KR840001426B1 - 전기전자 부품용 동합금 및 동합금판의 제조방법 - Google Patents

전기전자 부품용 동합금 및 동합금판의 제조방법 Download PDF

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Publication number
KR840001426B1
KR840001426B1 KR8204714A KR820004714A KR840001426B1 KR 840001426 B1 KR840001426 B1 KR 840001426B1 KR 8204714 A KR8204714 A KR 8204714A KR 820004714 A KR820004714 A KR 820004714A KR 840001426 B1 KR840001426 B1 KR 840001426B1
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South Korea
Prior art keywords
annealing
cold rolling
hours
strength
electrical conductivity
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Expired
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KR8204714A
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English (en)
Korean (ko)
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KR840002036A (ko
Inventor
김영길
박동규
Original Assignee
이영세
풍산금속공업 주식회사
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Publication date
Application filed by 이영세, 풍산금속공업 주식회사 filed Critical 이영세
Priority to KR8204714A priority Critical patent/KR840001426B1/ko
Priority to JP58118056A priority patent/JPS5974251A/ja
Priority to US06/534,893 priority patent/US4466939A/en
Priority to NLAANVRAGE8303605,A priority patent/NL188587C/xx
Publication of KR840002036A publication Critical patent/KR840002036A/ko
Application granted granted Critical
Publication of KR840001426B1 publication Critical patent/KR840001426B1/ko
Expired legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
KR8204714A 1982-10-20 1982-10-20 전기전자 부품용 동합금 및 동합금판의 제조방법 Expired KR840001426B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR8204714A KR840001426B1 (ko) 1982-10-20 1982-10-20 전기전자 부품용 동합금 및 동합금판의 제조방법
JP58118056A JPS5974251A (ja) 1982-10-20 1983-06-28 電気，電子部品用銅合金の製造方法
US06/534,893 US4466939A (en) 1982-10-20 1983-09-22 Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts
NLAANVRAGE8303605,A NL188587C (nl) 1982-10-20 1983-10-19 Koper-nikkellegering en werkwijze voor het vervaardigen daarvan.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR8204714A KR840001426B1 (ko) 1982-10-20 1982-10-20 전기전자 부품용 동합금 및 동합금판의 제조방법

Publications (2)

Publication Number Publication Date
KR840002036A KR840002036A (ko) 1984-06-11
KR840001426B1 true KR840001426B1 (ko) 1984-09-26

Family

ID=19225859

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8204714A Expired KR840001426B1 (ko) 1982-10-20 1982-10-20 전기전자 부품용 동합금 및 동합금판의 제조방법

Country Status (4)

Country Link
US (1) US4466939A (https=)
JP (1) JPS5974251A (https=)
KR (1) KR840001426B1 (https=)
NL (1) NL188587C (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
US4805009A (en) * 1985-03-11 1989-02-14 Olin Corporation Hermetically sealed semiconductor package
US4728372A (en) * 1985-04-26 1988-03-01 Olin Corporation Multipurpose copper alloys and processing therefor with moderate conductivity and high strength
US4594221A (en) * 1985-04-26 1986-06-10 Olin Corporation Multipurpose copper alloys with moderate conductivity and high strength
JPH07123155B2 (ja) * 1985-09-14 1995-12-25 株式会社住友金属セラミックス 半導体装置用容器及びその製造方法
US4715866A (en) * 1986-01-15 1987-12-29 National Distillers And Chemical Corporation Derivatives of polyether glycol esters of polycarboxylic acids as rheological additives for coal-water slurries
JPH01139736A (ja) * 1987-11-25 1989-06-01 Yazaki Corp 銅合金
DE68920995T2 (de) * 1989-05-23 1995-05-24 Yazaki Corp Elektrische Leiter auf der Basis von Cu-Fe-P Legierungen.
US5322575A (en) * 1991-01-17 1994-06-21 Dowa Mining Co., Ltd. Process for production of copper base alloys and terminals using the same
JPH0774420B2 (ja) * 1991-02-21 1995-08-09 日本碍子株式会社 ベリリウム銅合金の製造方法
DE4115998C2 (de) * 1991-05-16 1999-02-25 Diehl Stiftung & Co Verfahren zur Herstellung von Kupferlegierungen
KR940010455B1 (ko) * 1992-09-24 1994-10-22 김영길 고강도, 우수한 전기전도도 및 열적안정성을 갖는 동(Cu)합금 및 그 제조방법
DE4415067C2 (de) * 1994-04-29 1996-02-22 Diehl Gmbh & Co Verfahren zur Herstellung einer Kupfer-Nickel-Silizium-Legierung und deren Verwendung
FR2751990B1 (fr) * 1996-07-30 1998-10-02 Griset Ets Alliage a base de cuivre a conductivite electrique et a temperature d'adoucissement elevees pour des applications dans l'electronique
US6251199B1 (en) 1999-05-04 2001-06-26 Olin Corporation Copper alloy having improved resistance to cracking due to localized stress
CN100422365C (zh) * 2003-07-28 2008-10-01 中铝洛阳铜业有限责任公司 Lsic用引线框架铜带及其制作工艺方法
US7291232B2 (en) * 2003-09-23 2007-11-06 Luvata Oy Process for high strength, high conductivity copper alloy of Cu-Ni-Si group
WO2010140915A1 (ru) * 2009-06-04 2010-12-09 Kostln Sergei Alekseevich Способ получения дисперсионно твердеющего низколегированного сплава на медной основе и способ производства из него металлопродукции
KR101472348B1 (ko) * 2012-11-09 2014-12-15 주식회사 풍산 전기전자 부품용 동합금재 및 그의 제조 방법
CN106233447A (zh) 2014-04-21 2016-12-14 新日铁住金高新材料株式会社 半导体装置用接合线
CN111020283B (zh) * 2019-12-06 2021-07-20 宁波金田铜业(集团)股份有限公司 插件用铜合金带材及其制备方法
CN112518174A (zh) * 2020-12-04 2021-03-19 杭州华光焊接新材料股份有限公司 一种电真空器件焊接用的低银钎料及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522112A (en) * 1967-06-26 1970-07-28 Olin Corp Process for treating copper base alloy
FR2380347A1 (fr) * 1977-02-09 1978-09-08 Trefimetaux Alliages a base de cuivre, en bandes minces, pour applications electriques et electroniques
FR2383240A1 (fr) * 1977-03-09 1978-10-06 Louyot Comptoir Lyon Alemand Alliage de cuivre a haute conductibilite electrique
JPS5841782B2 (ja) * 1978-11-20 1983-09-14 玉川機械金属株式会社 Ｉｃ用リ−ド材
JPS55104449A (en) * 1979-02-02 1980-08-09 Hitachi Ltd High-strength high-electrically-conductive copper alloy with superior weldability
JPS5677354A (en) * 1979-11-27 1981-06-25 Chuetsu Gokin Chuko Kk Brass alloy with superior oxidation resistance at high temperature
JPS5853059B2 (ja) * 1979-12-25 1983-11-26 日本鉱業株式会社 析出硬化型銅合金
JPS5818981B2 (ja) * 1980-06-06 1983-04-15 日本鉱業株式会社 半導体機器のリ−ド材用銅合金
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture
JPS57109357A (en) * 1980-12-26 1982-07-07 Nippon Mining Co Ltd Copper alloy for semiconductor device lead
JPS57109356A (en) * 1980-12-26 1982-07-07 Nippon Mining Co Ltd Copper alloy for semiconductor device lead
JPS594493B2 (ja) * 1981-01-10 1984-01-30 日本鉱業株式会社 半導体機器のリ−ド材用銅合金

Also Published As

Publication number Publication date
JPS5974251A (ja) 1984-04-26
NL188587B (nl) 1992-03-02
NL8303605A (nl) 1984-05-16
NL188587C (nl) 1992-08-03
KR840002036A (ko) 1984-06-11
JPS6229503B2 (https=) 1987-06-26
US4466939A (en) 1984-08-21

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