KR860007722A - 개선된 절연피막처리방법 및 그 처리방법에 따라 제조된 웨이퍼와 집적회로 - Google Patents

개선된 절연피막처리방법 및 그 처리방법에 따라 제조된 웨이퍼와 집적회로 Download PDF

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KR860007722A
KR860007722A KR1019860001081A KR860001081A KR860007722A KR 860007722 A KR860007722 A KR 860007722A KR 1019860001081 A KR1019860001081 A KR 1019860001081A KR 860001081 A KR860001081 A KR 860001081A KR 860007722 A KR860007722 A KR 860007722A
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South Korea
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processing method
semiconductor
wafer
integrated circuit
peak temperature
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KR1019860001081A
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English (en)
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데니스 스코벨 피터
레슬리 베이커 로저
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마크 챨스 데니스
에스티씨이 퍼블릭 리미리드 캄파니
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Publication of KR860007722A publication Critical patent/KR860007722A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/2636—Bombardment with radiation with high-energy radiation for heating, e.g. electron beam heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H01L21/2686—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation using incoherent radiation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

내용 없음

Description

개선된 절연피막처리방법 및 그 처리방법에 따라 제조된 웨이퍼와 집적회로
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
산화물 피막두께와 산화 시간간의 관계를 설명 도시된 도면

Claims (12)

  1. 반도체 표면에 균일한 얇은 산화물 피막을 형성시키는 방법에 있어서, 그 방법이 반도체를 산화대기 내에서 500℃를 초과하는 피크온도로 펄스(pulse)가열함을 포함하는 바의 방법.
  2. 제 1 항에 있어서, 반도체가 700℃에서 1200℃까지의 온도로 가열되는 바의 처리방법.
  3. 제 1 항 또는 2항에 있어서, 피크온도가 1초에서 60초까지의 시간동안 유지되는 바의 처리방법.
  4. 제 2 항에 있어서, 피크온도가 740℃에서 1100℃까지의 온도인 바의 처리방법.
  5. 제 4 항에 있어서, 피크온도가 1초에 45초까지의 시간동안 유지되는 바의 처리방법.
  6. 제 1 항에서 5항까지의 항들중 어느 한 항에 있어서, 피막두께가 0.8mm에서 20nm까지인 바의 처리방법.
  7. 제 1 항에서 6항까지의 항들중 어느 한 항에 있어서, 산화대기가 감소된 압력하에 유지되는 바의 처리 방법.
  8. 제 1 항에서 7항까지의 항들중 어느 한 항에 있어서, 반도체가 전자빔에 의해 가열되는 바의 처리방법.
  9. 제 1 항에서 7항까지의 항들중 어느 한 항에 있어서, 반도체가 마이크로파 또는 광학방사에 의해 가열되는 바의 처리 방법.
  10. 첨부도면에 따라 설명된 바와 같이 실체상 반도체 표면 산화용의 처리방법.
  11. 앞선 청구범위에서 설명된 바와 같은 처리방법에 의한 표면 산화물 피막을 갖춘 반도체 웨이퍼.
  12. 제11항에 청구된 웨이퍼로부터 제조되는 집적회로.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860001081A 1985-03-23 1986-02-17 개선된 절연피막처리방법 및 그 처리방법에 따라 제조된 웨이퍼와 집적회로 KR860007722A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB858507601A GB8507601D0 (en) 1985-03-23 1985-03-23 Integrated circuits
GB8507601 1985-03-23

Publications (1)

Publication Number Publication Date
KR860007722A true KR860007722A (ko) 1986-10-15

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ID=10576523

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860001081A KR860007722A (ko) 1985-03-23 1986-02-17 개선된 절연피막처리방법 및 그 처리방법에 따라 제조된 웨이퍼와 집적회로

Country Status (4)

Country Link
EP (1) EP0196155A3 (ko)
JP (1) JPS61230329A (ko)
KR (1) KR860007722A (ko)
GB (2) GB8507601D0 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244843A (en) * 1991-12-17 1993-09-14 Intel Corporation Process for forming a thin oxide layer
US5990516A (en) 1994-09-13 1999-11-23 Kabushiki Kaisha Toshiba MOSFET with a thin gate insulating film
KR100379136B1 (ko) 1998-10-02 2003-04-08 인터내셔널 비지네스 머신즈 코포레이션 반도체 소자 형성 방법과 반도체 소자
US6429101B1 (en) 1999-01-29 2002-08-06 International Business Machines Corporation Method of forming thermally stable polycrystal to single crystal electrical contact structure
CN101625974B (zh) 2008-07-08 2011-10-05 中芯国际集成电路制造(上海)有限公司 采用高能电磁辐射的快速热处理半导体衬底形成介电层的方法
DE102011100024A1 (de) * 2011-04-29 2012-10-31 Centrotherm Thermal Solutions Gmbh & Co. Kg Verfahren zum ausbilden einer schicht auf einem substrat
DE102012200799A1 (de) 2011-09-26 2013-03-28 Interpane Entwicklungs-Und Beratungsgesellschaft Mbh Brandschutzelement mit Schutzbeschichtung und dessen Herstellungsverfahren
GB2520030A (en) * 2013-11-06 2015-05-13 Univ Warwick Tunnel junction

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT964137B (it) * 1971-09-27 1974-01-21 Ibm Accrescimento di strati isolanti in particolare per dispositivi semiconduttori
JPS5559729A (en) * 1978-10-27 1980-05-06 Fujitsu Ltd Forming method of semiconductor surface insulating film
JPS56124236A (en) * 1980-03-03 1981-09-29 Nippon Telegr & Teleph Corp <Ntt> Method for selective thermal oxidized film formation on semiconductor substrate
JPS56161646A (en) * 1980-05-19 1981-12-12 Fujitsu Ltd Manufacture of semiconductor device
GB2106709B (en) * 1981-09-17 1986-11-12 Itt Ind Ltd Semiconductor processing
GB2164796B (en) * 1981-09-17 1986-11-12 Itt Ind Ltd Semiconductor processing
FR2543581B1 (fr) * 1983-03-31 1986-11-14 Fiori Costantino Procede pour former une couche d'oxyde sur la surface d'un substrat en materiau semiconducteur
US4544418A (en) * 1984-04-16 1985-10-01 Gibbons James F Process for high temperature surface reactions in semiconductor material

Also Published As

Publication number Publication date
EP0196155A3 (en) 1987-05-27
GB2172746A (en) 1986-09-24
GB8604286D0 (en) 1986-03-26
GB8507601D0 (en) 1985-05-01
EP0196155A2 (en) 1986-10-01
JPS61230329A (ja) 1986-10-14
GB2172746B (en) 1989-06-28

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