KR850002687A - 링과 박판의 첩착장치 - Google Patents

링과 박판의 첩착장치 Download PDF

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Publication number
KR850002687A
KR850002687A KR1019840005410A KR840005410A KR850002687A KR 850002687 A KR850002687 A KR 850002687A KR 1019840005410 A KR1019840005410 A KR 1019840005410A KR 840005410 A KR840005410 A KR 840005410A KR 850002687 A KR850002687 A KR 850002687A
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KR
South Korea
Prior art keywords
ring
thin plate
support table
sticking device
adhesive film
Prior art date
Application number
KR1019840005410A
Other languages
English (en)
Other versions
KR900001038B1 (ko
Inventor
케이고 후나꼬시 (외 1)
Original Assignee
히지가따 사부로오
닛또오덴기 고오교오 가부시기 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히지가따 사부로오, 닛또오덴기 고오교오 가부시기 가이샤 filed Critical 히지가따 사부로오
Publication of KR850002687A publication Critical patent/KR850002687A/ko
Application granted granted Critical
Publication of KR900001038B1 publication Critical patent/KR900001038B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
    • B65H35/06—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators from or with blade, e.g. shear-blade, cutters or perforators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1348—Work traversing type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1788—Work traversing type and/or means applying work to wall or static structure
    • Y10T156/1793—Grip or clamp for web end
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1788—Work traversing type and/or means applying work to wall or static structure
    • Y10T156/1795—Implement carried web supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/18—Surface bonding means and/or assembly means with handle or handgrip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/748—With work immobilizer
    • Y10T83/7487—Means to clamp work
    • Y10T83/7493—Combined with, peculiarly related to, other element
    • Y10T83/7507—Guide for traveling cutter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/768—Rotatable disc tool pair or tool and carrier
    • Y10T83/7755—Carrier for rotatable tool movable during cutting
    • Y10T83/7788—Tool carrier oscillated or rotated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8748—Tool displaceable to inactive position [e.g., for work loading]
    • Y10T83/8749—By pivotal motion

Abstract

내용 없음

Description

링과 박판의 첩착장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명 첩착장치의 일실시예를 나타낸 측면도. 제2도는 동상 확대 종단측면도. 제3도는 동상확대 평면도. 제4도는 제2도 Ⅰ-Ⅰ선의 횡단 평면도. 제5도는 분리수단의 확대 종단측면도.

Claims (2)

  1. 링과 박판을 정위치에 지지하는 테이블과 이 테이블 위를 이동해서 점착필름을 링과 박판 위에 첩착하는 첩착수단을 착설하고, 테이블의 일단 위쪽에 기복 자재케 부착한 지지틀에는 링 위의 점착필름을 링에 연해서 타발하는 도려내기 수단과, 링과 박판 위에 첩착된 필름을 후속하는 점착필름에서 떼어내는 분를 수단을 착설한 링과 박판의 첩착장치.
  2. 제1항에 있어서, 링 지지테이블과 박판지지테이블을 별개체로 하고, 링 지지테이블을 프레임에 고정하고, 박판지지테이블을 부유식으로 한 링과 박판의 첩착장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840005410A 1983-09-13 1984-09-04 링과 박판의 접착장치 KR900001038B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58-170393 1983-09-13
JP58170393A JPS6060800A (ja) 1983-09-13 1983-09-13 リングと薄板の貼着装置

Publications (2)

Publication Number Publication Date
KR850002687A true KR850002687A (ko) 1985-05-15
KR900001038B1 KR900001038B1 (ko) 1990-02-26

Family

ID=15904092

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840005410A KR900001038B1 (ko) 1983-09-13 1984-09-04 링과 박판의 접착장치

Country Status (6)

Country Link
US (1) US4522679A (ko)
JP (1) JPS6060800A (ko)
KR (1) KR900001038B1 (ko)
DE (1) DE3427870A1 (ko)
FR (1) FR2551918B1 (ko)
GB (1) GB2146305B (ko)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2128580B (en) * 1982-09-06 1986-07-02 Kulicke & Soffa Handling system for laminar objects
US4662970A (en) * 1984-04-30 1987-05-05 Banson Nominees Pty. Ltd. Pads and their formation
US4714511A (en) * 1985-02-07 1987-12-22 Fujitsu Limited Method and apparatus for adhering a tape or sheet to a semiconductor wafer
JPH0671971B2 (ja) * 1985-05-23 1994-09-14 日東電工株式会社 テ−プ貼着装置におけるテ−プ端部保持装置
JPS61273462A (ja) * 1985-05-23 1986-12-03 Nitto Electric Ind Co Ltd テ−プ貼着装置におけるテ−プ繰り出し装置
US4824516A (en) * 1985-12-16 1989-04-25 Seibu Polymer Kasei Kabushiki Kaishas Pavement-marking tape applicator
FR2596552B1 (fr) * 1986-03-25 1989-07-28 Dassault Electronique Distributeur-programmateur automatique de cartes a micro-circuit
DE3614365A1 (de) * 1986-04-28 1987-10-29 Messerschmitt Boelkow Blohm Vorrichtung zum ablegen eines vorimpraegnierten faserbandes
US4779497A (en) * 1987-01-23 1988-10-25 Teikoku Seiki Kabushiki Kaisha Device and method of cutting off a portion of masking film adhered to a silicon wafer
JPS6443458A (en) * 1987-08-11 1989-02-15 Nitto Denko Corp Stick cutter for tacky tape with respect to thin board
JPH01143211A (ja) * 1987-11-27 1989-06-05 Takatori Haitetsuku:Kk ウエハーに対する保護テープの貼付け切り抜き方法および装置
US5097978A (en) * 1991-03-08 1992-03-24 Seagate Technology, Inc. Sealing apparatus for a disc drive
JPH04336428A (ja) * 1991-05-13 1992-11-24 Nitto Denko Corp ウエハのテープ貼合わせ剥離装置
JPH05121543A (ja) * 1991-08-09 1993-05-18 Teikoku Seiki Kk ウエハーマウンタのウエハー支持方法、その装置及びその装置を備えるウエハーマウンタ
US5362681A (en) * 1992-07-22 1994-11-08 Anaglog Devices, Inc. Method for separating circuit dies from a wafer
KR970002433B1 (ko) * 1993-12-31 1997-03-05 삼성전자 주식회사 마스킹 필름의 부착 방법 및 이에 사용되는 마스킹 필름 부착 장치
JPH1032179A (ja) * 1996-07-15 1998-02-03 Teikoku T-Pingu Syst Kk シリコンウエハー加工用マスキングシートの切断方法
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
JP3303294B2 (ja) * 1999-06-11 2002-07-15 株式会社東京精密 半導体保護テープの切断方法
JP3667241B2 (ja) * 2001-03-09 2005-07-06 松下電器産業株式会社 ボンディング方法および装置
AT502233B1 (de) * 2001-06-07 2007-04-15 Thallner Erich Vorrichtung zum lösen eines trägers von einer halbleiterscheibe
JP2010098062A (ja) * 2008-10-15 2010-04-30 Disco Abrasive Syst Ltd 支持テーブル
JP6114585B2 (ja) * 2013-03-15 2017-04-12 リンテック株式会社 シート貼付装置および貼付方法
JP6114586B2 (ja) * 2013-03-15 2017-04-12 リンテック株式会社 シート切断治具
CN105438885B (zh) * 2015-11-24 2017-05-31 宁波普利达智能科技应用有限公司 贴双面胶的机构
CN105946026B (zh) * 2016-06-17 2017-12-29 浙江钱江摩托股份有限公司 一种切膜机
KR102293007B1 (ko) * 2018-10-05 2021-08-24 주식회사 엘지에너지솔루션 배터리 셀의 테이프 부착 장치

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US1527763A (en) * 1925-02-24 Gasket cutter
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US2873789A (en) * 1957-02-18 1959-02-17 Francis J Ditter Protective tape applicator
US3971691A (en) * 1975-03-27 1976-07-27 Hercules Incorporated Apparatus for film application
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US4050971A (en) * 1976-02-19 1977-09-27 Minnesota Mining And Manufacturing Company Device for fusing lengths of film over the open ends of cups
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JPS5742918U (ko) * 1980-08-26 1982-03-09
JPS57132337A (en) * 1981-02-09 1982-08-16 Matsushita Electric Ind Co Ltd Expander device
IT8133115V0 (it) * 1981-04-01 1981-04-01 Strapazzini Resine Taglierina automatica e programmabile per il taglio trasversale di materiali flessibili

Also Published As

Publication number Publication date
GB2146305B (en) 1986-05-29
GB2146305A (en) 1985-04-17
FR2551918B1 (fr) 1986-08-14
US4522679A (en) 1985-06-11
DE3427870C2 (ko) 1987-02-05
DE3427870A1 (de) 1985-03-28
JPS6060800A (ja) 1985-04-08
GB8418096D0 (en) 1984-08-22
FR2551918A1 (fr) 1985-03-15
KR900001038B1 (ko) 1990-02-26
JPS6317738B2 (ko) 1988-04-14

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