KR20240087786A - 포접 화합물, 에폭시 수지 경화제 및 경화성 수지 조성물 - Google Patents

포접 화합물, 에폭시 수지 경화제 및 경화성 수지 조성물 Download PDF

Info

Publication number
KR20240087786A
KR20240087786A KR1020247011025A KR20247011025A KR20240087786A KR 20240087786 A KR20240087786 A KR 20240087786A KR 1020247011025 A KR1020247011025 A KR 1020247011025A KR 20247011025 A KR20247011025 A KR 20247011025A KR 20240087786 A KR20240087786 A KR 20240087786A
Authority
KR
South Korea
Prior art keywords
group
compound
acid
carbon atoms
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247011025A
Other languages
English (en)
Korean (ko)
Inventor
쇼타 코바야시
켄이치 타마소
Original Assignee
가부시키가이샤 아데카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 아데카 filed Critical 가부시키가이샤 아데카
Publication of KR20240087786A publication Critical patent/KR20240087786A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/15—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C07D233/58—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
KR1020247011025A 2021-10-26 2022-10-17 포접 화합물, 에폭시 수지 경화제 및 경화성 수지 조성물 Pending KR20240087786A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021174768 2021-10-26
JPJP-P-2021-174768 2021-10-26
PCT/JP2022/038644 WO2023074450A1 (ja) 2021-10-26 2022-10-17 包接化合物、エポキシ樹脂硬化剤及び硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
KR20240087786A true KR20240087786A (ko) 2024-06-19

Family

ID=86157789

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247011025A Pending KR20240087786A (ko) 2021-10-26 2022-10-17 포접 화합물, 에폭시 수지 경화제 및 경화성 수지 조성물

Country Status (7)

Country Link
US (1) US20240409681A1 (https=)
EP (1) EP4424673A4 (https=)
JP (1) JPWO2023074450A1 (https=)
KR (1) KR20240087786A (https=)
CN (1) CN118076588A (https=)
TW (1) TW202328262A (https=)
WO (1) WO2023074450A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1520867S (https=) 2014-03-24 2015-04-06

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998029469A1 (en) 1996-12-27 1998-07-09 Nippon Soda Co., Ltd. Curatives for epoxy resin, curing accelerator, and epoxy resin composition
JPH10324826A (ja) * 1997-03-25 1998-12-08 Kansai Paint Co Ltd 硬化型塗料組成物
JP5367201B2 (ja) * 2001-04-18 2013-12-11 日本曹達株式会社 分子化合物の製造方法
JP2006016542A (ja) * 2004-07-02 2006-01-19 Nippon Soda Co Ltd エポキシ・ポリエステル系粉体塗料組成物
JP5258191B2 (ja) * 2006-12-08 2013-08-07 積水化学工業株式会社 半導体チップ接合用接着剤
JP5357576B2 (ja) * 2009-02-27 2013-12-04 パナソニック株式会社 半導体封止用エポキシ樹脂組成物、及び半導体装置
JP5902494B2 (ja) * 2012-01-30 2016-04-13 日本曹達株式会社 硬化性粉体塗料組成物及びその硬化物
JP2013213168A (ja) * 2012-04-04 2013-10-17 Nippon Soda Co Ltd プリプレグ用エポキシ樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1520867S (https=) 2014-03-24 2015-04-06

Also Published As

Publication number Publication date
WO2023074450A1 (ja) 2023-05-04
EP4424673A1 (en) 2024-09-04
US20240409681A1 (en) 2024-12-12
CN118076588A (zh) 2024-05-24
TW202328262A (zh) 2023-07-16
JPWO2023074450A1 (https=) 2023-05-04
EP4424673A4 (en) 2025-10-29

Similar Documents

Publication Publication Date Title
CN101910238B (zh) 用于复合材料应用的高Tg环氧体系
US7750107B2 (en) Substituted urea accelerator with dicyandiamide for epoxy resin systems
CN102307924B (zh) 用于制造电层压材料的均匀二马来酰亚胺-三嗪-环氧树脂组合物
TWI461479B (zh) 一液型氰酸酯．環氧複合樹脂組成物及其硬化物、封止用材料、黏著劑及其硬化物之製造方法
KR20100033967A (ko) 일액형 시아네이트-에폭시 복합 수지 조성물
TWI439486B (zh) 用於固化環氧化物之觸媒
KR20100075842A (ko) 일액형 시아네이트-에폭시 복합수지 조성물, 그 경화물 및 그 제조방법, 및 그것을 이용한 봉지용 재료 및 접착제
JP4938567B2 (ja) 一液型シアネート−エポキシ複合樹脂組成物
KR101803123B1 (ko) 잠재성 경화제 조성물 및 일액 경화성 에폭시 수지 조성물
EP4361193A1 (en) Epoxy resin composition
JP7261580B2 (ja) 樹脂組成物
EP4289821A1 (en) Charge transfer complex
JP7325207B2 (ja) 樹脂組成物
WO2021112104A1 (ja) 樹脂組成物
KR20240087786A (ko) 포접 화합물, 에폭시 수지 경화제 및 경화성 수지 조성물
JP2020200389A (ja) 硬化性樹脂組成物
JP7699104B2 (ja) 硬化性樹脂組成物、及び硬化性樹脂組成物の硬化収縮を抑制する方法
JP7751894B2 (ja) 硬化触媒、樹脂組成物、封止材、接着剤、及び硬化物
JP7811202B2 (ja) 硬化性樹脂組成物、硬化物及び接着剤
JP2025132266A (ja) 化合物、化合物の製造方法、エポキシ樹脂組成物及び硬化性組成物
JP2023131013A (ja) 硬化剤組成物、エポキシ樹脂組成物及び硬化物
WO2023068109A1 (ja) 硬化性樹脂組成物、硬化物及び接着剤
WO2021112091A1 (ja) 樹脂組成物

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000