JP7413096B2 - Manufacturing device for thin plate-like laminate having film-like resin layer - Google Patents

Description

The present invention relates to an apparatus for producing a thin plate-like laminate having a film-like resin layer.

Resin films have excellent mechanical properties such as moldability and corrosion resistance, and are lightweight, easy to process, and easily fused with other resin materials, so they are used as decorative materials, packaging materials, adhesive films, optical components, etc. , is used in an extremely wide range of applications.

For example, when manufacturing a thin plate-like laminate such as a semiconductor substrate, a film-like resin layer is laminated on the surface of the base material. In this thin plate-like laminate, a predetermined uneven shape is transferred to a resin layer on a thin plate-like base material, and by etching, an uneven structure corresponding to the uneven shape of the resin layer is formed on the surface of the base material (for example, (See Patent Document 1). In the transfer of the thin plate-like laminate to the resin layer, for example, as shown in FIG. By placing the mold 210 on the resin layer 222 side and applying pressure through the mold 210, an uneven shape 223 is formed on the resin layer 222. Note that the reference numeral 200 in the figure represents a pressurizing means such as a press device, and 201 represents a machine base of the pressurizing means 200.

Since such an uneven structure on the surface of the substrate exhibits a predetermined functionality, high precision is required. However, since the film-like resin layer of the thin plate-like laminate is extremely thin, it is difficult to stably form uneven shapes on the resin layer with high precision. In particular, when the surface of the substrate has minute irregularities, the quality of processing accuracy has a large effect on functionality, so there is a demand for improvement in processing accuracy.

JP2018-200931A

The present invention has been proposed in view of the above circumstances, and is a thin plate-shaped resin layer having a film-shaped resin layer that can stably form an uneven shape with high precision on a film-shaped resin layer laminated on a thin plate-shaped base material. Provides a laminate manufacturing device.

That is, the invention of claim 1 provides a thin plate in which a workpiece material in which a film-like resin composition is laminated on at least one side of a thin-plate-like base material is pressed by a mold to integrally form a film-like resin layer on the base material. A manufacturing apparatus for obtaining a shaped laminate , wherein the molds are arranged on both sides of the workpiece to sandwich the workpiece and are held by a mold holding structure, includes a setting unit having a setting device for creating the mold holding structure that holds the mold holding the workpiece, and heating the mold to the heat distortion temperature of the film-like resin composition. A heating section having a heating device and a mold holding structure after the mold has been heated are introduced between two pressure rolls, and the rotation of the pressure rolls pinches the mold from the outer surface of the mold to form the film. a pressing section having a pressing roll device for integrally thermocompressing the resin composition and the base material to form a thin plate-like laminate having a film-like resin layer; and a mold holding structure after the pressing. a take-out part having a take-out device for removing the mold, and the mold holding structure is configured to be movable between the set part, the heating part, the pressurizing part, and the take-out part. The present invention relates to an apparatus for producing a thin plate-like laminate having a film-like resin layer.

A second aspect of the invention relates to the apparatus for manufacturing a thin plate-like laminate having a film-like resin layer according to the first aspect, wherein the heating device heats a mold holding the workpiece therebetween.

A third aspect of the invention relates to the apparatus for manufacturing a thin plate-like laminate having a film-like resin layer according to the first aspect, wherein the heating device heats a mold that does not sandwich the workpiece.

The invention according to claim 4 is characterized in that the mold holding structure is configured to be movable to the cooling unit, the mold holding structure comprising a cooling unit having a cooling device that cools the mold that has been clamped by the clamping roll device. The present invention relates to an apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of Items 1 to 3.

The invention according to claim 5 relates to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 4, wherein the setting device and the taking-out device are common devices.

The invention according to claim 6 is the film-like resin layer according to any one of claims 1 to 5, wherein the base material is a thin plate-like material with a thickness of 1 mm or less, and the thickness of the film-like resin composition is 500 μm or less. The present invention relates to an apparatus for producing a thin plate-like laminate.

The invention according to claim 7 provides an apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 6, wherein a film-like resin composition is laminated on both sides of the base material. Related.

The invention according to claim 8 has the film-like resin layer according to any one of claims 1 to 7, wherein a plurality of the workpieces are arranged and molds are arranged on both sides of each workpiece. It relates to a manufacturing device for thin plate-like laminates.

The invention according to claim 9 provides a thin plate having a film-like resin layer according to any one of claims 1 to 8, wherein the film-like resin composition is a decorative, adhesive, or conductive functional resin composition. The present invention relates to an apparatus for manufacturing a shaped laminate.

The invention according to claim 10 relates to an apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 9, wherein the mold surface of the mold has a finely uneven surface shape. .

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 1, a workpiece having a film-like resin composition laminated on at least one side of a thin plate-like base material is pressed by a mold. A manufacturing apparatus for obtaining a thin plate-like laminate in which a film-like resin layer is integrally formed on the base material, wherein the mold is disposed on both sides of the workpiece to sandwich the workpiece. The manufacturing apparatus also includes a setting section that includes a setting device that creates the mold holding structure that holds the mold holding the workpiece sandwiched therein; a heating section having a heating device that heats the film to the heat deformation temperature of the film-like resin composition; and a mold holding structure after the mold has been heated, which is introduced between two pressure rolls; Pressure having a pressure roll device that presses the film-like resin composition and the base material together by heat-pressing from the outer surface of the mold by rotation of the mold to form a thin plate-like laminate having a film-like resin layer. and a take-out part having a take-out device for removing the mold from the mold holding structure after the clamping, and the mold holding structure is connected to the setting part, the heating part, and the pressurizing part. Since it is configured to be movable between the part and the take-out part , pressure is applied uniformly to the mold, suppressing the occurrence of pressure unevenness, and removing the film-like material laminated on the thin plate-like base material. It is possible to stably form an uneven shape on the resin layer with high precision.

According to the apparatus for manufacturing a thin plate-like laminate having a film-like resin layer according to the invention of claim 2, in the invention of claim 1, since the heating device heats the mold holding the workpiece, the mold It is economically advantageous since excessive heating is not required.

According to the apparatus for manufacturing a thin plate-like laminate having a film-like resin layer according to the invention of claim 3, in the invention of claim 1, since the heating device heats a mold that does not sandwich the workpiece, It is possible to heat the material to a high temperature in a short time, thereby shortening the working time, and also suppresses oxidation of the film-like resin composition of the workpiece due to heating, thereby enabling high-quality molding.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention according to claim 4, in the invention according to claims 1 to 3, a cooling device for cooling the mold pressed by the pressing roll device Since the mold holding structure is configured to be movable to the cooling part , the shape of the uneven surface of the thin plate-like laminate can be stabilized.

According to the apparatus for manufacturing a thin plate-like laminate having a film-like resin layer according to the invention of claim 5, in the invention of claims 1 to 4, since the setting device and the taking-out device are common devices, The space of the apparatus can be saved, and the equipment used can be omitted, leading to cost reduction.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 6, in the invention of claims 1 to 5, the base material is a thin plate-like material having a thickness of 1 mm or less, and the film-like resin composition is Since the thickness of the product is 500 μm or less, a lightweight and precise product can be obtained.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 7, in the invention of claims 1 to 6, since the film-like resin composition is laminated on both sides of the base material, various It is possible to easily manufacture products with excellent functionality.

According to the apparatus for manufacturing a thin plate-like laminate having a film-like resin layer according to the invention of claim 8, in the invention of claims 1 to 7, a plurality of the workpieces are arranged, and gold is provided on both sides of each of the workpieces. Since the molds are arranged, it is possible to simultaneously mold a plurality of thin plate-like laminates of the same type or different types, thereby improving work efficiency and production efficiency.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 9, in the invention of claims 1 to 8, the film-like resin composition has decorative, adhesive, or conductive functionality. Since it is made of a resin composition, it is possible to provide a product that can be used for an extremely wide range of purposes.

According to the apparatus for producing a thin plate-like laminate having a film-like resin layer according to the invention of claim 10, in the invention of claims 1 to 9, since the mold surface of the mold has a finely uneven surface shape, the film A fine uneven shape can be formed stably with high precision in a shaped resin layer.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram of the whole manufacturing apparatus of the thin plate-like laminate based on one Example of this invention. FIG. 2 is a schematic cross-sectional view of a thin plate-like laminate. FIG. 2 is a schematic cross-sectional view showing a molded state of a workpiece. It is a perspective view of a mold holding structure. FIG. 7 is a schematic plan view showing variations of the mold holding structure. FIG. 3 is a schematic side view of the pressurizing section. FIG. 3 is a schematic side view of the pressurizing part during processing. FIG. 2 is a first schematic diagram showing a combination of arrangement of each part of the apparatus for manufacturing a thin plate-like laminate. FIG. 2 is a second schematic diagram showing a combination of arrangement of each part of the apparatus for manufacturing a thin plate-like laminate. It is a schematic diagram of a mold holding structure creation process. FIG. 3 is a first schematic diagram showing a process of compressing a workpiece. FIG. 2 is a second schematic diagram showing a process of compressing a workpiece. FIG. 3 is a first schematic cross-sectional view showing variations in the relationship between the laminated structure of the workpiece and the mold. FIG. 7 is a second schematic cross-sectional view showing variations in the relationship between the laminated structure of the workpiece and the mold. FIG. 7 is a third schematic cross-sectional view showing variations in the relationship between the laminated structure of the workpiece and the mold. It is a schematic sectional view showing the processing process of the conventional thin plate-like laminate.

An apparatus 10 for producing a thin plate-like laminate according to an embodiment of the present invention shown in FIG. ) is pressed by a mold (110) to obtain a thin plate-like laminate (80) in which a film-like resin layer (82) is integrally formed on a base material (81). This manufacturing apparatus 10 includes a setting section 30 having a setting device 31, a heating section 40 having a heating device 41, a pressing section 50 having a pinch roll device 51, and a take-out section 60 having a take-out device 61. .

The illustrated manufacturing apparatus 10 includes a machine stand 11 that connects a setting section 30 , a heating section 40 , a pressurizing section 50 , and a take-out section 60 via a rail section 20 . The rail section 20 has a rail main body 21 consisting of a pair of rod-shaped members disposed between a set section 30, a heating section 40, a pressure section 50, and a take-out section 60. The section 50 and the take-out section 60 are connected in series. A mold holding structure 100 is installed on the rail main body 21 so as to be movable between the setting section 30 , the heating section 40 , the pressurizing section 50 , and the taking-out section 60 . Reference numeral 12 in the figure is a leg portion of the machine base 11 that supports the rail portion 20.

As shown in FIG. 2, the thin plate-like laminate 80 is a laminate in which a film-like resin layer 82 is laminated on at least one surface of a thin-plate base material 81, and a predetermined uneven shape 83 is formed on the film-like resin layer 82. have 2(a) shows a thin plate-like laminate 80A in which a film-like resin layer 82 is formed on one side of a thin-plate-like base material 81, and FIG. 2(b) shows a film-like resin layer 82 formed on both sides of a thin-plate-like base material 81. This is a thin plate-like laminate 80B on which a layer 82 is formed. By forming a predetermined uneven shape 83 on the surface of the thin plate-like laminate 80, it can be used as a semiconductor substrate, an optical member such as an optical lens or an optical film, a separator for a fuel cell, a wearable electrode, a sensor, an electrostatic adsorbent, It is manufactured into various products such as resistance heating elements, electromagnetic shielding materials, connectors, solar cell members, and separators for water electrolysis equipment.

As shown in FIG. 3, this thin plate-like laminate 80 is produced by forming a film into a workpiece 85 in which a film-like resin composition 84 is laminated on at least one surface of a thin plate-like base material 81 using a predetermined mold 110. It is obtained by forming a predetermined uneven shape 83 on the surface of a resin composition 84. In the thin plate-like laminate 80, the shape, thickness, etc. of the thin plate-like base material 81 and the film-like resin composition 84 are determined depending on the type of the intended product. The thickness of the film-like resin composition 84 is 500 μm or less when the thickness is 1 mm or less, and more preferably the thickness of the thin plate-like base material 81 is 100 μm or less and the thickness of the film-like resin composition 84 is 50 to 150 μm. By setting the thin plate-like base material 81 and the film-like resin composition 84 to the above-mentioned thicknesses, a lightweight and precise product can be obtained. In particular, when imparting a conductive function to be described later, appropriate conductivity can be provided.

The thin plate base material 81 is a thin plate member made of a material having corrosion resistance and heat resistance, such as titanium, aluminum, and stainless steel (SUS).

The film-like resin composition 84 is laminated on one or both surfaces of the thin plate-like base material 81, and a predetermined uneven shape 83 is formed on the surface to form a film-like resin layer 82. The shape, size, etc. of the uneven shape 83 of the film-like resin layer 82 are determined depending on the use of the thin plate-like laminate 80, etc., but it is also possible to form fine unevenness. The fine irregularities include, for example, a groove depth (H) of 50 to 300 μm, a groove top width (W1) of 50 to 400 μm, and a groove inner width (W2) of 100 to 400 μm.

Examples of materials constituting the film-like resin composition 84 include ethylene homopolymer, propylene homopolymer (homopolypropylene), ethylene and propylene, 1-butene, 1-pentene, 1-hexene, and 4-methyl-1. -Random copolymers with one or more α-olefins such as pentene, block copolymers with the above compositions, and the like. Furthermore, there are polyolefin resins such as mixtures of the aforementioned polymers, polyolefin elastomers, acid-modified polypropylene, acid-modified polyethylene, ethylene-vinyl alcohol copolymer resins, and hydrocarbon-based resins. Examples include fluororesin and fluororubber. Further, at least one conductive material such as a carbon material or a conductive ceramic may be added to these materials. Examples of the carbon material include carbon nanotubes, granular graphite, and carbon fibers.

The film-like resin composition 84 is configured as a decorative, adhesive, or conductive functional resin composition depending on the product to be manufactured. The decorative functional resin composition is a resin layer that has been subjected to surface treatments such as graining (wrinkle pattern), embossing (embossed pattern), and reflective treatment (matte finish) on fine irregularities. The adhesive functional resin composition is a resin layer with high adhesive strength made of polyethylene resin or the like. The conductive functional resin composition is a resin layer in which a carbon material is added to a resin material and can conduct electricity. By including these functional resin compositions, the thin plate-like laminate 80 can be used for an extremely wide range of purposes.

The mold 110 is a member disposed on both sides of the base material 81 of the workpiece 85 to sandwich the workpiece 85, and includes a lower mold 120 on which the workpiece 85 is placed, and a lower mold 120 on which the workpiece 85 is placed. It has an upper mold 125 disposed on the upper surface side of the mold. In this mold 110, predetermined uneven surface shapes 122, 127 are formed on mold surfaces 121, 126 of either or both of the lower mold 120 and the upper mold 125. In the illustrated example, uneven surface shapes 122 and 127 are formed on both mold surfaces 121 and 126. By making the uneven surface shape 122 (127) of the mold surface 121 (126) particularly fine, the fine uneven surface shape can be stably formed in the film-like resin layer with high precision. The uneven surface shapes 122 and 127 of the lower mold 120 and the upper mold 125 may be the same or different shapes. Further, as shown in FIG. 3(a), a molded workpiece (thin plate-like laminate 80) may be placed between the mold surfaces 121, 126 of the mold 110 and the workpiece 85 as needed. An interleaf paper (release paper) 115 may be interposed to facilitate release of the mold. Note that the interleaving paper is omitted in FIG. 3(b).

The mold 110 is configured to be movable between the setting section 30 , the heating section 40 , the pressurizing section 50 , and the ejecting section 60 by the mold holding structure 100 . The mold holding structure 100 is not particularly limited as long as the mold 110 can move each part 30, 40, 50, 60 while holding the workpiece 85 therebetween. For example, an appropriate structure such as a structure having a clip member or the like for holding the lower mold 120 and the upper mold 125 may be used.

A mold holding structure 100 shown in FIG. 4 is an example of a frame structure that holds a mold 110 that holds a workpiece 85, and includes a set part 30, a heating part 40, a pressure part 50, to move between the take-out parts 60. This mold holding structure 100 includes a holding main body 101 that has a lower opening 104 and is slidable when placed on a rail main body 21, and a pair of mold holding parts 105 that hold a lower mold 120 of a mold 110. , 105. In addition, in the mold 110 held by the mold holding structure 100, the lower mold 120 is provided with bonding convex portions 123 at multiple locations, and the upper mold 125 is provided with bonding convex portions 123 corresponding to the bonding convex portions 123 of the lower die 120. A plurality of joining holes 128 are provided, and each joining convex part 123 of the lower mold 120 and each joining hole 128 of the upper mold 125 engage with each other, so that the upper mold 125 is moved relative to the lower mold 120. Overlaid in the appropriate position.

FIG. 5 is a schematic plan view showing variations of the mold holding structure 100 and the mold 110. FIG. 5A shows an example of a mold holding structure 100A that holds a mold 110A for processing a single workpiece 85. The mold holding structure 100A includes a pair of side edges 102, 102 that are slidably placed on the rail body 21, and edge portions 103, 103 that are installed at both ends of each side edge 102, 102, respectively. It has a frame-shaped holding body 101A consisting of a frame-shaped holding body 101A, and a pair of mold holding parts 105A, 105A installed between each end edge part 103, 103. The mold 120) is fixed by a fixing member (not shown) such as a screw member.

FIG. 5(b) is an example of a mold holding structure 100B that holds a mold 110B for processing a plurality of workpieces 85 with the same mold surface. In the mold holding structure 100B, a mold 110B having a rectangular shape in plan view is disposed between each edge portion 103, 103 of the holding main body 101A, and each edge portion 103, 103 is used as a mold holding portion 105, 105. It is fixed by a fixing member (not shown) such as a screw member.

FIG. 5(c) is an example of a mold holding structure 100C that holds a mold 110C for processing a relatively large workpiece 85. In the mold holding structure 100C, a mold 110C corresponding to the size of the entire lower opening 104 is arranged in the lower opening 104 of the holding main body 101A, and is attached to each side edge 102, 102 and each end of the holding main body 101A. The edges 103, 103 are fixed as mold holding parts 105, 105, 105, 105 by fixing members (not shown) such as screw members.

The frame structure of the mold holding structure is not limited to the structures 100A to 100C described above, and can be any suitable structure depending on the number and size of the workpieces 85, the shape of the mold, etc. For example, a structure in which a mold holding part of a mold holding structure is provided with a recess that can be fitted with a mold so that the mold can be held in a predetermined position, a structure in which an appropriate mold positioning member is provided, etc. . Alternatively, a moving device capable of moving on the rail main body 21 may be separately prepared, and the mold holding structure may be installed in the moving device so as to be movable.

The setting unit 30 includes a setting device 31 that creates a mold holding structure 100 in which a mold 110 is set. As the setting device 31, a known conveying means such as a robot arm capable of appropriately setting the holding body 101, the mold 110, and the workpiece 85 is preferably used. In the setting device 31 of the embodiment, the holding body 101, the mold 110, and the workpiece 85 are transported between the workbench and the rail section 20, and the mold holding structure 100 is created.

The heating unit 40 includes a heating device 41 that heats the mold 110 to the heat deformation temperature of the film-like resin composition 84. The heating device 41 is not particularly limited as long as it can heat the mold 110 efficiently. The heating device 41 of the embodiment has hot plates 42 and 43 that are arranged above and below the rail body 21 and can be moved up and down, and a mold 110 is held between the upper hot plate 42 and the lower hot plate 43. configured to heat.

The heat deformation temperature is a temperature sufficient to thermally deform the film-like resin composition 84 of the workpiece 85 held between the molds 110 and process it appropriately, and is The settings will be set accordingly. For example, the mold 110 is heated to a temperature that is 50° C. or more higher than the melting point of the film-like resin composition 84. The upper limit is not particularly limited, but excessive heating may cause the film-like resin composition 84 of the workpiece 85 to react with oxygen in the atmosphere and oxidize, causing deterioration. The temperature may be any temperature that does not easily cause oxidative deterioration due to heat.

Heating of the mold 110 by the heating device 41 may be performed on the mold 110 with the workpiece 85 sandwiched therebetween, or on the mold 110 with the workpiece 85 not sandwiched therebetween. You can. When the mold 110 holding the workpiece 85 is heated, excessive heating of the mold 110 is unnecessary, which is economically advantageous. In addition, when heating the mold 110 that does not hold the workpiece 85, only the mold 110 is heated, so it can be heated to a high temperature in a short time, reducing work time. The oxidation of the film-like resin composition 84 of the workpiece 85 due to heating is suppressed, and high-quality molding becomes possible.

As shown in FIGS. 6 and 7, the pressing section 50 includes a pressing roll device 51 that presses the heated mold 110 from the outside to form a thin plate-like laminate 80. The pressure roll device 51 includes a lower pressure roll 52 rotatably disposed at a position in contact with the lower surface side of the mold 111 and a mold holding structure 100 located directly above the lower pressure roll 52. It has an upper pressure roll 54 which is rotatably arranged above the upper pressure roll 54, and a pressure part elevating means 56 which is composed of a pressure cylinder device or the like that raises and lowers the upper pressure roll 54. Further, although not shown, the pressure roll device 51 includes temperature control means for adjusting the temperature of either or both of the lower pressure roll 52 and the upper pressure roll 54. In the figure, reference numeral 53 is a lower rotation drive device that rotationally drives the lower pressure roll 52, 55 is an upper rotation drive device that rotationally drives the upper pressure roll 54, and 57 is a rod portion of the pressure section lifting means 56. be.

In this pressure roll device 51, as shown in FIG. 7, after the mold 110 has been heated, the mold holding structure 100 is introduced between two pressure rolls, and the rotation of the pressure rolls causes the outer surface of the mold 110 to be Then, the film-like resin composition 84 and the base material 81 are bonded together by thermocompression, thereby forming a thin plate-like laminate 80 having a film-like resin layer 82 . The pinching roll device 51 of the embodiment has a drive control device (not shown) that controls the rotation of the lower pressure roll 52 and the upper pressure roll 54, and when the mold 111 is pinched, two pressures are applied. The rotation of the rolls 52 and 54 and the rocking motion of the mold holding structure 100 are controlled to be synchronized.

The take-out section 60 includes a take-out device 61 that takes out the mold 110 and the workpiece 85 from the mold holding structure 100 after being squeezed. The take-out device 61 preferably uses a known conveying means such as a robot arm, and carries the mold holding structure 100 and the mold between the work table on which the mold after processing is placed and the rail part 20. 110, the workpiece 85 is transported, and the mold 110 and the workpiece 85 are taken out from the mold holding structure 100.

In the thin plate-like laminate manufacturing apparatus 10 of the present invention, a cooling section 70 is arranged as necessary. The cooling unit 70 includes a cooling device 71 that cools the mold 110 that has been pressed by the pressing roll device 51. The cooling device 71 is not particularly limited as long as it can cool the thin plate-like laminate 80 via the mold 110. For example, the cooling device 71 shown in FIG. 1 has cooling plates 72 and 73 that are disposed above and below the rail body 21 and can be raised and lowered, and the upper cooling plate 72 and the lower cooling plate 73 form a mold holding structure. It is configured to sandwich and cool the mold 110 held by the body 100. By cooling the mold after being compressed in the cooling unit 70, the shape of the uneven surface of the thin plate-like laminate 80 can be stabilized.

Here, combinations of arrangement of the setting section 30, heating section 40, pressurizing section 50, take-out section 60, and cooling section 70 in the thin plate-like laminate manufacturing apparatus 10 of the present invention will be explained. FIG. 8 shows a thin plate-like laminate in which the workpiece is held between the molds in the setting section 30 to create a mold holding structure, and then the mold holding the workpiece is heated in the heating section 40. Represents variations (10A to 10D) of manufacturing equipment. Further, FIG. 9 shows a thin plate in which a mold without a workpiece held therein is heated in the heating section 40, and then the workpiece is held between the molds in the setting section 30 to create a mold holding structure. Variations (10E to 10H) of the manufacturing apparatus for the shaped laminate are shown.

An apparatus 10A for manufacturing a thin plate-like laminate shown in FIG. 8A is an example in which a setting section 30, a heating section 40, a pressurizing section 50, and a take-out section 60 are arranged in series on a rail section 20. In this thin plate-shaped laminate manufacturing apparatus 10A, the workpiece is transported from the downstream side of the rail section 20 (the setting section 30 side) and processed, and the processed thin plate-shaped laminate is transported from the upstream side of the rail section 20 (taken out). 60 side). Therefore, it becomes possible to incorporate the device 10A into the line process of a manufacturing line for various products using thin plate-like laminates, and the thin plate-like laminates taken out by the take-out section 60 are continuously transferred to other processing steps. be able to.

The apparatus 10B for manufacturing a thin plate-like laminate shown in FIG. This is an example in which the section 50, the cooling section 70, and the take-out section 60 are arranged in series in this order. In this thin plate-like laminate manufacturing apparatus 10B, the shape of the uneven surface of the thin plate-like laminate can be stabilized by the cooling unit 70, and it can be incorporated into the line process of the manufacturing line in the same manner as the manufacturing apparatus 10A. .

An apparatus 10C for manufacturing a thin plate-like laminate shown in FIG. This is an example in which a setting section 30, which also serves as a heating section 60, a heating section 40, a pressurizing section 50, and a cooling section 70 are arranged in series in this order. In this apparatus 10C for manufacturing thin plate-like laminates, the setting section 30 and the take-out section 60 are commonly configured, so that the manufacturing apparatus 10C can save space and the equipment used can be omitted. Cost reduction can be achieved. In addition, the workpiece transported from the setting section 30 is processed in the pressurizing section 50 and then returned to the setting section 30 (which also serves as the take-out section 60) and taken out, which reduces the number of man-hours during batch work. This makes it possible to improve work efficiency.

An apparatus 10D for manufacturing a thin plate-like laminate shown in FIG. This is an example in which a setting section 30 which also serves as a cooling section 60, a cooling section 70, a heating section 40, and a pressurizing section 50 are arranged in series in this order. In this thin plate-like laminate manufacturing apparatus 10D, since the pressurizing section 50 is disposed at the outermost part of the manufacturing apparatus 10D, maintenance work such as preparation of the pressure roll device of the pressurizing section 50 is facilitated. Further, similarly to the manufacturing apparatus 10C, it is possible to reduce costs by saving space and to improve work efficiency during batch work.

The thin plate-like laminate manufacturing apparatus 10E shown in FIG. 9(a) is an example in which a heating section 40, a setting section 30, a pressurizing section 50, and a take-out section 60 are arranged in series in the order of the rail section 20. . That is, the thin plate-like laminate manufacturing apparatus 10E is configured by replacing the setting section 30 and the heating section 40 with respect to the thin plate-like laminate manufacturing apparatus 10A. Therefore, the workpiece is processed while being conveyed from the downstream side (heating section 40 side) to the upstream side (takeout section 60 side) of rail section 20. Therefore, like the thin plate laminate manufacturing apparatus 10A, it can be incorporated into a line process of a production line for various products, and the manufactured thin plate laminate can be continuously transferred to other processing steps.

The thin plate-like laminate manufacturing apparatus 10F shown in FIG. In this example, the heating section 40, the setting section 30, the pressurizing section 50, the cooling section 70, and the take-out section 60 are arranged in series in this order. In this thin plate-like laminate manufacturing apparatus 10F, as in the thin plate-like laminate manufacturing apparatus 10B, the cooling unit 70 stabilizes the shape of the uneven surface of the thin plate-like laminate and is incorporated into the line process of the manufacturing line. be able to.

The apparatus 10G for manufacturing a thin plate-like laminate shown in FIG. In this example, a heating section 40, a setting section 30 which also serves as a take-out section 60, a pressurizing section 50, and a cooling section 70 are arranged in series in this order. Similar to the thin plate laminate manufacturing apparatus 10C, this thin plate laminate manufacturing apparatus 10G saves space, reduces costs by omitting the equipment used, and reduces man-hours during batch work. It is possible to improve efficiency.

The apparatus 10H for manufacturing a thin plate-like laminate shown in FIG. 9(d) includes a heating section 40, a setting section 30 that also serves as a take-out section 60, a cooling section 70, and a pressurizing section 50 arranged in series in this order on a rail section 20. This is an example. In this thin plate-like laminate manufacturing apparatus 10H, maintenance work such as preparation of the pressure roll device of the pressure section 50 is facilitated. Further, similarly to the manufacturing apparatus 10G, it is possible to reduce costs by saving space and improve work efficiency during batch work.

Next, a method for manufacturing the thin plate-like laminate 80 using the manufacturing apparatus 10 of the present invention will be described. The method for manufacturing the thin plate-like laminate 80 includes placing molds 110 on both sides of a workpiece 85 on which a film-like resin composition 84 is laminated on at least one surface of a base material 81, and sandwiching the film from the outside surface of the mold 110. This is a method of integrally forming a base material 81 and a film-like resin composition 84 by pressing, and includes a mold holding structure creation step, a pressing step, and a take-out step.

The mold holding structure creation process is a process of creating a mold holding structure in which molds 110 heated to the heat distortion temperature of the film-like resin composition 84 are arranged on both sides of the workpiece 85. This mold holding structure creation process is configured such that, for example, as shown in FIG. 10A, after a setting process is performed in a setting part 30, a heating process is performed in a heating part 40.

In the setting process shown in FIG. 10A, a mold holding structure 100 in which molds 110 are arranged on both surfaces of a workpiece 85 is created in a setting section 30 using a setting device 31 (not shown). step (pre-heating setting step). In this setting process, a setting device 31 such as a robot arm transports the mold holding structure 100 onto the rail body 21 of the rail section 20, and moves the lower mold 120 and upper mold 125 of the mold 110 to the mold holding structure. Processes such as transporting and holding the workpiece 85 to the body 100 and transporting the workpiece 85 to a mold are performed. In the embodiment, the lower mold 120 of the mold 110 is held in the holding body 101 of the mold holding structure 100 in advance, and after the workpiece 85 is placed on the lower mold 120, the mold holding body 101 holding the lower mold 120 is held. A setting process is performed in which the structure 100 is transported onto the rail body 21 and the upper mold 125 is superimposed on the lower mold 120.

In the heating step shown in FIG. 10A, the entire mold 110 is heated to the heat distortion temperature of the film-like resin composition 84 after the mold holding structure 100 is created using the heating device 41 in the heating section 40. step (post-setting heating step). In this heating step, the lower mold 120 and the upper mold 125 of the mold 110 are heated by the heating device 41 for the mold holding structure 100 that has been moved from the setting section 30 to the heating section 40, and the lower mold 120 and the upper mold 125 of the mold 110 are heated. A process of heating the sandwiched workpiece 85 to a thermal deformation temperature is performed. Thereby, the workpiece 85 can be processed appropriately in the pressurizing process described later. In the embodiment, a process of heating the mold 110 held by the mold holding structure 100 on the rail body 21 by sandwiching the mold 110 between the hot plates 42 and 43 by raising and lowering the upper and lower hot plates 42 and 43 of the heating device 41, respectively. will be held. Note that the heating temperature is determined depending on the material of the film-like resin composition of the workpiece.

As described above, in the mold holding structure creation step in which the mold 110 is heated after the workpiece 85 is sandwiched between the molds 110 and the mold holding structure 100 is set, excessive heating of the mold 110 is avoided. is not necessary and is economically advantageous.

In addition, in the mold holding structure creation process, instead of performing the heating process after the setting process, as shown in FIG. 10(b), after the heating process is performed in the heating unit 40, It may be configured to perform a setting process.

The heating step shown in FIG. 10(b) is a step (pre-setting heating step) in which the mold is heated to the heat deformation temperature of the film-like resin composition 84 using the heating device 41 in the heating section 40. In this heating step, the lower mold 120 and upper mold 125 of the mold 110 are heated by the heating device 41 on the mold 110 held by the holding body 101 and without the workpiece 85 sandwiched therebetween. . Thereby, the mold 110 can be heated to a high temperature in a short time, and oxidation of the film-like resin composition 84 of the workpiece 85 due to heating is suppressed, making it possible to perform high-quality molding.

In the setting process shown in FIG. 10(b), a workpiece 85 is held between heated molds 110 using a setting device 31 (not shown) in a setting section 30 to create a mold holding structure 100. This is a step (setting step after heating). In this setting process, the upper die 125 of the mold 110 held by the holding body 101 is once removed by the setting device 31 such as a robot arm, the workpiece 85 is placed on the lower die 120, and then the upper die 125 is removed. A setting process is performed to overlap the lower mold 120.

As described above, in the mold holding structure creation process in which the mold 110 is heated and then the workpiece 85 is held between the mold 110 and the mold holding structure 100 is set, only the mold 110 is heated. , it is possible to heat to a high temperature in a short time, shortening the working time, and oxidation of the film-like resin composition 84 of the workpiece 85 due to heating is suppressed, making it possible to perform high-quality molding. .

In the pressurizing process, as shown in FIGS. 6, 7, 11, and 12, in the pressurizing section 50, the mold holding structure 100 in which the heated mold 110 is placed is moved by two pressurizers of the pinch roll device 51. A thin plate having a film-like resin layer 82 is obtained by introducing the film-like resin composition between the pressure rolls 52 and 54 and pressing it from the outside surface of the mold 111 by rotation of the pressure rolls 52 and 54 to heat-press the film-like resin composition and the base material together. This is a step of forming a shaped laminate 80. In the pressurizing process, the mold 111 is heated while the mold holding structure 100 is moved from the setting part 30 or the heating part 40 to the pressing part 50 after the mold holding structure 100 is heated. A process of roll pressing the entire workpiece 85 held between the two is performed.

In the embodiment, the mold 111 of the mold holding structure 100 that has been moved to the pressurizing section 50 is such that the upper end of the lower pressure roll 52 is connected to the lower surface of the mold 111, as shown in FIG. 11(a). Since they are located at the same height, the lower pressure roll 52 and the lower surface of the mold 111 are in contact (contact position P1). Next, the upper pressure roll 54 above the mold holding structure 100 is lowered by the pressure unit elevating means 56, and upper pressure is applied to the upper surface side of the heated mold 111 held in the mold holding structure 100. The roll 54 is brought into pressure contact, and the mold 111 is pinched by the two pressure rolls 52 and 54 (see FIG. 7). In the pinching by the two pressure rolls 52 and 54, as shown in FIG. It comes into contact with the mold 111 (P2) and presses it. Therefore, pressure forces from the two pressure rolls 52 and 54 act on the mold 111 between the contact position P1 with the lower pressure roll 52 and the contact position P2 with the upper pressure roll 54.

Here, in a conventional processing method such as transfer molding as shown in FIG. ) is applied with pressure. When applying pressure in a planar manner, the pressure is distributed so as to act on the entire mold 210, and furthermore, the pressing force does not necessarily act uniformly on the entire mold 210, and uneven pressure may occur. On the other hand, in the pinching by the two pressure rolls 52 and 54 shown in FIG. A (linear) pressing force acts. Therefore, compared to the conventional method that acts two-dimensionally (planarly), the pressure is concentrated and it is easier to apply a large pressing force. Since the pressure is limited, the pressurizing force acts relatively uniformly and the occurrence of pressure unevenness is suppressed.

Then, when the two pressure rolls 52 and 54 apply pressure, as shown in FIG. The mold holding structure 100 acts on at least the entire workpiece 85 held between the molds 111 of the mold holding structure 100 (between positions 86 and 86 at each end of the workpiece 85). is shaken. When the mold holding structure 100 is rocked, the two pressure rolls 52 and 54 are in a pinched state as the mold holding structure 100 is moved in one direction (for example, in the backward direction in FIG. 12(a)). The mold holding structure 100 is rotated in the same direction (for example, the lower pressure roll 52 in FIG. 12(a) is rotated counterclockwise and the upper pressure roll 54 is rotated in the clockwise direction), and the mold holding structure 100 is rotated in the other direction (for example, As the two pressure rolls 52 and 54 are moved in the same direction in a pinching state (for example, the lower pressure roll 52 in FIG. 12B is moved clockwise and the upper pressure roll The pressure roll 54 is rotated (counterclockwise).

At this time, a drive control device (not shown) for the pressurizing section 50 controls the rocking of the mold holding structure 100 and the rotational driving of each of the pressurizing rolls 52 and 54 to be performed in synchronization. That is, the timing of the movement of the mold holding structure 100 (swinging timing), the timing of the rotation of each pressure roll 52, 54, the movement direction (swinging direction) of the mold holding structure 100, and each pressure roll 52, Control is performed to match the rotational direction of the pressure rolls 54, the movement distance (oscillation range) of the mold holding structure 100, the rotation amount of each pressure roll 52, 54, and the like. Therefore, the mold holding structure 100 can move smoothly while maintaining a predetermined pressure on the mold 111 from the two pressure rolls 52 and 54. By rocking the mold holding structure 100 in a compressed state in this way, the pressure position (between P1 and P2) by the two pressure rolls 52 and 54 covers the entire surface of the mold 111. It is possible to pressurize the entire surface almost uniformly. Note that the mold holding structure 100 is rocked a necessary number of times, including once (one round trip), depending on the type of resin layer, the fineness of the uneven shape, the intended product, and the like. Further, the starting position and ending position of the pinching by the two pressure rolls 52 and 54 are appropriate depending on the size of the workpiece 85, the type of uneven shape, etc. When the swinging of the mold holding structure 100 is stopped, the pressurization is completed, the upper pressure roll 54 is raised, and the clamping state on the mold 111 is released.

In this pressurizing step, when the pressure roll device 51 is pinching, the temperature of either or both of the lower pressure roll 52 and the upper pressure roll 54 is controlled by temperature control means (not shown). It may be configured to adjust. Temperature control by the temperature control means may be appropriately performed by heating, cooling, keeping warm, etc. For example, when a large number of products are processed continuously, if there is a temperature difference between the mold 110 and the pressure rolls 52 and 54, the temperature of the mold 110 changes during clamping, making it impossible to process the products appropriately. It can be difficult. Therefore, in this temperature adjustment, the temperature of the mold 110 during clamping is adjusted by heating or keeping it warm when the temperature of the mold 110 is low, or cooling it when it is excessively high. It can be held properly.

The take-out process is a process in which the pressed mold 110 is taken out from the mold holding structure 100 using the take-out device 61 in the take-out section 60 . In this ejecting process, the mold holding structure 100 is moved from the pressurizing section 50 to the ejecting section 60 by an ejecting device 61 such as a robot arm to remove the mold holding structure 100 from the rail body 21 of the rail section 20. Processes such as transporting, removing the lower mold 120 and upper mold 125 of the mold 110 from the mold holding structure 100, and taking out the workpiece 85 from the mold 110 are performed. In the embodiment, the upper mold 125 of the mold 110 held by the mold holding structure 100 is removed from the lower mold 120, and the mold holding structure 100 holding the lower mold 120 is removed from the rail body 21 to a workbench or other place. The thin plate-like laminate 80 (processed workpiece material) placed on the lower mold 120 is taken out. The manufacturing method is completed by taking out the thin plate-like laminate 80 from the mold 110.

When performing the above-described extraction process, the thin plate-like laminate 80 immediately after processing is in a state where it is easily deformed by heating in the heating section 40. Therefore, before performing the removal process, the temperature of the thin plate-like laminate 80 is lowered to a level that will not cause unintended deformation. At this time, it is possible to slowly cool the thin plate-like laminate 80 by leaving it for a predetermined period of time without taking it out from the mold 110. It is preferable to do this.

The cooling process is a process in which the entire mold 110 after being squeezed and held by the mold holding structure 100 is cooled down using the cooling device 71 in the cooling unit 70 . In this cooling step, the lower mold 120 and the upper mold 125 of the mold 110 are cooled by the cooling device 71 for the mold holding structure 100 that has been moved from the pressurizing section 50 to the cooling section 70, and the lower mold 120 and the upper mold 125 of the mold 110 are cooled. Processing is performed to cool the processed thin plate-like laminate 80 sandwiched between the two to a temperature at which unintentional deformation will not occur. As a result, the shape of the uneven surface of the thin plate-like laminate 80 is stabilized, and molding of the thin plate-like laminate 80 in the mold 110 is completed. In the embodiment, the process involves raising and lowering the upper and lower cooling plates 72 and 73 of the cooling device 71, respectively, and cooling the mold 110 held by the mold holding structure 100 on the rail body 21 by sandwiching the mold 110 between the cooling plates 72 and 73. will be held. After performing the cooling process, the mold holding structure 100 is moved from the cooling section 70 to the take-out part 60, and the above-mentioned take-out process is performed. Note that the cooling temperature is 20° C. or more lower than the heat deformation temperature of the film-like resin composition 84.

Next, variations in the relationship between the laminated structure of the workpiece and its mold will be explained using FIGS. 13 to 15. FIG. 13(a) shows a workpiece 85A in which a film-like resin composition 84A is laminated on one surface side (the upper surface side in the example shown) of a base material 81, and a mold 112A for single-sided processing is placed on the workpiece 85A. This is an example of a mold structure 150A. The mold 112A includes a lower mold 120A having a smooth mold surface 121A, and an upper mold 125A having a mold surface 126A on which an uneven surface shape 127 is formed. In this mold structure 150A, a smooth lower mold 120A is brought into contact with the other side (lower surface side) of the base material 81 of the workpiece 85A, and the resin composition 84A is placed on one side (upper surface side) of the base material 81. The upper mold 125A on which the uneven surface shape 127 is formed is brought into contact with the resin composition 84A on one side (upper surface side) of the base material 81 to form the uneven shape only on the resin composition 84A.

FIG. 13(b) is an example of a mold structure 150B in which a mold 112A for single-sided processing is arranged on a workpiece 85B in which film-like resin compositions 84A and 84B are laminated on both sides of a base material 81. . In this mold structure 150B, the smooth lower mold 120A is brought into contact with the resin composition 84B on the other side (lower surface side) of the base material 81 of the workpiece 85A, and the resin composition 84B on one side (upper surface side) of the base material 81 An upper mold 125A having an uneven surface shape 127 is brought into contact with the composition 84A. Then, by using the lower mold 120A, the resin composition 84B on the other side (lower surface side) of the base material 81 can be made into a smooth resin layer, and an uneven shape can be formed only on the resin composition 84A on one side (upper surface side).

FIG. 13(c) is an example of a mold structure 150C in which a mold 112B for double-sided processing is arranged on a workpiece 85B in which film-like resin compositions 84A and 84B are laminated on both sides of a base material 81. . The mold 112B includes a lower mold 120B having a mold surface 121B on which an uneven surface shape 122 is formed, and an upper mold 125A having a mold surface 126A on which an uneven surface shape 127 is formed. In this mold structure 150C, the lower mold 120B in which the uneven surface shape 122 is formed is brought into contact with the resin composition 84B on the other side (lower surface side) of the base material 81, and ) The upper mold 125A having an uneven surface shape 127 is brought into contact with the resin composition 84A. The lower mold 120B and the upper mold 125A can form an uneven shape on the resin compositions 84B and 84A on both sides of the base material 81.

According to the mold structure 150A shown in FIG. 13(a), a single resin layer having an uneven shape can be appropriately formed on the base material 81. On the other hand, mold structures 150B and 150C shown in FIGS. 13(b) and 13(c) are suitable for processing a workpiece 85B in which film-like resin compositions 84A and 84B are laminated on both sides of a base material 81. This is an example. In the mold structure 150B, a resin layer having a predetermined functionality and having an uneven shape can be formed on one side of the base material 81, and a smooth resin layer such as an adhesive layer can be formed on the other side. Further, in the mold structure 150C, a resin layer having a predetermined functionality and having an uneven shape can be formed on both sides of the base material 81. In particular, in the mold structure 150C, by making the uneven shapes of the lower mold 120B and the upper mold 125A different, different patterns of uneven shapes can be formed on each surface of the base material 81. In this way, by laminating the resin compositions 84A and 84B on both sides of the base material 81, products with various functionalities can be easily manufactured.

FIGS. 14 and 15 are examples of mold structures 150D and 150E, respectively, which simultaneously process a plurality of (two in each figure) workpieces. In the mold structure 150D shown in FIG. A mold 112C capable of processing a plurality of workpieces is placed in relation to another workpiece 85D in which the shaped resin compositions 84A and 84B are laminated. The mold 112C includes a lower mold 120B having a mold surface 121B on which an uneven surface shape 122 is formed, an upper mold 125A having a mold surface 126A on which an uneven surface shape 127 is formed, and a mold with smooth surfaces on both sides. A medium size 130A having surfaces 131A and 136A is provided.

In this mold structure 150D, the lower mold 120B in which the uneven surface shape 122 is formed is brought into contact with the resin composition 84B on the other side (lower surface side) of the base material 81 of another workpiece 85D. An upper mold 125A having an uneven surface shape 127 is brought into contact with the resin composition 84A on one side (upper surface side) of the base material 81 of the workpiece 85C, and further the one workpiece 85C and the other workpiece are A medium die 130A is interposed between the workpiece 85D and the smooth upper mold surface 131A of the medium die 130A is brought into contact with the other side (lower surface side) of the base material 81 of one workpiece 85C. The smooth lower mold surface 136A of the medium mold 130A is brought into contact with the resin composition 84A on one side (upper surface side) of the base material 81 of another workpiece 85D. Then, for one workpiece 85C, an uneven shape is formed only on the resin composition 84A on one side (upper surface side) by the upper mold 125A, and for the other workpiece 85D, the lower mold 120A can form an uneven shape only on the resin composition 84B on the other side (lower surface side) of the base material 81, and form the resin composition 84A on one side (upper surface side) as a smooth resin layer.

In the mold structure 150E shown in FIG. 15, one workpiece 85E has film-like resin compositions 84A and 84B laminated on both sides of the base material 81, and film-like resin compositions 84A and 84B are laminated on both sides of the base material 81, respectively. A mold 112D capable of processing a plurality of workpieces is arranged with respect to another workpiece 85F in which the workpieces 84B are laminated. The mold 112D includes a lower mold 120B having a mold surface 121B on which an uneven surface shape 122 is formed, an upper mold 125A having a mold surface 126A on which an uneven surface shape 127 is formed, and an uneven surface shape 132 on both sides. A middle mold 130B having mold surfaces 131B and 136B on which 137 is formed is provided.

In this mold structure 150E, the lower mold 120B in which the uneven surface shape 122 is formed is brought into contact with the resin composition 84B on the other side (lower surface side) of the base material 81 of the other workpiece 85F. An upper die 125A having an uneven surface shape 127 is brought into contact with the resin composition 84A on one side (upper surface side) of the base material 81 of the workpiece 85E, and further the one workpiece 85E and the other workpiece are An upper mold in which a medium die 130B is interposed between the workpiece 85F and an uneven surface shape 132 on the upper side of the medium die 130B is formed on the other side (lower surface side) of the base material 81 of one workpiece 85E. The surface 131B is in contact with the resin composition 84A on one side (upper surface side) of the base material 81 of the other workpiece 85F, and the lower surface shape 137 on the lower side of the medium mold 130B is formed. The mold surface 136B is brought into contact. Then, for one workpiece 85E, an uneven shape is formed on the resin composition 84A on one side (upper surface side) by the upper mold 125A, and an uneven shape is formed on the resin composition 84A on the other side (lower surface side) by the upper mold surface 131B of the middle mold 130B. ), and for the other workpiece 85F, a lower mold 120B forms an uneven shape on the resin composition 84B on the other side (lower surface side) of the base material 81. An uneven shape can be formed in the resin composition 84A on one side (upper surface side) by the lower mold surface 136B of the middle mold 130B.

According to the mold structure 150D shown in FIG. 14, by interposing the medium mold 130A between different workpieces, it is possible to mold a plurality of different types of thin plate-like laminates. On the other hand, the mold structure 150E shown in FIG. 15 can mold a plurality of the same thin plate-like laminates by interposing the middle mold 130B between the same workpieces. In this way, by arranging multiple workpieces and arranging the upper, middle, and lower dies on both sides of each workpiece, multiple thin plate-like laminates of the same or different types can be simultaneously formed. This makes it possible to improve work efficiency and production efficiency. Note that the middle molds 130A and 130B of the mold structures 150D and 150E are constructed with the same mold surface on both sides, but they may have different shapes, such as one having a smooth mold surface and the other having an uneven mold surface. By configuring the mold surface, it is also possible to mold a plurality of different types of thin plate-like laminates. Further, the number of workpieces to be processed simultaneously is not particularly limited, but from the viewpoint of processing accuracy, etc., it is preferably about 2 to 3.

[Preparation of thin plate-like laminate]
Prototype examples were made under the following conditions for workpieces using carbon-coated stainless steel (SUS316L) as the base material and a mixture of polypropylene resin, carbon nanotubes (CNT), and graphite as the film-like resin composition. 1 to 3 thin plate-like laminates were produced.

[Prototype example 1]
A mold holding structure is created by sandwiching the above-mentioned workpiece between the molds in the setting section of the thin plate-like laminate manufacturing apparatus (work time: about 10 seconds), and then heated at a heating temperature of 200°C for a heating time in the heating section. Heating was carried out for 120 seconds, and after thermocompression bonding was performed using a pressure roll at a pressure of 40 kN in the pressure section, a pressure time of 20 seconds, and a temperature of 200°C during pressure, it was slowly cooled to form the thin plate shape of Prototype Example 1. A laminate was obtained.

[Prototype example 2]
A mold holding structure is created by sandwiching the above-mentioned workpiece between the molds in the setting section of the thin plate-like laminate manufacturing device (work time: about 10 seconds), and then heated at a heating temperature of 300°C for a heating time in the heating section. Heating was carried out for 30 seconds, and after thermo-compression bonding was performed using a pressure roll at a pressure of 40 kN and a pressure time of 20 seconds at a temperature of 200°C during pressure application, the thin plate shape of Prototype Example 2 was slowly cooled. A laminate was obtained.

[Prototype example 3]
The mold is heated at a heating temperature of 300°C and a heating time of 30 seconds in the heating section of the thin plate-like laminate manufacturing apparatus, and the workpiece is held between the heated molds in the setting section to form the mold. A holding structure was created (work time: about 10 seconds), and thermocompression was performed using a pressure roll at a pressure of 40 kN for 20 seconds at a temperature of 200°C during pressure application, followed by slow cooling. A thin plate-like laminate of Prototype Example 3 was obtained.

The quality of the molded state of the thin plate-like laminates of Prototype Examples 1 to 3 was visually evaluated. The evaluation criteria were: "〇 (good)" when the molded part (film-like resin layer) was in an acceptable state as a product, and "◎ (excellent)" when it was in a better state. The results are shown in Table 1.

[Results and discussion]
In Prototype Example 1, processing was performed by gently heating a mold holding a workpiece. In Prototype Example 2, processing was performed by heating a mold holding a workpiece at a higher temperature and for a shorter time than in Prototype Example 1. In Prototype Example 3, a mold that does not hold the workpiece is heated at a higher temperature and for a shorter time than in Prototype Example 1, and then the unheated workpiece is immediately held between the heated mold and processed. That's what I did. As a result, as shown in Table 1, the thin plate-like laminate of Prototype Example 2 could be molded with no problem as a product. On the other hand, in the thin plate-like laminates of Prototype Examples 1 and 3, the molded parts were in extremely good condition compared to Prototype Example 2.

As can be understood from the comparison between Prototype Example 1 and Prototype Example 2, when heating a mold holding a workpiece, it is better to heat slowly at a relatively low temperature than for a short time at a high temperature. I found that I was getting a quality product. This is because in Prototype Example 2, the workpiece is heated at a higher temperature together with the mold than in Prototype Example 1, so the film-like resin composition of the workpiece is more easily oxidized than in Prototype Example 1. This is thought to be because it becomes difficult to improve quality.

On the other hand, in Prototype Example 3, a high quality product was obtained as in Prototype Example 1, by heating the mold without sandwiching the workpiece and then sandwiching the workpiece. This is because in Prototype Example 3, the workpiece was not exposed to high temperatures when the mold was heated, so oxidation of the film-like resin composition of the workpiece was suppressed more than in Prototype Example 2, allowing for high-quality molding. It is thought that it became. Moreover, since the third prototype can heat the mold in a shorter time than the first example, the working time can be reduced compared to the first example.

As illustrated and explained above, the apparatus for manufacturing a thin plate-like laminate having a film-like resin layer of the present invention includes a set device for creating a mold holding structure in which molds are arranged on both surfaces of a workpiece; A heating device that heats the mold to the heat deformation temperature of the film-like resin composition and a mold holding structure after the mold has been heated are introduced between two pressure rolls, and the mold is removed by rotation of the pressure roll. A pressure roll device that heat-presses the film-like resin composition and the base material together by applying pressure from the outside to form a thin plate-like laminate having a film-like resin layer, and a mold holding structure after the pressure is applied. Since it has a take-out device for removing the mold, pressure is applied uniformly to the mold, suppressing the occurrence of pressure unevenness, and stably applying high precision to the film-like resin layer laminated on the thin plate-like base material. It is possible to form an uneven shape by doing this. In particular, fine uneven shapes can be stably formed with high accuracy on a film-like resin layer laminated on a thin plate-like base material.

The apparatus for producing a thin plate-like laminate having a film-like resin layer according to the present invention is not limited to the above-mentioned embodiments, and a part of the structure may be changed as appropriate without departing from the spirit of the invention. It can be implemented by For example, the arrangement combination of the setting section, heating section, pressurizing section, and take-out section is not limited to the above-described embodiments, and can be configured as appropriate depending on the purpose, installation location, etc.

In addition, in the above embodiment, the setting section, heating section, pressurizing section, and ejecting section are connected in series by a rail section provided on the machine base, and the mold holding structure is configured to be movable on the rail section. However, the mold holding structure may be moved by a known transfer device or the like without providing the rail portion.

Furthermore, regarding the process of creating a mold holding structure in the setting section and the heating section, in the above-mentioned embodiment, after creating the mold holding structure in which the mold holding the workpiece is placed, the mold is attached to the film. A process of heating to the heat distortion temperature of the film-like resin composition, or heating a mold that does not sandwich the workpiece to the heat distortion temperature of the film-like resin composition, and then sandwiching the workpiece between the heated molds. However, the present invention is not limited thereto. For example, a process in which a mold holding structure is created after heating a mold that is not held in a holding body and that holds a workpiece, or In the process of creating a mold holding structure by sandwiching the workpiece between the molds after heating the mold, the heated mold that holds the workpiece is finally placed in the setting section and the heating section. Any process in which a mold holding structure is created can be carried out using an appropriate procedure.

The thin plate-like laminate manufacturing apparatus of the present invention is capable of applying uniform pressure to a mold, and is capable of stably forming an uneven shape with high precision on a film-like resin layer laminated on a thin plate-like base material. can. Therefore, it is promising as an alternative to conventional manufacturing equipment for thin plate-like laminates.

10, 10A to 10H Thin laminate manufacturing device 11 Machine stand 12 Machine stand legs 20 Rail part 21 Rail body 30 Setting part 31 Setting device 40 Heating part 41 Heating device 42 Upper hot plate 43 Lower hot plate 50 Pressure part 51 Pressure roll device 52 Lower pressure roll 53 Lower rotation drive device 54 Upper pressure roll 55 Upper rotation drive device 56 Pressure part elevating means 57 Rod part 60 of pressure part elevating means Removal part 61 Removal device 70 Cooling section 71 Cooling device 72 Upper cooling plate 73 Lower cooling plate 80 Thin plate-like laminate 81 Thin-plate base material 82 Film-like resin layer 83 Uneven shape of film-like resin layer 84, 84A, 84B Film-like resin Composition 85, 85A, 85B, 85C, 85D, 85E, 85F Workpiece 86 End position of workpiece 100, 100A, 100B, 100C Mold holding structure 101 Holding body 102 Side edge 103 End edge 104 Lower opening 105 Mold holder 110, 110A, 110B, 110C Mold 111 Mold after heating 112A, 112B, 112C, 112D Mold 115 Interleaving paper 120, 120A, 120B Lower mold 121, 121A, 121B Lower mold Mold surface 122 Lower mold uneven surface shape 123 Joining convex portions 125, 125A Upper mold 126, 126A Upper mold mold surface 127 Upper mold uneven surface shape 128 Joining holes 130A, 130B Middle mold 131A, 131B Medium mold Upper mold surface 132 Upper uneven surface shape of the medium mold 136A, 136B Lower mold surface 137 of the medium mold Lower uneven surface shape of the medium mold 150A, 105B, 150C, 150D, 150E Mold structure H Uneven groove Depth P1 Contact position between the lower pressure roll and the mold P2 Contact position between the upper pressure roll and the mold W1 Uneven groove upper surface width W2 Uneven groove inner width

Claims (10)

A manufacturing device for obtaining a thin plate-like laminate in which a film-like resin layer is integrally formed on the base material by compressing a workpiece in which a film-like resin composition is laminated on at least one side of a thin-plate base material using a mold. And,
The mold is disposed on both sides of the workpiece to sandwich the workpiece, and is held by a mold holding structure,
The manufacturing device includes:
a setting unit that includes a setting device that creates the mold holding structure that holds the mold with the workpiece sandwiched therein ;
a heating section having a heating device that heats the mold to a heat deformation temperature of the film-like resin composition;
After the mold has been heated, the mold holding structure is introduced between two pressure rolls, and the pressure rolls rotate to pinch the mold from the outer surface of the mold to separate the film-like resin composition and the base material. a pressure unit having a pressure roll device for integrally thermocompressing and forming a thin plate-like laminate having a film-like resin layer;
a take-out part having a take-out device for removing the mold from the mold holding structure after the clamping,
The mold holding structure is configured to be movable between the setting section, the heating section, the pressurizing section, and the ejecting section.
An apparatus for producing a thin plate-like laminate having a film-like resin layer, characterized in that: The apparatus for manufacturing a thin plate-like laminate having a film-like resin layer according to claim 1, wherein the heating device heats a mold holding the workpiece therebetween. The apparatus for producing a thin plate-like laminate having a film-like resin layer according to claim 1, wherein the heating device heats a mold that does not sandwich the workpiece. Any one of claims 1 to 3 , further comprising a cooling unit having a cooling device that cools the mold that is compressed by the clamping roll device, and wherein the mold holding structure is configured to be movable to the cooling unit. An apparatus for producing a thin plate-like laminate having a film-like resin layer according to item 1. The apparatus for manufacturing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 4, wherein the setting device and the taking-out device are common devices. The thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 5, wherein the base material is a thin plate-like material with a thickness of 1 mm or less, and the thickness of the film-like resin composition is 500 μm or less. Manufacturing equipment. The apparatus for manufacturing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 6, wherein a film-like resin composition is laminated on both sides of the base material. The apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 7, wherein a plurality of said workpieces are arranged and molds are arranged on both sides of each of said workpieces. . The apparatus for producing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 8, wherein the film-like resin composition comprises a decorative, adhesive, or conductive functional resin composition. The apparatus for manufacturing a thin plate-like laminate having a film-like resin layer according to any one of claims 1 to 9, wherein the mold surface of the mold has a finely uneven surface shape.

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