JP7717794B2 - 銅系線材および半導体デバイス - Google Patents

銅系線材および半導体デバイス

Info

Publication number
JP7717794B2
JP7717794B2 JP2023511909A JP2023511909A JP7717794B2 JP 7717794 B2 JP7717794 B2 JP 7717794B2 JP 2023511909 A JP2023511909 A JP 2023511909A JP 2023511909 A JP2023511909 A JP 2023511909A JP 7717794 B2 JP7717794 B2 JP 7717794B2
Authority
JP
Japan
Prior art keywords
copper
wire
less
bonding
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023511909A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023106241A5 (https=
JPWO2023106241A1 (https=
Inventor
茂樹 関谷
勝政 長谷川
秀一 北河
邦照 三原
秀雄 金子
司 高澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of JPWO2023106241A1 publication Critical patent/JPWO2023106241A1/ja
Publication of JPWO2023106241A5 publication Critical patent/JPWO2023106241A5/ja
Application granted granted Critical
Publication of JP7717794B2 publication Critical patent/JP7717794B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
JP2023511909A 2021-12-07 2022-12-02 銅系線材および半導体デバイス Active JP7717794B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021198360 2021-12-07
JP2021198360 2021-12-07
PCT/JP2022/044602 WO2023106241A1 (ja) 2021-12-07 2022-12-02 銅系線材および半導体デバイス

Publications (3)

Publication Number Publication Date
JPWO2023106241A1 JPWO2023106241A1 (https=) 2023-06-15
JPWO2023106241A5 JPWO2023106241A5 (https=) 2024-11-08
JP7717794B2 true JP7717794B2 (ja) 2025-08-04

Family

ID=86730471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511909A Active JP7717794B2 (ja) 2021-12-07 2022-12-02 銅系線材および半導体デバイス

Country Status (5)

Country Link
JP (1) JP7717794B2 (https=)
KR (1) KR20240121658A (https=)
CN (1) CN116568835A (https=)
DE (1) DE112022005812T5 (https=)
WO (1) WO2023106241A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025132750A (ja) * 2024-02-29 2025-09-10 古河電気工業株式会社 銅系導体、撚線導体および電線

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016002770A1 (ja) 2014-06-30 2016-01-07 新日鉄住金マテリアルズ株式会社 金属線、太陽電池集電用インターコネクター、太陽電池モジュール、及び金属線の製造方法
WO2020059856A1 (ja) 2018-09-21 2020-03-26 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
WO2020183748A1 (ja) 2019-03-12 2020-09-17 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、パラジウム被覆銅ボンディングワイヤの製造方法、及びこれを用いたワイヤ接合構造、半導体装置並びにその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4932974B2 (ja) * 2010-03-17 2012-05-16 新日本製鐵株式会社 金属テープ材料、及び太陽電池集電用インターコネクター
JP5772338B2 (ja) * 2011-07-21 2015-09-02 日立金属株式会社 軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線
JP2013102054A (ja) 2011-11-08 2013-05-23 Mitsubishi Cable Ind Ltd 太陽電池用リード線
EP3042972B1 (en) * 2013-09-06 2019-01-02 Furukawa Electric Co., Ltd. Copper alloy wire
JP5912008B1 (ja) * 2015-06-15 2016-04-27 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2018100916A1 (ja) * 2016-12-01 2018-06-07 古河電気工業株式会社 銅合金線材
CN112159911B (zh) * 2020-10-26 2022-10-21 有研工程技术研究院有限公司 一种高强度高导电耐疲劳铜合金及其制备方法和应用

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016002770A1 (ja) 2014-06-30 2016-01-07 新日鉄住金マテリアルズ株式会社 金属線、太陽電池集電用インターコネクター、太陽電池モジュール、及び金属線の製造方法
WO2020059856A1 (ja) 2018-09-21 2020-03-26 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
WO2020183748A1 (ja) 2019-03-12 2020-09-17 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、パラジウム被覆銅ボンディングワイヤの製造方法、及びこれを用いたワイヤ接合構造、半導体装置並びにその製造方法

Also Published As

Publication number Publication date
WO2023106241A1 (ja) 2023-06-15
KR20240121658A (ko) 2024-08-09
CN116568835A (zh) 2023-08-08
DE112022005812T5 (de) 2024-09-12
JPWO2023106241A1 (https=) 2023-06-15

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