CN116568866A - 包含亚硫酸金盐的镀金液和包含亚硫酸金盐的镀金液用补充液 - Google Patents
包含亚硫酸金盐的镀金液和包含亚硫酸金盐的镀金液用补充液 Download PDFInfo
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- 238000007747 plating Methods 0.000 title claims abstract description 99
- 239000010931 gold Substances 0.000 title claims abstract description 75
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 title claims abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract description 76
- 229910052737 gold Inorganic materials 0.000 title abstract description 74
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims abstract description 25
- MXZVHYUSLJAVOE-UHFFFAOYSA-N gold(3+);tricyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-] MXZVHYUSLJAVOE-UHFFFAOYSA-N 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000003792 electrolyte Substances 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 11
- ZWZLRIBPAZENFK-UHFFFAOYSA-J sodium;gold(3+);disulfite Chemical group [Na+].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O ZWZLRIBPAZENFK-UHFFFAOYSA-J 0.000 claims description 7
- MPOKJOWFCMDRKP-UHFFFAOYSA-N gold;hydrate Chemical compound O.[Au] MPOKJOWFCMDRKP-UHFFFAOYSA-N 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 7
- RXNUQHQAZAAIDP-UHFFFAOYSA-L sodium;gold(1+);sulfite Chemical compound [Na+].[Au+].[O-]S([O-])=O RXNUQHQAZAAIDP-UHFFFAOYSA-L 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- UESISTHQAYQMRA-UHFFFAOYSA-M formyloxythallium Chemical compound [Tl+].[O-]C=O UESISTHQAYQMRA-UHFFFAOYSA-M 0.000 description 2
- 150000002343 gold Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052716 thallium Inorganic materials 0.000 description 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- YASYEJJMZJALEJ-UHFFFAOYSA-N Citric acid monohydrate Chemical compound O.OC(=O)CC(O)(C(O)=O)CC(O)=O YASYEJJMZJALEJ-UHFFFAOYSA-N 0.000 description 1
- 244000248349 Citrus limon Species 0.000 description 1
- 235000005979 Citrus limon Nutrition 0.000 description 1
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 1
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- GABPAXJCPQEORA-UHFFFAOYSA-K azanium;gold(3+);disulfite Chemical compound [NH4+].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O GABPAXJCPQEORA-UHFFFAOYSA-K 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229960002303 citric acid monohydrate Drugs 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- MDECNDDIBYOQGF-UHFFFAOYSA-L gold(1+);sulfite Chemical compound [Au+].[Au+].[O-]S([O-])=O MDECNDDIBYOQGF-UHFFFAOYSA-L 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 238000000504 luminescence detection Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- RRDWZGMHSCBIGX-UHFFFAOYSA-J potassium;gold(3+);disulfite Chemical compound [K+].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O RRDWZGMHSCBIGX-UHFFFAOYSA-J 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- HZCKWLVRJXTKNU-UHFFFAOYSA-L sodium;gold(1+);sulfate Chemical compound [Na+].[Au+].[O-]S([O-])(=O)=O HZCKWLVRJXTKNU-UHFFFAOYSA-L 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- YZFKUFJKKKTKSB-UHFFFAOYSA-J trisodium;gold(1+);disulfite Chemical compound [Na+].[Na+].[Na+].[Au+].[O-]S([O-])=O.[O-]S([O-])=O YZFKUFJKKKTKSB-UHFFFAOYSA-J 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G7/00—Compounds of gold
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
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- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Abstract
课题在于提供能够解决镀敷性能的偏差问题的镀金液和镀金液用补充液。通过包含亚硫酸金盐、电解质和水且氰化物离子浓度为1mg/L以下的非氰镀金液和非氰镀金液用补充液解决了课题。
Description
技术领域
本发明涉及包含亚硫酸金盐的镀金液和包含亚硫酸金钠的镀金液用补充液。
背景技术
作为镀金液和镀金液用补充液中所含的金原料,使用亚硫酸金钠等亚硫酸金盐,其制造方法例如公开在专利文献1中。
另外,在专利文献2中公开了化学镀金液的制造方法和镀金液用亚硫酸金盐水溶液的制造方法,通过控制亚硫酸金水溶液的粒子增加率,能够提供镀敷运行稳定性优异的镀液。
现有技术文献
专利文献
专利文献1:日本专利第2773931号
专利文献2:日本特开2006-249485号公报
发明内容
发明所要解决的课题
在专利文献2记载的方法中,能够抑制在镀液槽的内壁等上形成金覆膜,另一方面,对形成的覆膜没有进行任何研究。本发明人等研究后发现,在利用包含亚硫酸金盐的镀金液形成覆膜时,所形成的覆膜存在偏差。特别是在化学镀金形成中,有时不能得到所期望的镀金膜厚度、发生镀金覆膜的色调不良。
本发明的课题为提供一种能够解决这样的镀金覆膜的偏差问题的镀金液和镀金液用补充液。
用于解决课题的手段
本发明人等为了解决上述课题,反复进行了研究,结果发现在镀金液和镀金液用补充液中存在的特定物质为产生镀金覆膜的偏差的原因。具体而言,明确了由于在镀金液中存在氰化物离子(CN-),镀金覆膜的膜厚降低、镀金覆膜的色调不良等镀金液的镀敷性能降低。
然后,基于上述见解,发现通过将镀金液和镀金液用补充液中的氰化物离子浓度降低到一定浓度以下,能够抑制镀金液的镀敷性能降低。
本发明的一个方式为包含亚硫酸金盐、电解质和水且氰化物离子浓度为1mg/L以下的非氰镀金液。另外,本发明的另一方式为包含亚硫酸金盐和水且氰化物离子浓度为1mg/L以下的非氰镀金液用补充液。
发明效果
根据本发明,能够提供镀金覆膜的膜厚降低、镀金覆膜的色调不良等镀金液的镀敷性能降低能够得以抑制的镀金液和镀金液用补充液。
具体实施方式
以下,对本发明详细地进行说明,但是以下记载的构成要素的说明为本发明的实施方式的一例(代表例),本发明不限于这些内容,能够在其主旨的范围内进行各种变形来实施。
本发明的一个实施方式为包含亚硫酸金盐、电解质和水且氰化物离子浓度为1mg/L以下的非氰镀金液。
本发明基于以下发现:在形成镀金时,溶液中存在特定物质、具体而言在镀金液中存在氰化物离子(CN-),从而使镀金液的镀敷性能(镀敷形成能力)降低。并且,基于该见解,通过将镀金液中的氰化物离子浓度设定为1mg/L以下,能够抑制镀金液的镀敷性能降低。
氰化物离子能够混入镀金液中的原因尚不明确,但是认为金大多是通过回收而得到的,因此有时在制造镀金液的环境中进行金精炼。然后,此时作为贵金属的溶剂使用的氰化钾挥发,导致不可避免地混入镀金液中等。
作为降低镀金液中氰化物离子的方法,可以列举利用离子交换树脂或螯合树脂除去镀金液中的氰化物离子的方法。
作为镀金液中的亚硫酸金盐,没有特别限制,可以列举亚硫酸金钠、亚硫酸金钾、亚硫酸金铵等,特别优选亚硫酸金钠。
对本实施方式的镀金液的制备方法没有特别限制,可以通过在包含水的水性介质中添加亚硫酸金盐和电解质并混合来制备。作为电解质,可以使用能够包含在镀金液中的已知电解质。
对镀金液中亚硫酸金盐的含量没有特别限制,通常换算成金浓度为0.2g/L以上且100g/L以下,优选为0.5g/L以上且30g/L以下。另外,对镀金液中电解质的含量没有特别限制,通常为20g/L以上且300g/L以下。
此外,还可以含有在镀金液中可以含有的其它成分,例如pH调节剂、络合剂等。通过添加络合剂,能够提高镀金液的稳定性。
本发明的另一实施方式为包含亚硫酸金盐和水且氰化物离子浓度为1mg/L以下的非氰镀金液用补充液。镀金液用补充液为补充镀金液中的金成分的溶液。对镀金液用补充液中亚硫酸金盐的含量没有特别限制,通常换算成金浓度为30g/L以上且200g/L以下,优选为50g/L以上且150g/L以下。
镀金液用补充液为对镀金液的金成分进行补充的补充液,因此对于镀金补充液也与镀金液同样地,通过氰化物离子浓度为1mg/L以下,能够抑制镀金液的镀敷性能降低。
在本实施方式中,镀金液用补充液中的金浓度与亚硫酸根离子浓度的摩尔比(SO3 2-/Au)优选为2.1以上且2.9以下。根据本发明人的研究,亚硫酸根离子对镀液的氧化还原电位有影响,因此通过在上述范围内,镀金液用补充液成为稳定的液体,并且能够发挥良好的镀敷性能,因此是优选的。
需要说明的是,镀金液用补充液中的金浓度可以通过IPC发光分光法测定。
实施例
以下,使用实施例对本发明更详细地说明,但是显然本发明的范围不限于实施例的记载。
<关于氰化物浓度的比较例1>
准备非氰镀金液1,所述非氰镀金液1在水中包含以金浓度计为14g/L的亚硫酸金(I)钠、80g/L的作为电解质的亚硫酸钠、20g/L的作为缓冲剂的乙二胺四乙酸二钠和10mg/L(铊浓度)的作为结晶调节剂的甲酸铊。测定氰化物浓度,结果为1.1mg/L。
将试验片(纯铜板,厚度0.3mm,尺寸25mm×40mm,基底:镀镍1μm,金触击电镀0.1μm)在浴温50℃下浸渍在非氰镀金液1中30分钟,以电流密度0.5A/dm2进行电镀,结果镀膜厚度为9.12μm。
<关于氰化物浓度的实施例1~2>
对非氰镀金液1进行吸附、除去氰的处理,制备氰化物浓度为0.8mg/L的非氰镀金液2(实施例1)、氰化物浓度为0.4mg/L的非氰镀金液3(实施例2)。对这些非氰镀金液也与比较例1同样地对试验片进行电镀,结果镀膜厚度分别为9.49μm、9.50μm。
表1
(比较例2~6和实施例3~7)
亚硫酸金(I)钠溶液的准备:
准备将金浓度设定为100g/L而氰化物浓度(CN-)和亚硫酸根离子浓度(SO3 2-)不同的比较例2~6和实施例3~7的各种亚硫酸金(I)钠溶液。
化学镀(置换镀)方法:
使用上述制备的比较例2~6和实施例3~7的亚硫酸金(I)钠溶液,制备包含浓度2g/L的金、5.0g/L的作为pH缓冲成分的柠檬酸一水合物和65.0g/L的柠檬酸三钠二水合物、0.1g/L的作为析出促进剂的硫脲和5mg/L(铊换算浓度)的作为结晶调节剂的甲酸铊的比较例2~6和实施例3~7的化学镀金液,将浴温设定为70℃,将pH设定为6.0。
利用市售的预处理剂和化学镀镍溶液在铜板材料上形成5μm~7μm的镀镍,然后将带镀镍的铜板材料在上述制备的化学镀液中浸渍15分钟,然后进行水洗,之后进行干燥。
利用目视和荧光X射线膜厚计确认在铜板材料上有无金析出。当柠檬黄的镀金覆膜以0.1μm以上的膜厚析出时判定为○,当镀金覆膜为0.1μm以上且色调出现微小不均时判定为△,当镀金的膜厚不足(小于0.1μm)时则判定为×。将〇判定或△判定评价为合格。
亚硫酸金(I)钠溶液稳定性评价方法:
在100mL容量的聚丙烯制容器中加入50mL的上述制备的比较例2~6和实施例3~7的亚硫酸金(I)钠溶液,将1张切成15mm×15mm的定量滤纸浸渍。然后,将聚丙烯容器的盖子关闭。
接着,将聚丙烯制容器浸渍在保持为70℃的温水槽中,间接加温亚硫酸金(I)钠溶液。在5小时后,取出聚丙烯制容器,打开盖子,用镊子捞出浸渍过的定量滤纸,目视确认滤纸颜色。
在亚硫酸金(I)钠溶液不稳定的情况下,通过加温而产生金的胶体粒子,所述金的胶体粒子吸附在定量滤纸上,纸的颜色变为紫色、褐色或黑色。在加温前后,在目视未确认到定量滤纸的颜色变化的情况下,判定为得到了稳定的亚硫酸金钠溶液,为合格(○)。在加温前后,在目视确认到定量滤纸颜色变化的情况下,判定为亚硫酸金钠溶液不稳定,为不合格(×)。将结果示于以下表2中。
表2
Claims (4)
1.一种非氰镀金液,所述非氰镀金液包含亚硫酸金盐、电解质和水,氰化物离子浓度为1mg/L以下。
2.如权利要求1所述的非氰镀金液,其中,所述亚硫酸金盐为亚硫酸金钠。
3.一种非氰镀金液用补充液,所述非氰镀金液用补充液包含亚硫酸金盐和水,氰化物离子浓度为1mg/L以下。
4.如权利要求3所述的非氰镀金液用补充液,其中,补充液中的金浓度与亚硫酸根离子浓度的摩尔比(SO3 2-/Au)为2.1以上且2.9以下。
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PCT/JP2021/014720 WO2022180867A1 (ja) | 2021-02-25 | 2021-04-07 | 亜硫酸金塩を含む金めっき液、及び亜硫酸金塩を含む金めっき液用補充液 |
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JP3252470B2 (ja) * | 1992-08-28 | 2002-02-04 | 株式会社日立製作所 | 無電解金めっき液及びその建浴方法 |
JPH07118867A (ja) * | 1993-10-26 | 1995-05-09 | Hitachi Chem Co Ltd | 無電解金めっき方法 |
JPH10251887A (ja) * | 1997-03-10 | 1998-09-22 | Hitachi Cable Ltd | 軟質金めっき液および軟質金めっきを利用する半導体装置 |
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