KR20230125312A - Resin molding device and manufacturing method of resin molding - Google Patents

Abstract

It is the resin molding apparatus 10 provided with the resin molding mechanism 20. The resin molding mechanism 20 includes a first mold 21, a second mold 22, and a clamping mechanism 27. The resin molding apparatus 10 further includes an unnecessary resin removal mechanism 100 . The unnecessary resin removal mechanism 100 includes a pair of molding product substrate mounting parts 130 and a pair of molding product substrate pressing parts 140 . The pair of molded article substrate mounting parts 130 heats the first molded article substrate 240a and the second molded article substrate 240b after the unnecessary resin parts 230 are removed from the pair of molded article substrates 200. A configured heating unit 170 is provided.

Description

Resin molding device and manufacturing method of resin molding

The present disclosure relates to a resin molding apparatus and a method for manufacturing a resin molded article.

For example, in Patent Document 1, a conveying device for conveying a substrate includes an insulating board capable of suppressing the release of heat from the substrate when conveying the substrate, and a function of reflecting heat radiated from the substrate to the surface of the insulating board facing the substrate. A resin sealing device capable of suppressing a decrease in temperature during transportation of a substrate by providing a heat reflection plate having a substrate is described.

In the resin encapsulation device described in Patent Literature 1, a molded product serving as a substrate after resin encapsulation is carried out from a mold onto a cooling stage of a gate brake unit by a transfer device. The molded product is clamped with metal plates placed above and below the molded product, and cooled by spraying room temperature air together with the metal plate, and the warpage of the molded product is corrected. After that, an unnecessary portion (curl portion) is cut out (gate broken) from the cooled molded product.

Japanese Unexamined Patent Publication No. 2014-117888

However, in the resin sealing device described in Patent Literature 1, since warpage of molded products could not be corrected in some cases, improvement thereof is desired.

According to the embodiment disclosed herein, in a resin molding apparatus including a resin molding mechanism, the resin molding mechanism comprises a first mold, a second mold disposed facing the first mold, and the first mold and the second mold. Equipped with a clamping mechanism configured to enable clamping, the resin molding apparatus is configured to be able to remove the unnecessary resin portion of the pair of molding product substrates after the first mold and the second mold are clamped and the pair of substrates are resin molded. A resin removal mechanism is further provided, wherein the unnecessary resin removal mechanism is configured to be able to press the pair of molded product substrates mounted on the pair of molded product substrates mounted on the pair of molded product substrates mounted on the pair of molded product substrates mounted on the pair of molded product substrates. A pair of molded article substrate pressurizing parts, and the pair of molded article substrate mounting parts having a heating part configured to be able to heat the first molded article substrate and the second molded article substrate after removing unnecessary resin parts from the pair of molded article substrates. , a resin molding apparatus can be provided.

According to the embodiment disclosed herein, the step of forming a pair of molded article substrates by clamping the first mold and the second mold and resin molding the pair of molded article substrates, and the pair of molded article substrates comprising the pair of molded article substrates. The pair of molded product substrates on the pair of molded product substrate mounting portions are pressed by the pair of molded product substrate pressing units to remove unnecessary resin portions of the pair of molded product substrates in a state of being mounted on the mounting portion, thereby performing first molding. Production of a resin molded product, including a step of forming a first substrate and a second mold product substrate, and a step of heating the first mold product substrate and the second mold product substrate by means of a heating unit provided on a pair of mold product substrate mounting units. method can be provided.

According to the embodiment disclosed herein, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded article capable of producing a resin molded article having warpage corrected with a high yield.

1 is a block diagram of an example of the configuration of a resin molding apparatus of an embodiment.
Fig. 2 is a schematic side view of an example of the resin molding mechanism shown in Fig. 1;
Fig. 3 is a schematic plan view of an example of a pair of molded article substrates in the embodiment.
Fig. 4 is a schematic front view of an example of the unnecessary resin removal mechanism shown in Fig. 1;
Fig. 5 is a schematic plan view illustrating a step of pressing a pair of molded article substrates according to the embodiment by means of a pair of molded article substrate pressing parts.
Fig. 6 is a schematic plan view illustrating a process of forming a first mold product substrate and a second mold product substrate by removing unnecessary resin portions of a pair of mold product substrates of the embodiment.
Fig. 7 is a schematic plan view illustrating a step of heating the first mold product substrate and the second mold product substrate of the embodiment.
FIG. 8 is a schematic front view of an example of the transport mechanism shown in FIG. 1 .
Fig. 9 is a schematic side view of the transport mechanism shown in Fig. 8;
Fig. 10 (a) is a schematic front view of an example of a conveyance mechanism in which a pressurization step is being performed, and (b) is a schematic front view of an example of a surface of a substrate of a first mold product or a substrate of a second mold product in which a pressurization step is performed. It is a flat plan.
11 is a photograph of a first molding product substrate and a second molding product substrate of an experimental example after removing unnecessary resin parts from a pair of molding product substrates of an experimental example.
12 is a photograph of a substrate of a first molded article and a substrate of a second molded article in an experimental example after a heating process.
13 is a photograph of a substrate of a first molded article and a substrate of a second molded article in an experimental example after being mounted on a transport rail.
14 is a photograph after mounting the substrate of the first mold product and the substrate of the second mold product of the experimental example after the pressurization step on the conveying rail.

Hereinafter, embodiment is described. In the drawings used in the description of the embodiments, the same reference numerals denote the same parts or equivalent parts.

1 shows a block diagram of an example of the configuration of a resin molding apparatus of an embodiment. A resin molding apparatus 10 shown in FIG. 1 includes a resin molding mechanism 20, an unnecessary resin removal mechanism 100, a transport mechanism 300, and a control unit 500. The controller 500 is configured to be capable of controlling the resin molding mechanism 20, the unnecessary resin removal mechanism 100, and the transport mechanism 300. It goes without saying that the resin molding apparatus 10 may include structures other than the resin molding mechanism 20, the unnecessary resin removal mechanism 100, the transport mechanism 300, and the control unit 500. For example, the resin molding apparatus 10 may include a molding former board supplying mechanism for supplying a substrate before resin molding and/or a resin material supplying mechanism for supplying a resin material.

FIG. 2 shows a schematic side view of an example of the resin molding mechanism 20 shown in FIG. 1 . The resin molding tool 20 shown in FIG. 2 includes a first mold 21, a second mold 22 disposed facing the first mold 21, the first mold 21 and the second mold ( 22) is provided with a clamping mechanism 27 configured to be capable of clamping. As the first mold 21, the second mold 22, and the clamping mechanism 27, conventionally known ones can be used, for example.

The resin molding mechanism 20 further includes a first platen 23 including a first mold 21, a movable platen 24 including a second mold 22, and a clamping mechanism 27. It is provided with a second platen 25 having a. The resin molding mechanism 20 further includes rod-shaped tie bars 26 connecting the first platen 23, the movable platen 24, and the second platen 25 at a distance from each other. The first platen 23 is fixed to one end of the tie bar 26, and the second platen 25 is fixed to the other end of the tie bar 26. The movable platen 24 is connected to the tie bar 26 so as to be movable between the first platen 23 and the second platen 25 . The resin molding mechanism 20 replaces the tie bar 26 and connects the first platen 23, the movable platen 24 and the second platen 25, and a pair of vertically extending pairs. A plate-like member can also be used.

FIG. 3 shows a schematic plan view of an example of a pair of molded article substrates 200 according to the embodiment. A pair of molded article substrates 200 shown in FIG. 3 are formed by transfer molding using a resin molding tool 20 shown in FIG. 1 .

A pair of molding product substrates 200 shown in FIG. 3 includes a first molding product substrate 240a and a second molding product substrate 240b, which are a pair of molding product substrates, and a first molding product substrate 240a. An unnecessary resin portion 230 between two molding substrates 240b is provided.

The first molding product substrate 240a includes a first substrate 210a and a first molding resin portion 220a provided on the surface of the first substrate 210a. The first molding resin part 220a may be provided to seal an electronic device (not shown) such as a semiconductor chip connected to the surface of the first substrate 210a. The surface of the first substrate 210a can be, for example, rectangular.

The second molding product substrate 240b includes a second substrate 210b and a second molding resin portion 220b provided on the surface of the second substrate 210b. The second molding resin part 220b may be provided to seal an electronic device (not shown) such as a semiconductor chip connected to the surface of the second substrate 210b. The surface of the second substrate 210b can be rectangular, for example.

As shown in FIG. 3 , for example, the unnecessary resin portion 230 includes four curled portions 232, and a first molded product substrate 240a and a second molded product substrate from each of the four curled portions 232. It is provided with two runner parts 234 extending in a straight line at intervals from each other toward each of 240b.

The pair of molded article substrates 200 shown in FIG. 3 can be manufactured, for example, by the following process. First, a first substrate 210a and a second substrate 210b, which are a pair of substrates having electronic elements, are placed on either the first mold 21 or the second mold 22.

Next, the first mold 21 and the second mold 22 of the resin molding mechanism 20 shown in FIG. 2 are clamped. Next, a pair of molding substrates 200 can be formed by resin molding the first substrate 210a and the second substrate 210b.

In addition, clamping of the first mold 21 and the second mold 22 is performed by, for example, the mold clamping mechanism 27 moving the movable platen 24 relative to the first platen 23. It can be executed by pressing the second mold 20 against the first mold 10.

In addition, resin molding of the first substrate 210a and the second substrate 210b is performed by, for example, providing the first molded resin portion 220a on the surface of the first substrate 210a and simultaneously forming the second substrate 210a. It can be implemented by providing the second molding resin part 220b on the surface of 210b.

As the first substrate 210a and the second substrate 210b, for example, a lead frame, a printed wiring board, a metal substrate, a resin substrate, a semiconductor substrate, or a ceramic substrate can be used. As the resin used for resin molding, for example, an epoxy resin or the like can be used.

FIG. 4 shows a schematic front view of an example of the unnecessary resin removal mechanism 100 shown in FIG. 1 . The unnecessary resin removal mechanism 100 is an unnecessary resin part 230 between the first molding product substrate 240a and the second molding product substrate 240b of the pair of molding product substrates 200 having the configuration shown in FIG. ) is configured to be removable.

The unnecessary resin removal mechanism 100 includes a pair of molded product substrate mounting units 130 configured to be able to mount a pair of molded product substrates 200 and a pair of molded product substrates mounted on the pair of molded product substrate mounting units 130 ( 200) is provided with a pair of molded article substrate pressing parts 140 configured to be able to press.

The pair of molded product substrate mounting parts 130 includes a first molded product substrate mounting part 130a and a second molded product substrate mounting part 130b. The first molded substrate mounting portion 130a and the second molded substrate mounting portion 130b are arranged in parallel with a gap therebetween. The first mold product substrate mounting portion 130a is configured to have a first mounting surface 131a configured to be able to mount the first mold product substrate 240a. The second molding product substrate mounting portion 130b is configured to have a second mounting surface 131b configured to be able to mount the second molding product substrate 240b.

The pair of molded article substrate mounting parts 130 are also capable of heating the first molded article substrate 240a and the second molded article substrate 240b after the unnecessary resin portion is removed from the pair of molded article substrates 200. A configured heating unit 170 is provided.

The heating unit 170 includes a first heating unit 170a capable of heating the first molded product substrate 240a and a second heating unit 170b configured to heat the second molded product substrate 240b. are doing The first heating part 170a is provided in the first molded article substrate mounting part 130a to heat the first molded article substrate 240a mounted on the first molded article substrate mounting part 130a. The second heating part 170b is provided in the second molded product substrate mounting part 130b to be able to heat the second molded product substrate 240b mounted on the second molded product substrate mounting part 130b.

In addition, the heating unit 170 controls the temperature of the first mounting surface 131a of the first molding substrate mounting unit 130a, which is an index of the heating temperature of the first molding substrate 240a by the first heating unit 170a. A second molded substrate mounting unit (not shown) may be provided that detects the temperature, and serves as an index of the heating temperature of the second molded substrate 240b by the second heating unit 170b ( 130b) may be provided with a second temperature sensor (not shown) for detecting the temperature of the second mounting surface 131b.

The pair of molding product substrate pressing units 140 includes a first molding product substrate pressing unit 140a and a second molding product substrate pressing unit 140b. The first forming product substrate pressing unit 140a and the second forming product substrate pressing unit 140b are disposed in parallel with a gap therebetween. The first mold product substrate pressing unit 140a is configured to press the first mold product substrate 240a mounted on the first mold product substrate mounting unit 130a against the first mold product substrate mounting unit 130a. The second mold product substrate pressing portion 140b is configured to press the second mold product substrate 240b mounted on the second mold product substrate mounting portion 130b against the second mold product substrate mounting portion 130b.

In addition to the above configuration, the unnecessary resin removal mechanism 100 includes a receiving member 120 configured to be able to mount the curled portion 232 of the unnecessary resin portion 230 of the pair of molding substrates 200, and the receiving member ( 120), a curl pressing member 150 configured to press the curl portion 232, and a pressing portion pressing member 160 configured to press both ends of the pair of molding product substrate pressing portions 140 are further provided, there is.

Hereinafter, with reference to Figs. 2 to 7, an example of a method for manufacturing a resin molded product according to an embodiment will be described.

First, a pair of substrates (first substrate 210a and second substrate 210b) are formed by clamping the first mold 21 and the second mold 22 of the resin molding tool 20 shown in FIG. By resin molding, a step of forming a pair of molding product substrates 200 shown in FIG. 3 is executed. The process of forming the pair of molding substrates 200 can be performed as described above, for example.

Next, as shown in the schematic front view of FIG. 4 , a step of mounting the pair of molding product substrates 200 on the pair of molding product substrate mounting units 130 is performed. In this step, for example, the first mold product substrate 240a of the pair of mold product substrates 200 is mounted on the first mold product substrate mounting portion 130a, and the pair of mold product substrates 200 are mounted. This can be carried out by mounting the substrate 240b made of second molded material on the substrate mounting portion 130b made of second molded material. At this time, the curled parts 232 of the pair of molding substrates 200 are mounted on the receiving member 120 .

Next, as shown in FIG. 5 , a step of pressing the pair of molding product substrates 200 on the pair of molding product substrate mounting units 130 with the pair of molding product substrate pressing units 140 is executed. In this step, for example, the pair of molding product substrates 200 are placed on the pair of molding product substrate mounting parts 130, and the pair of molding product substrates 200 are placed on the pair of molding product substrate mounting parts 130. It can be carried out by pressing with a pair of molded article substrate pressing parts 140.

In the present embodiment, for example, the first molded product substrate 240a is mounted on the first molded product substrate mounting portion 130a, and the first molded product substrate 240a is placed on the first molded product substrate mounting portion 130a. ) is pressed by the first mold product substrate pressing unit 140a, and the second mold product substrate mounting portion 130b is placed in a state where the second mold product substrate 240b is mounted on the second mold product substrate mounting portion 130b. It can be carried out by pressing the second mold product substrate 240b on the upper surface with the second mold product substrate pressing unit 140b. At this time, the curled parts 232 of the pair of molded article substrates 200 are pressed against the receiving member 120 by the curled pressing member 150 .

Next, as shown in FIG. 6, by removing the unnecessary resin portion 230 of the pair of molding product substrates 200, a first molding product substrate 240a and a second molding product substrate 240b are formed. run the process In this step, for example, the pair of molded article substrates 200 on the pair of molded article substrate mounting parts 130 are pressed by the pair of molded article substrate pressing parts 140, and the curl pressing member 150 is curled. In a state where 232 is pressed against the receiving member 120, the pressing member pressing member 160 pushes both ends of the pair of molded product substrates pressing part 140 to the side of the pair of molded product substrates pressing part 140. It can be executed by pressing. As a result, the unnecessary resin portion 230 is removed from the pair of molding product substrates 200, and the first molding product substrate 240a and the second molding product substrate 240b can be formed.

Next, as shown in FIG. 7, the first molded article substrate 240a and the second molded article substrate 240b are heated by the heating unit 170 provided on the pair of molded article substrate mounting units 130. A process (hereinafter simply referred to as "heating process") is executed. In this process, for example, the pressing of the pressing member pressing member 160 to both ends of the pair of molding product substrate pressing parts 140 is released, and the pair of molding product substrate pressing parts 140 are first In a state in which the molded article substrate 240a and the second molded article substrate 240b are pressed, the first heating part 170a provided on the first molded article substrate mounting part 130a heats the first molded article substrate 240a. At the same time as heating, the second heating unit 170b provided in the second substrate mounting unit 130b heats the second substrate 240b.

By passing through the above steps, in the present embodiment, warpage occurring in the first mold product substrate 240a and the second mold product substrate 240b after removal of the unnecessary resin portion 230 can be corrected.

That is, in the case where the above heating step is not performed after removing the unnecessary resin portion 230 from the pair of molding substrates 200, the pair of substrates (first substrate 210a and second substrate 210b) and the material of the molded resin part (first molded resin part 220a and second molded resin part 220b), the first molded product substrate 240a and the second molded resin part 240a after removal of the unnecessary resin part 230 are formed. Warpage may occur in the molding substrate 240b.

However, in this embodiment, by heating the first mold product substrate 240a and the second mold product substrate 240b after removing the unnecessary resin portion 230, the first mold product substrate 240a and the second mold product substrate 240a and the second mold product substrate 240a are heated. Since the warpage generated in the two-part substrate 240b can be corrected, it becomes possible to manufacture a resin molded product with the warpage corrected at a high yield.

From the viewpoint of further correcting the warpage generated in the first mold product substrate 240a and the second mold product substrate 240b, after removing the unnecessary resin portion 230 from the pair of mold product substrates 200, the pair of mold products In a state where the first substrate 200 is pressed by the pair of molded article substrate pressing units 140, the first molding is performed by the heating unit 170 (first heating unit 170a, second heating unit 170b). It is preferable to heat the first substrate 240a and the second forming agent substrate 240b.

The heating step is preferably performed in a state in which a pressure of 850 Pa or more and 1600 Pa or less is applied to the first mold product substrate 240a and the second mold product substrate 240 b, and a pressure of 900 Pa or more and 1400 Pa or less. It is more preferable to carry out in the state of applying, and it is more preferable to carry out in the state of applying a pressure of 950 Pa or more and 1200 Pa or less. In these cases, warpage of the first mold product substrate 240a and the second mold product substrate 240b tends to be more correctable.

In the above heating step, it is preferable to heat the surfaces (first mounting surface 131a and second mounting surface 131b) of the pair of molded product substrate mounting portions 130 to 140°C or more and 175°C or less, and 145°C It is more preferable to heat to 165°C or less, and it is more preferable to heat to 150°C or more and 155°C or less. In these cases, warpage of the first mold product substrate 240a and the second mold product substrate 240b tends to be more correctable.

In the above heating process, it is preferable to heat the first molding agent substrate 240a and the second molding agent substrate 240b for 15 seconds or more and 40 seconds or less, more preferably 20 seconds or more and 35 seconds or less, and 25 seconds or more. It is more preferable to heat for more than 30 seconds or less. In these cases, warpage of the first mold product substrate 240a and the second mold product substrate 240b tends to be more correctable.

FIG. 8 shows a schematic front view of an example of the transport mechanism 300 shown in FIG. 1 . FIG. 9 shows a schematic side view of the transport mechanism 300 shown in FIG. 8 . 8 and 9 show the transport mechanism 300 in a state where the first substrate 240a and the second substrate 240b are held after the heating step.

The transport mechanism 300 shown in FIGS. 8 and 9 picks up the first mold product substrate 240a and the second mold product substrate 240b after the heating step, and transfers them to the transport rail connected to the resin molded product receiving part. It is configured to be transportable. The first molding product substrate 240a and the second molding product substrate 240b are accommodated in a receiving portion (not shown) of a resin molded product via a transport rail.

The transport mechanism 300 includes a pair of transport substrate contacting portions 301 configured to allow contact between the first mold product substrate 240a and the second mold product substrate 240b and the pair of transport substrate contact portions 301 for first molding. A pair of transfer substrate pressing units 302 configured to be able to press the first substrate 240a and the second molded product substrate 240b are provided.

The pair of carrier substrate contacting parts 301 include a first carrier substrate contacting part 301a configured to contact the first molded product substrate 240a and a second carrierd substrate contacted portion configured to allow contact with the second molded product substrate 240b. (301b) is provided.

The pair of transfer substrate pressing units 302 include a first transfer substrate pressing unit 302a configured to be able to press the periphery of the first molded product substrate 240a and a periphery of the second molded product substrate 240b to be pressurized. It is provided with the structured 2nd conveyance substrate pressing part 302b.

In addition to the above configuration, the transport mechanism 300 is a transport rail (not shown) configured to receive the first substrate 204a and the second substrate 204b loaded from the transport mechanism 300. is additionally provided.

The transport mechanism 300 may perform a process of picking up the first mold product substrate 240a and the second mold product substrate 240b. In the step of picking up, for example, as shown in FIGS. 8 and 9 , the L-shaped first transport substrate pressing portion 302a and the second transport substrate pressing portion 302b move downward, and the L-shaped substrate pressing portion 302b moves downward. The first transfer substrate pressing part 302a on the upper side picks up the first molded product substrate 240a and the L-shaped second transfer substrate pressurizing part 302b picks up the second molded product substrate 240b. can run

The conveying mechanism 300 may carry out a process of holding the first molded product substrate 240a and the second molded product substrate 240b after the picking up process. In the process of holding the first mold product substrate 240a and the second mold product substrate 240b, for example, the L-shaped first transfer substrate pressing unit 302a picks up the first mold product substrate 240a. In one state, it moves toward the first transfer substrate contacting portion 301a, and the first molded article substrate 240a is brought into contact with the first transfer substrate contacting portion 301a, while the L-shaped second transfer substrate pressing portion 302b is It can be carried out by moving the second molded product substrate 240b to the side of the second transfer substrate contacting portion 301b in the state of being picked up and bringing the second molded product substrate 240b into contact with the second transferred substrate contacting portion 301b.

The transport mechanism 300 may perform a process of pressurizing the first mold product substrate 240a and the second mold product substrate 240b after the above pick-up process or the above holding process.

When the heating in the above heating process is completed, the temperature of the first mold product substrate 240a and the second mold product substrate 240b is rapidly lowered due to a difference in temperature from the surrounding atmosphere, causing recurrence of warpage. There is work.

Therefore, in this case, before the first substrate 240a and the second substrate 240b are mounted on the transport rail, the first substrate 240a and the second substrate 240b are Recurrence of warpage in the first mold product substrate 240a and the second mold product substrate 240b after mounting on the transport rail is suppressed by performing a pressurization process (hereinafter, simply referred to as "pressurization process") can do. More specifically, by applying pressure while cooling the first molded substrate 240a and the second molded substrate 240b in a state where the warpage has been corrected by heating until they reach the same temperature as the ambient temperature. , the warpage can be maintained in a corrected state.

Fig. 10(a) shows a schematic front view of an example of the conveyance mechanism 300 performing the above pressurization step. FIG. 10(b) shows a schematic plan view of an example of the surface of the first mold product substrate 240a or the second mold product substrate 240b subjected to the pressing process.

In the pressurizing step, for example, as shown in FIGS. 10(a) and 10(b) , the L-shaped first transfer substrate pressing part 302a presses the first molded product substrate 240a. While pressing the periphery of the second carrier substrate contacting portion 301a against the first transport substrate contacting portion 301a, the L-shaped second transporting substrate pressing portion 302b presses the periphery of the second molded product substrate 240b against the second transporting substrate contacting portion 301b. It can be executed by pressing against it. In addition, the dimensions of the periphery can be appropriately changed depending on the type of the pair of substrates or resin.

In the pressurizing step, it is preferable to apply a pressure of 5000 Pa or more and 7000 Pa or less to the first mold product substrate 240a and the second mold product substrate 240 b, and applying a pressure of 5500 Pa or more and 6500 Pa or less. More preferably, it is more preferable to apply a pressure of 6000 Pa or more and 6200 Pa or less. In these cases, there is a tendency that the recurrence of warpage due to cooling of the first mold product substrate 240a and the second mold product substrate 240b by the surrounding atmosphere can be suppressed.

The pressurizing step is preferably carried out for 10 seconds or more and 25 seconds or less, more preferably 12 seconds or more and 20 seconds or less, for the first mold product substrate 240a and the second mold product substrate 240b. It is more preferable to run more than 15 seconds and less than 15 seconds. In these cases, there is a tendency that the recurrence of warpage due to cooling of the first mold product substrate 240a and the second mold product substrate 240b by the surrounding atmosphere can be suppressed. It is more preferable to perform the pressurizing step until the temperature of the first mold product substrate 240a and the second mold product substrate 240b reaches the same temperature as the surrounding atmosphere.

The conveying mechanism 300 moves in a state where the pair of conveying substrate pressing parts 302 press the first molded article substrate 204a and the second molded article substrate 204b against the pair of conveyed substrate contacting parts 301. The stopping process can be executed. In this step, for example, the first transfer substrate pressing unit 302a presses the first molded product substrate 240a against the first transfer substrate contacting unit 301a, and the second transfer substrate pressing unit 302b It can be executed by stopping the movement of the conveying mechanism 300 in a state in which the second molded article substrate 240b is pressed against the second conveying substrate contact portion 301b. In this way, the pressing of the first molded product substrate 240a by the first transfer substrate pressing unit 302a and the pressurization of the second molded product substrate 204b by the second transfer substrate pressing unit 302b are made more stable. can run

As described above, after the pressurization process, the transport mechanism 300 may perform a process of mounting the first substrate 240a and the second substrate 240b on the transport rail. In the case where the step of loading on the conveying rail is performed after the pressurizing step, as described above, warpage recurs in the first molded substrate 240a and the second molded substrate 240b after being loaded on the conveying rail. can suppress

The conveying mechanism 300 may carry out a step of conveying the first molded article substrate 240a and the second molded article substrate 240b to the receiving unit after the step of mounting them on the conveying rail. In this embodiment, since the first mold product substrate 240a and the second mold product substrate 240b whose warpage is corrected can be manufactured with a high yield, more first mold product substrates 240a and second mold product substrates 240a and second mold product substrates 240a and It becomes possible to easily accommodate the molded article substrate 240b in the accommodating portion.

In the present embodiment, when warpage occurs in the first mold product substrate 240a and the second mold product substrate 240b after the removal of the unnecessary resin portion 230, the first mold product substrate is removed by the heating step described above. Since the warpage generated in the substrate 240a and the second molding product substrate 240b can be corrected, it becomes possible to manufacture a resin molded product having the warpage corrected with a high yield.

Further, in the present embodiment, by performing the pressing step of the first molded substrate 240a and the second molded substrate 240b by the conveyance mechanism 300 before the step of mounting them on the conveying rail, Since recurrence of warpage in the first mold product substrate 240a and the second mold product substrate 240b can be suppressed, when the pressurization step by the transport mechanism 300 is performed, the resin molded product with warpage corrected It becomes possible to manufacture with a higher yield.

Example

<Experimental example>

First, after placing a pair of 0.338 mm thick substrates made of FR4 on the first mold 21 of the resin molding apparatus 10 shown in FIG. 1, the first mold 21 and the second mold 22 were formed. After clamping, the surface of each substrate of the pair of substrates was resin-molded with an epoxy resin by transfer molding, thereby forming a pair of molded substrates 200 of the experimental example. Here, each surface of the substrates 210a and 210b of the pair of substrates had a rectangular shape measuring 180 mm in length x 90 mm in width.

Next, as shown in FIG. 6 by means of the unnecessary resin removal mechanism 100 shown in FIGS. 4 to 7, the unnecessary resin portion 230 is removed from the pair of molding substrates 200 of the experimental example. Thus, the first substrate 240a and the second substrate 240b of the experimental example were formed.

11 shows photographs of the first mold product substrate 240a and the second mold product substrate 240b of the experimental example after the unnecessary resin portion 230 is removed from the pair of mold product substrates 200 of the experimental example. As shown in Fig. 11, it was confirmed that warpage occurred in the first molded substrate 240a and the second molded substrate 240b in the experimental example after the unnecessary resin portion 230 was removed.

Next, as shown in FIG. 7, in a state in which the pair of molding product substrate pressing units 140 press the first molding product substrate 240a and the second molding product substrate 240b of the experimental example, the first molding process is performed. The first heating unit 170a mounted on the substrate mounting unit 130a heats the first molded substrate 240a of the experimental example, and the second heating unit 170b mounted on the second molded substrate mounting unit 130b. ) performed a heating step of heating the second molded article substrate 240b of the experimental example. In the heating process, the first mounting surface 131a and the second mounting surface 131b of the experimental example are applied with a pressure of 950 Pa to the first substrate 240a and the second substrate 240b. ) was heated for 30 seconds so that the temperature of 150 ℃.

12 shows photographs of the first mold product substrate 240a and the second mold product substrate 240b in an experimental example after the heating process. As shown in FIG. 12, it was confirmed that the warpage shown in FIG. 11 was corrected in the first molded substrate 240a and the second molded substrate 240b of the experimental example after the heating process.

Next, by the transport mechanism 300 shown in FIGS. 8 and 9 , the first substrate 240a and the second substrate 240b of the experimental example after the heating process are picked up, held, and transported. mounted on rails.

13 shows photographs of the first substrate 240a and the second substrate 240b of the experimental example after being mounted on the transport rail. As shown in Fig. 13, it was confirmed that warpage recurred in the first molded substrate 240a and the second molded substrate 240b of the experimental example after being mounted on the transport rail.

Therefore, prior to mounting the substrate 240a and the second substrate 240b of the experimental example on the transport rail, the transport mechanism 300 shown in Figs. After picking up and holding the substrate 240a and the second forming product substrate 240b, the pressing step was performed.

In the pressing process, as shown in FIGS. 10(a) and 10(b) , the first transfer substrate pressing unit 302a moves the periphery of the first molded product substrate 240a to the first transfer substrate contact unit ( 301a), the second transfer substrate pressing portion 302b presses the periphery of the second molded product substrate 240b against the second transfer substrate contact portion 301b. In the pressurization step, the first mold product substrate 240a and the second mold product substrate 240b of the experimental example were maintained for 10 seconds at the temperature of the ambient atmosphere in a state where a pressure of 6000 Pa was applied.

14 shows a photograph after mounting the first mold product substrate 240a and the second mold product substrate 240b of the experimental example after the pressing step on the transport rail. As shown in FIG. 14, it was confirmed that the warpage of the first mold product substrate 240a and the second mold product substrate 240b of the experimental example after the pressing process was corrected compared to the case shown in FIG. 13. In addition, when the thickness of the substrates 210a and 210b was set to 0.1 mm, and as a result of performing the same experiment as in the experiment example, it was confirmed that the warpage was corrected in the same way as in the experiment example.

<Summary>

From the results of the experimental example, in the present embodiment, after removing the unnecessary resin portion from the pair of mold product substrates, the first mold product substrate and the second mold product substrate are subjected to a heating step after removal of the unnecessary resin portion. It was confirmed that warpage generated in the substrates of the first mold product and the substrate of the second mold product could be corrected.

In addition, from the results of the experimental example, before loading the first mold product substrate and the second mold product substrate whose warpage was corrected on the delivery rail, the pair of conveying substrate pressing parts of the conveying mechanism relative to the pair of conveying substrate contact parts after the heating step It was confirmed that the recurrence of warpage in the substrate of the first mold product and the substrate of the second mold product after being loaded on the carrying rail can be suppressed by performing the pressing step on the substrate of the first mold product and the substrate of the second mold product. .

From the results of the above experimental examples, it was confirmed that, in the present embodiment, it is possible to manufacture a resin molded article in which warpage is corrected with a high yield.

As described above, the embodiments and experimental examples have been described, but appropriate combinations of the above-described embodiments and experimental examples are also planned from the beginning.

It should be considered that the embodiments and experimental examples disclosed this time are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims rather than the above description, and it is intended that all changes within the meaning and scope equivalent to the claims are included.

According to the embodiment disclosed herein, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded article capable of producing a resin molded article having warpage corrected with a high yield.

10: resin molding device 20: resin molding device
21: type 1 22: type 2
23: first platen 24: movable platen
25: second platen 26: tie bar
27: clamping mechanism 100: unnecessary resin removal mechanism
120: receiving member 130: a pair of molding substrate mounting parts
130a: first molding product board mounting portion 130b: second molding product substrate mounting portion
131a: first mounting surface 131b: second mounting surface
140: a pair of forming agent substrate pressing units 140a: first forming agent substrate pressing unit
140b: second forming agent substrate pressing unit 150: curling pressing member
160: pressing part pressing member 170: heating part
170a: first heating unit 170b: second heating unit
200: a pair of molding substrates 210a: first substrate
210b: second substrate 220a: first molding resin part
220b: second molding resin part 230: unnecessary resin part
232: curl part 234: runner part
240a: first forming agent substrate 240b: second forming agent substrate
250a, 250b: both ends 300: transport mechanism
301: pair of transport substrate contact portions 301a: first transport substrate contact portion
301b: second transfer substrate contact portion 302: a pair of transfer substrate pressing portions
302a: first conveying substrate pressing part 302b: second conveying substrate pressing part
500: control unit

Claims (13)

In the resin molding apparatus provided with the resin molding mechanism,
The resin molding mechanism includes a first mold, a second mold disposed facing the first mold, and a clamping mechanism configured to enable clamping of the first mold and the second mold;
The resin molding apparatus further includes an unnecessary resin removing mechanism configured to be able to remove unnecessary resin portions of the pair of molding product substrates after the first mold and the second mold are clamped and the pair of substrates are resin molded, ,
The unnecessary resin removing mechanism includes a pair of molded article substrate mounting parts configured to be able to mount the pair of molded article substrates, and a pair of molded article substrates configured to be able to press the pair of molded article substrates mounted on the pair of molded article substrate mounting parts. A substrate pressing unit is provided;
The pair of molded product substrate mounting units include a heating unit configured to be able to heat a first molded product substrate and a second molded product substrate after the unnecessary resin portion is removed from the pair of molded product substrates.
resin molding equipment. According to claim 1,
The pair of molding product substrate mounting units include a first molding product substrate mounting portion and a second molding product substrate mounting portion disposed in parallel with an interval therebetween,
The pair of molding product substrate pressing units having a first molding product substrate pressing unit and a second molding product substrate pressing unit arranged in parallel with a distance from each other
resin molding equipment. According to claim 1 or 2,
Further comprising a transport mechanism configured to be able to transport the first substrate or the second substrate,
The conveying mechanism includes a pair of conveying substrate contacting portions configured to allow contact between the first substrate of a molded product or the second substrate of a molded product, and the first substrate of a molded product and the substrate of the second molded product are attached to the pair of transported substrate contacting portions. A pair of carrier substrate pressing units configured to be pressurized
resin molding equipment. According to claim 3,
The conveying mechanism is configured to be capable of stopping movement in a state in which the pair of conveying substrate pressing parts press the first molded article substrate and the second molded article substrate,
resin molding equipment. According to claim 3 or 4,
The pair of conveying substrate pressing units are configured to be able to press the periphery of the first mold product substrate and the second mold product substrate.
resin molding equipment. A step of forming a pair of molded product substrates by clamping the first mold and the second mold and resin molding the pair of substrates;
The pair of molded article substrates are placed in a state where the pair of molded article substrates are mounted on the pair of molded article substrate mounting parts, and the pair of molded article substrates on the pair of molded article substrate mounting parts are pressed by the pair of molded article substrate pressing parts, A step of forming a first molding product substrate and a second molding product substrate by removing an unnecessary resin portion of the molding product substrate;
A step of heating the first mold product substrate and the second mold product substrate by a heating unit provided on the pair of mold product substrate mounting units.
A method for producing a resin molded article. According to claim 6,
The heating step includes a step of heating while pressing the first mold article substrate and the second mold article substrate by the pair of mold article substrate pressing units.
A method for producing a resin molded product. According to claim 6 or 7,
The heating step includes a step of heating the surface of the pair of molded article substrate mounting parts to 140 ° C. or more and 175 ° C. or less.
A method for producing a resin molded product. According to any one of claims 6 to 8,
The heating step includes a step of heating the first mold product substrate and the second mold product substrate for 15 seconds or more and 40 seconds or less.
A method for producing a resin molded product. According to any one of claims 6 to 9,
A conveyance mechanism further comprising a step of picking up the first substrate and the second substrate after the heating step.
A method for producing a resin molded product. According to any one of claims 6 to 10,
a step of pressing the pair of conveying substrate pressing parts of the conveying mechanism, after the picking up step, the first molded product substrate and the second molded product substrate after the heating step against the pair of conveying substrate contacting portions;
A method for producing a resin molded product. According to claim 11,
In the pressurizing step, the pair of conveying substrate pressing parts press the periphery of the first molded product substrate and the second molded product substrate after the heating step.
A method for producing a resin molded product. According to any one of claims 6 to 12,
A step of stopping the movement of the conveying mechanism in a state in which the pair of transfer substrate pressing parts press the first and second mold product substrates after the heating step with respect to the pair of transfer substrate contact parts; doing
A method for producing a resin molded article.