KR860000239Y1 - 혼성집적회로의 봉지구조 - Google Patents
혼성집적회로의 봉지구조 Download PDFInfo
- Publication number
- KR860000239Y1 KR860000239Y1 KR2019820003095U KR820003095U KR860000239Y1 KR 860000239 Y1 KR860000239 Y1 KR 860000239Y1 KR 2019820003095 U KR2019820003095 U KR 2019820003095U KR 820003095 U KR820003095 U KR 820003095U KR 860000239 Y1 KR860000239 Y1 KR 860000239Y1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- hybrid integrated
- resin layer
- encapsulation structure
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/481—Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56-160053(U) | 1981-10-26 | ||
| JP1981160053U JPS5866646U (ja) | 1981-10-26 | 1981-10-26 | 混成集積回路の封止構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR830004331U KR830004331U (ko) | 1983-12-30 |
| KR860000239Y1 true KR860000239Y1 (ko) | 1986-03-05 |
Family
ID=29952483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019820003095U Expired KR860000239Y1 (ko) | 1981-10-26 | 1982-04-20 | 혼성집적회로의 봉지구조 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5866646U (enExample) |
| KR (1) | KR860000239Y1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3539467B2 (ja) * | 1997-03-25 | 2004-07-07 | ミツミ電機株式会社 | 電子部品モジュール |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53139206U (enExample) * | 1977-04-07 | 1978-11-04 |
-
1981
- 1981-10-26 JP JP1981160053U patent/JPS5866646U/ja active Granted
-
1982
- 1982-04-20 KR KR2019820003095U patent/KR860000239Y1/ko not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5866646U (ja) | 1983-05-06 |
| KR830004331U (ko) | 1983-12-30 |
| JPS622775Y2 (enExample) | 1987-01-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4814943A (en) | Printed circuit devices using thermoplastic resin cover plate | |
| US4819041A (en) | Surface mounted integrated circuit chip package and method for making same | |
| KR970013239A (ko) | 반도체장치 및 그 실장 구조 | |
| KR950004467A (ko) | 반도체장치 및 그 제조방법 | |
| JPS61198769A (ja) | 混成集積回路 | |
| KR890001172A (ko) | 반도체 장치 | |
| KR860000239Y1 (ko) | 혼성집적회로의 봉지구조 | |
| JPS59129447A (ja) | 樹脂製キヤツプを有する半導体装置 | |
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| US6312975B1 (en) | Semiconductor package and method of manufacturing the same | |
| JP2515515Y2 (ja) | 電子機器 | |
| JP2932772B2 (ja) | 混成集積回路装置 | |
| JP2914679B2 (ja) | 混成集積回路装置 | |
| JPS629729Y2 (enExample) | ||
| KR200156148Y1 (ko) | 반도체 패키지 | |
| JPS622776Y2 (enExample) | ||
| KR19980019661A (ko) | 홈이 형성된 인쇄회로기판을 이용한 COB(Chip On Board)패키지 | |
| KR0185515B1 (ko) | 칩사이즈의볼그리드어레이 | |
| JPH0458189B2 (enExample) | ||
| JPH0236280Y2 (enExample) | ||
| JPH0739244Y2 (ja) | 混成集積回路装置 | |
| JPS5982750A (ja) | 高密度セラミツクパツケ−ジ | |
| JPH07161858A (ja) | 表面実装半導体装置のリード保護構造 | |
| JPH05183070A (ja) | 半導体チップ搭載用プリント配線板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| UA0108 | Application for utility model registration |
St.27 status event code: A-0-1-A10-A12-nap-UA0108 |
|
| UA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-UA0201 |
|
| UG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-UG1501 |
|
| UG1604 | Publication of application |
St.27 status event code: A-2-2-Q10-Q13-nap-UG1604 |
|
| UE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-UE0701 |
|
| UR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-UR0701 |
|
| UR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-UR1002 Fee payment year number: 1 |
|
| UR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-UR1001 Fee payment year number: 4 |
|
| UR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-UR1001 Fee payment year number: 5 |
|
| UR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-UR1001 Fee payment year number: 6 |
|
| UR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-UR1001 Fee payment year number: 7 |
|
| UR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-UR1001 Fee payment year number: 8 |
|
| UR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-UR1001 Fee payment year number: 9 |
|
| UC1801 | Expiration of term |
St.27 status event code: N-4-6-H10-H14-oth-UC1801 Not in force date: 19940421 Ip right cessation event data comment text: Termination Category : OTHERS |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |