JP3898473B2 - IC card manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC card manufacturing method suitable for use in manufacturing a thin non-contact IC card.
[0002]
[Prior art]
In general, an IC card incorporating an electronic component such as an IC chip is known. Since an IC card accommodates electronic components inside the card, it is necessary to manufacture the card surface so as not to cause unevenness due to the electronic components, and a manufacturing method and apparatus therefor are also disclosed in Japanese Patent Publication No. 2-16234. It has been proposed in Japanese Laid-Open Patent Publication Nos. 6-176214, 9-277766, and 11-48660.
[0003]
By the way, recently, a flexible thin non-contact IC card having a thickness of about several hundreds of micrometers has been put into practical use, and the present applicant is also suitable for manufacturing this type of thin non-contact IC card. An IC card manufacturing apparatus was proposed in Japanese Patent Application Laid-Open No. 2000-182014. This IC card manufacturing apparatus manufactures an IC card by thermocompression bonding a laminated base material in which an electronic component such as an IC chip is sandwiched between a pair of sheet fabric materials (laminate material). A laminated base material comprising a laminated base material sandwiching part comprising an upper sandwiched part and a lower sandwiched part to be sandwiched and sealed, and a deaeration part for degassing the inside of the laminated base material sandwiched part, and deaerated through the laminated base material An IC card is manufactured by sequentially processing the material sandwiching section by a preheating press section, a thermocompression pressing section, and a cooling press section.
[0004]
[Problems to be solved by the invention]
However, the IC card manufacturing apparatus described above still has the following problems to be improved.
[0005]
That is, as shown in FIG. 4, the laminated base material M is in a state of being sandwiched between the upper pressure plate 4u of the upper clamping part 11u and the lower pressure plate 4d of the lower clamping part 11d. The thickness of the laminated base material M is thicker than the laminated base material M after thermocompression bonding, and the thickness of the sealing material 16 of the laminated base material sandwiching portion 1y existing outside the laminated base material M is after thermocompression bonding. Since the thickness is adjusted to the thickness of the laminated base material M, the part located outside the laminated base material M in the laminated base material sandwiching part 1y is the part located inside the laminated base material M due to the start of deaeration. As a result, the outer side of the laminated base material M is sealed by a larger applied pressure than the inner side (see FIG. 8). For this reason, even if the deaeration process proceeds, the internal air of the laminated base material M is confined, and as a result, there is a possibility that the deaeration of the laminated base material M cannot be performed reliably and sufficiently.
[0006]
The present invention solves such a problem existing in the prior art, and in particular, it is possible to reliably and sufficiently perform deaeration on the laminated base material, thereby improving the quality and homogeneity of the IC card. It is an object of the present invention to provide a method of manufacturing an IC card that can be further enhanced.
[0007]
[Means for Solving the Problems and Embodiments]
The manufacturing method of the IC card Mi according to the present invention is as follows. When manufacturing the IC card Mi by thermocompression bonding the laminated base material M sandwiching an electronic component P such as an IC chip with a pair of laminate materials La and Lb, Alternatively, by pressing and heating a workpiece U in which two or more laminate materials L ... and one or two or more rough surface forming sheets C ... are alternately laminated, the surface of the laminate material L ... has a large number of irregularities. The laminated base material M formed on the rough surface fc... Serving as a deaeration passage and constituted by the laminate materials La and Lb having the rough surface fc is sandwiched with the lower sandwiching portion 11d constituting the laminated base material sandwiching portion 1y. While sandwiched by the portion 11u, the inside of the laminated base material sandwiching portion 1y is deaerated by the deaeration device 19, and thereafter, the laminated base material sandwiching portion 1y having a pair of flat pressure surfaces Fu and Fd is paired with a pair of press panel portions. Pressurize and press with 2u, 2d The layered base M by heating, characterized in that as thermocompression bonding.
[0008]
In this case, according to a preferred embodiment, the workpiece U can be pressed and heated by the IC card manufacturing apparatus 1 for thermocompression bonding the laminated base material M to form the rough surface fc.
[0009]
【Example】
Preferred embodiments according to the present invention will be described below in detail with reference to the drawings.
[0010]
First, the configuration of the IC card manufacturing apparatus 1 that can be used in the IC card manufacturing method according to the present embodiment will be described with reference to FIGS.
[0011]
The IC card manufacturing apparatus 1 includes a manufacturing apparatus main body 1x and a laminated base material sandwiching portion 1y configured separately from the manufacturing apparatus main body 1x. The laminated base material sandwiching portion 1y includes an upper sandwiched portion 11u and a lower sandwiched portion 11d shown in FIG. 4, and the upper sandwiched portion 11u overlaps the lower sandwiched portion 11d so that the interior is sealed. Part 1y. The upper clamping unit 11u includes an upper pressure plate 4u and an upper frame 12u configured in a rectangular frame shape larger than the upper pressure plate 4u. The upper pressure plate 4u overlaps the upper surface of the laminated base material M, and the lower surface of the upper pressure plate 4u becomes a flat pressure surface Fu.
[0012]
The upper pressing plate 4u is elastically deformed according to the deformation of the laminating material La when the laminating material La is not softened when the laminated base material M is pressed, and is elastically restored when the laminating material La is softened. An elastic plate having a thickness, preferably a stainless steel plate having a thickness of about 1 [mm] is used. As the upper pressure plate 4u, another elastic metal plate or a heat-resistant non-ferrous material, for example, an elastic synthetic resin plate using polyimide or the like may be used.
[0013]
Further, the upper pressure plate 4u and the upper frame 12u are connected via a plurality of rectangular connecting pieces 14u ... integrally formed with the upper pressure plate 4u. Thereby, the deformation of the upper pressure plate 4u due to heat is absorbed. As shown in FIG. 6, each of the connecting pieces 14 u... Protrudes from a pair of opposing end sides of the upper pressure plate 4 u and is provided at regular intervals along the end sides. In this case, each connecting piece 14u is bent into a crank shape. Then, all or a part of the ends of the connecting pieces 14u are screwed to the upper frame 12u using fixing screws 15.
[0014]
On the other hand, the lower clamping portion 11d is basically formed in the same manner as the upper clamping portion 11u. In the lower clamping part 11d, 4d is a lower pressure plate, 12d is a lower frame, 14d. The lower pressure plate 4d overlaps the lower surface of the laminated base material M, and the upper surface of the lower pressure plate 4d becomes a flat pressure surface Fd. In addition, the sealing material 16 along the periphery is fixed to the upper surface of the lower pressure plate 4d.
[0015]
The upper pressurizing plate 4 u is provided with a deaeration port 17, and the deaeration port 17 is connected to a deaeration device (such as a vacuum pump) 19 through a vent pipe 18. Thereby, while being able to deaerate the inside of the lamination | stacking base material clamping part 1y, air can be supplied to the inside of the lamination | stacking base material clamping part 1y from the deaeration port 17 by switching. It should be noted that a positioning portion (not shown) for positioning the upper frame 12u and the lower frame 12d when they are overlapped is provided at a predetermined position of the upper frame 12u and the lower frame 12d.
[0016]
On the other hand, the manufacturing apparatus main body 1x includes three press units, that is, a preheating press unit (not shown), a press mechanism 2 serving as a thermal pressure press unit, and a cooling press unit (not shown). FIG. 5 shows only the press mechanism (thermal pressure press part) 2.
[0017]
The press mechanism 2 includes a fixed press panel part 2u disposed on the upper side and a movable press panel part 2d disposed on the lower side. The fixed press panel 2u includes a press panel main body 21 having a pressing surface 3u. Unlike the lower press panel main body 31 described later, the press panel main body 21 is directly attached to a fixed press panel base (not shown). The press panel main body 21 is formed by sequentially stacking a heating panel 22, a heat insulating part 23, and a support panel 24 whose tip is the pressing surface 3u, and are integrated by fixing bolts 25. The heating platen 22 incorporates a number of heating bar heaters 26. Further, a cushion sheet 7u having a certain thickness is bonded to the lower surface of the hot platen 22, that is, the pressing surface 3u. Since the cushion sheet 7u using an elastic material such as rubber has high heat insulating properties, it is necessary to form it as thin as possible in order to improve thermal conductivity. In the embodiment, silicon rubber having a thickness of about 0.3 mm is used. A sheet was used. Note that even if such a thin silicon rubber sheet is bonded to the flat pressing surface 3u having at least one side of several tens [cm], the desired elasticity (cushioning property) cannot be obtained. On the lower surface, convex portions 6 are provided by forming a large number of partitions by grooves 5 of a predetermined width, thereby ensuring good thermal conductivity and at the same time sufficient and optimum cushioning properties in the cushion sheet 7u. Is secured. In addition, by forming such a large number of convex portions 6..., The problem of the cushion sheet 7u being in close contact with the pressure plate 4u can be avoided.
[0018]
On the other hand, the movable press board part 2d located on the lower side includes a press board body part 31 having a pressing surface 3d and a press board base part 41 on which the press board body part 31 is placed. The press panel main body 31 is formed by sequentially stacking a heating panel 32, a heat insulating part 33, and a support panel 34 whose tip is the pressing surface 3d, and they are integrated by fixing bolts 35. The heating platen 32 incorporates a large number of heating bar heaters 36. A cushion sheet 7d is bonded to the upper surface of the hot platen 32, that is, the pressing surface 3d. The cushion sheet 7d can be the same as the cushion sheet 7u described above. Therefore, a large number of convex portions 6 are formed on the upper surface of the cushion sheet 7d by the grooves 5 in the same manner as the lower surface of the cushion sheet 7u.
[0019]
On the other hand, 51 is a machine base part, and the movable press board part 2d is supported by a toggle link mechanism 52 installed between the machine base part 51 and the movable press board part 2d. Reference numeral 53 denotes a drive mechanism unit for driving the toggle link mechanism 52, and the drive mechanism unit 53 includes a servo motor 54 attached to the machine base unit 51 and a ball screw mechanism 55 driven by the servo motor 54. Thereby, the ball screw portion 56 of the ball screw mechanism 55 is rotationally driven by the servo motor 54, and the nut portion 57 of the ball screw mechanism 55 serves as an input portion of the toggle link mechanism 52.
[0020]
Next, an IC card manufacturing method according to the present embodiment including the operation (function) of the IC card manufacturing apparatus 1 will be described with reference to FIGS.
[0021]
First, a rough surface fc having a large number of irregularities is formed on the flat surface of the laminate L. FIG. 1 is a flowchart showing a processing procedure for forming the rough surface fc.
[0022]
When forming the rough surface fc, a necessary quantity of the laminate material L and a rough surface forming sheet C are prepared. In this case, as the rough surface forming sheet C, for example, a sheet material as shown in FIG. 2 in which glass fibers are knitted to about 60 [mesh] and the surface is coated with Teflon (trade name) can be used. This rough surface forming sheet C ... is for transferring a large number of irregularities onto the surface of the laminate material L ..., and any sheet having the same function can be used as long as it has excellent heat resistance, heat transfer, and releasability. A sheet material can be used. The laminate material L is a sheet material obtained by laminating 2 to 6 thermoplastic resin sheets having a thickness of about 20 to 300 [μm]. The laminate material L in the examples includes a hot melt sheet and polyethylene. A terephthalate sheet is included.
[0023]
The prepared plurality of laminate materials L and the plurality of rough surface forming sheets C are alternately stacked, and the workpiece U obtained by the stacking is set in the IC card manufacturing apparatus 1 (step S1). . That is, as shown in FIG. 3, the workpiece U is placed on the upper surface of the lower clamping portion 11d of the laminated substrate clamping portion 1y, and the upper clamping portion 11u is stacked from above to hold the workpiece U in an upper position. It is sandwiched between the part 11u and the lower clamping part 11d. Thereby, the to-be-processed material U is accommodated in the lamination | stacking base material clamping part 1y. The embodiment shows a case where four laminates L ... and three rough surface forming sheets C ... are set. The rough surface fc is basically formed on both surfaces of the laminate material L. However, the rough surface fc is not necessarily formed on both surfaces, and may be only one surface.
[0024]
Thus, when forming the rough surface fc..., The above-described IC card manufacturing apparatus 1 can be used. Therefore, since the IC card manufacturing apparatus 1 can be used for both the original use for thermocompression bonding of the laminated base material M, which will be described later, and the use for forming the rough surface fc, it can be easily carried out without causing an increase in cost. There are advantages you can do.
[0025]
On the other hand, the IC card manufacturing apparatus 1 may be operated in the same sequence as that in the case of processing a laminated base material M described later. In this case, the details of the basic operation and conditions are the same as in the case where the IC card Mi is manufactured by the laminated base material M described later, and the movable press machine according to the thickness of the workpiece U as necessary. What is necessary is just to change conditions, such as temperature and time, and the pressurization position of the part 2d.
[0026]
First, the inside of the laminated base material clamping part 1y is deaerated by the operation of the deaeration device 19 (step S2). Next, the laminated base material sandwiching part 1y is preheated by a preheating press part (not shown) (step S3). That is, the laminated base material sandwiching portion 1y is pressurized by a pair of presses and heated to a preheating temperature lower than a normal heating temperature in a thermocompression pressing portion described later. Thereby, the workpiece U is gradually heated by the preheating temperature while being pressurized.
[0027]
Next, the pre-heat-treated laminated base material sandwiching portion 1y is supplied to the press mechanism 2 serving as a thermocompression pressing portion, and is subjected to heating and pressure processing (step S4). In this case, since the movable press platen portion 2d is lowered as shown in FIG. 4, if the servo motor 54 is operated after placing the laminated base material sandwiching portion 1y on the movable press platen portion 2d, the nut The part 57 is raised, and the movable press panel part 2d is raised by the toggle link mechanism 52. Then, when the laminated base material sandwiching portion 1y comes into pressure contact with the upper cushion sheet 7u and an extremely low pressure is applied to the laminated base material sandwiching portion 1y, the rising of the movable press disk portion 2d is once stopped. At this time, the fixed press platen portion 2u and the movable press platen portion 2d are heated to normal heating temperatures by the heating bar heaters 26, 36, respectively. On the other hand, when the set time has elapsed and the laminate material L of the workpiece U has softened, the servo motor 54 is operated again to raise the movable press platen portion 2d, and the pressing surface 3d is set to the set position or set force. Stop when the torque reaches (set torque). Thus, the laminated base material sandwiching portion 1y is heated and pressurized from above and below by the fixed press platen portion 2u and the movable press platen portion 2d. After this, when the set time has elapsed, the movable press panel 2d is lowered.
[0028]
Next, the laminated base material sandwiching part 1y is transferred to the cooling press part and cooled (step S5). In the cooling process, the workpiece U is cooled while being pressurized. When the cooling process is completed, air is supplied from the deaeration port 17 to the inside of the laminated base material sandwiching portion 1y. Thereby, the deaeration state of the laminated base material sandwiching portion 1y is released, and the workpiece U is peeled from the laminated base material sandwiching portion 1y. Thereby, if the upper clamping part 11u is raised, the workpiece U can be taken out easily (step S6). Then, if each laminate material L ... is peeled off from the rough surface forming sheet C ..., the unevenness of the rough surface forming sheet C ... is transferred to the laminate material L ..., and the rough surface fc ... having a large number of unevenness on the surface is transferred. The formed laminate material L ... can be obtained. Furthermore, if the laminate material L ... forming the rough surface fc ... remains, the same processing is repeated (step S7).
[0029]
Then, when the laminate material L ... having the rough surface fc ... is obtained, the IC card Mi is manufactured using the laminate material L ... (La, Lb). First, the laminated base material M is manufactured with the laminating materials La and Lb having the rough surface fc. FIG. 7 shows the laminated base material M with phantom lines. In this case, P is an electronic component including an IC chip Pi and an antenna Pa, and is mounted on the base sheet B. Then, the base sheet B and the electronic component P are sandwiched between the laminate materials La and Lb from both sides. At this time, it is necessary that a rough surface fc... Be formed on at least the inner surfaces facing each other in the laminate materials La and Lb. The laminated base material M is usually cut into a plurality of IC cards (generally, n × m) continuously, and the laminated base material M is thermocompression bonded by the IC card manufacturing apparatus 1 and then cut. To obtain the target IC card Mi.
[0030]
On the other hand, the laminated base material M is accommodated in the laminated base material clamping part 1y. That is, the laminated base material M is placed on the upper surface of the lower sandwiching portion 11d, and the upper sandwiching portion 11u is stacked from above, whereby the laminated base material M is sandwiched between the upper sandwiching portion 11u and the lower sandwiching portion 11d. Thereafter, the deaeration device 19 is operated to deaerate the inside of the laminated base material sandwiching portion 1y.
[0031]
At this time, as shown in FIG. 4, the laminated base material M is sandwiched between the upper pressure plate 4u of the upper sandwiching portion 11u and the lower pressure plate 4d of the lower sandwiching portion 11d. The thickness of the previous laminated base material M is thicker than the laminated base material M after thermocompression bonding, and the thickness of the sealing material 16 of the laminated base material sandwiching portion 1y existing outside the laminated base material M is determined by thermocompression bonding. Since the thickness is adjusted to the thickness of the subsequent laminated base material M, the portion located outside the laminated base material M in the laminated base material sandwiching portion 1y is located inside the laminated base material M due to the start of deaeration. As a result, the outer side of the laminated base material M is sealed by a larger applied pressure than the inner side. However, since rough surfaces fc having irregularities are formed on the opposing surfaces of the laminating materials La and Lb constituting the laminated base material M, a deaeration passage is secured, and deaeration with respect to the laminated base material M is performed. Is surely and adequately done.
[0032]
And the lamination | stacking base material clamping part 1y which accommodated the lamination | stacking base material M is first preheated by the preheating press part not shown. That is, the laminated base material sandwiching portion 1y is pressed by a pair of presses, and preheating temperature lower than the normal heating temperature when thermocompression bonding is performed, specifically, plastic deformation or welding of the laminate materials La and Lb starts. It is heated to the immediately preceding temperature (for example, around 70 ° C.). Accordingly, the laminated base material M is gradually heated by the preheating temperature while being pressurized, and deaeration is promoted.
[0033]
Next, the pre-heat-treated laminated base material sandwiching portion 1y is supplied to a press mechanism 2 that becomes a thermocompression pressing portion. In this case, since the movable press platen portion 2d is lowered as shown in FIG. 4, if the servo motor 54 is operated after placing the laminated base material sandwiching portion 1y on the movable press platen portion 2d, the nut The part 57 is raised, and the movable press panel part 2d is raised by the toggle link mechanism 52. Then, when the laminated base material sandwiching portion 1y comes into pressure contact with the upper cushion sheet 7u and an extremely low pressure is applied to the laminated base material sandwiching portion 1y, the rising of the movable press disk portion 2d is once stopped. At this time, the fixed press platen portion 2u and the movable press platen portion 2d are heated to normal heating temperatures (for example, around 140 ° C.) by the heating bar heaters 26, 36, respectively. The laminated base material M is sandwiched between the upper sandwiching portion 11u and the lower sandwiching portion 11d on both sides, and is housed inside the sealed laminated base material sandwiching portion 1y. Since the inside is deaerated by the deaerator 19, the continuity of the heated state and the pressurized state is ensured even when the laminated base material M moves from the preheating press part to the thermocompression press part 2, that is, the laminated base The heat retaining property and pressure retaining property for the material M are ensured.
[0034]
When the set time elapses and the laminated base material M is softened, the movable press platen portion 2d is raised again by operating the servo motor 54, and the pressing surface 3d has the thickness position of the IC card or the setting force ( When the torque is reached, stop. Thereby, the laminated base material sandwiching portion 1y is heated and pressed from above and below by the fixed press platen portion 2u and the movable press platen portion 2d, and the laminated base material M is thermocompression bonded. At this time, the rough surfaces fc... Formed on the surfaces of the laminating materials La and Lb are melted, and the flat pressure surface Fu that is the lower surface of the upper pressure plate 4u and the flat surface that is the upper surface of the lower pressure plate 4d. With the pressing surface Fd, the surfaces of the laminate materials La and Lb are formed to be flat.
[0035]
Each of the pressure plates 4u and 4d in the laminated base material sandwiching portion 1y is deformed (enlarged) by heat (high temperature), but the deformation is absorbed by the plurality of connecting pieces 14u. The material M is always thermocompression bonded by a pair of pressure plates 4u and 4d having a high degree of parallelism, so that the yield (productivity) at the time of manufacture can be improved, and the quality and homogeneity of the IC card can be improved. Productivity can be significantly improved. Further, at the time of thermocompression bonding of the laminated base material M, since the laminated base material M itself is pressed in a state where it is not sufficiently heated at the initial stage of pressurization, it is applied to the electronic component P via the laminate materials La and Lb that are not sufficiently softened. Pressure will be applied. However, as shown in FIG. 8, each of the pressure plates 4u and 4d using the elastic plate is elastically deformed in accordance with the deformation of the laminate materials La and Lb by the electronic component P. Therefore, the deformation of the laminate materials La and Lb Is absorbed by the pressure plates 4u, 4d and the cushion sheets 7u, 7d. On the other hand, when a certain amount of time elapses and the laminate materials La and Lb are sufficiently softened, the pressure plates 4u and 4d are elastically restored to their original shapes. Thermocompression bonding is performed by the original flat shape of the pressure plates 4u and 4d. At this time, since each of the cushion sheets 7u, 7d is provided with a large number of convex portions 6 by the groove portions 5 of a predetermined width, sufficient thermal conductivity is secured in each of the cushion sheets 7u, 7d, and at the same time, Optimal cushioning is ensured.
[0036]
Thereafter, when a set time (for example, around 20 seconds) has elapsed, as shown in FIG. 7, the movable press platen portion 2d is lowered, and the laminated base material M, that is, the manufactured IC card Mi, is pressed. Is transferred to the cooling press section and cooled. In the cooling process, the IC card Mi is cooled while being pressurized. On the other hand, in order to take out the IC card Mi from the laminated base material sandwiching portion 1y after the cooling process, air may be supplied into the laminated base material sandwiching portion 1y from the deaeration port 17. Thereby, the deaeration state of the laminated base material sandwiching portion 1y is released, and the IC card Mi is peeled from the laminated base material sandwiching portion 1y. Therefore, the upper clamping part 11u can be raised and the manufactured IC card Mi can be taken out.
[0037]
The embodiments have been described in detail above, but the present invention is not limited to such embodiments, and the detailed configuration, shape, quantity, material, numerical values, and the like are within the scope not departing from the gist of the present invention. It can be changed, added, or deleted arbitrarily. For example, the rough surface fc having a large number of irregularities may be implemented in a form such as providing a large number of grooves, and the form is not limited as long as it exhibits the same action. Moreover, the formation stage does not ask | require, such as purchasing and using the laminate material L ... which has the rough surface fc .... Furthermore, the configuration and material of the laminated base material M (IC card Mi) are not limited to the examples, and can be applied to any type.
[0038]
【The invention's effect】
Thus, the IC card manufacturing method according to the present invention pressurizes and heats a workpiece in which one or two or more laminate materials and one or two or more rough surface forming sheets are alternately laminated in advance. Thus, the surface of the laminate material is formed into a rough surface serving as a deaeration passage having a large number of irregularities, and the laminated base material constituted by the laminate material is formed by the lower sandwiched portion and the upper sandwiched portion constituting the laminated substrate sandwiched portion. While sandwiching, the inside of the laminated base material sandwiching part is deaerated by a deaeration device, and thereafter, the laminated base material sandwiching part having a pair of flat pressure surfaces is pressurized and heated by a pair of press panel parts. Since the base material is thermocompression-bonded, the following remarkable effects can be obtained.
[0039]
(1) Since the deaeration of the laminated base material can be performed reliably and sufficiently, the quality and homogeneity of the IC card can be further improved.
[0040]
(2) In order to form a rough surface by pressurizing and heating one or two or more laminate materials and one or two or more rough surface forming sheets alternately laminated, a laminated base material is thermocompression bonded. The IC card manufacturing apparatus can be used for both rough surface formation in addition to the original use, and can be easily implemented without increasing the cost.
[Brief description of the drawings]
FIG. 1 is a flowchart showing a processing procedure for forming a rough surface on a laminate material in an IC card manufacturing method according to a preferred embodiment of the present invention;
FIG. 2 is a schematic perspective view showing a part of a laminate material and a rough surface forming sheet used in the production method;
FIG. 3 is a schematic longitudinal sectional view for explaining a process of forming a rough surface on a laminate material in the manufacturing method;
FIG. 4 is a partially sectional front view showing a main part of a press mechanism in an IC card manufacturing apparatus capable of performing the manufacturing method;
FIG. 5 is a partially sectional front view showing a press mechanism in the IC card manufacturing apparatus;
FIG. 6 is a plan view of a laminated base material sandwiching portion in the IC card manufacturing apparatus,
FIG. 7 is a schematic longitudinal sectional view of the main part of the IC card manufacturing apparatus and the manufactured IC card;
FIG. 8 is a schematic longitudinal sectional view of a main part for explaining the operation of the IC card manufacturing apparatus;
FIG. 9 is a schematic longitudinal sectional view of the main part for explaining the operation of the IC card manufacturing apparatus;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Laminate manufacturing apparatus 1y Laminating base material clamping part 2u Press board part 2d Press board part 11u Upper clamping part 11d Lower clamping part 19 Deaerator M Laminating base material Mi IC card La Laminating material Lb Laminating material P Electronic component C ... Rough surface Forming sheet U Work material fc ... Rough surface Fu Pressurized surface Fd Pressurized surface

Claims (2)

  In a manufacturing method of an IC card, in which an IC card is manufactured by thermocompression bonding a laminated base material in which an electronic component such as an IC chip is sandwiched between a pair of laminate materials, one or two or more laminate materials and one or two or more rough materials are previously prepared. By pressurizing and heating the work material in which the surface forming sheets are alternately laminated, the surface of the laminate material is formed into a rough surface serving as a deaeration passage having a large number of irregularities, and the laminate material is configured as described above. The laminated base material is sandwiched between a lower sandwiching portion and an upper sandwiching portion constituting the laminated base material sandwiching portion, and the inside of the laminated base material sandwiching portion is deaerated by a deaeration device, and thereafter, a pair of flat pressure surfaces A method for producing an IC card, wherein the laminated base material is thermocompression-bonded by pressurizing and heating the laminated base material sandwiching part having a pair of press plates.   2. The IC card manufacturing method according to claim 1, wherein the workpiece is pressed and heated by an IC card manufacturing apparatus for thermocompression bonding a laminated base material to form the rough surface.

Images