TW292254B - Process for mixed solder paste - Google Patents

Process for mixed solder paste

Info

Publication number
TW292254B
TW292254B TW84101780A TW84101780A TW292254B TW 292254 B TW292254 B TW 292254B TW 84101780 A TW84101780 A TW 84101780A TW 84101780 A TW84101780 A TW 84101780A TW 292254 B TW292254 B TW 292254B
Authority
TW
Taiwan
Prior art keywords
powder
solder paste
alloy powder
mixed
mixed solder
Prior art date
Application number
TW84101780A
Other languages
Chinese (zh)
Inventor
Toshimago Taguchi
Tetsuya Okuno
Nana Kawabe
Original Assignee
Chisumi Kinzoku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chisumi Kinzoku Kogyo Kk filed Critical Chisumi Kinzoku Kogyo Kk
Application granted granted Critical
Publication of TW292254B publication Critical patent/TW292254B/en

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A manufacturing process for mixed solder paste, mainly comprising:- A powder: Sn: 55~65 wt%, Ag: 0~2 wt%, Pb: the rest Pb alloy powder B powder: Sn: 100~70 wt% or Sn alloy powder C powder: Pb: 100~70 wt% or Pb alloy powder and mixed with a paste soldering agent each particle size of alloy powder is 10~45 (muon)m and flux 8~15 wt% - Soldering conditions: reflowing furance with nitrogen and preheat temperature 150 deg.C time 15 min. and then proceed to solder at reflowing temperature.
TW84101780A 1994-11-11 1995-02-27 Process for mixed solder paste TW292254B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27780194 1994-11-11

Publications (1)

Publication Number Publication Date
TW292254B true TW292254B (en) 1996-12-01

Family

ID=51398349

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84101780A TW292254B (en) 1994-11-11 1995-02-27 Process for mixed solder paste

Country Status (1)

Country Link
TW (1) TW292254B (en)

Similar Documents

Publication Publication Date Title
CA2140253A1 (en) Tin Bismuth Solder Paste, and Method Using Paste to Form Connection Having Improved High Temperature Properties
TW363334B (en) Lead-free, tin based solder composition
EP0867255A3 (en) Electrical solder and method of manufacturing
CA2095258A1 (en) Lead-Free Alloy Containing Tin, Silver and Indium
MY104328A (en) Solder precipitating composition and method of precipitating solder
AU6395286A (en) Fusible powdered metal solder paste
EP0893514A3 (en) Aqueous solution for forming metallic complex, tin-silver alloy plating solution, and method of plating with said plating solution
GB2282871B (en) Inert gas delivery for reflow solder furnaces
TW200605982A (en) Solder paste and process
TW354770B (en) Kinetic solder paste composition
TW360578B (en) Lead-free solder used for connecting electronic parts on organic substrate
MX9603213A (en) Soldering process.
GB2352200B (en) Lead-free solder alloy powder paste use in PCB production
MY127928A (en) Solder paste for chip components
IL140053A0 (en) Method for encapsulating solder metal powders and solder metal powders produced according to this method
JPS5518505A (en) Soldering alloy for attaching silver electrode leading wire
TW292254B (en) Process for mixed solder paste
GB9601257D0 (en) Electrical interconnection assembly
CA2011030A1 (en) Process for reflow soldering
CA2122376A1 (en) Solder alloy having decreased fatigue rupture occurring on soldered joints exposed to heat cycle stress
JPS5711794A (en) Covered arc electrode for copper and copper alloy
ES8501276A1 (en) Solder alloys for brazing contact materials.
JPS5669341A (en) High temperature solder
WO2001072466A3 (en) Anti-scavenging solders for silver metallization and method
JPS57171571A (en) Joining method for super hard alloy and other metal