JPWO2023106241A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023106241A5 JPWO2023106241A5 JP2023511909A JP2023511909A JPWO2023106241A5 JP WO2023106241 A5 JPWO2023106241 A5 JP WO2023106241A5 JP 2023511909 A JP2023511909 A JP 2023511909A JP 2023511909 A JP2023511909 A JP 2023511909A JP WO2023106241 A5 JPWO2023106241 A5 JP WO2023106241A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- less
- wire
- based wire
- crystal orientation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021198360 | 2021-12-07 | ||
| JP2021198360 | 2021-12-07 | ||
| PCT/JP2022/044602 WO2023106241A1 (ja) | 2021-12-07 | 2022-12-02 | 銅系線材および半導体デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023106241A1 JPWO2023106241A1 (https=) | 2023-06-15 |
| JPWO2023106241A5 true JPWO2023106241A5 (https=) | 2024-11-08 |
| JP7717794B2 JP7717794B2 (ja) | 2025-08-04 |
Family
ID=86730471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023511909A Active JP7717794B2 (ja) | 2021-12-07 | 2022-12-02 | 銅系線材および半導体デバイス |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7717794B2 (https=) |
| KR (1) | KR20240121658A (https=) |
| CN (1) | CN116568835A (https=) |
| DE (1) | DE112022005812T5 (https=) |
| WO (1) | WO2023106241A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025132750A (ja) * | 2024-02-29 | 2025-09-10 | 古河電気工業株式会社 | 銅系導体、撚線導体および電線 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2549489B1 (en) * | 2010-03-17 | 2014-10-22 | Nippon Steel & Sumitomo Metal Corporation | Metal tape material, and interconnector for solar cell collector |
| JP5772338B2 (ja) * | 2011-07-21 | 2015-09-02 | 日立金属株式会社 | 軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線 |
| JP2013102054A (ja) | 2011-11-08 | 2013-05-23 | Mitsubishi Cable Ind Ltd | 太陽電池用リード線 |
| WO2015034071A1 (ja) * | 2013-09-06 | 2015-03-12 | 古河電気工業株式会社 | 銅合金線材及びその製造方法 |
| WO2016002770A1 (ja) | 2014-06-30 | 2016-01-07 | 新日鉄住金マテリアルズ株式会社 | 金属線、太陽電池集電用インターコネクター、太陽電池モジュール、及び金属線の製造方法 |
| JP5912008B1 (ja) * | 2015-06-15 | 2016-04-27 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
| JP6407484B1 (ja) * | 2016-12-01 | 2018-10-17 | 古河電気工業株式会社 | 銅合金線材 |
| JP6651065B1 (ja) * | 2018-09-21 | 2020-02-19 | 日鉄ケミカル&マテリアル株式会社 | 半導体装置用Cu合金ボンディングワイヤ |
| PH12021552178A1 (en) * | 2019-03-12 | 2022-08-08 | Tanaka Electronics Ind | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof |
| CN112159911B (zh) * | 2020-10-26 | 2022-10-21 | 有研工程技术研究院有限公司 | 一种高强度高导电耐疲劳铜合金及其制备方法和应用 |
-
2022
- 2022-12-02 WO PCT/JP2022/044602 patent/WO2023106241A1/ja not_active Ceased
- 2022-12-02 KR KR1020237012521A patent/KR20240121658A/ko active Pending
- 2022-12-02 DE DE112022005812.9T patent/DE112022005812T5/de active Pending
- 2022-12-02 CN CN202280006972.4A patent/CN116568835A/zh active Pending
- 2022-12-02 JP JP2023511909A patent/JP7717794B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI325620B (en) | Die pad for semiconductor packages | |
| TW445616B (en) | An integrated circuit device | |
| JP2008294384A5 (https=) | ||
| JP2616565B2 (ja) | 電子部品組立体 | |
| US8039953B2 (en) | System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler | |
| US9087827B2 (en) | Mixed wire semiconductor lead frame package | |
| US7538422B2 (en) | Integrated circuit micro-cooler having multi-layers of tubes of a CNT array | |
| JP2008258411A5 (https=) | ||
| TWI295846B (en) | Semiconductor device having post-mold nickel/palladium/gold plated leads | |
| CN1131562C (zh) | 半导体器件及其制造方法 | |
| JP2005191240A5 (https=) | ||
| JPWO2023106241A5 (https=) | ||
| WO2008085559A9 (en) | Integrated circuit micro-cooler having tubes of a cnt array in essentially the same height over a surface | |
| JP2004528992A5 (https=) | ||
| TW201023311A (en) | Semiconductor package structure and method of fabricating the same | |
| CN210925997U (zh) | 柔性芯片封装结构 | |
| US8269355B2 (en) | Flexible contactless wire bonding structure and methodology for semiconductor device | |
| US20070114658A1 (en) | Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array | |
| CN109628793A (zh) | 一种铜镀钯镀镍再镀金键合丝及其制备方法 | |
| JP2016201505A (ja) | 半導体装置 | |
| CN116013891A (zh) | 封装结构、封装方法和电子设备 | |
| CN112736056A (zh) | 柔性芯片封装结构、柔性芯片的封装方法 | |
| CN118899304A (zh) | 一种芯片封装结构及其制作方法 | |
| JPH0572750B2 (https=) | ||
| JP2007134585A5 (https=) |