JP5544817B2 - Non-contact IC card manufacturing method - Google Patents

Description

  The present invention relates to a non-contact IC card, and more particularly, to a punching condition when punching a multi-sided multilayer sheet into individual pieces using upper and lower molds.

  An IC card is one in which an inlet having an IC chip is sandwiched inside a credit card-sized resin sheet and character information or the like is printed on the surface (see FIG. 1). As a manufacturing method, a plurality of resin films or resin sheets are laminated in a long or single-wafer method, integrated by thermal lamination, and then cut into individual pieces.

  In other words, an antenna coil is formed of copper, aluminum or the like on an insulating sheet selected from PET, PEN, PI, etc., and the core is processed so that the IC chip 6 can be accommodated in the inlet 3 on which the IC chip is mounted and the opening. The sheets 5 are laminated after electrical connection. Further core sheets 2 and 7 and surface sheets 1 and 8 are sequentially laminated on both sides. A multilayer adhesive sheet (hereinafter simply referred to as a multilayer sheet) is formed in a roll shape or a single wafer shape by applying, for example, a thermoplastic adhesive layer between the layers and pressing the laminated sheet while heating.

Since a plurality of IC cards are periodically applied to the multilayer sheet, it is necessary to cut to a predetermined size. For this purpose, the multi-layer sheet is punched out into pieces by using a press apparatus having upper and lower molds. When plastic processing such as punching or cutting is performed on the sheet material, burrs (vertical burrs) are generated in the processed cross section, and machining dust is scattered. Therefore, burrs (vertical burrs) are required in precision part manufacturing and clean room operations. ) And special equipment for dust-proofing measures are necessary, and there is a problem that the equipment cost increases.
Furthermore, there is a problem that periodic polishing of the mold is necessary, and a decrease in productivity for that purpose cannot be ignored.

  As a countermeasure against this, both the upper mold and the lower mold are provided with opposed cutting portions that are cutting blades facing each other, and the upper mold is stopped in a close opposing state where the opposed cutting portions of the upper mold and the lower mold do not contact each other. A special press apparatus having a function of heating the cut surface of the workpiece immediately after cutting and melting the surface has been developed (see Patent Document 1).

  In this press machine, even hard materials, brittle materials, and fragile materials are cut from the front and back by the opposing cutting parts of the upper and lower molds, preventing the spread of cracks to the periphery. It is said that precise press working can be performed, and the cutting surface of the workpiece is heated by heating means, and the surface is slightly melted, so that removal of burrs (vertical burrs) and dust generation during processing can be suppressed. .

JP 2006-341277 A

As described above, in the conventional method, burrs (vertical burrs) generated at the time of cutting are melted by a heating device after cutting and removed from the cut surface, and the generation of burrs (vertical burrs) is prevented in advance. It is not a thing. For this reason, there is a problem that the press device is complicated and expensive, such as a device for stopping immediately before the opposing cutting blades come into contact.
Furthermore, the multilayer sheet in which materials having different softening temperatures are laminated has a problem that it is difficult to set the heating conditions, and the appearance of the cut surface is worse than that of punching a single layer sheet.
Therefore, in the present invention, when an IC card or the like is manufactured by punching a multilayer structure sheet, the cross-sectional appearance after punching is good, the number of die polishing of the press device is reduced, and burrs (vertical burrs) are generated. An object of the present invention is to provide a method of manufacturing a non-contact IC card that can be punched without any defects.

In order to achieve the above object, the invention according to claim 1 is provided with a multi-face application in advance when a non-contact IC card is manufactured by punching at least a multi-face multi-face sheet composed of an inlet and a plurality of sheets into individual pieces. The sheet is heated by a heating means and punched in a state where the temperature is raised. The heating means is an infrared heater, the infrared heater is a mid-infrared having a peak at a wavelength of 2.6 μm , and there are three infrared heaters with an output of 600 W. The distance between the heater and the sheet is 200 mm, which is a non-contact IC card manufacturing method.

  Under such conditions, occurrence of vertical burrs (longitudinal burrs) accompanying cutting is suppressed.

The invention according to claim 2 is the method for producing a non-contact IC card according to claim 1, wherein the temperature of the heated sheet in claim 1 is set to a temperature below the glass transition point. .

  In such a temperature range considering the glass transition temperature, there is little change in card dimensions before and after punching.

According to the present invention, in a punching process of a multi-sided non-contact IC card having a multi-layer structure using a normal press device, when the multi-sided sheet is punched in a state where the temperature of the sheet is increased by preheating, Generation of burrs (vertical burrs) is suppressed, and if the temperature range is selected, the dimensional stability of the card is not hindered.
In addition, since there are no burrs (vertical burrs) in the punched section of the card, it is possible to reduce scratches caused by rubbing the cards in the subsequent process.
Furthermore, as a result of the reduction in the number of times the punching die is polished, the time required for adjustment can be greatly reduced, and the productivity is improved.

It is a figure of the cross-sectional view explaining the structure of a non-contact IC card. It is process drawing explaining the procedure of punching. It is a figure of the cross sectional view explaining the structure of a laminating apparatus.

  An example of the configuration of a non-contact IC card according to the present invention is shown in FIG. Explaining from the top of the figure, the top sheet 1 is a PET film having a thickness of about 130 μm. The first core sheet 2 below is an insulating resin sheet that is appropriately selected from PET-G, PVC and the like having a thickness of about 170 μm.

The inlet 3 has an IC chip 6 on an insulating sheet such as PET, PEN, PI, a metal reinforcing plate (not shown) such as stainless steel for sealing the IC chip 6 and reinforcing the physical strength of the IC chip 6, copper And an antenna (not shown) made of aluminum or the like. Since the IC chip 6 slightly protrudes from the inlet 3, the protruding portion is accommodated in an opening (vertical line portion in FIG. 1) formed in advance in the second core sheet. The antenna pattern and the IC chip are connected by connecting the connection bumps formed on the input / output pads of the IC chip and the antenna connection land through an anisotropic conductive film or anisotropic conductive paste.

  The spacer sheet 4 fills the difference in size and gap between the inlet 3 and the core sheets 2 and 5, but is an insulating resin sheet such as PET-G or PVC having a thickness of about 50 μm. The second core sheet 5 and the third core sheet 7 are insulating resin sheets such as PET-G and PVC having thicknesses of about 240 μm and 80 μm, respectively. The back sheet 8 is made of a sheet having a thickness of about 150 μm mainly composed of PET.

  The non-contact IC card shown in FIG. 1 is manufactured by multi-sided roll-to-roll method in which a roll-shaped film is sequentially laminated on a normal roll-shaped inlet and finally heat laminated. Alternatively, it is manufactured by any one of a multi-layered multi-layered heat laminating method in which a multi-layered sheet in which sheet-like sheets are sequentially stacked is further stacked in multiple stages. An example of the latter laminating apparatus is shown in FIG. The laminated sheet is approximately 300 mm × 350 mm in size, and about 15 non-contact IC cards can be taken.

  The laminating apparatus has a three-stage configuration, each stage being sandwiched between hot plates 10, and each stage sandwiched between the hot plates has three sets of single-layer multilayer sheets sandwiched between SUS plates 12. It is a device like that.

  The total thickness of the card after the inlet 3 and the plurality of core sheets are laminated and thermoformed is set to fall within the range of 0.68 to 0.83 mm. However, the layer configuration is not limited to those described, and other configurations may be employed depending on the application and function.

  Such a sheet-like multilayer sheet composed of a plurality of sheet base materials is integrated using a heat laminating apparatus, and then the sheet-like sheet is separated into card sizes using a punching apparatus. In particular, when punching into individual pieces, vertical burrs (vertical burrs) projecting in the punching direction may occur on the surface of the outermost layer of the cut surface and on the back sheet, and the processing conditions such as polishing of the die edge or punching speed may occur. It was supported by fine adjustment.

  In this invention, it is set as the form which provides the heat processing part which heats a multilayer sheet in a punching apparatus, and it punches, after aiming at the temperature rise of a multilayer sheet at the time of cutting.

  The process diagram is shown in FIG. In the sheet constituting the card, the shear elastic modulus tends to increase when cooled compared to the shear elastic modulus at room temperature, and tends to decrease when heated. That is, since heating is facilitated by heating, burrs (vertical burrs) are less likely to occur. However, in the case of a plastic material, there is a glass transition point, and when the temperature is higher than the glass transition point, the plastic material is rapidly softened and becomes unsuitable for punching. In this example, PET is used for the outer surface layer, but about 70 ° C. is the glass transition temperature for PET and PETG.

Therefore, a thermoformed multilayer sheet having the configuration shown in FIG. 1 was prepared using the sheet material and thickness described above, and the relationship between the occurrence of burrs (vertical burrs) and the sheet temperature was examined for the card punching section.
The results are shown in Table 1. The temperature on the left side in the table is the temperature at the center of the sheet.

  From Table 1, no burrs (vertical burrs) occur if the sheet temperature is maintained at about 30 ° C. or higher. Further, when punching was performed with the sheet temperature being raised, the result was that dimensional shrinkage at room temperature was large after punching. The dimensions in the table are the short side dimensions of the card. Punching after lowering the temperature and then returning to room temperature expands. The target dimension by the mold was 53.995 ± 0.055 mm at 25 ° C., but the target dimension was not finished at 50 ° C. or higher.

  Accordingly, the sheet temperature at the time of punching is preferably in a range of preferably 30 ° C. or higher and 45 ° C. or lower. However, regarding the dimensions, it is not unthinkable to set the cutting dimension of the mold short in consideration of the shrinkage amount in advance. In such a case, the upper limit temperature can be raised a little higher, but other problems such as temperature uniformity also occur, so it can be said that the lower limit is desirable.

  As the heating means, an infrared heater capable of uniformly heating the sheet in a short time is preferable in consideration of productivity. The sheet temperature can be finely adjusted by adjusting the power supply voltage, the distance between the lamp and the sheet, and the irradiation time.

  The infrared heater used was mid-infrared having a peak at a wavelength of 2.6 μm, three outputs of 600 W, a heater length of 497 mm, a heating length of 470 mm, and the distance between the heater and the workpiece was 200 mm, and irradiation was performed from above.

  The sheet of the size described above was equally divided into nine equal parts, the temperature at the center was measured, and the temperature variation in the sheet surface was examined. The surface temperature was 30.0 ° C or higher and 41.8 ° C or lower. It was settled. The temperature distribution was high in the center of the sheet and low in the corners. Within this range, the dimensional error of the card was within the allowable range regardless of the position where the card was cut and separated.

  When the occurrence frequency of burrs (longitudinal burrs) when heated and not heated was examined, the occurrence frequency decreased to 1./13 in the former case compared to the latter. Heating has been found to be very effective.

  The present invention can be applied to the manufacture of products in which sheets are laminated and laminated, and then cut into individual pieces, for example, printed wiring plates, semiconductor packages, and the like.

1, surface sheet 2, first core sheet 3, inlet 4, spacer sheet 5, second core sheet 6, IC chip (and opening for accommodating IC chip)
7, third core sheet 8, back sheet 10, hot plate 11, carrier plate 12, SUS plate 13, cushion material 14, non-contact IC card (with multiple sides)

Claims (2)

At least when manufacturing a non-contact IC card by punching a multi-sided sheet composed of a multi-layer structure consisting of an inlet and a plurality of sheets into individual pieces, the multi-sided sheet is punched in a heated state by heating means in advance, The heating means is an infrared heater, the infrared heater is a mid-infrared having a peak at a wavelength of 2.6 μm , there are three infrared heaters with an output of 600 W , and the distance between the heater and the sheet is 200 mm. A method for manufacturing a non-contact IC card. 2. The method of manufacturing a non-contact IC card according to claim 1, wherein the temperature of the heated sheet is set to a temperature not higher than the glass transition point.

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