KR20230136651A - 아황산금염을 포함하는 금도금액, 및 아황산금염을 포함하는 금도금액용 보충액 - Google Patents

아황산금염을 포함하는 금도금액, 및 아황산금염을 포함하는 금도금액용 보충액 Download PDF

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Publication number
KR20230136651A
KR20230136651A KR1020237029559A KR20237029559A KR20230136651A KR 20230136651 A KR20230136651 A KR 20230136651A KR 1020237029559 A KR1020237029559 A KR 1020237029559A KR 20237029559 A KR20237029559 A KR 20237029559A KR 20230136651 A KR20230136651 A KR 20230136651A
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KR
South Korea
Prior art keywords
gold
gold plating
sulfite
plating solution
solution
Prior art date
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KR1020237029559A
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English (en)
Korean (ko)
Inventor
쇼에이 미즈하시
다카후미 구보
Original Assignee
마츠다 산교 가부시끼가이샤
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Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=78119214&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20230136651(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 마츠다 산교 가부시끼가이샤 filed Critical 마츠다 산교 가부시끼가이샤
Publication of KR20230136651A publication Critical patent/KR20230136651A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G7/00—Compounds of gold
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
KR1020237029559A 2021-02-25 2021-04-07 아황산금염을 포함하는 금도금액, 및 아황산금염을 포함하는 금도금액용 보충액 KR20230136651A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-028554 2021-02-25
JP2021028554A JP6953068B1 (ja) 2021-02-25 2021-02-25 亜硫酸金塩を含む金めっき液、及び亜硫酸金塩を含む金めっき液用補充液
PCT/JP2021/014720 WO2022180867A1 (ja) 2021-02-25 2021-04-07 亜硫酸金塩を含む金めっき液、及び亜硫酸金塩を含む金めっき液用補充液

Publications (1)

Publication Number Publication Date
KR20230136651A true KR20230136651A (ko) 2023-09-26

Family

ID=78119214

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237029559A KR20230136651A (ko) 2021-02-25 2021-04-07 아황산금염을 포함하는 금도금액, 및 아황산금염을 포함하는 금도금액용 보충액

Country Status (5)

Country Link
JP (1) JP6953068B1 (ja)
KR (1) KR20230136651A (ja)
CN (1) CN116568866A (ja)
TW (1) TWI766824B (ja)
WO (1) WO2022180867A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006249485A (ja) 2005-03-10 2006-09-21 Japan Pure Chemical Co Ltd 金めっき液用亜硫酸金塩水溶液

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2960439B2 (ja) * 1989-08-11 1999-10-06 株式会社日立製作所 金めつき用補充液
JP3058178B2 (ja) * 1990-01-18 2000-07-04 エヌ・イーケムキヤツト株式会社 無電解金めつき液
JP3252470B2 (ja) * 1992-08-28 2002-02-04 株式会社日立製作所 無電解金めっき液及びその建浴方法
JPH07118867A (ja) * 1993-10-26 1995-05-09 Hitachi Chem Co Ltd 無電解金めっき方法
JPH10251887A (ja) * 1997-03-10 1998-09-22 Hitachi Cable Ltd 軟質金めっき液および軟質金めっきを利用する半導体装置
JP3677617B2 (ja) * 1999-06-08 2005-08-03 小島化学薬品株式会社 無電解金めっき液
JP3680838B2 (ja) * 2002-03-13 2005-08-10 三菱化学株式会社 金メッキ液および金メッキ方法
JP2006265648A (ja) * 2005-03-24 2006-10-05 Hitachi Chem Co Ltd 無電解金めっき液再調製方法、無電解金めっき方法及び金イオン含有液
JP4992434B2 (ja) * 2007-01-18 2012-08-08 三菱化学株式会社 金メッキ液および金メッキ方法
JP5623668B1 (ja) * 2014-05-22 2014-11-12 小島化学薬品株式会社 金めっき用ノンシアン金塩
CN106637314B (zh) * 2016-12-15 2018-08-31 广东光华科技股份有限公司 一种无氰镀金用的亚硫酸金钠溶液的制备方法
EP3517651B1 (en) * 2018-01-26 2020-09-02 ATOTECH Deutschland GmbH Electroless gold plating bath

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006249485A (ja) 2005-03-10 2006-09-21 Japan Pure Chemical Co Ltd 金めっき液用亜硫酸金塩水溶液

Also Published As

Publication number Publication date
JP6953068B1 (ja) 2021-10-27
TW202233526A (zh) 2022-09-01
JP2022129746A (ja) 2022-09-06
CN116568866A (zh) 2023-08-08
TWI766824B (zh) 2022-06-01
WO2022180867A1 (ja) 2022-09-01

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