JP2012131105A - Thermal transfer molding device and thermal transfer molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal transfer molding device and a thermal transfer molding method, which can reduce facility cost required for the molding device which performs thermal transfer molding under a vacuum (reduced pressure) condition and which can achieve improvement of productivity per time unit.SOLUTION: The thermal transfer molding device 1 has: transporting-and-molding units 10 which hold processed materials and maintain a reduced pressure state; a heating-and-molding section 20 which has heating board sections 21 by being laminated and holds the transporting-and-molding units between the heating board sections to heat and apply pressure to them and heats and molds the processed materials in them; a cooling section 30 which has cooling board section 31 by being vertically laminated and holds the transporting-and-molding units between the cooling board sections to cool and apply pressure to them, and cools the processed materials in the plurality of transporting-and-molding units; and a transporting device 40 which has a chuck section 41 that holds the transporting-and-molding units and on which the transporting-and-molding units are placed and which transports the transporting-and-molding units. The transporting device transports the transporting-and-molding units in arrangement order of a forward direction of the heating-and-molding section and the cooling section. The thermal transfer molding method uses the thermal transfer molding device 1.

Description

  The present invention relates to a thermal transfer molding apparatus and a thermal transfer molding method, and more particularly, to a thermal transfer molding apparatus and a thermal transfer molding method for moving and molding a unit containing the workpiece itself, rather than moving the workpiece itself.

  In a thermal transfer molding apparatus for transferring a mold surface to a workpiece made of thermoplastic resin or the like, the workpiece is placed on a fixed side member having a hot plate, and a movable hot plate is provided for the fixed side member. The movable member is advanced, and the workpiece is heated and pressed by pressing from both sides. As such an apparatus for thermal transfer molding, for example, an apparatus has been proposed in which a vacuum chamber is formed when the movable side member moves forward, and a workpiece is heated and pressurized (thermal transfer press) in a reduced pressure state (for example, Patent Documents). 1, see Patent Document 2). In the thermal transfer press apparatus disclosed in Patent Documents 1 and 2 and the like, since the vacuum state is set during molding, the stamper is in close contact with the workpiece, which is particularly convenient for molding a precise and fine surface shape.

  In the case of the apparatus described in the above-mentioned patent document and the like, since the pressure is reduced during molding, both the heating and pressurization and the cooling and pressurization for the workpiece are performed in a pair of press apparatuses. That is, for heating and pressurization, water vapor or the like is passed through a flow path formed on the press platen behind the stamper that transfers the mold surface to the workpiece. Further, during cooling and pressurization, cold water or the like is sent through the same flow path. Once the inside of the apparatus is in a reduced pressure state for molding, the workpiece is not taken out of the apparatus, and the temperature rise and fall are repeated on the press board side while the crimped state is maintained.

  Since it is necessary to perform heating and pressurization and cooling and pressurization under a predetermined set temperature condition corresponding to the workpiece, a preparation time for adjusting the temperature of the press panel is inevitably generated between the processes. Therefore, considering the improvement of the processing capacity per unit time due to the continuation of work, the demand is not always met. In addition, when trying to improve the processing capacity with the conventional apparatus, the number of apparatuses and devices is increased. For this reason, there is a problem that capital investment increases.

  Therefore, in a molding apparatus that performs thermal transfer molding under vacuum (reduced pressure) conditions, there has been a demand for a molding apparatus and a molding method capable of compressing the equipment cost required for the apparatus and improving productivity per hour.

JP 2006-167788 A JP 2008-155521 A

  The present invention has been made in view of the above points, and thermal transfer molding that compresses equipment costs required for a molding apparatus that performs thermal transfer molding under vacuum (decompression) conditions and can also improve productivity per hour. An apparatus and a thermal transfer molding method are provided.

  That is, the invention according to claim 1 accommodates the workpiece, the upper stamper and the lower stamper that are in close contact with the upper and lower surfaces of the workpiece, the upper stamper, the workpiece, and the lower stamper in this order. An upper housing member, a lower housing member, and a deaeration part that depressurizes the inside of the housing space formed by joining the upper housing member and the lower housing member, and can be conveyed while maintaining a decompressed state. A conveyance molding unit and a plurality of heating platens are stacked in the vertical direction, the conveyance molding unit is sandwiched between the heating platens, and the plurality of heating molding units are heated and pressed against the conveyance molding unit. A thermoforming unit that simultaneously heat-molds the workpiece in the transport molding unit and a plurality of cooling disk units are vertically stacked, and the transport molding unit is sandwiched between the cooling disk units. A cooling unit that cools and pressurizes the conveyance molding unit and simultaneously cools the workpieces in the plurality of conveyance molding units, and a chuck unit that holds the conveyance molding unit, A conveying device that places and conveys the conveyance molding unit at a predetermined position between each other or between the respective cooling disk units, and the conveyance device converts the conveyance molding unit into the heating molding unit, The present invention relates to a thermal transfer molding apparatus that transports the cooling unit in the order of arrangement in the forward direction.

  The invention according to claim 2 is arranged on the front side of the thermoforming part, depressurizes the housing space through the deaeration part, and places the transfer molding unit at a standby position, and then the transfer molding toward the thermoforming part. An unloading unit that unloads the unit; and a loading unit that is disposed on the rear side of the cooling unit and receives the transfer molding unit that is loaded from the cooling unit and separates the transfer molding unit. The thermal transfer molding apparatus according to claim 1, wherein the molding unit is transported in the order of the carry-out unit, the heating molding unit, the cooling unit, and the carry-in unit.

  A third aspect of the present invention relates to the thermal transfer molding apparatus according to the second aspect, further comprising a return device that returns the upper accommodation member and the lower accommodation member from the carry-in portion to the carry-out portion.

  According to a fourth aspect of the present invention, there is provided the thermal transfer molding apparatus according to the second or third aspect, wherein the transport molding unit is movable in the left-right direction perpendicular to the forward direction in the carry-out portion and the carry-in portion.

  In the invention according to claim 5, the carry-out unit and the carry-in unit can place a plurality of the conveyance molding units in a vertical direction according to the arrangement of the heating platen in the thermoforming unit and the cooling plate in the cooling unit. The thermal transfer molding apparatus according to claim 2.

  According to a sixth aspect of the present invention, the chuck portion has a length that allows the conveying and forming units placed on the carry-out portion, the thermoforming portion, and the cooling portion to be held together. The transport device collectively transports the transport molding units placed on the carry-out unit, the heating molding unit, and the cooling unit to the heating molding unit, the cooling unit, and the carry-in unit. The thermal transfer molding apparatus according to claim 2, wherein the thermal transfer molding apparatus is placed.

  The invention according to claim 7 is any one of claims 1 to 6, wherein both the transport molding unit carried into the heating molding unit and the transport molding unit carried into the cooling unit are decompressed through the deaeration unit. The thermal transfer molding apparatus according to Item 1.

  According to an eighth aspect of the present invention, after the conveyance molding unit finishes cooling in the cooling section, the conveyance molding unit is supplied with air through the deaeration section to pressurize the accommodating space. The thermal transfer molding apparatus according to any one of the above.

  The invention according to claim 9 is an upper housing that houses a workpiece, an upper stamper and a lower stamper that are in close contact with upper and lower surfaces of the workpiece, and an upper stamper, the workpiece, and the lower stamper in that order. Conveying molding that includes a member, a lower accommodating member, and a deaeration part that depressurizes the accommodating space formed by joining the upper accommodating member and the lower accommodating member, and is capable of conveying while maintaining a depressurized state. A unit and a plurality of heating platens are stacked in a vertical direction, the conveyance molding unit is sandwiched between the heating platens, and the conveyance molding unit is heated and pressurized to form the plurality of conveyance moldings. A thermoforming unit that simultaneously thermoforms the workpiece in the unit and a plurality of cooling disk units stacked in a vertical direction, and the conveyance molding unit is sandwiched between the cooling disk units and the front A cooling unit that cools and pressurizes the conveyance molding unit and simultaneously cools the workpieces in the plurality of conveyance molding units, and a chuck unit that grips the conveyance molding unit. A thermal transfer molding method using a molding apparatus having a conveyance device for placing and conveying the conveyance molding unit at a predetermined position between or between the respective cooling disk units, the heating molding unit and the cooling unit In any of the above, the chamber space is depressurized through the deaeration unit, and the transport molding unit is transported by the transport device in the order of arrangement of the thermoforming unit and the cooling unit in the forward direction. The present invention relates to a thermal transfer molding method characterized in that molding of the workpiece accommodated in a molding unit is performed.

  The invention according to claim 10 is arranged on the front side of the thermoforming unit, depressurizes the housing space through the deaeration unit, and places the transfer molding unit at a standby position, toward the thermoforming unit. An unloading unit for unloading the unit; and a loading unit that receives the transfer molding unit that is disposed on the rear side of the cooling unit and is loaded from the cooling unit, and separates the transfer molding unit. It concerns on the thermal transfer molding method of Claim 9 conveyed in order of the said carrying-out part, the said thermoforming part, the said cooling part, and the said carrying-in part with a conveying apparatus.

  The invention according to an eleventh aspect relates to the thermal transfer molding method according to the tenth aspect, further comprising a return device that returns the upper accommodation member and the lower accommodation member from the carry-in portion to the carry-out portion.

  According to a twelfth aspect of the present invention, after the transport molding unit finishes cooling in the cooling section, the transport molding unit is supplied with air through the deaeration section to pressurize the accommodating space. The thermal transfer molding method according to any one of the above.

  According to the thermal transfer molding apparatus of the invention of claim 1, the workpiece, the upper stamper and the lower stamper that are in close contact with the upper and lower surfaces of the workpiece, the upper stamper, the workpiece, and the lower stamper An upper housing member and a lower housing member that are housed in order, and a deaeration section that decompresses the housing space formed by the joining of the upper housing member and the lower housing member, while maintaining a decompressed state A conveyance molding unit that enables conveyance and a plurality of heating platens are stacked in a vertical direction, and the conveyance molding unit is sandwiched between the heating platens and heated and heated with respect to the conveyance molding unit. A heat forming section for simultaneously heat forming the workpieces in the plurality of transfer forming units, and a plurality of cooling plate portions stacked in a vertical direction, and the transfer forming unit between the cooling plate portions. A cooling unit that sandwiches the workpiece and cools and pressurizes the conveyance molding unit to simultaneously cool the workpiece in the plurality of conveyance molding units, and a chuck unit that holds the conveyance molding unit. A conveying device that places and conveys the conveyance molding unit at a predetermined position between the heating platen portions or between the cooling platen portions, and the conveyance device includes the conveyance molding unit as described above. Since the heat forming unit and the cooling unit are transported in the order of arrangement in the forward direction, the equipment cost required for a molding apparatus that performs thermal transfer molding under vacuum (reduced pressure) conditions is reduced, and productivity per hour is also improved. realizable.

  According to the thermal transfer molding apparatus according to the invention of claim 2, in the invention of claim 1, the transfer molding unit is disposed at the front side of the thermoforming unit and depressurizes the housing space through the deaeration unit, and the transport molding unit is placed at a standby position. An unloading unit that is placed and unloads the transfer molding unit toward the thermoforming unit, and the transfer molding unit that is disposed on the rear side of the cooling unit and is carried in from the cooling unit is separated. A carrying-in unit is provided, and the conveying device conveys the conveying and forming unit in the order of the carrying-out unit, the heating and molding unit, the cooling unit, and the carrying-in unit. In addition, the carry-in section can also prepare for removal and return of the processed workpiece after carrying in. Therefore, the carrying-in efficiency to a thermoforming part and the carrying-out efficiency from a cooling part are improved.

  According to the thermal transfer molding apparatus according to the invention of claim 3, in the invention of claim 2, the apparatus includes a return device that returns the upper accommodation member and the lower accommodation member from the carry-in portion to the carry-out portion. It is not necessary to move the encapsulated conveyance molding unit back and forth between the heating molding section and the cooling section, and the conveyance molding unit can always be one-way conveyance, so that the productivity of the molding process can be improved.

  According to the thermal transfer molding apparatus of the invention of claim 4, in the invention of claim 2 or 3, in the carry-out part and the carry-in part, the transport molding unit is movable in the left-right direction orthogonal to the forward direction, It is possible to change the direction of the transport molding unit and move it at a limited place in the carry-out part and the carry-in part.

  According to the thermal transfer molding apparatus according to the invention of claim 5, in the invention of any one of claims 2 to 4, the carry-out part and the carry-in part are the cooling in the heating platen part and the cooling part in the thermoforming part. Since a plurality of the transfer molding units can be mounted in the vertical direction according to the arrangement of the panels, it is possible to flexibly cope with the scale and the number of processes of the thermal transfer molding apparatus.

  According to the thermal transfer molding apparatus according to the invention of claim 6, in the invention of any one of claims 2 to 5, the chuck portion is placed on the carry-out portion, the thermoforming portion, and the cooling portion. Each conveyance molding unit has a length that allows the conveyance molding units to be held together, and the conveyance device collects the conveyance molding units placed on the carry-out unit, the heating molding unit, and the cooling unit. Thus, the number of transport molding units that can be transported by one forward movement of the transport device is increased, and transport in the thermal transfer molding device is performed because the transport device is transported and placed in the heating molding section, the cooling section, and the carry-in section. The conveyance efficiency of the molding unit can be increased.

  According to the thermal transfer molding apparatus according to the invention of claim 7, in the invention of any one of claims 1 to 6, the transport molding unit carried into the heating molding unit and the transport molding unit carried into the cooling unit are Since both are depressurized through the deaeration unit, even if the degree of vacuum in the storage space of the conveyance molding unit is reduced during conveyance, molding defects in the heating molding unit and misalignment in the cooling unit are avoided, and molding accuracy is increased. be able to.

  According to a thermal transfer molding apparatus according to an eighth aspect of the present invention, in the invention according to any one of the first to seventh aspects, after the transport molding unit finishes cooling in the cooling section, the transport molding unit passes through the deaeration section. Since the air is supplied and the inside of the housing space is pressurized, the inside of the housing space of the transfer molding unit becomes a positive pressure, and the separation between the upper housing member and the lower housing member becomes easy. Further, since compressed air enters the gap between the processed workpiece and the upper and lower stampers, both can be smoothly peeled off.

  According to the thermal transfer molding method of the invention of claim 9, the workpiece, the upper stamper and the lower stamper that are in close contact with the upper and lower surfaces of the workpiece, the upper stamper, the workpiece, and the lower stamper An upper housing member and a lower housing member that are housed in order, and a deaeration section that decompresses the housing space formed by the joining of the upper housing member and the lower housing member, while maintaining a decompressed state A conveyance molding unit that enables conveyance and a plurality of heating platens are stacked in a vertical direction, and the conveyance molding unit is sandwiched between the heating platens and heated and heated with respect to the conveyance molding unit. A heat forming section for simultaneously heat forming the workpieces in the plurality of transfer forming units, and a plurality of cooling plate portions stacked in a vertical direction, and the transfer forming unit between the cooling plate portions. A cooling unit that sandwiches the workpiece and cools and pressurizes the conveyance molding unit to simultaneously cool the workpiece in the plurality of conveyance molding units, and a chuck unit that holds the conveyance molding unit. A thermal transfer molding method using a molding apparatus having a conveying device that places and conveys the conveying molding unit at a predetermined position between the heating platens or between the cooling plates. In both the heat forming part and the cooling part, the pressure in the chamber space is reduced through the deaeration part, and the transfer forming unit is arranged in the order of arrangement of the heat forming part and the cooling part in the forward direction by the transfer device. Molding that performs thermal transfer molding under vacuum (reduced pressure) conditions because the workpiece is housed in the transport molding unit by being transported. Compressing the facility costs required for the location, and can find a way can be realized improvement in productivity per hour.

  Moreover, even if the degree of vacuum in the accommodation space of the conveyance molding unit decreases during conveyance, molding defects in the thermoforming unit can be avoided and molding accuracy can be increased.

  According to the thermal transfer molding method of the invention of claim 10, in the invention of claim 9, pressure reduction in the accommodation space is performed through the deaeration part arranged on the front side of the thermoforming part, and the transport molding unit is placed at a standby position. An unloading unit that is placed and unloads the transfer molding unit toward the thermoforming unit, and the transfer molding unit that is disposed on the rear side of the cooling unit and is carried in from the cooling unit is separated. A carry-in unit is provided, and the conveyance molding unit is conveyed by the conveyance device in the order of the carry-out unit, the thermoforming unit, the cooling unit, and the carry-in unit. In addition, the carry-in section can also prepare for taking out and returning the processed workpiece W after carrying in. Therefore, the carrying-in efficiency into the thermoforming unit and the carrying-out efficiency from the cooling unit are increased.

  According to the thermal transfer molding apparatus according to the invention of claim 11, in the invention of claim 10, a return device is provided for returning the upper accommodation member and the lower accommodation member from the carry-in portion to the carry-out portion. It is not necessary to move the transfer molding unit enclosing the transfer unit back and forth between the heating molding unit and the cooling unit one by one, and the conveyance molding unit can always be one-way conveyance, which can improve the productivity of the molding process. .

  According to a thermal transfer molding apparatus according to a twelfth aspect of the present invention, in the invention according to any one of the ninth to eleventh aspects, after the transport molding unit finishes cooling in the cooling section, the transport molding unit passes through the degassing section. Since the air is supplied and the inside of the housing space is pressurized, the inside of the housing space of the transfer molding unit becomes a positive pressure, and the separation between the upper housing member and the lower housing member becomes easy. Further, since compressed air enters the gap between the processed workpiece and the upper and lower stampers, both can be smoothly peeled off.

1 is a schematic perspective view of a thermal transfer molding apparatus according to an embodiment of the present invention. It is a schematic sectional drawing of a conveyance molding unit. It is principal part sectional drawing of a conveying apparatus. It is a whole perspective view of a carrying-in part. It is a 1st schematic side view of each part which comprises a thermal transfer molding apparatus. It is a 2nd schematic side view of each part which comprises a thermal transfer molding apparatus. It is a schematic diagram which shows the conveyance state by a conveying apparatus.

  The thermal transfer molding apparatus 1 shown in the schematic perspective view of FIG. 1 forms a pattern on the surface thereof by applying heat and pressure to the surface layer of a workpiece W (see FIG. 2) made of a thermoplastic resin such as PMMA. It is a device for doing. In the thermal transfer molding method using the thermal transfer molding apparatus 1 according to the present invention, the workpiece W is not sequentially conveyed alone, but is thermally molded and cooled. The workpiece W is accommodated in the conveyance molding unit 10, and heat and pressure are applied to the workpiece W accommodated in the conveyance molding unit 10 by sequentially conveying the conveyance molding unit 10. Is called. Hereinafter, the configuration of the thermal transfer molding apparatus 1 of the present invention will be described.

  In the thermal transfer molding apparatus 1, the carry-out unit 50, the heating molding unit 20, the cooling unit 30, and the carry-in unit 80 are linearly arranged in the order in which the conveyance molding unit 10 advances. This order is an arrangement in the forward direction. The transport molding unit 10 is transported in the forward direction by the transport device 40. In FIG. 1, reference numeral 21 denotes a heating board part, 31 denotes a cooling board part, 41 denotes a chuck part, and 45 denotes a return device. In the carry-out section 50, reference numeral 51 denotes a first carry-out stage, 52 denotes a second carry-out stage, 53 denotes a first carry-out zone, 54 denotes a first carry-in zone, 55 denotes a second carry-out zone, and 56 denotes a second carry-in zone. is there. In the carry-in section 80, reference numeral 81 denotes a first carry-in stage, 82 denotes a second carry-in stage, 83 denotes a first carry-in zone, 84 denotes a first carry-out zone, 85 denotes a second carry-in zone, and 86 denotes a second carry-out zone. Each part will be described in detail later.

  FIG. 2 is a schematic cross-sectional view showing members constituting the conveyance molding unit 10. As can be seen from FIG. 2A, the workpiece W, the upper stamper 11 in close contact with the upper surface Wa of the workpiece W, and the lower stamper in close contact with the lower surface Wb of the workpiece W. 12 is provided. While maintaining the order of the upper stamper 11, the workpiece W, and the lower stamper 12 in the vertical direction, these are accommodated between the upper accommodation member 13 and the lower accommodation member 14. A predetermined molding pattern is attached to the upper and lower stampers, and the stamper pattern is transferred to the surface of the workpiece W softened by heating. When the surface of the workpiece W is processed into a flat surface (smooth surface), a mirror finish stamper is used.

  The upper housing member 13 and the lower housing member 14 are provided with a positioning member 16 having a pin, an engagement hole, and the like for alignment at the time of mutual attachment. Further, a packing (not shown) is provided on the joint surface between the upper housing member 13 and the lower housing member 14 for the purpose of ensuring airtightness at the time of attachment.

  As shown in FIG. 2B, the upper housing member 13 and the lower housing member 14 are joined together, and the upper stamper 11, the workpiece W, and the lower stamper 12 are housed and held. An accommodation space 15 is created by the joining of the upper accommodation member 13 and the lower accommodation member 14. The workpiece W is heated and pressurized under reduced pressure conditions. By setting the reduced pressure state, the adhesion accuracy between the upper and lower stampers 11 and 12 and the workpiece W is increased. This is particularly convenient when forming a fine pattern uniformly.

  Therefore, a deaeration unit 17 is provided to deaerate the inside of the accommodation space 15 formed in the transport molding unit 10 and maintain a reduced pressure state (vacuum state). A known check valve, check valve or the like is used for the deaeration unit 17. As will be described later, the deaeration in the accommodation space 15 is performed via the deaeration unit 17 in the carry-out unit 50, the thermoforming unit 20, and the cooling unit 30. For example, in each part of the list, the deaeration part 17 of each conveyance molding unit 10 is connected to the vacuum pump V, and the air in the accommodation space 15 is sucked.

  The structure of the thermoforming unit 20 and the cooling unit 30 will be described with reference to FIGS. The thermoforming section 20 is provided with movable plates 23 and 26 that are driven forward and backward by a hydraulic piston portion 24 with respect to the fixed plate 22, a shaft portion 25 that maintains parallelism, and the like. The heating panel 21 is provided by being stacked in the vertical direction. The carried-in molding unit 10 carried in is sandwiched between the heating platens 21 and 21. Then, the conveyance molding unit 10 receives heating and pressing (thermal transfer press) from the heating plates 21 and 21, so that the mold surfaces of the upper and lower stampers 11 and 12 are transferred to the workpiece W. In the structure of the heat forming part 20 of the embodiment, the heating platen part 21 is provided in four stages. A heating platen 21 connected to the movable platen 23 from above, a heating platen 21 connected to the upper and lower sides of the movable platen 26, and a heating platen unit 21 connected to the fixed platen 22, respectively. Due to the arrangement configuration of the heating platen portion 21 of the embodiment, two transfer molding units 10 in the upper and lower directions can be processed at one time in the heating molding unit 20. Therefore, the workpieces W and W in the plurality (two) of the transfer molding units 10 and 10 are simultaneously heat-molded.

  Although not shown, the thermoforming unit 20 includes a hydraulic oil supply adjustment pump, a hydraulic oil tank, a hydraulic oil pressure control sensor, a heating plate position detection adjustment sensor, and a heating plate temperature sensor. A supply device for heating oil or steam to the heating panel is suitably provided. Further, a known vacuum pump is provided in the thermoforming unit 20.

  In thermal transfer molding, air may remain in the gap between the stamper and the workpiece. Then, the air expands at the time of thermoforming, causing deformation or molding omission in the workpiece, and depressing the product yield. In thermal transfer molding, fine processing and molding are required, so even a small amount of air remains fatal. In order to improve such problems, it is becoming mainstream to perform heat molding under reduced pressure conditions. By reducing the pressure, the degree of vacuum increases, the efficiency of removing air remaining in the gap between the stamper and the workpiece is increased, and the molding accuracy can be dramatically increased.

  Therefore, in the thermal transfer molding apparatus 1, a vacuum pump is also provided in the heating molding unit 20 in order to make better use of the advantages of vacuum thermal transfer molding. And the vacuum degree at the time of heat-pressing with respect to the conveyance shaping | molding unit 10 carried in to the thermoforming part 20 can be raised more than predetermined amount. For this reason, even if the degree of vacuum in the accommodation space of the conveyance molding unit decreases during conveyance, the decompression of the accommodation space 15 of the conveyance molding unit 10 is performed again in the heating molding unit.

  The cooling unit 30 includes movable plates 33 and 36 that are driven forward and backward by a hydraulic piston unit 34 with respect to the fixed platen 32, a shaft portion 35 that keeps parallelism, and the like. The cooling panel 31 is provided by being stacked in the vertical direction. The carried-in molding unit 10 carried in is sandwiched between the cooling disk units 31 and 31. The conveyance molding unit 10 receives cooling and pressing from the cooling plates 31 and 31, whereby the workpiece W is cooled via the upper and lower stampers 11 and 12 inside thereof. In the structure of the cooling unit 30 of the embodiment, the cooling platen 31 is provided with four stages in the same manner as the heating platen 21 described above. The cooling platen 31 is connected to the movable platen 33 from above, the cooling platen 31 is connected to the top and bottom of the movable platen 36, and the cooling platen 31 is connected to the fixed platen 32. Due to the arrangement configuration of the cooling platen 31 of the embodiment, two transfer molding units 10 can be processed at the same time in the cooling unit 30. Accordingly, the workpieces W and W in the plurality (two) of the transfer molding units 10 and 10 are simultaneously cooled.

  Although not shown, the cooling unit 30 also includes a hydraulic oil supply adjustment pump, a hydraulic oil tank, a hydraulic pressure sensor, a cooling plate position detection adjustment sensor, a cooling plate temperature sensor, A device for supplying cold water to the cooling panel is suitably provided. The cooling unit 30 is also provided with a known vacuum pump, similar to the thermoforming unit 20. Even if the degree of vacuum in the accommodation space 15 of the conveyance molding unit 10 is lowered during conveyance, pressure reduction is performed again in the cooling unit 30, so that a lower degree of vacuum can be obtained. Therefore, since the adhesion between the stamper and the workpiece is enhanced, the mutual displacement is avoided, and the malfunction of the product is solved. Further, since the stamper is in close contact, the workpiece can be efficiently cooled.

  The apparatus for transporting the transport molding unit 10 in the order of the heating molding unit 20 and the cooling unit 30 is not particularly limited as long as it can be transported stably. In the embodiment, as disclosed in FIGS. 1 and 3, a conveyance device 40 including chuck portions 41 and 41 that grip the conveyance molding unit 10 is used. The conveyance molding unit 10 is conveyed in the order in which the thermoforming unit 20 and the cooling unit 30 are arranged in the forward direction, and is placed at a predetermined position between the heating platens 21 and 21 or between the cooling plates 31 and 31. Placed.

  As understood from FIGS. 1 and 3, the chuck portions 41, 41 of the transport device 40 are in the forward direction of the transport molding unit 10 (the forward direction in which the heating molding unit 20 and the cooling unit 30 are arranged). It approaches and separates from the conveyance molding unit from the orthogonal left and right direction. By making the movement of the chuck portions 41 and 41, the chuck portions 41 and 41 are caught in the heating platen portion 21 and the cooling platen portion 31 at the time of pressurization performed in the thermoforming portion 20 and the cooling portion 30. And can be saved. The raising and lowering of the individual conveyance molding units 10 and the positioning to the heating platen 21 and the cooling platen 31 are performed by using a separate appropriate device or by the chuck units 41 and 41 of the conveyance device 40. Reference numeral 42 denotes a chuck holding portion that holds the chuck portion.

  The workpiece W in the transport molding unit can also be molded by transporting the transport molding unit 10 in the order in which the heat molding unit 20 and the cooling unit 30 are arranged, and performing heat molding and cooling in each part. However, “accommodating the work material W in the transport molding unit 10, transporting the transport molding unit 10 forward, taking out the work material W that has been molded, housing the work material in the transport molding unit again, When trying to improve productivity by continuing each process like “...”, processes that are not involved in direct machining other than molding and cooling of the workpiece W cannot be ignored.

  Therefore, in the thermal transfer molding apparatus 1 as disclosed in FIG. 1 and the like, the unloading unit 50 is provided on the front side of the thermoforming unit 20 in order to improve the efficiency of standby, feeding, taking out of the finished workpiece, and the like. The carrying-in part 80 is provided in the rear side of the cooling part 30. The thermal transfer molding apparatus 1 is also provided with a return device 45. The upper housing member 13 and the lower housing member 14 constituting the transport molding unit 10 and materials such as the upper stamper 11 and the lower stamper 12 are returned from the carry-in portion 80 side to the carry-out portion 50 side by the return device 45. The The return by the return device 45 is the reverse direction opposite to the forward direction. The return device 45 is not particularly limited as long as it is a roller conveyor or a device capable of transporting such as a rail and a carriage.

  As described above, the heating forming unit 20 and the cooling unit 30 of the embodiment each accommodate and process two upper and lower transfer forming units 10 (see FIGS. 5 and 6). Therefore, in order to be able to carry out the upper and lower two transfer molding units 10, 10, the carry-out part 50 has a first carry-out stage 51, and a second carry-out stage 52 on the upper stage of the first carry-out stage 51 has a leg Pi. The height is increased (see FIGS. 1 and 4). Similarly, also in the carrying-in part 80, the 1st carrying-in stage 81 and the 2nd carrying-in stage 82 are provided in the upper stage (refer FIG. 1).

  Therefore, the carry-out unit 50 and the carry-in unit 80 can place a plurality of the conveyance molding units 10 in the vertical direction in accordance with the arrangement of the heating platen 21 in the heating molding unit 20 and the cooling platen 31 in the cooling unit 30. it can. For this reason, the number of placement of the conveying molding unit in the vertical direction is not limited to the two stages (upper and lower two) of the illustrated embodiment, and the two stages of the embodiment according to the scale of the thermal transfer molding apparatus, the number of processes, and the like. It can be flexibly expanded from (upper and lower two) to four (upper and lower four) and eight (upper and lower eight).

  In addition, in the carrying-out part 50 and the carrying-in part 80 of an Example, the member etc. which are used for each are common. Therefore, only the carry-out unit 50 is illustrated in FIG. 4 to describe the detailed configuration, and the detailed illustration of the carry-in unit 80 is omitted.

  The first carry-out stage 51 has a first carry-out section 53 in which one assembled transfer molding unit 10 is placed at a standby position and carried out toward the heat-forming unit 20, and a return device 45 (see FIG. 1) from the carry-in unit 80. The first accommodating section 54 into which the upper accommodating member 13 and the lower accommodating member 14 are carried in.

  In the first carry-out stage 51 of the carry-out unit 50, roller conveyors 61 are provided in both the first carry-out zone 53 and the first carry-in zone 54. Since the roller conveyor 61 has a plurality of rollers arranged in a row on a pedestal, movement of materials carried in the backward direction from the return device 45 is simplified. At the same time, the transport molding unit 10 can be smoothly carried out in the forward direction toward the thermoforming unit 20.

  Further, the first carry-out stage 51 of the carry-out unit 50 is also provided with a roller conveyer 62 in a direction orthogonal to the roller conveyer 61. Therefore, the conveyance molding unit 10 can also move from the first carry-in section 54 to the first carry-out section 53 in the left-right direction (longitudinal direction of the carry-out section 50) perpendicular to the forward direction in the first carry-out stage 51. For this reason, by combining the roller conveyor 61 and the roller conveyor 62, it is possible to change the direction of the transport molding unit 10 at a limited location in the first unloading stage 51 of the unloading unit 50 and move it.

  The roller conveyor 61 and the roller conveyor 62 are installed at different height positions in the first carry-out stage 51. When the conveyance molding unit 10 moves from the first carry-in zone 54 to the first carry-out zone 53, the lift 58 rises and the conveyance molding unit 10 is lifted and placed on the roller conveyor 62. The conveyance molding unit 10 is a roller. It is sent to the first carry-out zone 53 via the conveyor 62. Next, when the conveyance molding unit 10 is moved from the first carry-out section 53 to the heat molding unit 20, the lift unit 57 is raised and the conveyance molding unit 10 is lifted and placed on the roller conveyor 61. Then, the transport molding unit 10 is sent to the heat molding unit 20 by the transport device 40.

  In the first carry-out stage 51, a linear actuator 70a including a movable part 71 and a magnet rod 73 is provided. Therefore, the conveyance molding unit 10 on the roller conveyor 62 is pressed in contact with the movable portion 71, so that the conveyance molding unit 10 can move in the left-right direction within the first carry-out stage 51. A movable stop plate 65 and a stop plate 67 are provided to ensure safety by avoiding inadvertent movement of the transfer molding unit 10 and the like. A guide rail 75 is also provided along the magnet rod 73.

  The upper housing member 13 and the lower housing member 14, and the materials such as the upper stamper 11 and the lower stamper 12, which constitute the conveyance molding unit 10 returned from the carry-in unit 80 through the return device 45, are once brought into the first carry-in. Accepted by District 54. In the first carry-in zone 54, the workpiece W before processing is newly accommodated in the upper accommodating member 13 and the lower accommodating member 14 together with the upper stamper 11 and the lower stamper 12, and is again accommodated, and is again conveyed and molded unit 10. Is assembled.

  The assembled conveyance molding unit 10 is conveyed to the first unloading section 53 by the roller conveyor 62 and the linear actuator 70a as described above. In the first carry-out zone 53, a vacuum pump (not shown) is connected to the transfer molding unit 10, and the inside of the accommodation space 15 of the transfer molding unit 10 is depressurized to a predetermined degree of vacuum through the deaeration unit 17. Then, in the first carry-out zone 53 (standby position), a transfer standby state to the thermoforming unit 20 is entered.

  The second carry-out stage 52 is also placed on the upper side through the return device 45 (see FIG. 1) from the second carry-out section 55 where the single transfer molding unit 10 is placed at the standby position and carried out toward the thermoforming unit 20. The housing member 13 and the lower housing member 14 are divided into second carrying-in zones 56 into which the housing member 13 and the lower housing member 14 are carried. Similarly to the first carry-out stage 51, the second carry-out stage 52 of the carry-out unit 50 is provided with a roller conveyor 63 and a roller conveyor 64 in both the second carry-out zone 55 and the second carry-in zone 56. Therefore, the transfer molding unit 10 can move from the second carry-in section 56 to the second carry-out section 55 in the second carry-out stage 52 in the left-right direction (longitudinal direction of the carry-out portion 50) perpendicular to the forward direction.

  The roller conveyor 63 and the roller conveyor 64 are also installed at different height positions in the second carry-out stage 52. When the conveyance molding unit 10 is moved from the second carry-in zone 56 to the first carry-out zone 55, the lift unit 60 is raised and the conveyance molding unit 10 is lifted and placed on the roller conveyor 62, through which conveyance molding is performed. The unit 10 is sent to the second carry-out zone 55. Next, when the conveyance molding unit 10 is moved from the second carry-out section 55 to the heating molding unit 20, the lift unit 59 is raised and the conveyance molding unit 10 is lifted and placed on the roller conveyor 61. Then, the transport molding unit 10 is sent to the heat molding unit 20 by the transport device 40.

  Also in the second carry-out stage 52, a linear actuator 70b including a movable portion 72 and a magnet rod 74 is provided. The conveyance molding unit 10 on the roller conveyor 62 is pressed in contact with the movable portion 72, so that the conveyance molding unit 10 can move in the left-right direction within the second carry-out stage 52. The second carry-out stage 52 is also provided with a movable stop plate 66 and a stop plate 68, and a guide rail 76 is also provided along the magnet rod 74.

  The upper housing member 13 and the lower housing member 14 and the materials such as the upper stamper 11 and the lower stamper 12 that constitute the transport molding unit 10 returned from the carry-in section 80 through the return device 45 are temporarily brought into the second carry-in. Accepted by District 56. Similarly, in the second carry-in zone 56, the workpiece W before processing is newly accommodated in the upper accommodating member 13 and the lower accommodating member 14 together with the upper stamper 11 and the lower stamper 12, and is again conveyed and molded. The unit 10 is assembled.

  The assembled conveyance molding unit 10 is conveyed to the second unloading section 55 by the roller conveyor 62 and the linear actuator 70b as described above. Also in the second unloading section 55, the inside of the accommodation space 15 of the transfer molding unit 10 is depressurized to a predetermined degree of vacuum through the deaeration unit 17 by the vacuum pump. And in the said 2nd unloading area 55 (standby position), it will be in the conveyance standby state to the thermoforming part 20. FIG.

  The conveyance molding unit 10 that has finished cooling in the cooling unit 30 is received in the carry-in unit 80 disposed on the rear side of the cooling unit 30 as shown in FIG. 1. The lower conveyance molding unit 10 is carried into the first carry-in section 83 of the first carry-in stage 81 of the carry-in unit 80. And it conveys from the 1st carrying-in area 83 to the 1st carrying-out area 84 by the roller conveyor, linear actuator, etc. which are not shown in figure. Similarly, the upper transfer molding unit 10 is also carried into the second carry-in zone 85 of the second carry-in stage 82 and is carried from the second carry-in zone 85 to the second carry-out zone 86 by a roller conveyor, a linear actuator, etc. (not shown). Is done.

  Since the thermal transfer molding apparatus 1 includes the carry-out unit 50 and the carry-in unit 80, the carry-out unit 50 can prepare for and carry out the carry-out, and the carry-in unit 80 can take out the processed workpiece W after carrying in. Preparation for return is also possible. Therefore, the carrying-in efficiency to the thermoforming part 20 and the carrying-out efficiency from the cooling part 30 are improved.

  Further, the thermal transfer molding apparatus 1 includes a return device 45 that can return materials such as the upper housing member 13 and the lower housing member 14 constituting the transport molding unit 10 from the carry-in unit 80 to the carry-out unit 50. For this reason, in the thermal transfer molding apparatus 1, it is not necessary to move the conveyance molding unit 10 enclosing the workpiece W between the heating molding unit 20 and the cooling unit 30 step by step. The conveyance molding unit 10 is always one-way conveyance, and the productivity of the molding process is dramatically improved.

  In the thermal transfer molding apparatus 1 of the embodiment, the processed workpiece W is taken out from the transport molding unit 10 in the carry-in unit 80. The conveyance molding unit 10 that has finished cooling in the cooling unit 30 and is carried into the carry-in unit 80 has a high degree of vacuum in the accommodation space 15 due to deaeration by a vacuum pump (in a high vacuum state). Even if the air tightness of the deaeration part 17 is simply released and the inside of the accommodation space 15 is returned to atmospheric pressure, it is not easy to separate the processed workpiece W (product) from the upper and lower stampers 11 and 12. There is.

  In the thermal transfer molding apparatus 1 of the embodiment, after cooling is completed in the cooling unit 30, the conveyance molding unit 10 is supplied with compressed air into the accommodation space 15 through the deaeration unit 17 in the carry-in unit 80. Inside pressurization is performed. Since the inside of the housing space 15 is at a positive pressure rather than atmospheric pressure, the detachment between the upper housing member 13 and the lower housing member 14 constituting the transport molding unit 10 is facilitated. Further, the compressed air enters the gap between the processed workpiece W (product) and the upper and lower stampers 11 and 12, and both can be smoothly separated.

  As described above, the conveyance unit 40 conveys the conveyance molding unit 10 from the carry-out unit 50 to the carry-in unit 80. In the thermal transfer molding apparatus 1 of the embodiment, in order to further improve the conveyance efficiency of the conveyance molding unit 10, the chuck portions 41 and 41 of the conveyance apparatus 40 are lengthened in the forward direction side of the conveyance molding unit. Specifically, as schematically shown in FIGS. 5 and 6, the chuck portions 41, 41 of the transport device 40 are each transport-molded mounted on the carry-out unit 50, the heating molding unit 20, and the cooling unit 30. It is formed in the full length which enables the unit 10 to be held collectively.

  Therefore, each conveyance molding unit 10 placed on each of the carry-out unit 50, the heating molding unit 20, and the cooling unit 30 is collectively performed as the chuck units 41 and 41 of the conveyance device 40 move in the forward direction. It is possible to carry forward transport, and the paper is transported and placed in each of the heat forming unit 20, the cooling unit 30, and the carry-in unit 80. After the chuck portions 41 and 41 of the transport device 40 reach the carry-in portion 80 and have finished transporting and placing the transport molding unit 10, the chuck portions 41 and 41 of the transport device 40 are not gripped, and the original unloading portion 50. Retreat until. Then, similarly, the conveyance molding unit 10 is held again, and the conveyance is continuously repeated. The conveying device 40 continuously advances and retreats a distance corresponding to one of the carry-out unit 50, the heating molding unit 20, the cooling unit 30, and the carry-in unit 80, so that the conveyance molding unit 10 is continuously moved in the forward direction. Be transported. In this way, the number of conveyance molding units that can be conveyed by one advance of the conveyance device is increased, and the conveyance efficiency of the conveyance molding unit in the thermal transfer molding device is increased.

  With reference to the schematic diagram of FIG. 7, the description will be further focused on one conveyance molding unit 10 x. Initially, the transfer molding unit 10x is placed at the standby position of the carry-out unit 50 ((a) in the figure). The conveyance molding unit 10x is conveyed and placed on the next thermoforming unit 20 as the conveyance device 40 (chuck portion 41) advances (FIG. 5B). At the same time, the transport molding unit 10 of the heating molding unit 20 is transported to the cooling unit 30, and the transport molding unit 10 of the cooling unit 30 is transported to the carry-in unit 80.

  Next, the conveyance device 40 (chuck part 41) moves backward without being gripped, and grips the conveyance molding unit of the carry-out part 50, the heating molding part 20, and the cooling part 30 ((c) in the figure). As the gripping transport device 40 (chuck unit 41) moves forward, the transport molding unit 10x is transported and placed from the heating molding unit 20 to the cooling unit 30 ((d) in the figure).

  Again, the conveying device 40 (chuck part 41) moves backward without being gripped, and grips the conveying and forming units of the carry-out part 50, the heat forming part 20 and the cooling part 30 ((e) in the figure). When the gripping transport device 40 (chuck part 41) moves forward, the transport molding unit 10x is transported and placed from the cooling unit 30 to the carry-in unit 80 ((f) in the figure).

  Then, again, the conveying device 40 (chuck portion 41) moves backward without being gripped ((g) in the figure). Finally, the processed workpiece is taken out from the conveyance molding unit 10x ((h) in the figure). Thereafter, as described above, the upper accommodation member and the lower accommodation member are returned from the carry-in portion 80 to the carry-out portion 50.

  A thermal transfer molding method performed using the thermal transfer molding apparatus 1 shown and described above will also be described. First, in the unloading part 50 (the 1st carrying-in area 54, the 2nd carrying-in area 56) of the thermal transfer molding apparatus 1, these are stored in the upper stamper 11, the workpiece W, and the lower stamper 12 in the vertical direction. It is accommodated between the member 13 and the lower accommodating member 14, and the conveyance molding unit 10 is assembled. And the conveyance molding unit 10 deaerates the air in the accommodation space 15 through the deaeration part 17, and is mounted in the stand-by position (the 1st unloading area 53, the 2nd unloading area 55) of the unloading part 50.

  The transport molding unit 10 is transported in the forward direction from the carry-out unit 50 to the heat forming unit 20 by the transport device 40 and is placed between the heating platens 21 of the heat forming unit 20. Also in the thermoforming unit 20, the air in the accommodation space 15 is degassed from the conveyance molding unit 10 through the deaeration unit 17. After deaeration, the workpiece W is subjected to a thermal transfer press via the transfer molding unit 10 by the heating platen 21 of the thermoforming unit 20.

  Next, the transport molding unit 10 is transported in the forward direction from the thermoforming unit 20 to the cooling unit 30 by the transport device 40, and is placed between the cooling disk units 31 of the cooling unit 30. Also in the cooling unit 30, the air in the accommodation space 15 is degassed through the deaeration unit 17 in the transport molding unit 10. After deaeration, the workpiece W is pressurized and cooled by the cooling platen 31 of the cooling unit 30 via the transfer molding unit 10.

  Then, the transport molding unit 10 is transported in the forward direction from the cooling unit 30 to the carry-in unit 80 by the transport device 40, and is transferred to the first carry-in zone 83 and the second carry-in zone 85 that serve as the carry-in position (accepting position) of the carry-in unit 80. Placed.

  The conveyance molding unit 10 that has finished cooling in the cooling unit 30 supplies compressed air to the accommodation space 15 through the deaeration unit 17 in the carry-in unit 80 (particularly, the first carry-in zone 83 and the second carry-in zone 85) immediately after that. I care. The transfer molding unit 10 moves the loading unit 80 from the first loading zone 83 to the first loading zone 84 and from the second loading zone 85 to the second loading zone 85, and in the first loading zone 84 and the second loading zone 85. The upper housing member 13 and the lower housing member 14 of the transport molding unit 10 are separated, and the workpiece W from the upper stamper 11 and the lower stamper 12 is removed. Here, the thermal transfer molding is completed, and a processed workpiece W (product) can be obtained.

  The upper housing member 13 and the lower housing member 14 after the processed workpiece W (product) is taken out, and the upper stamper 11 and the lower stamper 12 are first moved from the first carry-out section 84 using the return device 45. Returned to the carry-in zone 54 from the second carry-out zone 85 to the second carry-in zone 56.

  Then, a new workpiece W is incorporated in the upper housing member 13 and the lower housing member 14, the upper stamper 11, and the lower stamper 12 returned from the carry-in unit 80 in the carry-out unit 50, and the transport molding unit 10 is assembled. It is done. Similarly, after deaeration in the accommodation space 15 of the new conveyance molding unit 10, conveyance to the thermoforming unit 20, deaeration in the unit 20, thermal transfer press, subsequent conveyance to the cooling unit 30, and the same unit 30. Degassing, cooling, pressurization, subsequent conveyance to the carry-in section 80, supply of air into the accommodation space 15 of the conveyance molding unit 10, removal of the processed workpiece W (product), and return of the material The thermal transfer molding of the workpiece W is continuously performed within the operation time of the thermal transfer molding apparatus 1.

  As can be understood from the series of steps described above, it is possible to continue the vacuum thermal transfer molding for the workpiece. Therefore, productivity per unit time can be increased. In addition, the workpiece can be transported while maintaining the reduced pressure state as a transport molding unit, not as a single unit. For this reason, it is not necessary to surround the thermoforming part or the cooling part itself with a decompression chamber as in the conventional apparatus, and the apparatus itself can be simplified. In addition, since the temperatures of the heating platen of the intermediate heating forming unit and the cooling platen of the cooling unit can be made substantially constant, it is not necessary to adjust the temperature rise and fall, which contributes to time reduction.

DESCRIPTION OF SYMBOLS 1 Thermal transfer molding apparatus 10 Conveying molding unit 11 Upper stamper 12 Lower stamper 13 Upper accommodating member 14 Lower accommodating member 15 Accommodating space 17 Deaeration part 20 Heating molding part 21 Heating board part 30 Cooling part 31 Cooling board part 40 Conveying apparatus 41 Chuck part 50 Unloading part 51 First unloading stage 52 Second unloading stage 53 First unloading section 54 First unloading section 55 Second unloading section 56 Second unloading section 61, 62, 63, 64 Roller conveyor 80 Loading section 81 First Loading stage 82 Second loading stage 83 First loading zone 84 First loading zone 85 Second loading zone 86 Second loading zone W Work material

Claims (12)

A workpiece, an upper stamper and a lower stamper that are in close contact with the upper and lower surfaces of the workpiece, an upper housing member and a lower housing member that house the upper stamper, the workpiece, and the lower stamper in that order. A conveyance molding unit that includes a deaeration part that depressurizes the inside of the accommodation space formed by joining the upper accommodation member and the lower accommodation member, and that can be conveyed while maintaining a reduced pressure state;
A plurality of heating platens are stacked in a vertical direction, the conveyance molding unit is sandwiched between the heating platens, and heated and pressurized with respect to the conveyance molding unit. A thermoforming section for simultaneously thermoforming the workpiece;
A plurality of cooling disk parts are stacked in the vertical direction, the conveyance molding unit is sandwiched between the cooling disk parts, and the conveyance molding unit is cooled and pressurized to be in the plurality of conveyance molding units. A cooling section for simultaneously cooling the workpiece;
A chuck unit for gripping the transport molding unit, and a transport device for mounting and transporting the transport molding unit at a predetermined position between the heating panel units or between the cooling panel units. And
The thermal transfer molding device, wherein the transport device transports the transport molding unit in the order of arrangement of the heating molding unit and the cooling unit in the forward direction. An unloading unit disposed on the front side of the thermoforming unit, depressurizing the housing space through the deaeration unit, placing the transfer molding unit at a standby position, and unloading the transfer molding unit toward the thermoforming unit; ,
A carry-in unit that is disposed on the rear side of the cooling unit and receives the transfer molding unit carried in from the cooling unit and separates the transfer molding unit;
The thermal transfer molding apparatus according to claim 1, wherein the transport device transports the transport molding unit in the order of the carry-out unit, the heating molding unit, the cooling unit, and the carry-in unit.   The thermal transfer molding apparatus according to claim 2, further comprising a return device that returns the upper accommodation member and the lower accommodation member from the carry-in portion to the carry-out portion.   4. The thermal transfer molding apparatus according to claim 2, wherein the transport molding unit is movable in a left-right direction orthogonal to a forward direction in the carry-out unit and the carry-in unit.   The said carrying-out part and the said carrying-in part can mount two or more said conveyance molding units in the orthogonal | vertical direction according to arrangement | positioning of the said heating board part in the said thermoforming part, and the said cooling board in the said cooling part. The thermal transfer molding apparatus described. The chuck portion has a length that enables the conveyance molding units placed on the carry-out portion, the heat forming portion, and the cooling portion to be collectively held,
The transport device collectively transports and mounts the transport molding units placed on the carry-out unit, the heating molding unit, and the cooling unit to the heating molding unit, the cooling unit, and the carry-in unit. The thermal transfer molding apparatus according to claim 2, wherein the thermal transfer molding apparatus is placed.   The thermal transfer molding according to any one of claims 1 to 6, wherein both the conveyance molding unit carried into the heating molding unit and the conveyance molding unit carried into the cooling unit are decompressed through the deaeration unit. apparatus.   8. The transfer molding unit according to claim 1, wherein after the cooling and forming unit finishes cooling in the cooling unit, the conveying and forming unit is supplied with air through the deaeration unit to pressurize the housing space. Thermal transfer molding equipment. A workpiece, an upper stamper and a lower stamper that are in close contact with the upper and lower surfaces of the workpiece, an upper housing member and a lower housing member that house the upper stamper, the workpiece, and the lower stamper in that order. A conveyance molding unit that includes a deaeration part that depressurizes the inside of the accommodation space formed by joining the upper accommodation member and the lower accommodation member, and that can be conveyed while maintaining a reduced pressure state;
A plurality of heating platens are stacked in a vertical direction, the conveyance molding unit is sandwiched between the heating platens, and heated and pressurized with respect to the conveyance molding unit. A thermoforming section for simultaneously thermoforming the workpiece;
A plurality of cooling disk parts are stacked in the vertical direction, the conveyance molding unit is sandwiched between the cooling disk parts, and the conveyance molding unit is cooled and pressurized to be in the plurality of conveyance molding units. A cooling section for simultaneously cooling the workpiece;
A chuck unit for gripping the transport molding unit, and a transporting device for mounting and transporting the transport molding unit at a predetermined position between the heating panel units or between the cooling panel units. A thermal transfer molding method using a molding apparatus,
In any of the thermoforming part and the cooling part, the pressure in the chamber space is reduced through the deaeration part,
That the workpiece formed in the conveyance molding unit is molded by the conveyance molding unit being conveyed by the conveyance device in the order of arrangement of the heating molding unit and the cooling unit in the forward direction. A thermal transfer molding method characterized. An unloading unit disposed on the front side of the thermoforming unit, depressurizing the housing space through the deaeration unit, placing the transfer molding unit at a standby position, and unloading the transfer molding unit toward the thermoforming unit; ,
A carry-in unit that is disposed on the rear side of the cooling unit and receives the transfer molding unit carried in from the cooling unit and separates the transfer molding unit;
The thermal transfer molding method according to claim 9, wherein the transport molding unit is transported by the transport device in the order of the carry-out unit, the heating molding unit, the cooling unit, and the carry-in unit.   The thermal transfer molding method according to claim 10, further comprising a return device that returns the upper accommodation member and the lower accommodation member from the carry-in portion to the carry-out portion.   12. The transfer molding unit according to claim 9, wherein after the cooling and forming unit finishes cooling in the cooling unit, the transfer and forming unit is supplied with air through the deaeration unit to pressurize the housing space. Thermal transfer molding method.

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