2008-01-02 | 삼성전자주식회사 | 저온에서의 접합 방법, 및 이를 이용한 반도체 패키지 실장 방법 |
US8048448B2 (en) * | 2006-06-15 | 2011-11-01 | Abbott Cardiovascular Systems Inc. | Nanoshells for drug delivery |
EP2096905A1 (de) * | 2008-02-26 | 2009-09-02 | ROAL ELECTRONICS S.p.A. | Verfahren zum Aufbauen von elektronischen und/oder elektrooptischen Vorrichtungen auf einer Elektroleiterplatte |
JP5533665B2 (ja) | 2008-11-28 | 2014-06-25 | 富士通株式会社 | 電子装置の製造方法、電子部品搭載用基板及びその製造方法 |
CN103170757A (zh) * | 2011-12-23 | 2013-06-26 | 富泰华工业(深圳)有限公司 | 锡膏及其制备方法 |
IN2014DN07833A (de) | 2012-03-20 | 2015-04-24 | Alpha Metals | |
US10563292B2 (en) * | 2015-04-09 | 2020-02-18 | Electronics And Telecommunications Research Institute | Metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2712517C2 (de) * | 1977-03-22 | 1979-05-23 | Et. Dentaire Ivoclar, Schaan (Liechtenstein) | Verwendung einer Wismut-Zinn-Legierung zur Herstellung von Modellen in der Zahntechnik |
US4170472A (en) * | 1977-04-19 | 1979-10-09 | Motorola, Inc. | Solder system |
US4173468A (en) * | 1978-05-05 | 1979-11-06 | Gault Frank M | Alloy for soldering aluminum |
US4373974A (en) * | 1981-04-02 | 1983-02-15 | Mcdonnell Douglas Corporation | Solder composition |
US4670217A (en) * | 1985-07-26 | 1987-06-02 | J. W. Harris Company | Solder composition |
US4657589A (en) * | 1986-02-03 | 1987-04-14 | Mcdonnell Douglas Corporation | Solder cream |
ATE65444T1 (de) * | 1986-02-19 | 1991-08-15 | Degussa | Verwendung einer weichlotlegierung zum verbinden von keramikteilen. |
US4806309A (en) * | 1988-01-05 | 1989-02-21 | Willard Industries, Inc. | Tin base lead-free solder composition containing bismuth, silver and antimony |
GB9103018D0 (en) * | 1991-02-13 | 1991-03-27 | Lancashire Fittings Ltd | Lead free soft solder for stainless steel |
US5229070A (en) * | 1992-07-02 | 1993-07-20 | Motorola, Inc. | Low temperature-wetting tin-base solder paste |
US5221038A (en) * | 1992-10-05 | 1993-06-22 | Motorola, Inc. | Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature |
-
1993
- 1993-06-01 US US08/069,640 patent/US5389160A/en not_active Expired - Lifetime
-
1994
- 1994-04-05 AT AT94932155T patent/ATE194533T1/de not_active IP Right Cessation
- 1994-04-05 EP EP94932155A patent/EP0655961B1/de not_active Expired - Lifetime
- 1994-04-05 KR KR1019950700356A patent/KR100213695B1/ko not_active IP Right Cessation
- 1994-04-05 WO PCT/US1994/003730 patent/WO1994027777A1/en active IP Right Grant
- 1994-04-05 DE DE69425224T patent/DE69425224T2/de not_active Expired - Lifetime
- 1994-04-05 CA CA002140253A patent/CA2140253C/en not_active Expired - Fee Related
- 1994-04-05 JP JP50060895A patent/JP3476464B2/ja not_active Expired - Lifetime
- 1994-09-09 US US08/304,025 patent/US5429292A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3476464B2 (ja) | 2003-12-10 |
CA2140253A1 (en) | 1994-12-08 |
US5389160A (en) | 1995-02-14 |
JPH07509662A (ja) | 1995-10-26 |
DE69425224D1 (de) | 2000-08-17 |
EP0655961A1 (de) | 1995-06-07 |
EP0655961A4 (de) | 1996-04-17 |
DE69425224T2 (de) | 2001-03-08 |
CA2140253C (en) | 1998-12-22 |
KR950702463A (ko) | 1995-07-29 |
EP0655961B1 (de) | 2000-07-12 |
KR100213695B1 (ko) | 1999-08-02 |
WO1994027777A1 (en) | 1994-12-08 |
US5429292A (en) | 1995-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE194533T1 (de) | Zinn-wismuth-lötpaste und deren verwendung | |
TW363334B (en) | Lead-free, tin based solder composition | |
RU94030492A (ru) | Способ покрытия порошка, способы получения изделия из интерметаллического сплава, способ изготовления интерметаллической зубной пломбы и композиция | |
GB1440196A (en) | Method of producing a specified solder layer thickness in the production of semiconductor components | |
TW200605982A (en) | Solder paste and process | |
CA2135794A1 (en) | Tin-Bismuth Solder Connection Having Improved High Temperature Properties, and Process for Forming Same | |
TW354770B (en) | Kinetic solder paste composition | |
ES8104932A1 (es) | Procedimiento para la obtencion de una composicion para sol-dar. | |
MY111857A (en) | Soldering process | |
GB9903552D0 (en) | Reflow peak temperature reduction of solder alloys | |
RU99127935A (ru) | Способ изготовления объемных изделий из биметаллических порошковых композиций | |
MY116760A (en) | Electro-conductive composition and electronic equipment using same. | |
WO2003004713A3 (en) | Lead-free solder alloy | |
JPS5684432A (en) | Gold brazing material | |
Niepielska et al. | Production of Fine-Grained Powders From Soft Solders | |
RU92001259A (ru) | Припой для пайки изделий электронной техники | |
JP2002001575A (ja) | 無鉛半田合金およびこの無鉛半田合金を搭載した回路基板ならびに管球 | |
WO2001072466A3 (en) | Anti-scavenging solders for silver metallization and method | |
ES333624A1 (es) | Procedimiento para formar uniones por estano soldadura. | |
RU2049635C1 (ru) | Припой для пайки изделий электронной техники | |
CN1055135A (zh) | 纯金饰品用金基钎料合金 | |
KR930009685A (ko) | 브레이징용 가재(Brazing Filler Metal)의 제조방법 | |
RU93005425A (ru) | Припой для пайки изделий электронной техники | |
Sixt | In Retrospect--the Development and Manufacture of Copper Alloy Welding Metals in Austria | |
TW292254B (en) | Process for mixed solder paste |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |