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Electric Connection Of Electric Components To Printed Circuits
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Abstract
A manufacturing process for mixed solder paste, mainly comprising:- A powder: Sn: 55~65 wt%, Ag: 0~2 wt%, Pb: the rest Pb alloy powder B powder: Sn: 100~70 wt% or Sn alloy powder C powder: Pb: 100~70 wt% or Pb alloy powder and mixed with a paste soldering agent each particle size of alloy powder is 10~45 (muon)m and flux 8~15 wt% - Soldering conditions: reflowing furance with nitrogen and preheat temperature 150 deg.C time 15 min. and then proceed to solder at reflowing temperature.
TW84101780A1994-11-111995-02-27Process for mixed solder paste
TW292254B
(en)