CN116568835A - 铜系线材及半导体器件 - Google Patents

铜系线材及半导体器件 Download PDF

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Publication number
CN116568835A
CN116568835A CN202280006972.4A CN202280006972A CN116568835A CN 116568835 A CN116568835 A CN 116568835A CN 202280006972 A CN202280006972 A CN 202280006972A CN 116568835 A CN116568835 A CN 116568835A
Authority
CN
China
Prior art keywords
copper
wire
less
bonding
crystal orientation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280006972.4A
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English (en)
Chinese (zh)
Inventor
关谷茂树
长谷川胜政
北河秀一
三原邦照
金子秀雄
高泽司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of CN116568835A publication Critical patent/CN116568835A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
CN202280006972.4A 2021-12-07 2022-12-02 铜系线材及半导体器件 Pending CN116568835A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021198360 2021-12-07
JP2021-198360 2021-12-07
PCT/JP2022/044602 WO2023106241A1 (ja) 2021-12-07 2022-12-02 銅系線材および半導体デバイス

Publications (1)

Publication Number Publication Date
CN116568835A true CN116568835A (zh) 2023-08-08

Family

ID=86730471

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280006972.4A Pending CN116568835A (zh) 2021-12-07 2022-12-02 铜系线材及半导体器件

Country Status (5)

Country Link
JP (1) JP7717794B2 (https=)
KR (1) KR20240121658A (https=)
CN (1) CN116568835A (https=)
DE (1) DE112022005812T5 (https=)
WO (1) WO2023106241A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025132750A (ja) * 2024-02-29 2025-09-10 古河電気工業株式会社 銅系導体、撚線導体および電線

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102812522A (zh) * 2010-03-17 2012-12-05 新日本制铁株式会社 金属带材料和太阳能电池集电用互连线
CN102890976A (zh) * 2011-07-21 2013-01-23 日立电线株式会社 软质低浓度铜合金线、软质低浓度铜合金板及软质低浓度铜合金捻线
WO2016002770A1 (ja) * 2014-06-30 2016-01-07 新日鉄住金マテリアルズ株式会社 金属線、太陽電池集電用インターコネクター、太陽電池モジュール、及び金属線の製造方法
CN105518165A (zh) * 2013-09-06 2016-04-20 古河电气工业株式会社 铜合金线材及其制造方法
WO2016203899A1 (ja) * 2015-06-15 2016-12-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
CN108431255A (zh) * 2016-12-01 2018-08-21 古河电气工业株式会社 铜合金线材
CN111886685A (zh) * 2018-09-21 2020-11-03 日铁化学材料株式会社 半导体装置用Cu合金接合线
CN112159911A (zh) * 2020-10-26 2021-01-01 有研工程技术研究院有限公司 一种高强度高导电耐疲劳铜合金及其制备方法和应用
CN113748493A (zh) * 2019-03-12 2021-12-03 田中电子工业株式会社 钯覆盖铜接合线、钯覆盖铜接合线的制造方法、及使用了其的引线接合结构、半导体装置以及其制造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013102054A (ja) 2011-11-08 2013-05-23 Mitsubishi Cable Ind Ltd 太陽電池用リード線

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102812522A (zh) * 2010-03-17 2012-12-05 新日本制铁株式会社 金属带材料和太阳能电池集电用互连线
CN102890976A (zh) * 2011-07-21 2013-01-23 日立电线株式会社 软质低浓度铜合金线、软质低浓度铜合金板及软质低浓度铜合金捻线
CN105518165A (zh) * 2013-09-06 2016-04-20 古河电气工业株式会社 铜合金线材及其制造方法
WO2016002770A1 (ja) * 2014-06-30 2016-01-07 新日鉄住金マテリアルズ株式会社 金属線、太陽電池集電用インターコネクター、太陽電池モジュール、及び金属線の製造方法
WO2016203899A1 (ja) * 2015-06-15 2016-12-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
CN108431255A (zh) * 2016-12-01 2018-08-21 古河电气工业株式会社 铜合金线材
JP6407484B1 (ja) * 2016-12-01 2018-10-17 古河電気工業株式会社 銅合金線材
CN111886685A (zh) * 2018-09-21 2020-11-03 日铁化学材料株式会社 半导体装置用Cu合金接合线
CN113748493A (zh) * 2019-03-12 2021-12-03 田中电子工业株式会社 钯覆盖铜接合线、钯覆盖铜接合线的制造方法、及使用了其的引线接合结构、半导体装置以及其制造方法
CN112159911A (zh) * 2020-10-26 2021-01-01 有研工程技术研究院有限公司 一种高强度高导电耐疲劳铜合金及其制备方法和应用

Also Published As

Publication number Publication date
WO2023106241A1 (ja) 2023-06-15
KR20240121658A (ko) 2024-08-09
JP7717794B2 (ja) 2025-08-04
DE112022005812T5 (de) 2024-09-12
JPWO2023106241A1 (https=) 2023-06-15

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