KR20240086601A - 점착 테이프 - Google Patents

점착 테이프 Download PDF

Info

Publication number
KR20240086601A
KR20240086601A KR1020237033412A KR20237033412A KR20240086601A KR 20240086601 A KR20240086601 A KR 20240086601A KR 1020237033412 A KR1020237033412 A KR 1020237033412A KR 20237033412 A KR20237033412 A KR 20237033412A KR 20240086601 A KR20240086601 A KR 20240086601A
Authority
KR
South Korea
Prior art keywords
adhesive tape
meth
adhesive layer
adhesive
acrylic polymer
Prior art date
Application number
KR1020237033412A
Other languages
English (en)
Korean (ko)
Inventor
노리유키 우치다
유다이 오가타
고조 우에다
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20240086601A publication Critical patent/KR20240086601A/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95001—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020237033412A 2021-10-21 2022-10-20 점착 테이프 KR20240086601A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021172625 2021-10-21
JPJP-P-2021-172625 2021-10-21
JPJP-P-2021-214308 2021-12-28
JP2021214308 2021-12-28
PCT/JP2022/039020 WO2023068315A1 (fr) 2021-10-21 2022-10-20 Ruban adhésif

Publications (1)

Publication Number Publication Date
KR20240086601A true KR20240086601A (ko) 2024-06-18

Family

ID=86058281

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020237033412A KR20240086601A (ko) 2021-10-21 2022-10-20 점착 테이프
KR1020237033413A KR20240086602A (ko) 2021-10-21 2022-10-20 점착 테이프

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020237033413A KR20240086602A (ko) 2021-10-21 2022-10-20 점착 테이프

Country Status (5)

Country Link
JP (3) JPWO2023068315A1 (fr)
KR (2) KR20240086601A (fr)
DE (2) DE112022005002T5 (fr)
TW (2) TW202334358A (fr)
WO (2) WO2023068314A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019065441A1 (fr) 2017-09-29 2019-04-04 東レエンジニアリング株式会社 Substrat de transfert et procédé de transfert

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2806592B2 (ja) * 1990-02-14 1998-09-30 積水化学工業株式会社 アクリル系粘着剤組成物及び粘着テープ、粘着ラベル又は粘着シート
JP2011116916A (ja) 2009-12-07 2011-06-16 Daio Paper Corp 粘着剤組成物、及び粘着シート
JP2013173913A (ja) * 2011-11-10 2013-09-05 Nitto Denko Corp 板の剥離方法
JP2013159760A (ja) * 2012-02-08 2013-08-19 Daio Paper Corp 熱伝導性粘着シート
WO2016010013A1 (fr) 2014-07-14 2016-01-21 電気化学工業株式会社 Film adhésif en résine de poly(fluorure de vinylidène)
GB2544335A (en) * 2015-11-13 2017-05-17 Oculus Vr Llc A method and apparatus for use in the manufacture of a display element
JP6800062B2 (ja) * 2017-03-28 2020-12-16 古河電気工業株式会社 粘着テープ
JP6757479B2 (ja) * 2019-01-30 2020-09-16 日東電工株式会社 粘着シート、粘着層付き光学フィルム、積層体、および画像表示装置
KR102554028B1 (ko) * 2019-02-07 2023-07-11 (주)이녹스첨단소재 폴더블 디스플레이용 점착제 조성물
JP2022116798A (ja) * 2021-01-29 2022-08-10 日東電工株式会社 電子部品転写用粘着シートおよび電子部品転写用粘着シートを用いた電子部品の加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019065441A1 (fr) 2017-09-29 2019-04-04 東レエンジニアリング株式会社 Substrat de transfert et procédé de transfert

Also Published As

Publication number Publication date
JPWO2023068315A1 (fr) 2023-04-27
TW202330849A (zh) 2023-08-01
KR20240086602A (ko) 2024-06-18
WO2023068315A1 (fr) 2023-04-27
TW202334358A (zh) 2023-09-01
JP2024086923A (ja) 2024-06-28
WO2023068314A1 (fr) 2023-04-27
JPWO2023068314A1 (fr) 2023-04-27
DE112022005002T5 (de) 2024-08-01
DE112022005024T5 (de) 2024-08-01
JP7476351B2 (ja) 2024-04-30

Similar Documents

Publication Publication Date Title
CN108064202B (zh) 基于丙烯酸的柔性组件层
TWI424036B (zh) Adhesive, both sides of the adhesive film and display device
KR101488047B1 (ko) 다이싱-다이본딩 테이프 및 반도체 칩의 제조 방법
KR102088783B1 (ko) 광학 필름용 점착제층, 광학 필름용 점착 필름
TWI639674B (zh) Adhesive sheet for electronic equipment
KR102138154B1 (ko) 적층체의 제조 방법
JP5437681B2 (ja) 粘着シートおよび半導体装置の製造方法
KR20090007222A (ko) 점착제, 점착 시트 및 점착제 부착 광학 필름
JP2013170200A (ja) 粘着剤組成物およびこれを用いた粘着シート
WO2016157921A1 (fr) Film protecteur de surface
JP5566774B2 (ja) 放射線硬化性半導体ウエハ表面保護用粘着テープ
JP2018115333A (ja) 粘着テープおよび半導体装置の製造方法
JP2006216773A (ja) ダイシングシートおよび電子部品の製造方法
CN112063328A (zh) 粘着片及层叠体
TWI841538B (zh) 含硬化性接合材的積層體的製造方法
KR20240086601A (ko) 점착 테이프
CN110997324A (zh) 层叠体的制造方法
JP5583099B2 (ja) 脆性ウェハ加工用粘着テープ
JP5809685B2 (ja) 粘着シートおよび半導体装置の製造方法
CN117545815A (zh) 粘合带
KR102675803B1 (ko) 점착제 조성물, 이를 포함하는 점착 시트 및 디스플레이
WO2022163166A1 (fr) Feuille acrylique adhésive sensible à la pression, composition acrylique adhésive sensible à la pression, film adhésif sensible à la pression et dispositif flexible
JP2010067772A (ja) ダイシング−ダイボンディングテープ及び半導体チップの製造方法
TW202432760A (zh) 黏著片材
JP2021055061A (ja) 粘着テープ