JPWO2023106241A1 - - Google Patents

Info

Publication number
JPWO2023106241A1
JPWO2023106241A1 JP2023511909A JP2023511909A JPWO2023106241A1 JP WO2023106241 A1 JPWO2023106241 A1 JP WO2023106241A1 JP 2023511909 A JP2023511909 A JP 2023511909A JP 2023511909 A JP2023511909 A JP 2023511909A JP WO2023106241 A1 JPWO2023106241 A1 JP WO2023106241A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023511909A
Other languages
Japanese (ja)
Other versions
JP7717794B2 (ja
JPWO2023106241A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023106241A1 publication Critical patent/JPWO2023106241A1/ja
Publication of JPWO2023106241A5 publication Critical patent/JPWO2023106241A5/ja
Application granted granted Critical
Publication of JP7717794B2 publication Critical patent/JP7717794B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
JP2023511909A 2021-12-07 2022-12-02 銅系線材および半導体デバイス Active JP7717794B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021198360 2021-12-07
JP2021198360 2021-12-07
PCT/JP2022/044602 WO2023106241A1 (ja) 2021-12-07 2022-12-02 銅系線材および半導体デバイス

Publications (3)

Publication Number Publication Date
JPWO2023106241A1 true JPWO2023106241A1 (https=) 2023-06-15
JPWO2023106241A5 JPWO2023106241A5 (https=) 2024-11-08
JP7717794B2 JP7717794B2 (ja) 2025-08-04

Family

ID=86730471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511909A Active JP7717794B2 (ja) 2021-12-07 2022-12-02 銅系線材および半導体デバイス

Country Status (5)

Country Link
JP (1) JP7717794B2 (https=)
KR (1) KR20240121658A (https=)
CN (1) CN116568835A (https=)
DE (1) DE112022005812T5 (https=)
WO (1) WO2023106241A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025132750A (ja) * 2024-02-29 2025-09-10 古河電気工業株式会社 銅系導体、撚線導体および電線

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016002770A1 (ja) * 2014-06-30 2016-01-07 新日鉄住金マテリアルズ株式会社 金属線、太陽電池集電用インターコネクター、太陽電池モジュール、及び金属線の製造方法
WO2020059856A1 (ja) * 2018-09-21 2020-03-26 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
WO2020183748A1 (ja) * 2019-03-12 2020-09-17 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、パラジウム被覆銅ボンディングワイヤの製造方法、及びこれを用いたワイヤ接合構造、半導体装置並びにその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2549489B1 (en) * 2010-03-17 2014-10-22 Nippon Steel & Sumitomo Metal Corporation Metal tape material, and interconnector for solar cell collector
JP5772338B2 (ja) * 2011-07-21 2015-09-02 日立金属株式会社 軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線
JP2013102054A (ja) 2011-11-08 2013-05-23 Mitsubishi Cable Ind Ltd 太陽電池用リード線
WO2015034071A1 (ja) * 2013-09-06 2015-03-12 古河電気工業株式会社 銅合金線材及びその製造方法
JP5912008B1 (ja) * 2015-06-15 2016-04-27 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP6407484B1 (ja) * 2016-12-01 2018-10-17 古河電気工業株式会社 銅合金線材
CN112159911B (zh) * 2020-10-26 2022-10-21 有研工程技术研究院有限公司 一种高强度高导电耐疲劳铜合金及其制备方法和应用

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016002770A1 (ja) * 2014-06-30 2016-01-07 新日鉄住金マテリアルズ株式会社 金属線、太陽電池集電用インターコネクター、太陽電池モジュール、及び金属線の製造方法
WO2020059856A1 (ja) * 2018-09-21 2020-03-26 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
WO2020183748A1 (ja) * 2019-03-12 2020-09-17 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、パラジウム被覆銅ボンディングワイヤの製造方法、及びこれを用いたワイヤ接合構造、半導体装置並びにその製造方法

Also Published As

Publication number Publication date
CN116568835A (zh) 2023-08-08
DE112022005812T5 (de) 2024-09-12
WO2023106241A1 (ja) 2023-06-15
JP7717794B2 (ja) 2025-08-04
KR20240121658A (ko) 2024-08-09

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