KR20240121658A - 구리계 선재 및 반도체 디바이스 - Google Patents

구리계 선재 및 반도체 디바이스 Download PDF

Info

Publication number
KR20240121658A
KR20240121658A KR1020237012521A KR20237012521A KR20240121658A KR 20240121658 A KR20240121658 A KR 20240121658A KR 1020237012521 A KR1020237012521 A KR 1020237012521A KR 20237012521 A KR20237012521 A KR 20237012521A KR 20240121658 A KR20240121658 A KR 20240121658A
Authority
KR
South Korea
Prior art keywords
wire
copper
less
crystal orientation
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237012521A
Other languages
English (en)
Korean (ko)
Inventor
시게키 세키야
카츠마사 하세가와
슈이치 키타가와
쿠니테루 미하라
히데오 카네코
츠카사 타카자와
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20240121658A publication Critical patent/KR20240121658A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H01L21/60—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
KR1020237012521A 2021-12-07 2022-12-02 구리계 선재 및 반도체 디바이스 Pending KR20240121658A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-198360 2021-12-07
JP2021198360 2021-12-07
PCT/JP2022/044602 WO2023106241A1 (ja) 2021-12-07 2022-12-02 銅系線材および半導体デバイス

Publications (1)

Publication Number Publication Date
KR20240121658A true KR20240121658A (ko) 2024-08-09

Family

ID=86730471

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237012521A Pending KR20240121658A (ko) 2021-12-07 2022-12-02 구리계 선재 및 반도체 디바이스

Country Status (5)

Country Link
JP (1) JP7717794B2 (https=)
KR (1) KR20240121658A (https=)
CN (1) CN116568835A (https=)
DE (1) DE112022005812T5 (https=)
WO (1) WO2023106241A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025132750A (ja) * 2024-02-29 2025-09-10 古河電気工業株式会社 銅系導体、撚線導体および電線

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013102054A (ja) 2011-11-08 2013-05-23 Mitsubishi Cable Ind Ltd 太陽電池用リード線
WO2020183748A1 (ja) 2019-03-12 2020-09-17 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、パラジウム被覆銅ボンディングワイヤの製造方法、及びこれを用いたワイヤ接合構造、半導体装置並びにその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4932974B2 (ja) * 2010-03-17 2012-05-16 新日本製鐵株式会社 金属テープ材料、及び太陽電池集電用インターコネクター
JP5772338B2 (ja) * 2011-07-21 2015-09-02 日立金属株式会社 軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線
EP3042972B1 (en) * 2013-09-06 2019-01-02 Furukawa Electric Co., Ltd. Copper alloy wire
JPWO2016002770A1 (ja) * 2014-06-30 2017-04-27 新日鉄住金マテリアルズ株式会社 金属線、太陽電池集電用インターコネクター、太陽電池モジュール、及び金属線の製造方法
JP5912008B1 (ja) * 2015-06-15 2016-04-27 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2018100916A1 (ja) * 2016-12-01 2018-06-07 古河電気工業株式会社 銅合金線材
US10985130B2 (en) * 2018-09-21 2021-04-20 Nippon Steel Chemical & Material Co., Ltd. Cu alloy bonding wire for semiconductor device
CN112159911B (zh) * 2020-10-26 2022-10-21 有研工程技术研究院有限公司 一种高强度高导电耐疲劳铜合金及其制备方法和应用

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013102054A (ja) 2011-11-08 2013-05-23 Mitsubishi Cable Ind Ltd 太陽電池用リード線
WO2020183748A1 (ja) 2019-03-12 2020-09-17 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、パラジウム被覆銅ボンディングワイヤの製造方法、及びこれを用いたワイヤ接合構造、半導体装置並びにその製造方法

Also Published As

Publication number Publication date
WO2023106241A1 (ja) 2023-06-15
CN116568835A (zh) 2023-08-08
JP7717794B2 (ja) 2025-08-04
DE112022005812T5 (de) 2024-09-12
JPWO2023106241A1 (https=) 2023-06-15

Similar Documents

Publication Publication Date Title
EP2339038B1 (en) Copper alloy sheet for electric and electronic part
KR101158113B1 (ko) 전기 전자 부품용 동 합금판
CN101168829B (zh) 轧制铜箔及其制造方法
JP4857395B1 (ja) Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP4215093B2 (ja) 圧延銅箔およびその製造方法
JP4168077B2 (ja) 酸化膜密着性に優れた電気電子部品用銅合金板
US20110200480A1 (en) Copper alloy material for electric/electronic parts
JP5245813B2 (ja) 圧延銅箔
CN103492597A (zh) 铝合金导体
US20130042949A1 (en) Method of manufacturing soft-dilute-copper-alloy-material
JP6472477B2 (ja) Ｃｕ−Ｎｉ−Ｓｉ系銅合金条
TW201809581A (zh) 散熱零件用銅合金板
KR20240121658A (ko) 구리계 선재 및 반도체 디바이스
TWI625403B (zh) Ｃｕ－Ｎｉ－Ｓｉ系銅合金條及其製造方法
JP5128152B2 (ja) ベアボンディング性に優れるリードフレーム用銅合金及びその製造方法
JP2013104082A (ja) Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
TWI450986B (zh) Cu-Co-Si alloy and a method for producing the same
JP5039863B1 (ja) コルソン合金及びその製造方法
JP5795939B2 (ja) 導電性、耐熱性及びはんだ濡れ性に優れたＣｕ−Ｆｅ−Ｐ系銅合金板及びその製造方法
JP4987155B1 (ja) Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
WO2026018912A1 (ja) 銅系線材および半導体デバイス
JP5514762B2 (ja) 曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系合金
JP5261579B2 (ja) 太陽電池用インターコネクタ材、その製造方法及び太陽電池用インターコネクタ
KR20210138020A (ko) 본딩 와이어
JP2013072128A (ja) 導電性、耐熱性及び曲げ加工性に優れたＣｕ−Ｆｅ−Ｐ系銅合金板及びその製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000