JP2012056018A - Light guide blanking device and machining method thereof - Google Patents

Light guide blanking device and machining method thereof Download PDF

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JP2012056018A
JP2012056018A JP2010201581A JP2010201581A JP2012056018A JP 2012056018 A JP2012056018 A JP 2012056018A JP 2010201581 A JP2010201581 A JP 2010201581A JP 2010201581 A JP2010201581 A JP 2010201581A JP 2012056018 A JP2012056018 A JP 2012056018A
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blade
cutting
base material
light guide
guide plate
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Matsuo Nakayama
松雄 中山
Hisayuki Yagisawa
久之 八木澤
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KURAMOCHI KK
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Abstract

PROBLEM TO BE SOLVED: To provide a blanking device which forms a cut end face having a superior optical performance as a light guide plate.SOLUTION: The blanking device blanks a light guide plate out of a base material W made of thermoplastic organic glass by holding the base material W between a cutting blade 3 at one side and a receiving blade 4 at the other side and narrowing a gap between the blade edge 3a of the cutting blade 3 and the blade edge 4a of the receiving blade 4 to press-cut the base material W. With respect to the surface of the base material W, the cutting blade 3 is vertical on a product side and has an acute angle on a removal side. With respect to the surface of the base material W, the receiving blade 4 is formed into a trapezoidal shape having a flat blade edge 4a parallel with the surface of the base material W. A blade fixing portion of the cutting blade 3 and a blade fixing portion of the receiving blade 4 have heaters 5b and 6b for heating the cutting blade 3 and receiving blade 4 at temperatures in a range from a softening temperature of the base material W to a liquefying temperature of the same under control by a temperature control unit 7. The cutting blade and the receiving blade are each provided with a blade edge advance control unit that controls the advance, stop, retreat, and advance speed of the cutting.

Description

本発明は電子機器の発光表示部などに使用される導光板のプレスによる打ち抜き加工装置及びその加工方法に関する。   The present invention relates to a punching apparatus using a press for a light guide plate used in a light-emitting display unit of an electronic apparatus and the like, and a processing method thereof.

目視情報を液晶表示する携帯電話やパソコンなどの電子機器の発光表示部などでは、導光板の端面にLEDなどの光源を配して、基材内に光を導き入れて板面に形成した反射ドットなどの乱反射加工部で文字や図形などを光表示することが実施されている。
前記導光板には、ポリメタクリル酸メチル樹脂(以下アクリル樹脂と呼ぶ)やポリカーボネート樹脂などの硬質で高い光透過率を有する有機ガラス製の薄板が電子機器に組み込に可能な所望形状に切断加工して用いられている。
このような導光板の加工において、加工して得られる導光板の端面には表示部分に高い輝度が得られる光の入射性能が要求される。
従来その切断加工においては、破断や亀裂などの発生をさせずに切断端面が均一に加工できるルーター加工が実施されているが、ルーター加工ではワークの周囲に沿って刃を移動させて切断するものなので時間かかかるという難点があった。
In light emitting display parts of electronic devices such as mobile phones and personal computers that display visual information on a liquid crystal, a light source such as an LED is arranged on the end face of the light guide plate, and light is introduced into the base material to form a reflection on the plate surface. Characters and figures are optically displayed at irregular reflection processing parts such as dots.
In the light guide plate, a thin organic glass plate having a high light transmittance such as polymethyl methacrylate resin (hereinafter referred to as acrylic resin) or polycarbonate resin is cut into a desired shape that can be incorporated into an electronic device. It is used as.
In the processing of such a light guide plate, the end face of the light guide plate obtained by processing is required to have a light incident performance that provides high luminance in the display portion.
Conventionally, in the cutting process, the router process that can process the cut end face uniformly without causing breakage or cracks is performed, but in the router process, the blade is moved along the periphery of the workpiece and cut. So there was the difficulty of taking time.

これに対して、プレス機による抜き加工は、型刃で一瞬にワークを切断するため、ルーター加工よりも極めて短時間で加工できる点で大量生産や低コスト化に適しているものの、アクリル樹脂などの導光板が硬質であるために切断部から板面に亀裂が生じて良質な製品を得ることができず、たとえ亀裂なく切断することができても切断端面には破断による凹凸が発生するため、導光板としての十分な光に関する性能が得られないという問題があった。このためこれまでは導光板の切断加工においてプレスによる加工は実施されていない。   On the other hand, punching with a press machine cuts the work instantly with a die blade, so it is suitable for mass production and cost reduction because it can be processed in a much shorter time than router processing, but acrylic resin etc. Because the light guide plate is hard, cracks are generated on the plate surface from the cut portion, so that a good quality product cannot be obtained, and even if it can be cut without cracks, unevenness due to breakage occurs on the cut end surface There is a problem that sufficient light performance as a light guide plate cannot be obtained. For this reason, the processing by a press is not implemented until now in the cutting process of a light-guide plate.

一方、樹脂製カードのプレスによる打ち抜き加工の分野では、樹脂製カード用基材の上下に基材押え用ガイドを備えることで抜き加工でのバリやうねりがない安定した品質の製品を得ようとした下記特許文献1に記載の発明の提案がなされている。
しかしながら、これを導光板の製造に使用したとしても、導光板は基材が薄くて硬質であるため、板厚が約0.6mm以上では亀裂が発生し、板厚が0.6mm未満では亀裂の発生は少なくなるが切断面に破断現象が起こり、また亀裂や破断なく切断できた場合であっても板厚中央部に筋状の破断線が発生するのを防ぐことができず、このため切断端面に導光板としての光性能を得ることはできないのでこの特許文献1に記載の発明を導光板の製造に使用することはできない。
On the other hand, in the field of punching by resin card press, by providing base material pressing guides on the top and bottom of the resin card base material, an attempt is made to obtain a stable quality product free from burrs and undulations in the punching process. The proposal of the invention of the following patent document 1 has been made.
However, even if this is used for the manufacture of a light guide plate, the base material of the light guide plate is thin and hard, so that cracks occur when the plate thickness is about 0.6 mm or more, and cracks when the plate thickness is less than 0.6 mm. However, even if it can be cut without cracks or breakage, it cannot prevent the occurrence of a streak break line at the center of the plate thickness. Since the optical performance as the light guide plate cannot be obtained on the cut end face, the invention described in Patent Document 1 cannot be used for manufacturing the light guide plate.

また、プラスチック製レンズの製造分野では、射出形成後に行われる樹脂製品のゲート部分の切断加工について、下記特許文献2には、ランナー部分の切断の際に切断刃を加熱して微細な切り屑の発生を抑えてレンズ製品に切り屑が付着するのを防止する装置の提案がある。   Further, in the field of plastic lens manufacturing, regarding the cutting process of the gate part of the resin product performed after injection molding, the following Patent Document 2 discloses that the cutting blade is heated during the cutting of the runner part to remove fine chips. There is a proposal of a device that suppresses generation and prevents chips from adhering to the lens product.

特開2001−205597号公報JP 2001-205597 A 特開2005−470099号公報JP 2005-470099 A

しかしながら、上記特許文献2に記載の切断刃を加熱してプレス切断する技術を導光板の製造に用いようとしても、亀裂や切断端面の破断発生に関しては解消可能とはなるものの、切断刃を120〜160℃と高温に加熱するために、その高熱により薄いアクリル樹脂板の湾曲変形を誘発し、アクリル樹脂板の発光表示面の高い平面性と安定性が要求される導光板を得ることが困難となる。このため特許文献2に記載の技術を導光板の製造に使用することはできない。   However, even if the technique of heating and cutting the cutting blade described in Patent Document 2 is used for manufacturing the light guide plate, cracks and breakage of the cut end face can be eliminated, but the cutting blade is 120. It is difficult to obtain a light guide plate that requires high flatness and stability of the light emitting display surface of the acrylic resin plate by inducing bending deformation of the thin acrylic resin plate due to the high heat in order to heat up to ~ 160 ° C. It becomes. For this reason, the technique of patent document 2 cannot be used for manufacture of a light-guide plate.

そこで本発明は、アクリル樹脂などの有機ガラス製導光板のプレスによる打ち抜き加工において、その基材から高い平面性を維持しつつ切断端面に導光板としての優れた光の性能が得られる打ち抜き加工装置及びその加工方法を提供し、従来のルーター加工による方法よりも極めて短時間で高品質な導光板を製造できるようにすることを目的とする。   Therefore, the present invention provides a punching apparatus that can obtain excellent light performance as a light guide plate on the cut end face while maintaining high flatness from the base material in punching processing of an organic glass light guide plate made of acrylic resin or the like. An object of the present invention is to provide a high-quality light guide plate in an extremely short time compared with a conventional router processing method.

上記課題を解決するために、本発明の導光板の打ち抜き加工装置における請求項1に記載の発明にあっては、熱可塑性を有する有機ガラスの基材から得られる導光板を加工対象として、一方側の切り刃と他方側の受け刃との間に前記基材を挟んで該切り刃と受け刃の刃先間を狭めてプレス切断する打ち抜き加工装置であって、前記切り刃は基材の板面に対して加工製品側は垂直且つ除去側は鋭角のレ字型に形成し、前記受け刃は基材の板面に対して平行且つ平坦状の刃先を有した台形状に形成し、前記切り刃及び受け刃を前記基材の軟化温度以上且つ基材が固体から液体に変化する温度以下の温度域に加熱可能としたヒータを前記切り刃及び受け刃の刃固定部に備えたことを特徴とする。   In order to solve the above-mentioned problem, in the invention according to claim 1 in the light guide plate punching apparatus according to the present invention, a light guide plate obtained from a thermoplastic organic glass substrate is used as a processing target. A punching device for press-cutting by sandwiching the base material between a cutting blade on the side and a receiving blade on the other side and narrowing a space between the cutting edge and the cutting edge of the receiving blade, the cutting blade being a base plate The processed product side is perpendicular to the surface and the removal side is formed into an acute-angled letter shape, and the receiving blade is formed in a trapezoidal shape having a blade edge parallel to and flat with the plate surface of the substrate, A heater capable of heating the cutting blade and the receiving blade to a temperature range not lower than the softening temperature of the base material and not higher than the temperature at which the base material changes from solid to liquid is provided in the blade fixing portion of the cutting blade and the receiving blade. Features.

請求項2に記載の発明にあっては、上記発明において、前記切り刃及び受け刃にはそれぞれ切断の進行、停止、後退及び進行速度を制御する刃先進行制御部を備えて成り、前記刃先進行制御部の制御で、加工に際して両刃先が基材の表面に接触したら、基材の表層部の刃先近接部分が軟化するまで一旦停止してから切断を進行可能としたことを特徴とする。   According to a second aspect of the present invention, in the above invention, each of the cutting blade and the receiving blade is provided with a blade edge advancement control unit that controls the progress, stop, retreat, and advancement speed of the cutting, and the blade edge advancement. When both cutting edges come into contact with the surface of the base material during processing under the control of the control unit, the cutting is allowed to proceed after temporarily stopping until the cutting edge proximity portion of the surface layer portion of the base material is softened.

請求項3に記載の発明にあっては、上記発明において、前記ヒータの切り刃及び受け刃の各刃先の温度をそれぞれ加熱制御可能とする温度制御部を設けたことを特徴とする。   The invention described in claim 3 is characterized in that, in the above invention, a temperature control unit is provided which enables heating control of the temperature of each cutting edge of the heater and the receiving blade.

請求項4に記載の発明にあっては、上記発明において、前記切り刃の刃先の加工製品側部分の先端部を5〜9μmの丸面に形成したことを特徴とする。   The invention according to claim 4 is characterized in that, in the above invention, the tip of the processed product side portion of the cutting edge of the cutting blade is formed in a round surface of 5 to 9 μm.

請求項5に記載の発明にあっては、上記発明において、前記受け刃の刃先の平坦部分の幅を0.03〜0.1mmに形成したことを特徴とする。   The invention according to claim 5 is characterized in that, in the above invention, the width of the flat portion of the cutting edge of the receiving blade is 0.03 to 0.1 mm.

請求項6に記載の発明にあっては、上記請求項1から5に記載の導光板の打ち抜き加工装置を使用した打ち抜き加工方法であって、
予め切り刃の刃先を導光板の有機ガラスの基材の軟化温度以上且つ基材が固体から液体に変化する温度以下の温度域にヒータで加熱調整しておく刃先加熱調整工程と、
基材を受け刃の上部の設定された位置にセットする基材投入工程と、
切り刃を基材板面に接触するまで進行させる刃先進行開始工程と、
切り刃が基材の板面に接触後、切り刃の進行を一旦端停止させ、その停止中に前記基材の表層部の刃先近接部分を最適な温度にまで軟化させる基材軟化待機工程と、
切り刃で良好な切断面が得られる適正な速度に制御して切断進行させ、切り刃と受け刃とが近接したら切断完了設定位置で切り刃の進行を停止させる基材せん断工程と、
切り刃を高速で後退させる刃先後退工程と、
切断された導光板を受け刃の上から取り出す製品取出し工程と、
前記製品取出し工程から前記投入工程に戻り、それ以降の工程を何度も繰り返して行う繰返し工程と、
から成り、高性能な導光板を効率良く得られるようにしたことを特徴とする。
In invention of Claim 6, it is the punching method using the punching apparatus of the light-guide plate of the said Claims 1-5,
A blade edge heating adjustment step in which the blade edge of the cutting blade is heated and adjusted with a heater to a temperature range not lower than the softening temperature of the organic glass substrate of the light guide plate and the temperature at which the substrate changes from solid to liquid, and
A base material charging step for setting the base material at a set position above the receiving blade;
A blade edge progression starting step for advancing the cutting blade until it contacts the substrate plate surface;
After the cutting blade comes into contact with the plate surface of the base material, the progress of the cutting blade is temporarily stopped, and during the stoppage, the base material softening standby step of softening the blade tip adjacent portion of the surface layer portion to the optimum temperature; ,
A base material shearing process for controlling the cutting speed to an appropriate speed at which a good cutting surface can be obtained with the cutting blade, and stopping the progress of the cutting blade at the cutting completion setting position when the cutting blade and the receiving blade are close to each other;
A blade tip retraction process for retracting the cutting blade at high speed;
A product take-out process for taking out the cut light guide plate from the top of the blade,
Returning to the input process from the product take-out process, repeated process to repeat the subsequent processes many times,
And is characterized in that a high-performance light guide plate can be obtained efficiently.

請求項7に記載の発明にあっては、上記方法の発明において、前記有機ガラスの基材にアクリル樹脂を用いたことを特徴とする。   The invention according to claim 7 is characterized in that, in the above-mentioned method invention, an acrylic resin is used for the base material of the organic glass.

請求項8に記載の発明にあっては、上記方法の発明において、前記基材軟化待機工程において、切り刃と受け刃の刃先が基材の板面に接触しときに0.2〜3秒の停止時間を設定したことを特徴とする。   In the invention according to claim 8, in the invention of the method described above, in the base material softening standby step, 0.2 to 3 seconds when the cutting edge and the cutting edge of the receiving blade come into contact with the plate surface of the base material. The stop time is set.

請求項9に記載の発明にあっては、上記方法の発明において、前記刃先加熱調整工程において、切り刃と受け刃の刃先温度を60〜110℃の範囲内としたことを特徴とする。   The invention according to claim 9 is characterized in that, in the invention of the method described above, in the blade edge heating adjustment step, the blade edge temperatures of the cutting blade and the receiving blade are in the range of 60 to 110 ° C.

本発明は導光板の原材料の熱可塑性を有する有機ガラス製基材をプレスによって打ち抜き加工する装置が、一方側の鋭角のレ字型に形成した切り刃と他方側の平坦状の受け刃を備え、且つ前記切り刃及び受け刃はヒータで基材の軟化温度に加熱可能となっており、この装置を用いて切断加工する際に、前記基材の切断部分の表面を切り刃及び受け刃の刃先で加熱して基材を軟化させることで、切断中の基材の破断を防止するとともに前記切り刃と受け刃の先端形状による鋭利性の違いと加熱温度の差による軟化度の違いにより前記切り刃と受け刃の異なったせん断抵抗を生じさせ、そのせん断抵抗の違いから切り刃を優先的に切断進行させて、基材の分離痕を前記受け刃側の基材表層部の刃先近接部分部に発生させ、その結果、加工された基材の切断端面に導光板として高い輝度を発現可能な高い光性能を有する端面を形成させることが可能となる。
その際に、前記受け刃は基材表面がポリエチレンや塩化ビニル製の軟質な保護フィルムが被覆されていても、それらは平坦な刃先に加えられた熱で容易に切断されるので、加工の障害にはならず、また導光板の光性能の低下も生じない。
In the present invention, an apparatus for punching an organic glass substrate having thermoplasticity as a raw material of a light guide plate with a press includes a cutting blade formed into an acute-angled letter shape on one side and a flat receiving blade on the other side. The cutting blade and the receiving blade can be heated to a softening temperature of the base material with a heater, and when the cutting process is performed using this apparatus, the surface of the cutting portion of the base material is cut between the cutting blade and the receiving blade. By softening the base material by heating with the blade edge, it prevents the base material from being broken during cutting, and the difference in sharpness due to the tip shape of the cutting blade and the receiving blade and the difference in softness due to the difference in heating temperature The cutting blade and the receiving blade are caused to have different shear resistances, and the cutting blade is preferentially advanced due to the difference in the shearing resistance, so that the separation trace of the base material is close to the edge of the base surface layer portion on the receiving blade side. Generated as a result, the processed base It is possible to form an end surface having a high optical performance capable of expressing high luminance as the light guide plate to cut edge of the.
At that time, even if the base surface is covered with a soft protective film made of polyethylene or vinyl chloride, they are easily cut by the heat applied to the flat blade edge. In addition, the optical performance of the light guide plate is not deteriorated.

前記基材にアクリル樹脂を用いた場合では、刃先が前記基材に食い込む前に基材の表面に0.2〜3秒の設定された停止時間だけ60〜110℃の範囲内に加熱させた刃先を接触させて局部的に軟化させることで切断中の基材の破断を防止することが可能となる。
さらに、該切り刃の切断速度は前記刃先進行制御部の制御によって基材の軟化に要する時間に合わせるよう調整可能であるので、該切り刃のよる硬質な基材の破断を生じさせないように抑制しつつ継続的に正常な切断加工を行うことが可能となる。
In the case of using an acrylic resin for the base material, the surface of the base material was heated in the range of 60 to 110 ° C. for a set stop time of 0.2 to 3 seconds before the cutting edge digged into the base material. It is possible to prevent breakage of the base material during cutting by bringing the cutting edge into contact with the softening locally.
Furthermore, since the cutting speed of the cutting blade can be adjusted to match the time required for softening the base material by controlling the blade edge advancement control unit, it is suppressed so that the hard base material is not broken by the cutting blade. However, it is possible to perform normal cutting continuously.

上記の如き本発明は、基材は切り刃と受け刃を介して局部的には加熱されることはあっても、前記有機ガラスの基材にアクリル樹脂を使用した場合では、切り刃と受け刃の刃先温度を60〜110℃の範囲内とすることで基材全体の温度が大きく上昇することがなく、基材が軟化されても溶融までは発生せず、また基材の板面が熱により変形を起こしたり、熱膨張により寸法変化を生じることのない安定した製品を得ることが可能となる。   In the present invention as described above, the substrate is heated locally through the cutting blade and the receiving blade, but when the acrylic resin is used for the organic glass substrate, the cutting blade and the receiving device are used. By setting the blade tip temperature within the range of 60 to 110 ° C., the temperature of the entire base material does not rise significantly, and even if the base material is softened, it does not occur until melting, and the base plate surface of the base material is It is possible to obtain a stable product that is not deformed by heat and does not undergo dimensional changes due to thermal expansion.

その打ち抜き加工はルーター加工よりも極めて短時間に行うことができるので生産効率を格段に向上させることが可能となる。   The punching process can be performed in a much shorter time than the router process, so that the production efficiency can be remarkably improved.

そして、上記打ち抜き加工装置によって、刃先加熱調整工程、基材投入工程、刃先進行開始工程、基材軟化待機工程、基材せん断工程、刃先後退工程、製品取出し工程及び繰返し工程の各工程を手順通り行うことが可能となり、その結果、高性能な導光板を打ち抜き加工で得ることが可能となる。   Then, by the punching device, the blade heating adjustment process, the substrate charging process, the blade edge advancement start process, the substrate softening standby process, the substrate shearing process, the blade edge retracting process, the product takeout process, and the repetition process are performed according to the procedure. As a result, a high-performance light guide plate can be obtained by punching.

その際、刃先進行制御部を設けることで前記切り刃及び受け刃の切断の進行、停止、後退及び進行速度を制御し、温度制御部を設けることで切り刃と受け刃の刃先の温度を60〜110℃の範囲内で制御することが可能となり、さらに前記受け刃の刃先の平坦部分の幅を0.03〜0.1mmに形成すると、アクリル樹脂板に対して前記切り刃の先端形状と異なる軟化度及び異なるせん断抵抗が生じ、その違いから切り刃を優先的に切断進行させて、基材の分離痕を前記受け刃側の基材表層部の刃先近接部分部に発生させ、高い輝度を発現可能な優れた光性能を有する切断端面に基材を加工することが可能となる。   At that time, by providing a blade edge advancement control unit, the progress, stop, retreat and advancement speed of the cutting blade and the receiving blade are controlled, and by providing a temperature control unit, the temperature of the cutting edge and the blade edge of the receiving blade is set to 60. It becomes possible to control within a range of ˜110 ° C., and further, when the width of the flat part of the blade edge of the receiving blade is formed to 0.03 to 0.1 mm, the tip shape of the cutting blade with respect to the acrylic resin plate Different softening degrees and different shear resistances are generated, and the cutting blade is preferentially advanced from the difference, and the separation trace of the base material is generated in the edge portion adjacent to the base surface layer part on the receiving blade side, resulting in high brightness. It becomes possible to process the base material on the cut end face having excellent optical performance capable of exhibiting.

また、切り刃の刃先を5〜9μmの丸面に形成した場合では、切断端面に全体にほぼ均一な細かい凹凸を形成することが可能となり、この端面から入射させた光性能は単に端面を鏡のように平滑に形成した場合との比較やルーター加工によるものと比較をしても、よりすぐれた高輝度を得ることが可能となる。   In addition, when the cutting edge is formed on a round surface of 5 to 9 μm, it is possible to form almost uniform fine irregularities on the entire cutting end face, and the optical performance incident from this end face is simply a mirror of the end face. Even when compared with the case of smooth formation as described above or with the processing by router processing, it is possible to obtain better high luminance.

本発明の導光板の打ち抜き加工装置の抜き金型部分の要部を示す縦断側面図である。It is a vertical side view which shows the principal part of the die part of the punching apparatus of the light-guide plate of this invention. 基材投入工程を示す縦断側面図である。It is a vertical side view which shows a base material injection | throwing-in process. 基材軟化待機工程を示す縦断側面図である。It is a vertical side view which shows a base-material softening standby process. せん断途中の基材切断工程を示す縦断側面図である。It is a vertical side view which shows the base-material cutting process in the middle of shearing. せん断終了の基材切断工程を示す縦断側面図である。It is a vertical side view which shows the base-material cutting process of the completion | finish of shearing. 刃先後退工程を示す縦断側面図である。It is a vertical side view which shows a blade edge | tip retraction process. 取出し後の基材の繋がった状態を示す縦断側面図である。It is a vertical side view which shows the state with which the base material after extraction was connected. 取出し後の導光板が分離した状態を示す縦断側面図である。It is a vertical side view which shows the state which the light-guide plate after taking out isolate | separated. 基材軟化待機工程を示す刃先周囲の要部の拡大した縦断側面図である。It is the expanded vertical side view of the principal part periphery of a blade edge | tip which shows a base-material softening standby process. せん断終了の基材切断工程における刃先周囲の要部の拡大縦断側面図である。It is an expanded vertical side view of the principal part around the blade edge | tip in the base-material cutting process of completion | finish of a shear. 刃先後退工程を示す刃先周囲の要部の拡大した縦断側面図である。It is the vertical side view which expanded the principal part around a blade edge | tip which shows a blade edge | side retraction process. 取出し後の基材の繋がった状態を示す拡大した縦断側面図である。It is the expanded vertical side view which shows the state with which the base material after extraction was connected. 取出し後の導光板が分離した状態を示す拡大した縦断側面図である。It is the expanded vertical side view which shows the state which the light-guide plate after taking out isolate | separated. 切り刃の鋭利な刃先の縦断側面図である。It is a vertical side view of the sharp blade edge of a cutting blade. 切り刃の丸面状刃先の縦断側面図である。It is a vertical side view of the round blade edge of a cutting blade. 本発明で得られた切り刃の鋭利な刃先で加工した導光板のせん断端面の写真図である。It is a photograph figure of the shear end face of the light-guide plate processed with the sharp blade edge | tip of the cutting blade obtained by this invention. 本発明で得られた切り刃の丸面状の刃先で加工した導光板のせん断端面の写真図である。It is a photograph figure of the shearing end surface of the light-guide plate processed with the round blade edge of the cutting blade obtained by this invention. 図17の拡大写真図である。It is an enlarged photograph figure of FIG. 従来のルーター加工によって得られた導光板の加工面の写真図である。It is a photograph figure of the processed surface of the light-guide plate obtained by the conventional router process. 本発明の導光板の打ち抜き加工工程を示すフロー図であるIt is a flowchart which shows the punching process process of the light-guide plate of this invention.

本発明の導光板の打ち抜き加工装置及びその加工方法を実施するための形態について、先に打ち抜き加工装置から説明する。   The form for implementing the punching apparatus of the light-guide plate of this invention and its processing method is demonstrated from a punching apparatus previously.

本発明の打ち抜き加工装置は、サーボモータ等を駆動源として切断部分の前進、後退、停止及び速度の制御を可能とするプレス機に、図1に示すように、導光板の形状に応じた形状に形成した上側の切り刃3と下側の受け刃4を備えた金型1、2が装着され、製品原料の基材Wである有機ガラス製の薄板を前記金型1、2内に投入してせん断による打ち抜き加工を行い、携帯電話やパソコンなどの電子機器の発光表示部など使用する導光板を得る装置である。   The punching apparatus of the present invention is a press machine that can control the forward, backward, stop, and speed of the cutting portion using a servo motor or the like as a drive source, and has a shape corresponding to the shape of the light guide plate as shown in FIG. The molds 1 and 2 having the upper cutting blade 3 and the lower receiving blade 4 formed in the above are mounted, and a thin plate made of organic glass, which is a base material W of the product raw material, is put into the molds 1 and 2. This is a device for performing a punching process by shearing to obtain a light guide plate used for a light emitting display portion of an electronic device such as a mobile phone or a personal computer.

加工対象の前記基材Wは、ポリメタクリル酸メチル樹脂板(以下アクリル板と呼ぶ)やポリカーボネート樹脂等の熱可塑性樹脂である有機ガラスの薄板であり、例えば前記アクリル板は硬質で透明度が高くこのため導光板として一般的に使用され、80〜100℃程度で軟化変形し始め、ガラス点移転は約110℃でそれ以上の温度で液体化する性質がある。
本発明では前記基材W単独の場合だけではなく、その基材表面に該有機ガラスよりも低温で溶融可能な保護用シートや保護フィルムを張ったものも加工対象とするものである。
The substrate W to be processed is a thin plate of organic glass which is a thermoplastic resin such as a polymethyl methacrylate resin plate (hereinafter referred to as an acrylic plate) or a polycarbonate resin. For example, the acrylic plate is hard and highly transparent. Therefore, it is generally used as a light guide plate, begins to soften and deform at about 80 to 100 ° C., and glass point transfer has a property of becoming liquid at about 110 ° C. or higher.
In the present invention, not only the substrate W alone, but also a substrate in which a protective sheet or a protective film that can be melted at a lower temperature than the organic glass is stretched is processed.

本発明の打ち抜き加工装置は、図1に示すように、前記切り刃3及び受け刃4を備えた上下の金型1、2間に基材Wをセット可能とする周辺の各種補助機構を備え、上側の切り刃3と下側の受け刃4の移動、停止及び速度の制御を可能とする駆動機構及び刃先進行制御部7を備えたプレス機であるが、該プレス機本体や刃先以外の金型1、2の刃金型固定部Aなどは通常使用されている既知の構造なので、以下の装置を示す各図では基材Wの切断加工部の要部を示し、その他の部分は省略して説明する。   As shown in FIG. 1, the punching apparatus of the present invention includes various peripheral auxiliary mechanisms that allow the base material W to be set between the upper and lower molds 1 and 2 including the cutting blade 3 and the receiving blade 4. The press machine is provided with a drive mechanism and a blade edge advancement control unit 7 that can control the movement, stop, and speed of the upper cutting blade 3 and the lower receiving blade 4, but other than the press machine body and the blade edge. Since the blade mold fixing part A of the molds 1 and 2 is a known structure that is usually used, each drawing showing the following apparatus shows the main part of the cutting process part of the substrate W, and the other parts are omitted. To explain.

図1は、本発明の打ち抜き加工装置における打ち抜き加工部の要部を示し、該図1に示すように、前記有機ガラス製薄板の基材Wの上側には、製品側が垂直面で、除去側が傾斜面であるレ字形をあいた刃先3aを形成した切り刃3を取り付けた金型1、2を前記上側の刃金型固定部Aに装着する。
また、基材Wの下側には該基材Wの板面に対して平行面となる平坦状の刃先4aを備えた台形状の受け刃4を備えた金型2を下側の前記刃金型固定部Aに装着する。
そして、前記金型1、2には前記刃先4a、4bの温度を感知するための熱電対5a、6aと電気で発熱させるヒータ5b、6bが埋め込まれ、該熱電対5a、6aとヒータ5b、6bのそれぞれの電気回路には温度制御部5c、6cが接続されて、前記切り刃3及び受け刃4を異なる温度に調整加熱して温度を制御可能とする。
本発明では、前記上下の刃金型固定部Aの一方又は両方を上下方向に移動操作して切り刃3と受け刃4との間を狭めることで基材Wを切断するものであるが、以下前記上側の刃金型固定部Aのみを上下方向に移動操作する場合で説明する。
FIG. 1 shows a main part of a punching section in the punching apparatus of the present invention. As shown in FIG. 1, the product side is a vertical surface and the removal side is above the substrate W of the organic glass thin plate. The molds 1 and 2 to which the cutting blade 3 formed with the cutting edge 3a having a letter shape that is an inclined surface is attached are mounted on the upper blade mold fixing portion A.
Further, the die 2 provided with a trapezoidal receiving blade 4 provided with a flat cutting edge 4a that is parallel to the plate surface of the substrate W is provided below the base W. Attach to mold fixing part A.
The molds 1 and 2 are embedded with thermocouples 5a and 6a for sensing the temperature of the cutting edges 4a and 4b and heaters 5b and 6b for generating heat by electricity, and the thermocouples 5a and 6a and the heater 5b. Temperature control units 5c and 6c are connected to the respective electric circuits 6b, and the temperature can be controlled by adjusting and heating the cutting blade 3 and the receiving blade 4 to different temperatures.
In the present invention, one or both of the upper and lower blade mold fixing parts A are moved up and down to cut the substrate W by narrowing the space between the cutting blade 3 and the receiving blade 4, Hereinafter, the case where only the upper blade mold fixing part A is moved up and down will be described.

まず、前記切り刃3と受け刃4についてより詳細に説明する。
前記切り刃3は、図1に示すように、ストレートの基部の先を楔状のレ字型に形成し、図4に示すように、加工製品側は垂直面であるが除去側は該垂直面に対して25度〜40度の傾斜を有するものを使用する。
そして、その鋭角に形成した先端の刃先3aの形状は、図14に示すように、尖った形状の刃先3aと、図15に示すように、5〜9μmの半径の丸面に形成した形状の刃先3aとが使用でき、製品として要求される用途により選択して使用する。
特に、図15に示す先端を8μmの半径の丸面に形成した切り刃3では、尖った形状に形成されたものに比べ面粗度は粗くなるが入光性能が向上する。
First, the cutting blade 3 and the receiving blade 4 will be described in more detail.
As shown in FIG. 1, the cutting blade 3 is formed in a wedge-shaped letter shape at the tip of a straight base. As shown in FIG. 4, the processed product side is a vertical surface, but the removal side is the vertical surface. The one having an inclination of 25 to 40 degrees to the angle is used.
And, the shape of the cutting edge 3a at the tip formed at the acute angle is as shown in FIG. 14, with a sharp cutting edge 3a and a shape formed on a round surface having a radius of 5 to 9 μm as shown in FIG. The blade edge 3a can be used, and is selected and used according to the application required as a product.
In particular, in the cutting blade 3 having the tip shown in FIG. 15 formed on a round surface with a radius of 8 μm, the surface roughness is rougher than that formed in a sharp shape, but the light incident performance is improved.

前記切り刃3と対向する前記受け刃4は、全体が台形を成し、その先端の刃先4aは基材Wの板面に対して平行面となる平坦状に形成し、アクリル樹脂の基材にはその平坦状部分の幅は数0.03mmから0.2mmに形成したもの使用する。
該受け刃4の基部については、強度や加熱温度の伝播などを勘案して、図1に示すように、基部をストレートにし、その先部分を概ね台形状や、全体を各種山形状などの形成することができる。
The receiving blade 4 facing the cutting blade 3 has a trapezoidal shape as a whole, and the cutting edge 4a at the tip thereof is formed in a flat shape parallel to the plate surface of the substrate W. The flat portion is used with a width of several 0.03 mm to 0.2 mm.
In consideration of the strength and the propagation of the heating temperature, the base of the receiving blade 4 is straight, and the base is formed into a trapezoidal shape or various mountain shapes as a whole as shown in FIG. can do.

次に、金型1、2のヒータ5b、6bによる加熱について説明する。
図1に示すように、上の金型1の温調制御部5cには熱電対5aと発熱するヒータ5bが接続され、また下の金型2の温度制御部6cには熱電対6aと発熱するヒータ6bが接続されており、上の金型1と下の金型2は個々に加熱制御できるようにし、前記切り刃3及び受け刃4との温度を異なる温度で加熱制御を可能とする。
アクリル樹脂板を加工する場合では、上側の切り刃は概ね高めの80〜120℃に、また下側の受け刃4は概ね60〜70℃に設定する。上側の切り刃の設定温度に幅があるのは刃先の形状や品質及びアクリル板の表面硬度により温度を調節する必要があるためである。
その温度の調節は熱電対5a、5bで各刃の温度を確認しつつ、設定温度を越えたらオフにして加熱を停止し、設定温度より低くなったらオンにして加熱することで、常に一定の温度域に温度を上げ下げして行うことが可能となる。
Next, heating by the heaters 5b and 6b of the molds 1 and 2 will be described.
As shown in FIG. 1, a thermocouple 5a and a heater 5b that generates heat are connected to the temperature control section 5c of the upper mold 1, and a thermocouple 6a and heat generation are connected to the temperature control section 6c of the lower mold 2. The upper die 1 and the lower die 2 can be individually controlled to be heated, and the temperature of the cutting blade 3 and the receiving blade 4 can be controlled at different temperatures. .
In the case of processing the acrylic resin plate, the upper cutting edge is set to a generally higher 80 to 120 ° C., and the lower receiving blade 4 is set to a substantially 60 to 70 ° C. The reason why the set temperature of the upper cutting blade is wide is that it is necessary to adjust the temperature according to the shape and quality of the cutting edge and the surface hardness of the acrylic plate.
The temperature is adjusted by checking the temperature of each blade with the thermocouples 5a and 5b. When the temperature exceeds the set temperature, the heating is turned off to stop the heating. It is possible to increase and decrease the temperature in the temperature range.

次に、使用するプレス機について詳しく説明する。
図1に示すように、上の刃金型固定部Aに前記切り刃3の金型1が固定され、前記刃金型固定部Aがプレス機のプレススライド面に支持されており、該プレススライド面が上下に動くことにより上の切り刃3の金型1が上下方向に移動する。
該プレススライド面の上下駆動はサーボモータが動力源となっており。そのサーボモータを刃先進行制御部(図省略)で制御することにより、切り刃3の任意の正確な位置での停止と、昇降移動速度の微細な調整が可能となる。
またプレス機は切断荷重を受けるとフレームに伸びが発生し、停止位置が変化してしまうが、本発明の加工では切り刃3の刃先3aと受け刃4の刃先4aとが接触手前まで接近するので、停止位置が大変重要であり、フレームに伸びが発生しても停止位置が変化しないようサーボモータの制御には、高精度のNC工作機械等に使われているスケールフィードバック機構を用いて正確な位置停止の補正を行う必要がある。
Next, the press machine to be used will be described in detail.
As shown in FIG. 1, the die 1 of the cutting blade 3 is fixed to the upper blade die fixing portion A, and the blade die fixing portion A is supported by a press slide surface of a press machine. As the slide surface moves up and down, the mold 1 of the upper cutting blade 3 moves up and down.
A servo motor is used as the power source to drive the press slide surface up and down. By controlling the servo motor with a blade edge advancement control unit (not shown), it is possible to stop the cutting blade 3 at an arbitrary accurate position and finely adjust the vertical movement speed.
Further, when the press machine receives a cutting load, the frame is stretched and the stop position is changed. However, in the processing of the present invention, the cutting edge 3a of the cutting blade 3 and the cutting edge 4a of the receiving blade 4 come close to contact. Therefore, the stop position is very important, and the servo motor control is accurate using the scale feedback mechanism used in high-precision NC machine tools etc. so that the stop position does not change even if the frame is extended. It is necessary to correct the position stop.

そして、図9に示すように、せん断加工に際しては、前記切り刃3と受け刃4の刃先3a、4aが基材Wの上下の表面8、9に接触したら、その基材Wの上下表層部の刃先近接部分部8a、9aが両刃3、4の接触で軟化するまで、前記切り刃3の進行は一旦停止し、基材Wの刃接触部分が局部的に設定温度以上になったら前記切り刃3の切断を進行して基材Wを抜き加工する。
この際の前記切り刃3の移動速度、停止位置、停止時間の設定はアクリルの厚みや表面硬度及び保護フィルムでの被覆の有無により異なるので任意に設定できる必要がある。
なお、前記基材Wのセットやその基材Wの抜き加工後の製品及び端材の取り出しは、人が行うことと、ロボットアームによって行うこととのどちらでも可能である。
As shown in FIG. 9, when the cutting edge 3 and the cutting edges 3 a and 4 a of the receiving blade 4 come into contact with the upper and lower surfaces 8 and 9 of the base material W, the upper and lower surface layers of the base material W are shown. Until the blade edge adjacent portions 8a and 9a are softened by the contact between the two blades 3 and 4, the cutting blade 3 is temporarily stopped, and when the blade contact portion of the substrate W locally exceeds the set temperature, the cutting is performed. The cutting of the blade 3 proceeds and the base material W is punched.
The setting of the moving speed, stop position, and stop time of the cutting blade 3 at this time varies depending on the acrylic thickness, surface hardness, and the presence or absence of coating with a protective film, so it must be arbitrarily set.
It should be noted that the setting of the substrate W and the removal of the product and the end material after the punching of the substrate W can be performed either by a person or by a robot arm.

以上、本発明の打ち抜き加工装置について説明をしたが、その打ち抜き加工装置を使用して行う打ち抜き加工方法について次に説明する。
本発明の打ち抜き加工方法は、図20に示すように、次ぎの(a)〜(h)の工程順で行われる。
(a)刃先加熱調整工程
予め切り刃の刃先を良好な断面品質を得られる温度になるよう、有機ガラスの基材の軟化温度以上且つ基材が固体から液体に変化する温度以下の温度域にヒータで加熱調整しておく。
(b)基材投入工程
基材を受け刃の上部の設定された位置にセットする。
(c)刃先進行開始工程
切り刃を基材板面に接触するまで進行させる。
(d)基材軟化待機工程
切り刃が基材の板面に接触後、切り刃の進行を一旦端停止させ、その停止中に前記基材の表層部の刃先近接部分を最適な温度にまで軟化させる。
(e)基材せん断工程
切り刃で良好な切断面が得られる適正な速度に制御して切断進行させ、切り刃と受け刃とが近接したら切断完了設定位置で切り刃の進行を停止させる。
(f)刃先後退工程
切り刃を高速で後退させる。
(g)製品取り出し工程
切断された導光板を受け刃の上から取り出す。
(h)繰返し工程
前記製品取出し工程から前記投入工程に戻り、それ以降の工程を何度も繰り返して行う。
そして、以上の(a)〜(h)の工程により高性能な導光板を大量に生産し効率良く得ることが可能となる。
The punching apparatus according to the present invention has been described above. A punching method performed using the punching apparatus will be described below.
As shown in FIG. 20, the punching method of the present invention is performed in the following order of steps (a) to (h).
(A) Cutting edge heating adjustment step The cutting edge of the cutting edge is preliminarily set to a temperature range not lower than the softening temperature of the organic glass substrate and not higher than the temperature at which the substrate changes from solid to liquid. Adjust the heating with a heater.
(B) Substrate loading step The substrate is set at a set position above the receiving blade.
(C) Cutting edge progression starting step The cutting edge is advanced until it contacts the substrate plate surface.
(D) Substrate softening standby step After the cutting blade comes into contact with the plate surface of the base material, the progress of the cutting blade is temporarily stopped, and during the stop, the blade edge proximate portion of the surface layer portion of the base material is brought to an optimum temperature. Soften.
(E) Substrate shearing process The cutting edge is controlled to an appropriate speed at which a good cutting surface can be obtained with the cutting edge, and the cutting is advanced. When the cutting edge and the receiving edge come close to each other, the progress of the cutting edge is stopped at the cutting completion set position.
(F) Cutting edge retraction process The cutting edge is retreated at high speed.
(G) Product removal process The cut light guide plate is taken out from above the blade.
(H) Repeating process The process returns from the product take-out process to the charging process, and the subsequent processes are repeated many times.
And it becomes possible to produce a high performance light-guide plate in large quantities and to obtain it efficiently by the process of the above (a)-(h).

上記各工程について上記装置の図を基にさらに詳しく説明する。
先ず、前記(a)刃先加熱調整工程では、以下の打ち抜き加工の工程に先立って、基材Wをセットする前に、予め切り刃3と受け刃4の各刃先3a、4aを導光板の基材の軟化温度以上且つ基材が固体から液体に変化する温度以下の良好な切断面を得られる温度に個別にヒータ5b、6bで加熱調整しておく。
基材がアクリル樹脂の場合、その板の材質は軟化温度が60〜120℃であるが、本発明では上側の切り刃3は先端部分が狭く形成されているため熱の伝達速度が小さいので概ね高めの80〜120℃に、また下側の台形の受け刃4は概ね60〜70℃に差を付けて設定し、その設定した温度に前記温度制御部5c、6cで制御して加熱する。
前記切り刃3の温度は刃先3aの形状や品質及びアクリル板の表面硬度によりせん断具合を調節するため設定温度を広く選択して対応できるようにする。
なお、基材Wが上記アクリル板の場合、温度が60℃以下であると基材に軟化が起こらないので切断面に破断が起こるので好ましくなく、また120℃以上であると接触部分に溶融が始まり、基材板面波打ち変形が起こり易くなるので好ましくない。
Each of the above steps will be described in more detail based on the drawing of the apparatus.
First, in the (a) cutting edge heating adjustment step, prior to setting the base material W, the cutting edges 3a and 4a of the cutting blade 3 and the receiving blade 4 are previously connected to the base of the light guide plate prior to the following punching process. The heaters 5b and 6b are individually heated and adjusted to a temperature at which a good cut surface not lower than the softening temperature of the material and not higher than the temperature at which the base material changes from solid to liquid can be obtained.
When the base material is an acrylic resin, the material of the plate has a softening temperature of 60 to 120 ° C. However, in the present invention, the upper cutting blade 3 is formed with a narrow tip portion, so the heat transfer speed is low, so The lower trapezoidal receiving blade 4 is set to a high temperature of 80 to 120 ° C., and is set with a difference of about 60 to 70 ° C., and the temperature is controlled by the temperature control units 5c and 6c to be heated.
The temperature of the cutting blade 3 can be set by selecting a wide range of set temperatures in order to adjust the shear condition according to the shape and quality of the blade edge 3a and the surface hardness of the acrylic plate.
In addition, when the substrate W is the above-mentioned acrylic plate, it is not preferable that the temperature is 60 ° C. or lower because the substrate does not soften. In the beginning, it is not preferable because corrugated deformation of the base plate tends to occur.

次に、前記(b)基材投入工程では、図2に示すように、前記基材Wを受け刃4の上に基材Wをセットするが、このセット位置は予め設計された位置に正確にセットする。このセット位置は、ドットパターン等の前加工が施されている基材でも効果的な輝度がドットパターンに得られるように加工形状が予め設計さるので、その設計通りに加工できる位置に基材を正確にセットする。基材のセット位置決め方法はプレス加工における既知の方法となるので説明は省略する。   Next, in the (b) base material charging step, as shown in FIG. 2, the base material W is set on the receiving blade 4 as shown in FIG. Set to. This set position is designed in advance so that the effective brightness can be obtained in the dot pattern even if the substrate is pre-processed, such as a dot pattern. Set correctly. Since the set positioning method of the base material is a known method in press working, description thereof is omitted.

次に、前記(c)刃先進行開始工程では、前記刃先進行制御部でプレス機の制御装置に設定した刃先進行条件で、前記切り刃3及び受け刃4の刃先3a、4aを基材Wの上下の表面8,9に接触させるまで上側の切り刃3を進行させる。
このとき、基材投入工程での前記基材Wのセットは、図2に示すように、前記基材Wが受け刃4の刃先4aに乗って接触状態となるので、受け刃の設定温度が70℃以上の場合は基材を浮かせておくリフトピン(図省略)を金型2に設けると基材Wが金型2から離れるので金型2の熱が基材Wまで殆ど届かず、基材の熱による変形を防ぐことができる。
この工程では、図3に示すように、前記切り刃3が該基材Wに表面に接触するまでは、生産効率を上げるためと熱による基材板面の反りなどの変形が防げるために、プレス機の持っている最大の速度で降下させると良い。
Next, in the (c) cutting edge advancement starting step, the cutting edges 3a and 4a of the cutting blade 3 and the receiving blade 4 are placed on the substrate W under the cutting edge advance conditions set in the control device of the press machine by the cutting edge advancement control unit. The upper cutting blade 3 is advanced until it contacts the upper and lower surfaces 8 and 9.
At this time, the base material W is set in the base material charging step, as shown in FIG. 2, because the base material W rides on the cutting edge 4a of the receiving blade 4 and comes into contact. In the case of 70 ° C. or higher, if the mold 2 is provided with a lift pin (not shown) for floating the base material, the base material W is separated from the mold 2, so that the heat of the mold 2 hardly reaches the base material W. Can be prevented from being deformed by heat.
In this step, as shown in FIG. 3, until the cutting blade 3 comes into contact with the surface of the substrate W, in order to increase production efficiency and to prevent deformation such as warpage of the substrate plate surface due to heat, It is better to descend at the maximum speed that the press has.

次に、前記(d)基材軟化待機工程では、図3に示すように、前記切り刃3が基材の表面に接触後、対向する受け刃4との間に基材Wを接触状態で挟んで前記切り刃3の進行を一旦端停止させる。
そして、前記切り刃3が停止中の基材の表面8,9に前記切り刃3と受け刃4の刃先3a、4aを接触させたままで前記基材の表層部の刃先近接部分8a、9aを前記刃先3a、4aの熱で最適な温度にまで軟化させる。図9では刃先近接部分8a、9aの軟化された部分を黒く表示している。
前記刃先近接部分8a、9aを軟化するのに必要な前記切り刃3の待機時間は基材Wの板厚や硬度により異なるが、0.2mm厚さの一般的なアクリル板では約0.4秒、0.4mmのアクリル板では約1秒が適した停止時間である。このように、前記切り刃3の進行の停止時間は基材Wの種類や厚さ、硬度を考慮して最良の時間の設定を行うこととする。
しかし、停止時間が長過ぎると軟化が進み過ぎて、切断加工後の基材8a、9a部分にダレが発生するおそれがあるので好ましくない。また停止時間が短過ぎる軟化が不十分となって切断端面の異常な破断が生じるおそれがあるので好ましくない。
なお、切り刃3が該基材Wに表面に接触するまでは、生産効率を上げる為にプレス機の持っている最大の速度で降下させると良い。
Next, in the substrate softening standby step (d), as shown in FIG. 3, after the cutting blade 3 contacts the surface of the substrate, the substrate W is brought into contact with the opposing receiving blade 4. The advancement of the cutting blade 3 is temporarily stopped while being sandwiched.
And the cutting edge proximity portions 8a and 9a of the surface layer portion of the base material are kept in contact with the cutting edges 3a and 4a of the receiving blade 4 on the surfaces 8 and 9 of the base material on which the cutting blade 3 is stopped. The cutting edges 3a and 4a are softened to an optimum temperature by heat. In FIG. 9, the softened portions of the blade edge adjacent portions 8a and 9a are displayed in black.
The waiting time of the cutting blade 3 necessary for softening the blade edge adjacent portions 8a and 9a varies depending on the plate thickness and hardness of the substrate W, but is about 0.4 for a general acrylic plate having a thickness of 0.2 mm. For a second, 0.4 mm acrylic plate, about 1 second is a suitable stop time. Thus, the time for stopping the advancement of the cutting blade 3 is set to the best time in consideration of the type, thickness, and hardness of the substrate W.
However, if the stop time is too long, the softening progresses too much, and sagging may occur in the base material 8a, 9a after the cutting process, which is not preferable. Moreover, since the softening whose stop time is too short is insufficient and there is a possibility that the cut end face may be abnormally broken, it is not preferable.
In addition, until the cutting blade 3 contacts the surface of the substrate W, it is preferable to lower it at the maximum speed of the press machine in order to increase production efficiency.

次に、前記(e)基材せん断工程では、図4に示すように、基材Wの表層部の刃先近接部分8a、9aの局部的に基材Wが軟化した部分から基材Wの内部に切り刃3の刃先3aを侵入させ、基材の切断を開始すると前記切り刃3の刃先3aは、図4に示すように、降下移動しつつ継続的なせん断加工が進む。
このとき刃先3aの切断進行速度は良好な切断面が得られる適正な速度(軟化は促進するが溶解しない速度)に前記刃先進行制御部で制御するが、切り刃3の刃先3aは継続的にせん断加工を行いながら降下進行する。
また、このとき下側の受け刃4は対向面が僅かに平坦部を有しているのでせん断抵抗が高く、基材Wは表層部の刃先近接部分9aが刃先4aの温度を受けて軟化しているので、図10に示すように、平坦な刃先4aは基材Wに極僅かに陥没状態になって食い込む。
そして前記切り刃3の刃先3aは、降下進行して下側の受け刃4の刃先4aとの間隔を10〜20μm保った位置で停止させる。このように対向した両刃先3a、4aを直接接触させないのは刃先同士の接触破損を防ぐためである。
Next, in the (e) base material shearing step, as shown in FIG. 4, the inside of the base material W is started from the portion where the base material W is locally softened in the blade edge proximate portions 8 a and 9 a of the surface layer portion of the base material W. When the cutting edge 3a of the cutting blade 3 is caused to enter and the cutting of the base material is started, the cutting edge 3a of the cutting blade 3 is lowered and moved continuously as shown in FIG.
At this time, the cutting speed of the cutting edge 3a is controlled by the cutting edge progress control unit at an appropriate speed (a speed at which softening is promoted but not melted) at which a good cut surface is obtained. The descent proceeds while shearing.
At this time, since the lower receiving blade 4 has a slightly flat portion on the opposite surface, the shear resistance is high, and the base material W is softened when the blade edge adjacent portion 9a of the surface layer receives the temperature of the blade edge 4a. Therefore, as shown in FIG. 10, the flat cutting edge 4 a bites into the substrate W in a slightly depressed state.
The cutting edge 3a of the cutting blade 3 is lowered and stopped at a position where the distance from the cutting edge 4a of the lower receiving blade 4 is kept at 10 to 20 μm. The reason why the opposing blade edges 3a and 4a are not in direct contact is to prevent contact damage between the blade edges.

前記受け刃4の刃先4aが基材Wに僅かに陥没状態に食い込む影響については、切断時に発生するバリの抑制と、バリが発生しても発生箇所が基材表面でなく、切断面の一部になるのでバリの悪影響を低減させる効果がある。また基材への食い込みは切断端面の表面間際のごく一部なので、図16の写真図に示すように加工後に得られた導光板の光性能には、影響は殆ど見られない。   Regarding the influence that the cutting edge 4a of the receiving blade 4 slightly bites into the base material W, suppression of burrs that occur during cutting and the occurrence of burrs are not on the surface of the base material but on the cutting surface. Therefore, it has the effect of reducing the adverse effects of burrs. Further, since the bite into the base material is only a part of the edge of the cut end face, there is almost no effect on the optical performance of the light guide plate obtained after processing as shown in the photograph of FIG.

以上の如く前記切り刃の刃先3aと受け刃の刃先4aとは10〜20μmの距離を残して切断工程が完了することから、図12に示すように、切断直後には下側の受け刃4の直上部分は完全には分離されずに僅かに繋がった状態となっているが、その残った僅かな基材部分は、軟化程度が僅かであれば切り刃3の刃先3aの楔形状により破断が発生して自然に分離し、また図13に示すように、軟化程度が進んでいれば僅かな外力により分離可能な状態となる。   As described above, since the cutting step is completed with the cutting edge 3a of the cutting blade and the cutting edge 4a of the receiving blade leaving a distance of 10 to 20 μm, the lower receiving blade 4 is immediately after cutting as shown in FIG. The part directly above is not completely separated but is slightly connected, but the remaining part of the base material is broken by the wedge shape of the cutting edge 3a of the cutting edge 3 if the degree of softening is slight. Is generated and separated spontaneously, and as shown in FIG. 13, if the degree of softening has progressed, it can be separated by a slight external force.

次の、前記(f)刃先後退工程では、図6に示すように、前記基材Wをせん断加工後、前記切り刃3を前記受け刃4から高速で後退させる(基材Wから切り刃3が離れた状態を図11に示す)。この速度は生産効率を上げるために前記刃先進行制御部で制御してプレス機の持っている最大の速度で切り刃3を後退させると良い。   In the next (f) cutting edge retreating step, as shown in FIG. 6, after the base material W is sheared, the cutting blade 3 is retreated at a high speed from the receiving blade 4 (from the base material W to the cutting edge 3). Is shown in FIG. 11). In order to increase the production efficiency, this speed may be controlled by the blade edge advancement control unit, and the cutting blade 3 may be moved backward at the maximum speed possessed by the press.

次に、前記(g)製品取出し工程では、図6に示すように、基材Wのせん断後、前記切り刃3を上昇させ最上位置にて停止させ、図8に示すように、切断加工された導光板W1を前記切り刃3及び受け刃4の間から速やかに取り出して導光板W1を得る。
このとき、導光板W1以外の部分の端切れである外側端材W2も一緒に取り出し除去する。
この導光板W1と外側端材W2とは、図7に示すように、基材Wが切断溝部分Kで僅かに接続した状態で取り出しても良い。その場合、導光板W1と外側端材W2が同時に取り出せるのでその後に僅かな外力を加えて分離すれば良いので、外側端材W2の除去も容易となる。
Next, in the (g) product take-out step, as shown in FIG. 6, after the base material W is sheared, the cutting blade 3 is raised and stopped at the uppermost position, and is cut as shown in FIG. The light guide plate W1 is quickly taken out from between the cutting blade 3 and the receiving blade 4 to obtain the light guide plate W1.
At this time, the outer end member W2, which is a cut end of a portion other than the light guide plate W1, is also taken out and removed together.
The light guide plate W1 and the outer end member W2 may be taken out in a state where the substrate W is slightly connected at the cutting groove portion K as shown in FIG. In that case, since the light guide plate W1 and the outer end member W2 can be taken out at the same time, the outer end member W2 can be easily removed because a slight external force is applied thereafter.

前記基材に保護フィルムが被服してある状態で切断加工を行なった場合には、切り刃3の刃先3aと受け刃4の刃先4aとの距離を10〜20μm残してせん断工程が完了することから、受け刃4aに接する保護フィルムだけを残して基材は完全にせん断される。この状態は基材シート1枚から複数の導光板を抜き加工する際に、導光板W1と外側端材W2とが保護フィルムを介して接続していることから、金型から導光板W1と外側端材W2を取り出す作業が基材シート1枚分に要する複数回の抜き加工後に一度に行うことができるため生産効率を高めることが可能となる。   When cutting is performed in a state where the substrate is covered with a protective film, the shearing process is completed with the distance between the cutting edge 3a of the cutting blade 3 and the cutting edge 4a of the receiving blade 4 remaining 10 to 20 μm. Thus, the substrate is completely sheared, leaving only the protective film in contact with the receiving blade 4a. In this state, the light guide plate W1 and the outer end member W2 are connected via a protective film when a plurality of light guide plates are punched from one base sheet, so that the light guide plate W1 and the outer side are connected from the mold. Since the operation of taking out the end material W2 can be performed at once after a plurality of punching processes required for one base sheet, the production efficiency can be increased.

(比較試験例)
次に本発明との比較のため雄雌型を用いた打ち抜き加工についての実験を行った結果を記載する。
雄雌型は10μm程度のクリアランスで雄刃と雌刃が交差することから膨張が発生する加熱を行うことができないので常温でのプレス加工実験となった。
アクリル基材厚が0.6以上の基材を打ち抜きした場合、基材を分断するような割れが発生してしまい商品にならなかった。アクリル基材厚0.6未満の基材を打ち抜きした場合、基材を分断するような割れは発生しなかったが、板厚中央付近に2次せん断が発生し、また2次せん断部分の上下両側に大きな破断部分が発生した。したがってこの場合でも導光板としての要求品質の端面を得ることはできなかった。
(Comparative test example)
Next, for comparison with the present invention, the results of experiments on punching using male and female dies will be described.
The male and female molds were pressed at room temperature because the male blade and the female blade crossed with a clearance of about 10 μm and cannot be heated to cause expansion.
When a base material with an acrylic base material thickness of 0.6 or more was punched, a crack that would cause the base material to sever occurred and did not become a product. When a base material with an acrylic base material thickness of less than 0.6 was punched, no cracks that would break the base material occurred, but secondary shear occurred near the center of the plate thickness, and the top and bottom of the secondary shear part Large fractures occurred on both sides. Therefore, even in this case, the end face of the required quality as the light guide plate cannot be obtained.

また、本発明の装置を使い加熱しないでアクリル基材を打ち抜き加工した場合は、板厚中央付近に2次せん断が発生した。また、切り刃3及び受け刃4の温度を基材のガラス転移点の温度120℃以上に加熱した場合には、基材の板面に波打ち変形を生じ、また断面された端面は基材Wの液状化した樹脂が熱変形して鏡面化され、正常な導光板を得ることはできなかった。   In addition, when the acrylic substrate was punched without heating using the apparatus of the present invention, secondary shear occurred in the vicinity of the thickness center. Further, when the temperature of the cutting blade 3 and the receiving blade 4 is heated to a temperature of 120 ° C. or more at the glass transition point of the base material, the plate surface of the base material undergoes undulation deformation, and the cross-sectioned end surface is the base material W. The liquefied resin was thermally deformed and mirror-finished, and a normal light guide plate could not be obtained.

本発明の上記導光板の打ち抜き加工装置によって上記加工工程で導光板を抜き加工して導光板として好ましい光性能を有する切断端面を備えた導光板が得られるが、次に、さらに具体的に基材Wを厚さ0.4mmのアクリル板を用いて上記打ち抜き加工装置によって導光板を得る場合の実施例を以下説明する。   The light guide plate having the cut end surface having a preferable optical performance as the light guide plate is obtained by punching the light guide plate in the processing step by the light guide plate punching apparatus of the present invention. An example in which the light guide plate is obtained by the punching apparatus using an acrylic plate having a thickness of 0.4 mm as the material W will be described below.

アクリル板の基材は上記のように、熱可塑性があり、透明度が高く、樹脂としては高い硬度を有し、非結晶質プラスチックで60〜100℃程度となると軟化変形し始め、ガラス点移転は110〜120℃で、それ以上の温度で液体化する性質がある。
したがって、このようなアクリル板の物性に合わせて装置の加工条件を設定する。
具体的には、前記刃先加熱工程において、前記切り刃3と受け刃4の設定温度は、温度制御部5c、6cで上下別々に制御し、切り刃3を有する上の金型1は100℃に設定し、受け刃4を有する下の金型2は70℃に設定した。
As described above, the base material of the acrylic plate is thermoplastic, has high transparency, has a high hardness as a resin, and starts to soften and deform when it is an amorphous plastic at about 60 to 100 ° C. It has a property of being liquefied at a temperature of 110 to 120 ° C. or higher.
Therefore, the processing conditions of the apparatus are set according to the physical properties of such an acrylic plate.
Specifically, in the blade edge heating step, the set temperatures of the cutting blade 3 and the receiving blade 4 are controlled separately by the temperature control units 5c and 6c, and the upper mold 1 having the cutting blade 3 is 100 ° C. The lower mold 2 having the receiving blade 4 was set to 70 ° C.

また、前記基材軟化待機工程において、前記プレス機の制御は、切り刃3と受け刃4の刃先3a、4aが基材Wの上下の表面8、9に接触したときに切り刃3と受け刃4の進行を1秒間停止した後、前記基材せん断工程において、上側の切り刃3を下側の受け刃4の方へ進行させ、基材Wを切断後、前記切り刃3及び受け刃4を基材Wから後退させた。
このときの切り刃3と受け刃4のせん断速度は、0.4mm/sec程度とした。
そして、前記製品取出し工程において、切り刃3及び受け刃4の間からせん断加工した基材Wを取り出して、せん断面から入射した光から高い輝度が得られる導光板W1が得られた。
In the base material softening standby step, the press machine controls the cutting blade 3 and the receiving edge 4 when the cutting edges 3 and 4a of the receiving blade 4 come into contact with the upper and lower surfaces 8 and 9 of the base material W. After the progress of the blade 4 is stopped for 1 second, in the base material shearing step, the upper cutting blade 3 is advanced toward the lower receiving blade 4, and after cutting the base material W, the cutting blade 3 and the receiving blade 4 was retracted from the substrate W.
The shear rate of the cutting blade 3 and the receiving blade 4 at this time was about 0.4 mm / sec.
And in the said product taking-out process, the base material W sheared from between the cutting blade 3 and the receiving blade 4 was taken out, and the light-guide plate W1 from which high brightness | luminance was obtained from the light which injected from the shearing surface was obtained.

上記打ち抜き加工装置及びその加工方法で打ち抜き加工された導光板W1の切断端面は、板表面に対し垂直であり、平坦な面となっているが、上記丸面の形成した刃先を用いた場合と鋭利な刃先を用いた場合とでは下記の如く異なったものが得られた。これを以下の写真図16〜18に示す。   The cut end surface of the light guide plate W1 punched by the punching apparatus and the processing method is perpendicular to the plate surface and is a flat surface, and the case where the cutting edge formed with the round surface is used. What was different from the case of using a sharp cutting edge was obtained as follows. This is shown in the following photo FIGS.

図16の写真図は、切り刃の刃先3aに図14の如く鋭利な刃先の切り刃を用いて切断加工した導光板の断面を電子顕微鏡の170倍で観察したものである。
図17の写真図は、切り刃の刃先3aに図15の如く丸面に形成した刃先の切り刃を用いて切断加工した導光板の断面を電子顕微鏡の170倍で観察したものである。
図18の写真図は、図17の断面をさらに電子顕微鏡の500倍で観察したものである。
図16では、切り刃に鋭利な刃先の切り刃を用いた場合は、一部に引き摺ったような切断方向に並んだ細かい凹凸が見られるが全体としては均一な平面であり一般的なせん断加工に見られる破断現象の発生はないことが確認できる。
図17では、切り刃に丸面の形状の刃先を用いて加工した場合であり、表面部分に殆ど溝が見られないが端面の中央ほぼ全面に細かな深い溝が連なって全体で平坦化した面を構成している。
なお、比較のために、従来のルーター加工による場合の切断端面を図19で示した。この加工端面には板面と平行な多くの刃回転条痕とこの条痕に直交する筋が認められる。
The photograph of FIG. 16 is an observation of the cross section of the light guide plate cut with a sharp blade edge 3a as shown in FIG.
The photograph of FIG. 17 is an observation of a cross section of a light guide plate cut using a cutting edge having a round surface as shown in FIG.
The photograph of FIG. 18 is a cross-sectional view of FIG. 17 further observed at 500 times the electron microscope.
In FIG. 16, when a cutting blade with a sharp edge is used as the cutting blade, fine irregularities arranged in the cutting direction as if dragged in part are seen, but the whole is a uniform flat surface and is generally sheared. It can be confirmed that there is no occurrence of the breaking phenomenon seen in FIG.
FIG. 17 shows a case where the cutting edge is processed by using a round-shaped cutting edge, and almost no groove is seen on the surface portion, but a fine deep groove is connected to almost the entire center of the end face to be flattened as a whole. Make up surface.
For comparison, FIG. 19 shows a cut end face in the case of conventional router processing. On this processed end face, many blade rotation streaks parallel to the plate surface and streaks perpendicular to the streaks are recognized.

上記実施例で得られた導光板のせん断面について性能評価に実験をした。
下記表1は、「ルーター加工」による場合と、本発明の図14に示した切り刃3に鋭利な刃先3a「鋭利刃加工」を用いた場合と、本発明の図15に示した切り刃3の丸面の刃先3a「丸面刃加工」を用いた場合との各場合のおける、四角板の板面の4角寄り部位と中央部位の5箇所に光表示用の反射ドットを設けた導光板のそれぞれの輝度を測定した試験結果の比較データである。
An experiment was conducted to evaluate the performance of the shear plane of the light guide plate obtained in the above example.
Table 1 below shows the case of “router processing”, the case of using the sharp cutting edge 3a “sharp blade processing” for the cutting blade 3 shown in FIG. 14 of the present invention, and the cutting blade shown in FIG. 15 of the present invention. Reflective dots for light display were provided at five locations on the four corners and the central portion of the plate surface of the square plate in each of the cases of using the round blade edge 3a “round blade processing”. It is comparison data of the test result which measured each brightness | luminance of the light-guide plate.

Figure 2012056018
Figure 2012056018

上記表1では、輝度の平均値がルーター加工による場合(この切断端面を図19で示す)では16.8Cd/mであるのに対して、本発明の鋭利な刃先による場合(この切断端面を図16で示す)が16.9Cd/mであり、丸面に形成した刃先による場合(この切断端面を図17で示す)が20.8Cd/mと高い数値となっている。
このときの切断条件は、下記(1)〜(5)である。
(1)「鋭利刃加工」では刃先3aに約30度勾配を持った鋭利な刃を使用
(2)「丸面刃加工」では刃先3aに8μmの半径に形成した丸面の刃先を使用。
(3)受け刃4には刃先4aの平坦状部分の幅は0.04mmのものを使用。
(4)切り刃3の刃先3aの温度は100℃、受け刃4の刃先4aの温度は70℃に設定。
(5)基材軟化待機工程での基材Wの板表面8、9に接触した時の停止時間を1秒に設定。
In Table 1 above, when the average luminance value is 16.8 Cd / m 2 when the average value of brightness is obtained by router processing (this cut end face is shown in FIG. 19), the case where the sharp edge of the present invention is used (this cut end face) 16) is 16.9 Cd / m 2 , and the case of using a cutting edge formed on a round surface (this cut end surface is shown in FIG. 17) is a high value of 20.8 Cd / m 2 .
The cutting conditions at this time are the following (1) to (5).
(1) “Sharp blade machining” uses a sharp blade with a gradient of about 30 degrees for the blade edge 3a. (2) “Round blade machining” uses a round blade edge formed at a radius of 8 μm for the blade edge 3a.
(3) The receiving blade 4 uses a blade with a flat part width of 0.04 mm.
(4) The temperature of the cutting edge 3a of the cutting blade 3 is set to 100 ° C, and the temperature of the cutting edge 4a of the receiving blade 4 is set to 70 ° C.
(5) The stop time when contacting the plate surfaces 8 and 9 of the substrate W in the substrate softening standby step is set to 1 second.

本発明で得られた導光板では、上記の実験データに示されるようにルーター加工による場合よりは「丸面刃加工」と「鋭利刃加工」とのいずれでも優れていることが確認できる。
なお、上記(1)〜(5)のうち、刃先の丸面を12μmの半径に形成したものや、刃先をこれらとは温度設定と異なる温度で切断した場合には、切断面に破断が発生したり溶けてしまったりと平坦な切断面を得ることは出来なかった。また、鋭利刃加工において刃先を更に磨いて鋭利性を上げた場合は端面の一部に発生した図16に示すような引き摺ったような細かい凹凸も殆どなくなった。
It can be confirmed that the light guide plate obtained by the present invention is superior to both “round blade processing” and “sharp blade processing” as compared with the case of router processing as shown in the above experimental data.
Of the above (1) to (5), if the round surface of the cutting edge is formed with a radius of 12 μm, or if the cutting edge is cut at a temperature different from these, the cut surface will break. It was not possible to obtain a flat cut surface as it melted or melted. Further, when sharpening was performed by further sharpening the blade edge in sharp blade processing, there was almost no dragged fine irregularities as shown in FIG.

次に、別の導光板の切断端面について性能評価に試験をした。
この試験は導光板としての性能を要求される輝度についての測定試験である。
その結果が下記表2及び表3である。
Next, a performance evaluation was performed on a cut end face of another light guide plate.
This test is a measurement test for luminance that requires performance as a light guide plate.
The results are shown in Tables 2 and 3 below.

Figure 2012056018
Figure 2012056018

Figure 2012056018
Figure 2012056018

上記表2及び表3は、従来の「ルーター加工」で得られた導光板と本発明の「鋭利刃加工」で得られた導光板との輝度の違いを比較したデータである。
上記表3では厚さt=0.4mm、表4では厚さt=0.5mmの各アクリル板を使用した試験結果である。
試験体には、5箇所の反射ドットのパターン印刷を施した導光板を用いた。
輝度の単位はCd/mである。
また光源のLEDの入力電圧は13V(0.68mA)であり、いずれも切断端面から入射した。
なお、上記各表の数値は板面から放出される光の強さ(輝度)を示している。
また測定点の1、2、3、4、5は、四角板の導光板板面の4角寄り部位の左上の1、左下の2、右上の4、右下の5と中央部位の3との5箇所に設けた光表示用の反射ドットを示している。
Tables 2 and 3 are data comparing the difference in luminance between the light guide plate obtained by the conventional “router processing” and the light guide plate obtained by the “sharp blade processing” of the present invention.
In Table 3 above, the test results using each acrylic plate having a thickness t = 0.4 mm and in Table 4 using a thickness t = 0.5 mm are shown.
As the test body, a light guide plate on which pattern printing of five reflective dots was performed was used.
Unit of luminance is Cd / m 2.
Moreover, the input voltage of LED of the light source was 13V (0.68 mA), and all entered from the cut end face.
In addition, the numerical value of each said table | surface has shown the intensity | strength (luminance) of the light discharge | released from a board surface.
Also, 1, 2, 3, 4, and 5 of the measurement points are 1 at the upper left corner, 2 at the lower left corner, 4 at the upper right corner, 5 at the lower right corner, and 3 at the middle portion of the square light guide plate surface. The reflective dots for light display provided at the five locations are shown.

上記の各表にあるように平均値で0.4mm厚のアクリル板ではルーター加工が23.473Cd/mに対して本発明は24.635d/mであり、0.5mm厚のアクリル板ではルーター加工が24.809Cd/mに対して、本発明は24.829Cd/mであり、この数値から本発明の加工品ではルーター加工の製品よりもいずれの場合でも良好な結果が得られることが確認できた。 As shown in the above tables, with an acrylic plate having an average value of 0.4 mm, the router processing is 23.473 Cd / m 2 whereas the present invention is 24.635 d / m 2 , and the acrylic plate has a thickness of 0.5 mm. The router processing is 24.809 Cd / m 2, while the present invention is 24.829 Cd / m 2 , and from this figure, the processed product of the present invention gives better results in any case than the router processed product. It was confirmed that

本発明の鋭利な切り刃の刃先3aで切断した図16に表れる切断面は、均一な平坦であり透明性を有していることから、ルーター加工と比べても入光性が劣らないものと思われる。
またこれに比較して本発明の丸面に形成した切り刃の刃先3aで切断した図17に表れる切断端面では、全体に細かい溝が連なり、前記図16の場合よりは入射する光が少なくなると考えられたが、実際にはそうではなく、上記実施例中の表1の試験結果をみると、本発明の鋭利な刃先3aによる場合の数値16.9Cd/mに対して、丸面に刃先による場合による数値20.8Cd/mが格段に高い数値であった。
Since the cut surface shown in FIG. 16 cut by the cutting edge 3a of the sharp cutting edge of the present invention is uniform and flat and has transparency, the light incident property is not inferior to that of router processing. Seem.
Further, in comparison with this, on the cutting end face shown in FIG. 17 cut by the cutting edge 3a of the cutting edge formed on the round surface of the present invention, fine grooves are continuous throughout, and the incident light is less than in the case of FIG. In fact, this is not the case, and when looking at the test results in Table 1 in the above examples, the rounded surface is shown in comparison with the numerical value 16.9 Cd / m 2 when the sharp cutting edge 3a of the present invention is used. The numerical value 20.8 Cd / m 2 depending on the cutting edge was a remarkably high numerical value.

このように丸面状刃先で加工した場合に輝度が上がる要因については考察すると、切断面は図17に示すとおり細かな一見不規則な溝が連なって平坦面と構成しているが、図18にてさらに拡大した写真を見るとその溝の底が観察でき、その溝底部は光沢のある透明な湾曲面がほぼ切断端面に向かって多数形成されていることが確認できる。
この溝底部の光沢性の湾曲面の形成で入光性に富んだ切断端面が得られ、その溝底部周囲の切り立った側面が光の拡散性を高める作用をして、この結果、上記各表のデータの如く輝度が上がったものと推察される。
Considering the factors that increase the brightness when machining with a round blade like this, the cut surface is formed as a flat surface with a series of finely irregular grooves as shown in FIG. When the photograph further enlarged is viewed, the bottom of the groove can be observed, and it can be confirmed that a large number of glossy transparent curved surfaces are formed almost toward the cut end surface at the bottom of the groove.
By forming the glossy curved surface at the bottom of the groove, a cut end face rich in light entering property is obtained, and the side surfaces around the bottom of the groove act to increase the light diffusibility. It is inferred that the brightness has increased as in the data.

本発明で得られる切断端面が、図16のような平坦な状態や、図17のような細かな溝により構成される状態は、切り刃のせん断抵抗と基材の軟化状態と加工速度のバランスにより成り立っており、この3つの要素を調整・制御することにより切断端面の性能もコントロールすることが可能となる。   The cutting end surface obtained by the present invention is a flat state as shown in FIG. 16 or a state constituted by fine grooves as shown in FIG. 17 is a balance between the shear resistance of the cutting blade, the softened state of the base material, and the processing speed. The performance of the cut end face can be controlled by adjusting and controlling these three elements.

このように本発明で製造される導光板が、これまでのルーター加工で提供されている導光板よりも良好な輝度が得られることは、IT機器に使用される携帯電話や情報端末などの表示部に本発明で得られる導光板を使用すれば、それらの機器の表示面に電力消費でしかも明るく表示させることが可能となるので、使用される充電バッテリーの寿命を延ばし、1回の充電で機器類が長時間使用可能となる点でこれまでになく高く評価されるものであると思料する。   As described above, the light guide plate manufactured in the present invention can obtain better luminance than the light guide plate provided by the conventional router processing, such as display of mobile phones and information terminals used in IT equipment. If the light guide plate obtained by the present invention is used for the part, it is possible to display the power consumption and brightly on the display surface of these devices. I think that it will be highly appreciated than ever in the point that the equipment can be used for a long time.

本発明は、有機ガラスの導光板をプレスによる抜き加工を行うことが可能とするものであるが、その他各種樹脂の加工においても綺麗なせん断面をバリなく得ることが可能となる点で、導光板以外でも多くの樹脂基材の抜き加工に広く利用できる可能性がある。   The present invention enables an organic glass light guide plate to be punched by a press. However, a beautiful shear surface can be obtained without burrs even in the processing of various other resins. There is a possibility that it can be widely used for punching many resin substrates other than the optical plate.

1 刃金型
2 刃金型
3 切り刃
3a 切り刃の刃先
4 受け刃
4a 切り刃の刃先
5a 熱電対
5b ヒータ
5c 温度制御部
6a 熱電対
6b ヒータ
6c 温度制御部
7 削除
8 基材の上表面
8a 基材の上表層の刃先近接部分
9 基材の下表面
9a 基材の下表層の刃先近接部分
W 基材
W1 導光板
W2 端材
K 切断溝
A プレス機の刃金型固定部
DESCRIPTION OF SYMBOLS 1 Blade die 2 Blade die 3 Cutting blade 3a Cutting blade edge 4 Receiving blade 4a Cutting blade edge 5a Thermocouple 5b Heater 5c Temperature control part 6a Thermocouple 6b Heater 6c Temperature control part 7 Deletion 8 Upper surface of base material 8a Blade edge proximity part of upper surface layer of base material 9 Lower surface of base material 9a Blade edge proximity part of lower surface layer of base material W Base material W1 Light guide plate W2 End material K Cutting groove A Blade mold fixing part of press machine

Claims (9)

熱可塑性を有する有機ガラスの基材から得られる導光板を加工対象として、一方側の切り刃と他方側の受け刃との間に前記基材を挟んで該切り刃と受け刃の刃先間を狭めてプレス切断する打ち抜き加工装置であって、前記切り刃は基材の板面に対して加工製品側は垂直且つ除去側は鋭角のレ字型に形成し、前記受け刃は基材の板面に対して平行且つ平坦状の刃先を有した台形状に形成し、前記切り刃及び受け刃を前記基材の軟化温度以上且つ基材が固体から液体に変化する温度以下の温度域に加熱可能としたヒータを前記切り刃及び受け刃の刃固定部に備えたことを特徴とする導光板の打ち抜き加工装置。   With a light guide plate obtained from a thermoplastic organic glass substrate as a processing target, the substrate is sandwiched between a cutting blade on one side and a receiving blade on the other side, and a gap between the cutting edge and the cutting edge of the receiving blade A punching device for narrowing and press-cutting, wherein the cutting blade is formed in a letter-shaped shape perpendicular to the processed product side and an acute angle on the removal side with respect to the base plate surface, and the receiving blade is a base plate It is formed in a trapezoidal shape with a flat blade edge parallel to the surface, and the cutting blade and the receiving blade are heated to a temperature range not lower than the softening temperature of the base material and not higher than the temperature at which the base material changes from solid to liquid. An apparatus for punching a light guide plate, characterized in that a heater capable of being provided in a blade fixing portion of the cutting blade and the receiving blade. 切り刃及び受け刃にはそれぞれ切断の進行、停止、後退及び進行速度を制御する刃先進行制御部を備えて成り、前記刃先進行制御部の制御で、加工に際して両刃先が基材の表面に接触したら、基材の表層部の刃先近接部分が軟化するまで一旦停止してから切断を進行可能としたことを特徴とする請求項1に記載の導光板の打ち抜き加工装置。   Each of the cutting blade and the receiving blade is provided with a blade edge advancement control unit that controls the progress, stop, retreat, and advancement speed of the cutting, and the two blade edges come into contact with the surface of the base material during processing by the control of the blade edge advancement control unit. Then, the punching device for the light guide plate according to claim 1, wherein the cutting is allowed to proceed after temporarily stopping until the cutting edge proximity portion of the surface layer portion of the base material is softened. ヒータの切り刃及び受け刃の各刃先の温度をそれぞれ加熱制御可能とする温度制御部を設けたことを特徴とする請求項1又は2に記載の導光板の打ち抜き加工装置。   3. The light guide plate punching apparatus according to claim 1, further comprising a temperature control unit that enables heating control of the temperature of each blade edge of the heater cutting blade and the receiving blade. 切り刃の刃先の加工製品側部分の先端部を5〜9μmの丸面に形成したことを特徴とする請求項1から3のうちいずれか1項に記載の導光板の打ち抜き加工装置。   4. The light guide plate punching apparatus according to claim 1, wherein a tip end portion of a processed product side portion of the cutting edge of the cutting blade is formed in a round surface of 5 to 9 μm. 5. 受け刃の刃先の平坦部分の幅を0.03〜0.1mmに形成したことを特徴とする請求項1から4のうちいずれか1項に記載の導光板の打ち抜き加工装置。   5. The light guide plate punching apparatus according to claim 1, wherein the width of the flat portion of the blade edge of the receiving blade is 0.03 to 0.1 mm. 6. 上記請求項1から5のうちいずれかに記載の導光板の打ち抜き加工装置を使用した打ち抜き加工方法であって、
予め切り刃の刃先を導光板の有機ガラスの基材の軟化温度以上且つ基材が固体から液体に変化する温度以下の温度域にヒータで加熱調整しておく刃先加熱調整工程と、
基材を受け刃の上部の設定された位置にセットする基材投入工程と、
切り刃を基材板面に接触するまで進行させる刃先進行開始工程と、
切り刃が基材の板面に接触後、切り刃の進行を一旦端停止させ、その停止中に前記基材の表層部の刃先近接部分を最適な温度にまで軟化させる基材軟化待機工程と、
切り刃で良好な切断面が得られる適正な速度に制御して切断進行させ、切り刃と受け刃とが近接したら切断完了設定位置で切り刃の進行を停止させる基材せん断工程と、
切り刃を高速で後退させる刃先後退工程と、
切断された導光板を受け刃の上から取り出す製品取出し工程と、
前記製品取出し工程から前記投入工程に戻り、それ以降の工程を何度も繰り返して行う繰返し工程と、
から成り、高性能な導光板を効率良く得られるようにしたことを特徴とする導光板の打ち抜き加工方法。
A punching method using the light guide plate punching apparatus according to any one of claims 1 to 5,
A blade edge heating adjustment step in which the blade edge of the cutting blade is heated and adjusted with a heater to a temperature range not lower than the softening temperature of the organic glass substrate of the light guide plate and the temperature at which the substrate changes from solid to liquid, and
A base material charging step for setting the base material at a set position above the receiving blade;
A blade edge progression starting step for advancing the cutting blade until it contacts the substrate plate surface;
After the cutting blade comes into contact with the plate surface of the base material, the progress of the cutting blade is temporarily stopped, and during the stoppage, the base material softening standby step of softening the blade tip adjacent portion of the surface layer portion to the optimum temperature; ,
A base material shearing process for controlling the cutting speed to an appropriate speed at which a good cutting surface can be obtained with the cutting blade, and stopping the progress of the cutting blade at the cutting completion setting position when the cutting blade and the receiving blade are close to each other;
A blade tip retraction process for retracting the cutting blade at high speed;
A product take-out process for taking out the cut light guide plate from the top of the blade,
Returning to the input process from the product take-out process, repeated process to repeat the subsequent processes many times,
A method of punching a light guide plate, characterized in that a high performance light guide plate can be obtained efficiently.
有機ガラスの基材にアクリル樹脂を用いたことを特徴とする請求項6に記載の導光板の打ち抜き加工方法。   7. The light guide plate punching method according to claim 6, wherein an acrylic resin is used for the base material of the organic glass. 基材軟化待機工程において、切り刃と受け刃の刃先が基材の板面に接触しときに0.2〜3秒の停止時間を設定したことを特徴とする請求項6又は7に記載の導光板の打ち抜き加工方法。   8. The stop time of 0.2 to 3 seconds is set when the cutting edge and the cutting edge of the receiving blade are in contact with the plate surface of the base material in the base material softening standby step. A method of punching a light guide plate. 刃先加熱調整工程において、切り刃と受け刃の刃先温度を60〜110℃の範囲内としたことを特徴とする請求項7から8のうちいずれか1項に記載の導光板の打ち抜き加工方法。   9. The light guide plate punching method according to claim 7, wherein in the blade edge heating adjustment step, the blade edge temperatures of the cutting blade and the receiving blade are within a range of 60 to 110 ° C. 9.
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