KR20240070537A - 경화성 수지 조성물, 코팅층 및 필름 - Google Patents
경화성 수지 조성물, 코팅층 및 필름 Download PDFInfo
- Publication number
- KR20240070537A KR20240070537A KR1020247009354A KR20247009354A KR20240070537A KR 20240070537 A KR20240070537 A KR 20240070537A KR 1020247009354 A KR1020247009354 A KR 1020247009354A KR 20247009354 A KR20247009354 A KR 20247009354A KR 20240070537 A KR20240070537 A KR 20240070537A
- Authority
- KR
- South Korea
- Prior art keywords
- curable resin
- resin composition
- hydrogen
- group
- functional group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021161676 | 2021-09-30 | ||
| JPJP-P-2021-161676 | 2021-09-30 | ||
| PCT/JP2022/036380 WO2023054563A1 (ja) | 2021-09-30 | 2022-09-29 | 硬化性樹脂組成物、コーティング層、及び、フィルム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240070537A true KR20240070537A (ko) | 2024-05-21 |
Family
ID=85782883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247009354A Withdrawn KR20240070537A (ko) | 2021-09-30 | 2022-09-29 | 경화성 수지 조성물, 코팅층 및 필름 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023054563A1 (https=) |
| KR (1) | KR20240070537A (https=) |
| CN (1) | CN117980404A (https=) |
| TW (1) | TW202323462A (https=) |
| WO (1) | WO2023054563A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016001657A (ja) | 2014-06-11 | 2016-01-07 | コニカミノルタ株式会社 | ハードコート剤、封止用組成物、積層体、及び発光装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2133063A1 (en) * | 2008-06-10 | 2009-12-16 | 3M Innovative Properties Company | Initiator system with biphenylene derivates, method of production and use thereof |
| WO2016204115A1 (ja) * | 2015-06-17 | 2016-12-22 | 株式会社ダイセル | 硬化物の製造方法、硬化物、及び前記硬化物を含む積層物 |
| JP6795498B2 (ja) * | 2015-06-17 | 2020-12-02 | 株式会社ダイセル | 硬化性組成物、及び成形体 |
| US20190185711A1 (en) * | 2016-08-26 | 2019-06-20 | Jnc Corporation | Epoxy resin composition and cured resin film with low curing shrinkage and excellent adhesion |
| JP2018111786A (ja) * | 2017-01-13 | 2018-07-19 | 三菱製紙株式会社 | 積層体 |
| JP2018177951A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社ダイセル | 硬化性組成物、硬化物及びハードコートフィルム |
| JP2018177952A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社ダイセル | 硬化性組成物、硬化物及びハードコートフィルム |
-
2022
- 2022-09-29 WO PCT/JP2022/036380 patent/WO2023054563A1/ja not_active Ceased
- 2022-09-29 KR KR1020247009354A patent/KR20240070537A/ko not_active Withdrawn
- 2022-09-29 JP JP2022562105A patent/JPWO2023054563A1/ja not_active Withdrawn
- 2022-09-29 CN CN202280063668.3A patent/CN117980404A/zh active Pending
- 2022-09-30 TW TW111137236A patent/TW202323462A/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016001657A (ja) | 2014-06-11 | 2016-01-07 | コニカミノルタ株式会社 | ハードコート剤、封止用組成物、積層体、及び発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023054563A1 (ja) | 2023-04-06 |
| CN117980404A (zh) | 2024-05-03 |
| JPWO2023054563A1 (https=) | 2023-04-06 |
| TW202323462A (zh) | 2023-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| B11 | Application withdrawn |
Free format text: ST27 STATUS EVENT CODE: N-1-6-B10-B11-NAP-PC1202 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PC1202 | Submission of document of withdrawal before decision of registration |
St.27 status event code: N-1-6-B10-B11-nap-PC1202 |