KR830006781A - 후막(厚膜)저항회로 - Google Patents

후막(厚膜)저항회로 Download PDF

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Publication number
KR830006781A
KR830006781A KR1019810002341A KR810002341A KR830006781A KR 830006781 A KR830006781 A KR 830006781A KR 1019810002341 A KR1019810002341 A KR 1019810002341A KR 810002341 A KR810002341 A KR 810002341A KR 830006781 A KR830006781 A KR 830006781A
Authority
KR
South Korea
Prior art keywords
heating
substrate
thick film
tissue
establish
Prior art date
Application number
KR1019810002341A
Other languages
English (en)
Inventor
프란시스 브라운 죤
미쉘 스탠톤 로버트
Original Assignee
오레그 이.알버
웨스턴 일렉트릭 캄파니, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오레그 이.알버, 웨스턴 일렉트릭 캄파니, 인코포레이티드 filed Critical 오레그 이.알버
Publication of KR830006781A publication Critical patent/KR830006781A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/001—Starting from powder comprising reducible metal compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Non-Adjustable Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

내용 없음

Description

후막(厚膜)저항회로
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 본 발명의 한 실시예에 따라 설비된 후막회로의 단면도.

Claims (1)

  1. 본문에 설명하고 도면에 도시한 바와 같이, 기판상에 금속을 포함하는 레이스트를 침적하는 단계와, 금속화 물질과 기판사이의 접착을 설정하기에 충분한 온도에서 조직을 가열하는 단계와, 도전체들의 영역과 상기 기판상에 저항물질(13)을 형성하는 단계와, 저항물질에 요구된 저항성을 설정하기 위하여 산화성 분위기내에서 결과조직을 가열하는 단계와, 도전체에 요구된 저항성을 설정하기 위하여 환원성 분위기내에서 조직을 가열하는 단계를 포함하는 기판상(10)의 비귀금속 도전체(11, 12)를 포함한 후막저항회로를 설비하기 위한 방법에 있어서, 도전체 페이스트가 낮은 온도의 산화성 분위기 내에서의 가열로 접착이 성취되도록 유리원료들을 포함하며, 초기가열로 인한 금속산화물이 저항물질에 심오한 악영향을 끼치지 않도록 충분히 낮은 온도에서 환원되어지는 것을 특징으로 하는 후막저항회로.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019810002341A 1980-07-03 1981-06-29 후막(厚膜)저항회로 KR830006781A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/165,551 US4316920A (en) 1980-07-03 1980-07-03 Thick film resistor circuits
US165551 1980-07-03

Publications (1)

Publication Number Publication Date
KR830006781A true KR830006781A (ko) 1983-10-06

Family

ID=22599395

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019810002341A KR830006781A (ko) 1980-07-03 1981-06-29 후막(厚膜)저항회로

Country Status (9)

Country Link
US (1) US4316920A (ko)
EP (1) EP0055277B1 (ko)
JP (1) JPH0213803B2 (ko)
KR (1) KR830006781A (ko)
CA (1) CA1159122A (ko)
GB (1) GB2079322B (ko)
HK (1) HK69984A (ko)
SG (1) SG33284G (ko)
WO (1) WO1982000233A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409261A (en) * 1980-02-07 1983-10-11 Cts Corporation Process for air firing oxidizable conductors
JPS5852900A (ja) * 1981-09-24 1983-03-29 株式会社日立製作所 セラミツク多層配線板の製造方法
US4503090A (en) * 1983-02-23 1985-03-05 At&T Bell Laboratories Thick film resistor circuits
US4511601A (en) * 1983-05-13 1985-04-16 North American Philips Corporation Copper metallization for dielectric materials
US4536328A (en) * 1984-05-30 1985-08-20 Heraeus Cermalloy, Inc. Electrical resistance compositions and methods of making the same
US4619894A (en) * 1985-04-12 1986-10-28 Massachusetts Institute Of Technology Solid-transformation thermal resist
JPH0653253B2 (ja) * 1986-11-08 1994-07-20 松下電工株式会社 セラミツク基板の粗化法
JPH0795483B2 (ja) * 1989-05-18 1995-10-11 株式会社東芝 厚膜抵抗素子の製造方法
GB8920745D0 (en) * 1989-09-13 1989-10-25 Ici Plc Thick film resistor/integrated circuit substrate and method of manufacture
JP5766336B1 (ja) * 2014-06-16 2015-08-19 株式会社マテリアル・コンセプト 銅ペーストの焼成方法
CZ2020110A3 (cs) * 2020-03-03 2021-04-28 Západočeská Univerzita V Plzni Způsob výroby rezistoru pro výkonové aplikace

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2993815A (en) * 1959-05-25 1961-07-25 Bell Telephone Labor Inc Metallizing refractory substrates
US3310432A (en) * 1963-07-11 1967-03-21 Corning Glass Works Method for applying electrical conductors on a smooth vitreous surface and article
US3481306A (en) * 1967-04-27 1969-12-02 Itt Apparatus for chemical adjustment of film components
US3645783A (en) * 1970-06-03 1972-02-29 Infrared Ind Inc Thin film planar resistor
GB1374763A (en) * 1971-12-21 1974-11-20 Atomic Energy Authority Uk Metalising pastes
US3998980A (en) * 1972-05-05 1976-12-21 Hewlett-Packard Company Fabrication of thick film resistors
US3914514A (en) * 1973-08-16 1975-10-21 Trw Inc Termination for resistor and method of making the same
GB1506450A (en) * 1974-09-18 1978-04-05 Siemens Ag Pastes for the production of thick-film conductor paths
US4079156A (en) * 1975-03-07 1978-03-14 Uop Inc. Conductive metal pigments
US4072771A (en) * 1975-11-28 1978-02-07 Bala Electronics Corporation Copper thick film conductor
US4172919A (en) * 1977-04-22 1979-10-30 E. I. Du Pont De Nemours And Company Copper conductor compositions containing copper oxide and Bi2 O3
US4140817A (en) * 1977-11-04 1979-02-20 Bell Telephone Laboratories, Incorporated Thick film resistor circuits
US4191789A (en) * 1978-11-02 1980-03-04 Bell Telephone Laboratories, Incorporated Fabrication of bi-level circuits

Also Published As

Publication number Publication date
US4316920A (en) 1982-02-23
EP0055277A1 (en) 1982-07-07
EP0055277B1 (en) 1985-10-02
SG33284G (en) 1985-02-08
JPH0213803B2 (ko) 1990-04-05
CA1159122A (en) 1983-12-20
EP0055277A4 (en) 1983-06-08
HK69984A (en) 1984-09-14
GB2079322B (en) 1983-11-09
GB2079322A (en) 1982-01-20
WO1982000233A1 (en) 1982-01-21
JPS57500955A (ko) 1982-05-27

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