JPS6444023A - Heat treatment - Google Patents
Heat treatmentInfo
- Publication number
- JPS6444023A JPS6444023A JP19969487A JP19969487A JPS6444023A JP S6444023 A JPS6444023 A JP S6444023A JP 19969487 A JP19969487 A JP 19969487A JP 19969487 A JP19969487 A JP 19969487A JP S6444023 A JPS6444023 A JP S6444023A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thermal stress
- temperature
- temperature side
- temperature rising
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62199694A JP2675011B2 (en) | 1987-08-12 | 1987-08-12 | Heat treatment apparatus and heat treatment method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62199694A JP2675011B2 (en) | 1987-08-12 | 1987-08-12 | Heat treatment apparatus and heat treatment method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6444023A true JPS6444023A (en) | 1989-02-16 |
JP2675011B2 JP2675011B2 (en) | 1997-11-12 |
Family
ID=16412059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62199694A Expired - Lifetime JP2675011B2 (en) | 1987-08-12 | 1987-08-12 | Heat treatment apparatus and heat treatment method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2675011B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5880503A (en) * | 1996-08-07 | 1999-03-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit device having static memory cell with CMOS structure |
DE19938781A1 (en) * | 1999-08-16 | 2001-03-01 | Infineon Technologies Ag | Grinding disk for conditioning of polishing surface for polishing of semiconductor structures |
KR20010066153A (en) * | 1999-12-31 | 2001-07-11 | 황인길 | a method of rapid thermal process |
US6372611B1 (en) | 1997-01-24 | 2002-04-16 | Nec Corporation | Semiconductor manufacturing method including gettering of metal impurities |
US9870964B1 (en) | 2016-09-28 | 2018-01-16 | Hitachi Kokusai Electric, Inc. | Method of manufacturing semiconductor device by determining and selecting cooling recipe based on temperature |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4967566A (en) * | 1972-11-02 | 1974-07-01 | ||
JPS5595330A (en) * | 1979-01-12 | 1980-07-19 | Toshiba Corp | Preparation of semiconductor device |
JPS57167638A (en) * | 1981-03-11 | 1982-10-15 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS61137332A (en) * | 1984-12-08 | 1986-06-25 | Internatl Rectifier Corp Japan Ltd | Manufacture of high speed semiconductor device |
-
1987
- 1987-08-12 JP JP62199694A patent/JP2675011B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4967566A (en) * | 1972-11-02 | 1974-07-01 | ||
JPS5595330A (en) * | 1979-01-12 | 1980-07-19 | Toshiba Corp | Preparation of semiconductor device |
JPS57167638A (en) * | 1981-03-11 | 1982-10-15 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS61137332A (en) * | 1984-12-08 | 1986-06-25 | Internatl Rectifier Corp Japan Ltd | Manufacture of high speed semiconductor device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5880503A (en) * | 1996-08-07 | 1999-03-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit device having static memory cell with CMOS structure |
US6372611B1 (en) | 1997-01-24 | 2002-04-16 | Nec Corporation | Semiconductor manufacturing method including gettering of metal impurities |
DE19938781A1 (en) * | 1999-08-16 | 2001-03-01 | Infineon Technologies Ag | Grinding disk for conditioning of polishing surface for polishing of semiconductor structures |
DE19938781B4 (en) * | 1999-08-16 | 2004-09-09 | Infineon Technologies Ag | Conditioning disc for conditioning CMP pads |
KR20010066153A (en) * | 1999-12-31 | 2001-07-11 | 황인길 | a method of rapid thermal process |
US9870964B1 (en) | 2016-09-28 | 2018-01-16 | Hitachi Kokusai Electric, Inc. | Method of manufacturing semiconductor device by determining and selecting cooling recipe based on temperature |
Also Published As
Publication number | Publication date |
---|---|
JP2675011B2 (en) | 1997-11-12 |
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Legal Events
Date | Code | Title | Description |
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S531 | Written request for registration of change of domicile |
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S111 | Request for change of ownership or part of ownership |
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