SG33284G - Thick film resistor circuits - Google Patents
Thick film resistor circuitsInfo
- Publication number
- SG33284G SG33284G SG332/84A SG33284A SG33284G SG 33284 G SG33284 G SG 33284G SG 332/84 A SG332/84 A SG 332/84A SG 33284 A SG33284 A SG 33284A SG 33284 G SG33284 G SG 33284G
- Authority
- SG
- Singapore
- Prior art keywords
- thick film
- film resistor
- resistor circuits
- circuits
- thick
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/001—Starting from powder comprising reducible metal compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Non-Adjustable Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/165,551 US4316920A (en) | 1980-07-03 | 1980-07-03 | Thick film resistor circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
SG33284G true SG33284G (en) | 1985-02-08 |
Family
ID=22599395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG332/84A SG33284G (en) | 1980-07-03 | 1984-04-25 | Thick film resistor circuits |
Country Status (9)
Country | Link |
---|---|
US (1) | US4316920A (ko) |
EP (1) | EP0055277B1 (ko) |
JP (1) | JPH0213803B2 (ko) |
KR (1) | KR830006781A (ko) |
CA (1) | CA1159122A (ko) |
GB (1) | GB2079322B (ko) |
HK (1) | HK69984A (ko) |
SG (1) | SG33284G (ko) |
WO (1) | WO1982000233A1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4409261A (en) * | 1980-02-07 | 1983-10-11 | Cts Corporation | Process for air firing oxidizable conductors |
JPS5852900A (ja) * | 1981-09-24 | 1983-03-29 | 株式会社日立製作所 | セラミツク多層配線板の製造方法 |
US4503090A (en) * | 1983-02-23 | 1985-03-05 | At&T Bell Laboratories | Thick film resistor circuits |
US4511601A (en) * | 1983-05-13 | 1985-04-16 | North American Philips Corporation | Copper metallization for dielectric materials |
US4536328A (en) * | 1984-05-30 | 1985-08-20 | Heraeus Cermalloy, Inc. | Electrical resistance compositions and methods of making the same |
US4619894A (en) * | 1985-04-12 | 1986-10-28 | Massachusetts Institute Of Technology | Solid-transformation thermal resist |
JPH0653253B2 (ja) * | 1986-11-08 | 1994-07-20 | 松下電工株式会社 | セラミツク基板の粗化法 |
JPH0795483B2 (ja) * | 1989-05-18 | 1995-10-11 | 株式会社東芝 | 厚膜抵抗素子の製造方法 |
GB8920745D0 (en) * | 1989-09-13 | 1989-10-25 | Ici Plc | Thick film resistor/integrated circuit substrate and method of manufacture |
JP5766336B1 (ja) | 2014-06-16 | 2015-08-19 | 株式会社マテリアル・コンセプト | 銅ペーストの焼成方法 |
CZ2020110A3 (cs) * | 2020-03-03 | 2021-04-28 | Západočeská Univerzita V Plzni | Způsob výroby rezistoru pro výkonové aplikace |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2993815A (en) * | 1959-05-25 | 1961-07-25 | Bell Telephone Labor Inc | Metallizing refractory substrates |
US3310432A (en) * | 1963-07-11 | 1967-03-21 | Corning Glass Works | Method for applying electrical conductors on a smooth vitreous surface and article |
US3481306A (en) * | 1967-04-27 | 1969-12-02 | Itt | Apparatus for chemical adjustment of film components |
US3645783A (en) * | 1970-06-03 | 1972-02-29 | Infrared Ind Inc | Thin film planar resistor |
GB1374763A (en) * | 1971-12-21 | 1974-11-20 | Atomic Energy Authority Uk | Metalising pastes |
US3998980A (en) * | 1972-05-05 | 1976-12-21 | Hewlett-Packard Company | Fabrication of thick film resistors |
US3914514A (en) * | 1973-08-16 | 1975-10-21 | Trw Inc | Termination for resistor and method of making the same |
GB1506450A (en) * | 1974-09-18 | 1978-04-05 | Siemens Ag | Pastes for the production of thick-film conductor paths |
US4079156A (en) * | 1975-03-07 | 1978-03-14 | Uop Inc. | Conductive metal pigments |
US4072771A (en) * | 1975-11-28 | 1978-02-07 | Bala Electronics Corporation | Copper thick film conductor |
US4172919A (en) * | 1977-04-22 | 1979-10-30 | E. I. Du Pont De Nemours And Company | Copper conductor compositions containing copper oxide and Bi2 O3 |
US4140817A (en) * | 1977-11-04 | 1979-02-20 | Bell Telephone Laboratories, Incorporated | Thick film resistor circuits |
US4191789A (en) * | 1978-11-02 | 1980-03-04 | Bell Telephone Laboratories, Incorporated | Fabrication of bi-level circuits |
-
1980
- 1980-07-03 US US06/165,551 patent/US4316920A/en not_active Expired - Lifetime
-
1981
- 1981-05-22 CA CA000378151A patent/CA1159122A/en not_active Expired
- 1981-06-11 WO PCT/US1981/000787 patent/WO1982000233A1/en active IP Right Grant
- 1981-06-11 JP JP56502334A patent/JPH0213803B2/ja not_active Expired
- 1981-06-11 EP EP81901870A patent/EP0055277B1/en not_active Expired
- 1981-06-29 KR KR1019810002341A patent/KR830006781A/ko unknown
- 1981-06-30 GB GB8120161A patent/GB2079322B/en not_active Expired
-
1984
- 1984-04-25 SG SG332/84A patent/SG33284G/en unknown
- 1984-09-06 HK HK699/84A patent/HK69984A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPS57500955A (ko) | 1982-05-27 |
GB2079322A (en) | 1982-01-20 |
EP0055277A1 (en) | 1982-07-07 |
EP0055277A4 (en) | 1983-06-08 |
GB2079322B (en) | 1983-11-09 |
KR830006781A (ko) | 1983-10-06 |
CA1159122A (en) | 1983-12-20 |
WO1982000233A1 (en) | 1982-01-21 |
JPH0213803B2 (ko) | 1990-04-05 |
HK69984A (en) | 1984-09-14 |
US4316920A (en) | 1982-02-23 |
EP0055277B1 (en) | 1985-10-02 |
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