JP2010072744A - Ic card and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card excellent in printing property by suppressing an occurrence of the warp of the card and the unevenness on the surface thereof. <P>SOLUTION: Uncured photo-curable resin layers 4, 5 are respectively applied to both main surfaces of a card base material 1 of which the one main surface is mounted with electronic components such as an IC chip 3 and an antenna coil 2 or the like, both the layers 4, 5 are subjected to ultraviolet ray irradiation to be cured by ultraviolet rays, and after that, coating film-formed sheets 6, 7 are laminated onto the layers 4, 5, respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a non-contact type IC card including a card base material on which a non-contact type IC chip and an antenna coil are mounted, and a manufacturing method thereof.

  In recent years, IC cards equipped with semiconductor elements (IC chips) for recording and processing data are becoming widespread from the viewpoint of efficiency of information processing and security. Such IC cards include a contact type that connects an external terminal of the card and a terminal of an external processing device to transmit / receive data, an antenna coil that transmits / receives data using electromagnetic waves, and data processing. Non-contact type with built-in electronic components such as semiconductor elements (IC chip), read / write to / from external processing device by so-called wireless method, IC circuit drive power supplied by electromagnetic induction, no built-in battery Things have been developed.

  As a conventional method of manufacturing a non-contact type IC card incorporating electronic components such as an antenna coil and an IC chip for data transmission / reception and driving power supply, a card base on which the electronic component is mounted is used as an IC chip recess or an IC chip. Holes are punched out or sandwiched with a film such as PET (polyethylene terephthalate) provided by NC (Numerical Control), and the cover sheet is fused with a film such as PET on the outermost surface by heat press or adhesive. A method of bonding by laminating and the like, punching out to a card size and forming a card is widely used (see, for example, Patent Document 1).

  In addition, an antenna coil for data transmission / reception and driving power supply and a card base with electronic components made up of IC chips are fixed in a predetermined mold, and pressure is applied to the heat-melted thermoplastic resin or thermosetting resin. A method of molding an IC card by a so-called injection molding method that is poured and poured (for example, see Patent Document 2).

  In addition, a method is also known in which an antenna coil for data transmission / reception and driving power supply or a card substrate on which an IC chip is mounted is stored in a thermoplastic resin, a thermosetting resin, etc., and is molded by a hot press (for example, And Patent Document 3).

  However, according to the above conventional method for manufacturing a non-contact type IC card, a card substrate on which electronic components such as antenna coils and IC chips for data transmission / reception and driving power supply are mounted is sandwiched between films and laminated. In the method, when the IC chip recess or the IC chip hole is provided, it is necessary to process a hole larger than necessary in order to allow variation when mounting the IC chip arranged on the card base. A void is formed between the chip recess and the IC chip hole and the IC chip. When laminating an inlet, a perforated PET film for an IC chip, and an oversheet, the melted perforated PET sheet for the IC chip flows into the gap, and a so-called “sink” occurs in which the upper surface is depressed. There is an inconvenience that unevenness occurs.

  Moreover, in the method by injection molding, it was molded due to the difference in thermal shrinkage between the metal resin such as the antenna coil and IC chip for data transmission / reception and driving power supply mounted on the card substrate and the molding resin. There are problems that marks such as IC chips appear on the surface of the card as irregularities, the thickness of the card is not uniform, or the card is curved.

  In the method of storing card equipment equipped with antenna coil for electronic data transmission / reception and driving power supply or electronic parts consisting of IC chips in thermoplastic resin, thermosetting resin, etc., and molding by hot press, injection molding is used. As in the case of the above, traces of the IC chip or the like are uneven on the surface of the molded card due to the difference in thermal shrinkage between the metal resin such as the antenna coil and IC chip for data transmission / reception and driving power supply and the molding resin. Appear, the thickness of the card is not uniform, or the card is curved.

In recent years, contactless IC cards are often used for personal authentication such as licenses, membership cards, and credit cards, and there is a demand for printing designs, characters, and facial images for identification on the card surface. Due to the increase, flatness on the card surface is particularly required.
Japanese Patent Laid-Open No. 10-86569 Japanese Patent Laid-Open No. 06-286375 JP 11-91275 A

  The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an IC card excellent in printability and a manufacturing method thereof, which suppresses card warpage and card surface unevenness.

  The IC card of the present invention includes a card base on which a non-contact type IC chip and an antenna coil are mounted on one main surface of both main surfaces, the non-contact type IC chip on the one main surface, and A first photocurable resin layer provided via the antenna coil; a second photocurable resin layer provided on the other main surface of the two main surfaces; and the first photocuring. And a first cover sheet respectively provided on the curable resin layer and the second photocurable resin layer.

The IC card manufacturing method of the present invention provides a card base on which a non-contact type IC chip and an antenna coil are mounted on one main surface of both main surfaces,
An uncured first photocurable resin layer on one main surface through the non-contact IC chip and the antenna coil, and an uncured second photocurable resin on the other main surface. Layer is applied, and the uncured first photocurable resin layer, the card base material, and the second photocurable resin layer are sandwiched between first and second press plates, The first and second photocurable resin layers for curing are subjected to ultraviolet irradiation to be cured with ultraviolet rays,
After removing the first press plate and the second press plate,
A first covering sheet is laminated on the first photocurable resin layer, and a second covering sheet is laminated on the second photocurable resin layer, respectively.

  According to the present invention, it is possible to obtain an IC card excellent in printability by suppressing the warpage of the card and the occurrence of irregularities on the card surface.

  A card base on which a non-contact IC chip and an antenna coil for data transmission / reception and driving power supply are mounted on one main surface of the two main surfaces, and the non-contact IC chip on the one main surface And a first resin layer provided via the antenna coil, a second resin layer provided on the other main surface of the two main surfaces, and the first and second resin layers In the IC card including the first and second cover sheets provided respectively, a photocurable resin is used as the first and second resins.

  Further, the IC card manufacturing method of the present invention includes a first resin layer on one main surface and another main surface of the card base on which an IC chip and an antenna coil for data transmission / reception and driving power supply are mounted, and Each of the second resin layers is applied to form a stack of the first resin layer, the card base, and the second resin layer, and then the first cover sheet and the second layer are formed on the first resin layer. In the method of laminating the second covering sheet on each of the resin layers, each of the first and second resin layers is composed of an uncured photocurable resin layer, and the first resin layer is formed on the first resin layer. Prior to laminating the second covering sheet on the covering sheet and the second resin layer, the first and second press plates are laminated on the first resin layer, the card base, and the second resin layer. Between the first press plate and the first press plate And wherein the removal of the press plates.

  An uncured first photocurable resin layer and an uncured second photocurable resin layer are applied on one main surface and the other main surface of the card base, and the first photocurable resin layer is applied. As a method of sandwiching the lamination of the card base material and the second photocurable resin layer with the first and second press plates, for example, on one main surface and the other main surface of the card base material, A method in which the uncured first photocurable resin layer and the uncured second photocurable resin layer are respectively applied and then sandwiched by the first press plate and the second press plate, or one of them. Using the first press plate and the second press plate to which the uncured first photocurable resin layer and the uncured second photocurable resin layer were applied, respectively, were applied to the main surface. There is a method of sandwiching the card substrate through an uncured photocurable resin layer.

  The first photocurable resin layer and the second photocurable resin layer can be formed on one side of the card substrate or on both sides simultaneously.

  For example, a transparent PET film can be further stacked on the surfaces of the first and second photocurable resin layers as the first and second auxiliary sheets.

  The first and second press plates are applied and pressed onto the transparent PET film superimposed on the first and second photocurable resin layers, and at the same time, the ultraviolet rays can be irradiated to cure the ultraviolet rays.

  Further, a spacer for maintaining the distance can be disposed between the first and second press plates.

  Furthermore, Teflon (registered trademark) processing can be performed on at least one side of the first and second press plates. Thereby, after ultraviolet-curing, the member which touches a press plate, for example, a covering sheet, an auxiliary sheet, etc., and a press plate can be peeled easily.

  For the first and second press plates, quartz glass can be used as a material that transmits ultraviolet rays.

  Since the photocurable resin layer has a function of an adhesive, a transparent PET film can be adhered.

  According to the present invention, since the uncured photocurable resin layer has viscoelasticity, the surface of the press plate provided with a spacer via a transparent PET film is cured by ultraviolet rays while being transferred, so that flatness is obtained. High IC card substrate can be obtained. In addition, by using an ultraviolet curable resin, high temperature is not required, so due to the difference in heat shrinkage between metal parts such as antenna coils and IC chips for data transmission / reception and driving power supply, and molding resin, A base sheet that contains a uniform and highly flat inlet because traces of IC chips or the like do not appear as irregularities on the surface of the IC card base that encloses the molded card base. Can be.

  Furthermore, in this invention, it consists of thermoplastic resins, such as a white PET film, on a 1st and 2nd photocurable resin layer or a 1st and 2nd auxiliary sheet through a hot-melt-adhesive layer. The covering sheet can be thermocompression bonded and laminated.

  According to the cover sheet made of a thermoplastic resin such as white PET film, it is possible to improve the color of printing of the design, characters and face image for authentication identification on the card surface, and data transmission and reception and driving power included in the core sheet Electronic components made up of electronic components such as a supply antenna coil and an IC chip can be concealed.

  In addition, an image receiving layer and a writing layer can be provided on a cover sheet made of a thermoplastic resin such as a white PET film in order to print a design, characters and a face image for authentication identification on the card surface.

  Furthermore, according to the method of manufacturing a non-contact type IC card of the present invention, the unevenness of the inlet made of the antenna coil and IC chip for data transmission / reception and driving power supply does not appear on the card surface, and the card does not warp, Since the irregularities of the inlet do not appear on the image receiving layer and the writing layer provided on the cover sheet made of a thermoplastic resin such as white PET film, it is possible to print the design and characters on the card surface, face images for authentication identification, etc. It is possible to obtain a non-contact type IC card having high-quality printing without print defects such as chipping, wrinkling, and omission.

  Hereinafter, the present invention will be described in more detail with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view showing a first example of a non-contact type IC card according to the present invention.

  As shown in the figure, this non-contact type IC card 10 includes a card substrate 1 on which an electronic component such as an antenna coil 2 and an IC chip 3 for data transmission / reception and driving power supply is mounted on one main surface, The first photocurable resin layer 4 provided on the main surface via these electronic components, the second photocurable resin layer 5 formed on the other main surface of the card substrate 1, the first The first and second cover sheets 6 and 7 are provided on the photocurable resin layer 4 and the second photocurable resin layer 5 respectively.

  In the card substrate 1, an antenna coil is formed by screen printing or the like, an IC chip is electrically bonded face down using an anisotropic conductive adhesive, and the like, and an inlet sheet serving as a core part of the IC card It is.

  FIG. 2 is a schematic sectional view showing a second example of the non-contact type IC card according to the present invention.

  As shown in the drawing, the non-contact type IC card 20 includes a first auxiliary sheet 8 and a second photocurable resin between the first photocurable resin layer 4 and the first cover sheet 6. Except that a second auxiliary sheet 9 is further provided between the layer 5 and the second covering sheet 7, it has the same configuration as that of FIG.

  FIG. 3 is a schematic cross-sectional view showing a third example of the non-contact type IC card according to the present invention.

  As shown in the figure, the non-contact type IC card 30 includes a first hot melt adhesive layer 11 between the first cover sheet 6 and the first auxiliary sheet 8, and the second cover sheet 7 and the second cover sheet 8. The structure is the same as that in FIG. 2 except that a second hot melt adhesive layer 12 is further provided between the auxiliary sheet 9.

  FIG. 4 shows an example of a process for manufacturing the non-contact type IC card according to the first example.

  As shown in the drawing, a card substrate 1 on which a non-contact type IC chip 3 and an antenna coil 2 are mounted is prepared on one of the two main surfaces (ST1).

  An uncured first photocurable resin layer 4 is formed on one main surface via the non-contact IC chip 3 and the antenna coil 2, and an uncured second photocurable resin is formed on the other main surface. The layer 5 is formed, for example, by applying a photocurable resin coating liquid (ST2).

  The uncured first photocurable resin layer 4, the card base 1, and the second photocurable resin layer 5 are sandwiched between the first and second press plates 14 and 15, After the spacers 16 and 17 are provided between the second press plates 14 and 15 to maintain a certain thickness and fixed with a clamp (not shown), the uncured first and second photocurable resin layers are, for example, It is subjected to ultraviolet irradiation from the ultraviolet light source 13 and cured by ultraviolet light (ST3).

After removing the first press plate and the second press plate,
A first covering sheet is laminated on the first photocurable resin layer, and a second covering sheet is laminated on the second photocurable resin layer (ST4).

  In this way, a non-contact type IC card having the same configuration as that shown in FIG. 1 is obtained.

  Here, although the 1st and 2nd photocurable resin layers 4 and 5 were each formed by apply | coating a photocurable resin coating liquid on both main surfaces of the card | curd base material 1, respectively, It can also be applied to both main surfaces of the card substrate 1 after being formed by applying a photo-curable resin coating liquid on one side of the press plate 14 and the second press plate 15.

Further, in the case of manufacturing the non-contact type IC card according to the second example, instead of ST3 in FIG. 4 as shown in FIG. After the first auxiliary sheet 8 is provided and the second auxiliary sheet 9 is provided on the second photocurable resin layer 5, the first auxiliary sheet 8 is sandwiched between the first and second press plates 14 and 15. Further, spacers 16 and 17 are provided between the first and second press plates 14 and 15 to maintain a certain thickness, and are fixed with a clamp (not shown), and then uncured first and second photocuring properties. The resin layer is subjected to UV irradiation to be cured by UV (ST3 ')
After removing the first press plate and the second press plate, the first cover sheet 6 and the second cover sheet 7 are respectively placed on the first auxiliary sheet 8 and the second auxiliary sheet 9. When stacked, a non-contact type IC card as shown in FIG. 2 is obtained.

  Further, when the first cover sheet 6 is laminated on the first auxiliary sheet 8, the first hot melt adhesive layer 11, the second hot melt adhesive layer 11, between the first auxiliary sheet 8 and the first cover sheet 6. When the second cover sheet 7 is laminated on the auxiliary sheet 9, a second hot melt adhesive layer 12 is provided between the second cover sheet 9 and the second cover sheet 7 as shown in FIG. A non-contact type IC card can be obtained.

  In addition, as a method of applying the first and second hot melt adhesive layers between the first and second auxiliary sheets and the first and second cover sheets, for example, a hot melt adhesive layer coating liquid is used. The auxiliary sheet and the first covering sheet, and the second auxiliary sheet and the second covering sheet are applied to one of the mutually opposed surfaces to form a hot melt adhesive coating layer, which is heated in layers. Can be laminated. Or it can laminate | stack by heating by interposing a sheet-like hot-melt-adhesion layer.

  After the uncured first photocurable resin layer, the card substrate, and the second photocurable resin layer are subjected to ultraviolet irradiation to be precured and sandwiched between the first and second press plates, The precured first and second photocurable resin layers can be subjected to ultraviolet irradiation to be sufficiently cured with ultraviolet light. As a result, it is possible to sufficiently cure even a thick film exceeding 0.3 mm.

  As the card substrate, polyester resin, polyethylene resin, polypropylene resin, polyimide resin, or the like can be used. As the card substrate, in particular, a film made of polyethylene-tylene terephthalate (PET) resin is preferable from the viewpoint of mechanical strength and heat resistance.

  As a material for the antenna coil, copper, aluminum, gold, silver, iron, tin, nickel, zinc, titanium, tungsten, solder alloy, or the like can be used.

  Using the antenna coil and the metal material, an antenna coil pattern can be formed on the card base material by etching or screen printing. An IC chip is face-downed on a card substrate provided with an antenna coil pattern, and an anisotropic conductive adhesive or the like is used for electrical bonding to form an inlet sheet.

  As a material of the second auxiliary sheet and the second auxiliary sheet, for example, a thermoplastic resin such as a polyester resin, a polyethylene resin, a polypropylene resin, and a polyimide resin can be used.

  The photocurable resin layer can be reacted and cured by an active energy beam such as ultraviolet rays.

  As the photocurable resin, a resin composition in which prepolymers, oligomers, and monomers having a polymerizable unsaturated bond or an epoxy group in the molecule are appropriately selected and mixed can be used.

  The uncured photocurable resin layer stays on the card substrate for a certain period of time in order to secure a thickness that can sufficiently fill the irregularities on the card substrate made of electronic components such as antenna coils and IC chips. It is hoped that. It is preferable to use a photo-curing resin having a viscosity as high as possible and a low castability within a range that does not hinder the application. When the viscosity of the resin composition is low and the castability is large, when the photocurable resin layer is formed on the card substrate, the thickness sufficient to fill the unevenness formed by the electronic components such as the antenna coil and the IC chip. A dam can be provided on the card substrate for the purpose of clogging the photo-curable resin until it reaches the end. In such a case, the first and second auxiliary sheets cannot be pinched. The photocurable resin layer is provided in order on each side of the card substrate. Moreover, there exists a tendency for an apparatus to enlarge. Furthermore, since the height of the dam (dam) provided on the card base material is the thickness of the core sheet that encloses the card base material, it is necessary to keep the liquid level of the weir horizontal, and the card thickness can be made uniform. It tends to be difficult. Moreover, in order to make the surface of a core sheet flat, it is necessary to leave the liquid level of a weir until a hardening process is complete | finished, a vibration suppression means is needed, and there exists a tendency for an apparatus to become expensive.

  As described above, if the viscosity of the photocurable resin composition is low, the number of steps for producing a core sheet that encloses the card substrate increases, and the cost tends to increase.

  As the photopolymerizable monomer that can be used in the photocurable resin forming the photocurable resin layer, a radical polymerizable monomer and a cationic polymerizable monomer such as a vinyl ether compound, an oxetane compound, and an epoxy compound can be used.

  The radical polymerizable monomer is a compound having an unsaturated bond capable of radical polymerization and may be any compound as long as it has at least one ethylenically unsaturated bond capable of radical polymerization in the molecule. At least one selected from polymers and the like may be used, or two or more may be used in combination.

  Examples of compounds having an ethylenically unsaturated bond capable of radical polymerization include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid and their salts, esters, urethanes, amides. And radical polymerizable compounds such as various anhydrides, acrylonitrile, styrene, various unsaturated polyesters, unsaturated polyethers, unsaturated polyamides, and unsaturated urethanes.

  Examples include 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, butoxyethyl acrylate, carbitol acrylate, cyclohexyl acrylate, tetrahydrofurfuryl acrylate, benzyl acrylate, bis (4-acryloxypolyethoxyphenyl) propane, neopentyl glycol diacrylate 1,6-hexanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate polyethylene glycol diacrylate, polypropylene glycol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, Dipentaerythri Acrylic derivatives such as methyl tetraacrylate, trimethylolpropane triacrylate, tetramethylol methane tetraacrylate, oligoester acrylate, N-methylol acrylamide, diacetone acrylamide, epoxy acrylate, methyl methacrylate, n-butyl methacrylate, 2-ethylhexyl methacrylate, Lauri methacrylate, allyl methacrylate, glycidyl methacrylate, benzyl methacrylate, dimethylaminomethyl methacrylate, 1,6-hexanediol dimethacrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, trimethylol ethanetri Examples include methacrylic derivatives such as tacrylate, trimethylolpropane trimethacrylate, 2,2-bis (4-methacryloxypolyethoxyphenyl) propane, and allyl derivatives such as allyl glycidyl ether, diallyl phthalate, and triallyl trimellitate. It is done.

  Preferred as the radical photopolymerizable monomer is polyfunctional photopolymerizable (meth) acrylate, and examples include 2,2-bis (4-methacryloyloxyphenyl) propane and 2,2-bis (4-methacryloyloxy-3). , 5-Dibromophenyl) propane, 2,2-bis (4-methacryloyloxyethoxyphenyl) propane, 2,2-bis (4-methacryloyloxyethoxy-3,5-dibromophenyl) propane, 2,2- Bis (4-methacryloyloxyjetoxyphenyl) propane, 2,2-bis (4-methacryloyloxyethoxy-3,5-dibromophenyl) propane, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, trimethylene glycol dimethacrylate diol di Methacrylate, , 2-bis (4-methacryloyloxy-cyclohexyl) propane.

  Moreover, as a cation polymerizable monomer, at least 1 sort (s) selected from a vinyl ether compound, an oxetane compound, an epoxy compound, etc. may be used, or 2 or more types may be used together. An epoxy compound is preferable. Examples of the epoxy compound include bisphenol A epoxy resin, bisphenol AD epoxy resin, bisphenol F epoxy resin, phenol novolac epoxy resin, hydrogenated bisphenol A epoxy resin, cyclic aliphatic epoxy resin, and organic carboxylic acids. Examples thereof include glycidyl ether. Among these, aliphatic epoxy resins are preferable from the viewpoint of the flexibility and heat resistance of the coating film, and alicyclic epoxy resins are particularly preferable.

  As the alicyclic epoxy resin, cyclohexene oxide or cyclopentene obtained by epoxidizing a compound having at least one cyclohexene ring such as cyclohexene or cyclopentene ring with a suitable oxidizing agent such as hydrogen peroxide or peracid. Oxide-containing compounds are preferred.

  Preferred aliphatic epoxy resins include dihydric or polyglycidyl ethers of aliphatic polyhydric alcohols or alkylene oxide adducts thereof, diglycidyl ethers of propylene glycol, or diglycidyl ethers of 1,6-hexanediol. Polyglycidyl ether of polyhydric alcohol such as di- or triglycidyl ether of glycidyl ether, glycerin or its alkylene oxide adduct, diglycidyl ether of polyethylene glycol or its alkylene oxide adduct, diglycidyl ether of polypropylene glycol or alkylene oxide adduct And diglycidyl ethers of polyalkylene glycols. Here, examples of the alkylene oxide include ethylene oxide and propylene oxide.

  In the present invention, a photopolymerization initiator is added to perform the curing reaction more efficiently. The photopolymerization initiator is a radical generator when a radical polymerizable compound as a polymerizable compound is used, and acts as a photoacid generator when a cationic polymerizable compound is used as the polymerization compound. There are two types of radical generators, an intramolecular bond cleavage type and an intramolecular hydrogen abstraction type.

  For example, radical photopolymerization initiators include 2,6-dimethylbenzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2,6-dichlorobenzoyldiphenylphosphine oxide, 2,6 -Acylphosphine oxides such as dimethoxybenzoyldiphenylphosphine oxide. Acylphosphinic esters such as 2,4,6-trimethylbenzoylphenylphosphinic acid methyl ester. αhydroxy, α, α 'dimethyl, 4- (2-hydroxyethoxy) phenyl (2-hydroxy2-2propyl) ketone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-methyl-1, 4- (methylthio) phenyl-2-morpholinopropan-1-one 1, phenyl-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl-phenylketone, 4-diphenoxydichloroacetophenone, diethoxy Acetophenone compounds such as acetophenone and 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one. Examples thereof include benzophenone compounds such as benzophenone, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone 3,3'-dimethyl-4-methoxybenzophenone, and diphenoxybenzophenone. These may be used alone or in combination of two or more.

  Examples of the cationic photopolymerization initiator that can be used in the present invention include ions such as aryldiazonium salts, diarylhalonium salts, triarylsulfonium salts, triphosphonium salts, iron allene complexes, titanocene complexes, and arylsilanol aluminum complexes. Photoacid generator. Nonionic photoacid generators such as nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenol sulfonic acid ester, diazonaphthoquinone, N-hydroxyimide sulfonate and the like can be mentioned. These may be used independently and 2 or more types may be used together.

  As a photopolymerization initiator that can be used in the present invention, a cationic polymerization type photopolymerization initiator has an advantage that curing shrinkage is small and internal stress is hardly generated. The preferred addition amount is preferably 2 to 5 parts by weight, and 3 to 4 parts by weight. When the addition amount of the cationic polymerization type photopolymerization initiator is less than 2 parts by weight, it is not completely cured, the heat resistance is poor, and when it exceeds 5 parts by weight, the effect is saturated and uneconomical, and unreacted polymerization starts. Since the agent remains in the cured product and causes stickiness, it is not preferable.

Examples Hereinafter, the present invention will be described in more detail with reference to examples.

Example 1
An ultraviolet curable adhesive coating solution having the following composition was prepared.

  Here, “parts” represents parts by weight unless otherwise specified.

UV curable adhesive coating composition alicyclic epoxy monomer ... UVR6110 (manufactured by UCC) 67.9 parts ε caprolactone triol ·· TONE301 (manufactured by UCC) 29.1 parts photopolymerization initiator ···・ ・ ・ ・ ・ UVI6970 (UCC) 3.0 parts silica ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ R972 (Nippon Aerosil Co., Ltd.) 120PHR
The viscosity of the coating solution was adjusted to 3000 to 10,000 mPa when the coating solution temperature was 22 ° C to 28 ° C.

  A first ultraviolet curable adhesive layer having a coating thickness of 0.3 mm was formed using a slit die coater on the mounting surface of the card substrate on which the non-contact IC chip and the antenna coil were mounted. . Subsequently, while holding the card base so that the coating surface does not touch the coater bed, a similar coating solution is used on the surface opposite to the mounting surface, and a coating thickness of 0.3 mm is applied using a slit die coater. A second UV curable adhesive layer was provided.

  As an auxiliary sheet, the PET film (Tetron film HS; manufactured by Teijin DuPont Films Co., Ltd.) having a transparency of 38 μm in thickness is laid on the coater bed of the slit die coater with The card substrate is placed so that one of the first and second ultraviolet curable adhesive layers is in contact with the PET film, and the other adhesive film is further bonded to the other adhesive film. The layers were stacked so as to face the coated surface.

  Subsequently, after passing air through a leveler made of a stainless steel roller facing the coater bed adjusted to a gap of 0.6 mm, the glass is made of quartz glass with a spacer having a thickness of 0.25 mm and has transparency. It was sandwiched from above and below with a press plate and tightened using a clamp.

  Subsequently, by using an ultraviolet irradiation device equipped with a belt conveyor, ultraviolet rays are irradiated on each side, the ultraviolet curable adhesive layer is cured, and a card base material on which a non-contact IC and an antenna coil having a thickness of 0.56 mm are mounted. A core sheet to be included was obtained. Moreover, when the surface roughness around the non-contact IC chip of the core sheet was measured, the height difference between the mounting portion and the non-mounting portion was 2 μm to 5 μm.

  A hot melt adhesive sheet (Aron Melt PES; manufactured by Toa Gosei Co., Ltd.) having a thickness of 50 μm is layered on the front and back surfaces of the core sheet, and an upper covering sheet and a lower covering sheet made of a white PET film having a thickness of 125 μm are laminated. A non-contact IC sheet having a built-in non-contact IC chip and antenna coil with a thickness of 0.81 mm was obtained by sandwiching between 0.8 mm spacer press plates and hot pressing at a temperature of 120 ° C. When the surface roughness of the periphery of the non-contact IC chip of the non-contact IC sheet thus obtained was measured, the height difference between the mounting portion and the non-mounting portion was 2 μm to 4 μm.

  A non-contact IC sheet was punched into an ID3 card size to produce a non-contact IC card.

  As a printability, non-contact IC cards were printed on the entire surface using a card printer (PX410; manufactured by PHOENIX Co., Ltd.), and the presence of missing characters around the non-contact IC chip was visually observed. The case where an unreadable character missing occurred was evaluated as x, and the case where an unreadable character missing or character missing did not occur was evaluated as ◯.

  Further, using a wireless IC card reader / writer (RHI-D30; manufactured by Denso Corporation), communication characteristics were evaluated based on whether or not the non-contact IC chip and the antenna coil were disconnected.

  Regarding the communication characteristics, ○ when the wireless IC reader / writer is kept in contact with the non-contact IC card and the communication inspection software is started from the PC and communication is possible. The case where communication was not possible was marked with x.

  The results obtained are shown in the table below.

  If the UV curable adhesive coating solution is too fluid, it will not reach the thickness of the non-contact IC chip mounted on the card substrate, and will be washed away before the auxiliary sheet is laminated. There is a tendency that unevenness of the contact IC chip cannot be buffered, and flatness on the surface of the IC card main body cannot be obtained. In addition, the thickness of the IC card body tends to be non-uniform. Furthermore, if the fluidity is too low, a coating strip remains on the surface of the ultraviolet curable adhesive coating layer, and when the auxiliary sheet is laminated, there is a tendency that the flatness on the surface of the IC card main body cannot be obtained. Moreover, in order to eliminate this application | coating strip, although it can press with a high pressure via the 1st and 2nd auxiliary sheet | seat, there exists a tendency for productivity to worsen. In order to solve these problems and obtain preferable fluidity, the viscosity of the UV curable adhesive coating solution is preferably 3000 mPa · s to 10000 mPa · s when the coating solution temperature is 22 ° C. to 28 ° C. More preferably, it is 5000 mPa · s to 8000 mpa · s.

  When the viscosity of the ultraviolet curable adhesive coating solution is less than 3000 mPa · s, the fluidity is too good, and thus the coating film tends to be unable to maintain a thickness equal to or greater than the thickness of the non-contact IC chip. On the other hand, when the viscosity exceeds 8000 mPa · s, the fluidity of the ultraviolet curable adhesive coating solution is too low, and the coating strip formed when it is extruded from the slit die head is difficult to level. Furthermore, since the viscosity of the ultraviolet curable adhesive coating solution is likely to vary depending on the temperature of the liquid, it is difficult to obtain a desired fluidity. Therefore, it is necessary to control the temperature of the solution.

Comparative Example 1
First, a white PET-G sheet having a thickness of 188 μm (Diafix; manufactured by Mitsubishi Plastics Co., Ltd.) is cut into a size slightly larger than the card substrate on which the non-contact IC chip and the antenna coil are mounted. A punch hole having a size that can accommodate the non-contact IC chip was formed by hitting the position where the non-contact IC chip was mounted.

  Subsequently, the PET-G sheet is overlaid on the formed punch hole so that the non-contact IC chip on the inlet can be accommodated, and the PET-G sheet without the punch hole is laminated on the surface opposite to the mounting surface.

  Next, a 200 μm thick white PET film (Lumirror E22; manufactured by Toray Industries, Inc.) is cut into the same size as the white PET-G sheet, and laminated on the front and back surfaces of the inlet with the PET-G sheet overlaid. To do. Subsequently, the non-contact IC sheet having a thickness of 0.82 mm was prepared by sandwiching the press plate with the spacer having a thickness of 0.8 mm and hot pressing at a temperature of 120 ° C. When the surface roughness around the non-contact IC chip of the completed non-contact IC sheet was measured, the height difference between the mounting portion and the non-mounting portion was 14 μm to 19 μm.

Example 2
A non-contact IC card was prepared in the same manner as in Example 1 except that the PET film as an auxiliary sheet was not used.

  About the obtained non-contact IC card, surface roughness, printability, and communication characteristics were measured.

  As a result, the surface roughness was 1 to 3 μm, the printability and the communication characteristics were good.

Example 3
Instead of applying the UV curable adhesive coating solution on both sides of the card substrate, a non-contact IC card is formed in the same manner as in Example 1 except that it is applied on a pair of auxiliary sheets and adhered to both sides of the card substrate. Created.

  About the obtained non-contact IC card, surface roughness, printability, and communication characteristics were measured.

  As a result, the surface roughness was 4 to 6 μm, the printability and the communication characteristics were good.

Example 4
A non-contact IC card was prepared in the same manner as in Example 1 except that a hot melt adhesive sheet (Aron Melt PES; manufactured by Toa Gosei Co., Ltd.) having a thickness of 50 μm was not applied to the front and back surfaces of the core sheet.

  About the obtained non-contact IC card, surface roughness, printability, and communication characteristics were measured.

  As a result, both the covering sheet and the core sheet did not adhere to each other, resulting in a thin non-contact IC card that deviated from international standards.

Example 5
A surface roughness of 2 was applied in the same manner as in Example 1 except that UV curable resin was applied to both main surfaces of the card base, UV light was irradiated for 2 to 5 seconds, and UV light was irradiated by applying a press plate. The printability and communication characteristics were ○.

  As can be seen from the table, according to the present invention, in the case of a non-contact IC card in which cover sheets are laminated on the upper and lower surfaces of a core sheet having a flatness such that the surface roughness does not exceed 10 μm, A non-contact IC card having good printability on the surface on which the chip is mounted can be obtained.

  Further, according to the non-contact IC card manufacturing method of the present invention, since the disconnection between the non-contact IC chip and the antenna coil does not occur, a non-contact IC card having communication characteristics equivalent to those of the conventional manufacturing method can be manufactured.

Schematic sectional view showing a first example of the configuration of the non-contact type IC card of the present invention Schematic cross section showing the 2nd example of composition of a non-contact type IC card of the present invention Schematic sectional view showing a third example of the configuration of the non-contact type IC card of the present invention The figure showing an example of the process for manufacturing the non-contact-type IC card concerning a 1st example The figure showing a part of process for manufacturing the non-contact-type IC card concerning a 2nd example

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... 2 ... Antenna coil, 3 ... IC chip, 4, 5 ... Photocurable resin layer, 6, 7 ... Cover sheet, 8, 9 ... Auxiliary sheet, 11, 12 ... Hot-melt adhesive layer 10, 20, 30 ... Non-contact IC card

Claims (17)

  A card base on which a non-contact IC chip and an antenna coil are mounted on one main surface of the two main surfaces, and provided on the one main surface via the non-contact IC chip and the antenna coil The first photocurable resin layer obtained, the second photocurable resin layer provided on the other main surface of the two main surfaces, the first photocurable resin layer, and the second photocurable resin layer An IC card comprising: a first cover sheet and a second cover sheet provided on the photocurable resin layer.   A second auxiliary sheet between the first photocurable resin layer and the first cover sheet, and a second between the second photocurable resin layer and the second cover sheet. The IC card according to claim 1, further comprising an auxiliary sheet.   The IC card according to claim 2, wherein the first and second auxiliary sheets have UV transparency.   The IC card according to claim 2 or 3, wherein the first and second auxiliary sheets contain a thermoplastic resin.   A first hot melt adhesive layer between the first cover sheet and the first auxiliary sheet; and a second hot melt adhesive layer between the second cover sheet and the second auxiliary sheet. The IC card according to any one of claims 2 to 4, further provided.   The IC card according to any one of claims 1 to 5, wherein the first and second photocurable resin layers contain a cationic polymerization type photocurable resin. Prepare a card base on which a non-contact IC chip and an antenna coil are mounted on one of the main surfaces,
An uncured first photo-curing resin layer via the non-contact IC chip and the antenna coil on the one main surface, and an uncured second photo-curing property on the other main surface. Applying a resin layer, sandwiching the uncured first photocurable resin layer, the card substrate, and the second photocurable resin layer with first and second press plates, The uncured first and second photocurable resin layers are subjected to ultraviolet irradiation to be cured with ultraviolet light,
After removing the first press plate and the second press plate,
A method for manufacturing an IC card, comprising: laminating a first cover sheet on the first photocurable resin layer and a second cover sheet on the second photocurable resin layer.   Before the ultraviolet irradiation, a first auxiliary sheet and the second press plate and the uncured second light are disposed between the first press plate and the uncured first photocurable resin layer. The method according to claim 7, further comprising a second auxiliary sheet provided between the curable resin layer.   The method of claim 8, wherein the first and second auxiliary sheets are UV transmissive.   The method according to claim 8 or 9, wherein the first and second auxiliary sheets contain a thermoplastic resin.   When laminating the first and second cover sheets, a first hot-melt adhesive layer between the first cover sheet and the first auxiliary sheet, and the second cover sheet and the second The method according to any one of claims 8 to 10, wherein a second hot melt adhesive layer is further provided between the auxiliary sheet and heat bonding is performed.   The method according to any one of claims 8 to 11, wherein the first and second photocurable resin layers include a cationic polymerization type photocurable resin.   13. A method according to any one of claims 7 to 12, wherein the first and second press plates have a teflon treated surface.   The method according to any one of claims 7 to 13, further comprising arranging a spacer between the first and second press plates before the ultraviolet irradiation.   The method according to any one of claims 7 to 14, wherein the first and second press plates have ultraviolet transparency.   The method according to claim 15, wherein the ultraviolet irradiation is performed from both sides of the card substrate.   The uncured first photocurable resin layer, the card base material, and the second photocurable resin layer are preliminarily cured by irradiation with ultraviolet rays, and are narrowed by the first and second press plates. 16. The method according to any one of claims 7 to 15, wherein after the holding, the pre-cured first and second photo-curable resin layers are subjected to ultraviolet irradiation to sufficiently cure the ultraviolet rays. .

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