JPH0236280Y2 - - Google Patents
Info
- Publication number
- JPH0236280Y2 JPH0236280Y2 JP1983033581U JP3358183U JPH0236280Y2 JP H0236280 Y2 JPH0236280 Y2 JP H0236280Y2 JP 1983033581 U JP1983033581 U JP 1983033581U JP 3358183 U JP3358183 U JP 3358183U JP H0236280 Y2 JPH0236280 Y2 JP H0236280Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- circuit board
- hybrid integrated
- integrated circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W74/00—
-
- H10W90/724—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983033581U JPS59138236U (ja) | 1983-03-07 | 1983-03-07 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983033581U JPS59138236U (ja) | 1983-03-07 | 1983-03-07 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59138236U JPS59138236U (ja) | 1984-09-14 |
| JPH0236280Y2 true JPH0236280Y2 (enExample) | 1990-10-03 |
Family
ID=30164364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983033581U Granted JPS59138236U (ja) | 1983-03-07 | 1983-03-07 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59138236U (enExample) |
-
1983
- 1983-03-07 JP JP1983033581U patent/JPS59138236U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59138236U (ja) | 1984-09-14 |
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