KR102258106B1 - Method of cutting and chamfering strengthened glass - Google Patents

Abstract

The present invention relates to a method of cutting and chamfering tempered glass, and more particularly, comprising: cutting the tempered glass by irradiating an infrared laser having a pulse width of 1ps to 20ps and an output of 4W to 75W; And a heat source having a temperature equal to or greater than the slow cooling point or less than the evaporation point of the tempered glass on the cut surface of the tempered glass in ^{an area of 0.001 to 2.5 mm 2} , and then moved at a moving speed of 5 to 300 mm/sec to chamfer the cut surface. By including the step, it relates to a method for rapidly cutting the tempered glass without defects and chamfering to have a uniform surface and excellent strength.

Description

Method of cutting and chamfering tempered glass{METHOD OF CUTTING AND CHAMFERING STRENGTHENED GLASS}

The present invention relates to a method of cutting and chamfering a tempered glass, and more particularly, to a method of cutting and processing a tempered glass used for a touch screen panel to have high strength without damage.

In a wide range of technologies and industries, such as video and optical equipment such as monitors, cameras, VTRs, mobile phones, transportation equipment such as automobiles, various tableware, and construction facilities, glass products are treated as essential components, and accordingly, the characteristics of each industrial field. Glass having various physical properties has been manufactured and used according to the requirements.

Among these, the touch screen is drawing attention as a core component of video equipment. A touch screen is a display and input device that is installed on a terminal monitor and allows a computer to perform specific commands by inputting various data such as simple contact or drawing characters or pictures using auxiliary input means such as a finger or a pen. Such a touch screen is increasingly important as a core component for various digital devices that transmit or exchange information with one or both sides, such as mobile communication devices such as smartphones, computers, cameras, issuing machines such as certificates, and industrial equipment. The range is expanding rapidly.

Among the parts constituting such a touch screen, the upper transparent protective layer that the user directly contacts is mainly a plastic organic material such as polyester or acrylic, and these materials are poor in heat resistance and mechanical strength, so they are deformed due to continuous and repeated use and contact. There is a limit to durability, such as damage, scratches, or damage. Therefore, the upper transparent protective layer of the touch screen is gradually being replaced by a reinforced thin plate glass having excellent heat resistance, mechanical strength, and hardness from the existing transparent plastic. In addition, tempered thin glass is gradually expanding its use area by serving as a transparent protective window for LCD or OLED monitors in addition to touch screens.

When the tempered glass is cut, it is destroyed as an irregular fragment that is not the intended shape due to the large compressive stress existing on the surface, or even if it is cut in the intended shape, it compresses a large area within a range of about 20 mm to the left and right around the cutting line. Since the stress is lost and the strength decreases, it is difficult to cut it into a desired size or shape once it is strengthened, regardless of the composition of the glass.

Therefore, the cutting method of the tempered glass requires very precise and strict conditions compared to the conventional cutting method of glass. The method introduced as a cutting method of this tempered glass is as follows.

First, there is a mechanical cutting method. In this manner, a diamond or carbide grading wheel is drawn across the glass surface to mechanically engrave a scale on the glass plate, which is then cut by bending the glass plate along the scale to create a cut edge. Typically, the mechanical cutting method as described above creates a lateral crack of about 100 to 150 μm in depth, and the crack is generated from the cutting line of the grading wheel. Since the lateral crack lowers the strength of the window substrate, it must be removed by polishing the cut portion of the window substrate.

However, the mechanical cutting method described above has a disadvantage in that expensive cutting wheels need to be replaced over time, and precise cutting is not easy.

Next, there is a non-contact cutting method using a laser. In the above method, when the laser expands the glass surface by moving along a predetermined path on the glass surface past a check on the edge of the window substrate, the cooler moves along the back and stretches the surface, thereby following the progression path of the laser. The crack is thermally propagated to cut the window substrate.

However, in the case of performing a cutting process with a laser beam after forming the touch pattern electrode in advance in the area corresponding to the unit window substrate, if the laser beam is irradiated on the surface where the pattern portion is formed, it is irradiated close to the pattern of the high temperature laser beam. If so, there is a fear that the pattern may be damaged, and if the laser beam is irradiated from the opposite side of the pattern, the laser beam is refracted while passing through the window substrate, and similarly, there is a fear that the pattern portion may be damaged.

Accordingly, since it is difficult to cut the tempered glass, a large area glass was cut before the tempered treatment to obtain a unit glass product, and a touch electrode required for the unit glass product was patterned. In this case, it takes a lot of time to form the pattern electrode, and thus there is a problem in that the process efficiency is deteriorated.

On the other hand, since the cut surface of the tempered glass is sharp and its surface is uneven, it is vulnerable to external impact, so it must undergo a chamfering process.

The chamfering process is generally performed by rotating a polishing wheel to process the cut, that is, chamfering. Through the chamfering process, the smoothness of the cut portion is improved and the strength is increased, but it has been difficult to provide a window substrate having excellent strength by the conventional chamfering process.

Korean Patent No. 0895830 discloses a method of using a cup wheel as an edge processing method of a flat display glass substrate, but the method of using a cup chun is a mechanical chamfering method, which requires repetitive execution in order to obtain a desired surface condition. There is a problem that it takes a long time to process.

In addition, a chamfering method using a laser has recently been introduced, but the laser method is a method of cutting the chamfered surface into a fine size, and there is also a problem that the processed surface is not uniform, and for processing, focus on the cut surface. A fitting step is needed.

Korean Patent Registration No. 0895830

Another object of the present invention is to provide a cutting and chamfering method capable of rapidly cutting tempered glass without defects, effectively removing fine cracks on the cut surface, and exhibiting high strength.

In addition, another object of the present invention is to provide a method capable of precisely cutting and chamfering a tempered glass.

In addition, another object of the present invention is to provide a cutting and chamfering method capable of exhibiting high strength by effectively reinforcing the cut surface of the cut tempered glass.

1. Cutting the tempered glass by irradiating an infrared laser having a pulse width of 1 ps to 20 ps and an output of 4 W to 75 W; And

A step of chamfering the cut surface by contacting the cut surface of the tempered glass with a heat source having a temperature equal to or less than the evaporation point of the tempered glass with ^{an area of 0.001 to 2.5 mm 2} and then moving at a moving speed of 5 to 300 mm/sec. Cutting and chamfering method of tempered glass comprising a.

2. The method of 1 above, wherein the heat source is in point contact or line contact with the cut surface of the tempered glass, and the contact area is 0.001 to 1 mm ² , and the method of cutting and chamfering the tempered glass.

3. In the above 1, wherein the heat source is in surface contact with the cut surface of the tempered glass, the contact area is 0.01 to 2.5mm ^{2 The} method of cutting and chamfering the tempered glass.

4. In the above 1, the temperature of the heat source is less than the evaporation point of the softening point of the tempered glass, the method of cutting and chamfering the tempered glass.

5. In the above 1, the wavelength of the laser is 800 to 1,100nm cutting and chamfering method of tempered glass.

6. The method of 1 above, wherein a protective resin film is formed on at least one surface of the tempered glass before the cutting step, and the method of cutting and chamfering the tempered glass.

7. The method of 1 above, wherein the tempered glass has a Vickers hardness of 600 to 700 kgf/mm ² , cutting and chamfering the tempered glass.

8. In the above 1, wherein the chamfering is performed at room temperature, the method of cutting and chamfering the tempered glass.

9. The method of 1 above, wherein the chamfering is performed by causing the cut surface to fall off to a predetermined depth from the heat source contact site by thermal stress, and the method of cutting and chamfering the tempered glass.

10. In the above 1, the cutting and chamfering method of the tempered glass, in which the upper and lower edges of the cut surface are obliquely processed by the contact of the heat source.

11. In the above 10, the cutting and chamfering method of the tempered glass, which is performed by contacting the heat source with the upper and lower corners of the cut surface.

12. In the above 10, the cutting and chamfering method of the tempered glass, which is performed by contacting the heat source in a direction parallel to the cut surface after contacting the heat source with the upper and lower corners of the cut surface.

13. The method of 1 above, further comprising the step of polishing the cut surface by contacting the rotating polishing wheel with the cut surface after contacting the heat source, and cutting and chamfering the tempered glass.

14. The method of 1 above, further comprising the step of applying an etching composition containing hydrofluoric acid to the cut surface after contacting the heat source, cutting and chamfering the tempered glass.

By using the laser method performed under the specific conditions of the present invention, not only can the tempered glass be quickly cut without defects, but also it is possible to precisely cut the tempered glass in an inexpensive manner.

In addition, according to the present invention, by chamfering the cut surface of the cut tempered glass by contacting the heat source under specific conditions, it is possible to effectively remove the fine cracks generated on the cut surface and have high strength.

In addition, according to the present invention, the strength of the tempered glass may be further improved by reinforcing the cut surface by etching or polishing with hydrofluoric acid or a polishing wheel after contact with the heat source.

1 is a schematic cross-sectional view (a) and a front view (b) of a cut surface chamfered according to the present invention.
Figure 2 is a schematic cross-sectional view of a cut surface chamfered in accordance with the present invention.
3 is a schematic cross-sectional view of a cut surface chamfered according to the present invention.
Figure 4 is a schematic cross-sectional view of a cut surface chamfered in accordance with the present invention.
5 shows changes in phase and volume according to the heating temperature of the tempered glass.
6 is a photograph of a cut surface chamfered according to the present invention.
7 is a schematic cross-sectional view of a cut surface of a tempered glass when a shape deformation occurs due to a small volume change amount when chamfering the cut surface of the tempered glass.
8 is a photograph of the cut surface of the tempered glass when the shape of the tempered glass is deformed due to a small amount of change in volume when chamfering the cut surface.

The present invention comprises the steps of cutting the tempered glass by irradiating an infrared laser having a pulse width of 1ps to 20ps and an output of 4W to 75W; And a heat source having a temperature equal to or greater than the slow cooling point or less than the evaporation point of the tempered glass on the cut surface of the tempered glass in ^{an area of 0.001 to 2.5 mm 2} , and then moved at a moving speed of 5 to 300 mm/sec to chamfer the cut surface. By including the step, it relates to a method for rapidly cutting the tempered glass without defects and chamfering to have a uniform surface and excellent strength.

Hereinafter, the present invention will be described in detail.

In the cutting and chamfering method of the present invention, the cutting step is performed by irradiating an infrared laser having a pulse width of 1 ps to 20 ps and an output of 4 W to 75 W.

The laser method has been widely used for cutting ordinary glass other than tempered glass, and is known as a method capable of accurately cutting glass.

However, in the case of toughened glass that is difficult to cut, it was difficult to find a condition capable of effectively cutting the tempered glass without breaking it. Accordingly, the present invention provides a method for precisely cutting the tempered glass by providing the characteristic conditions of the laser method capable of cutting the tempered glass.

The tempered glass to which the cutting and chamfering method of the present invention can be applied is not particularly limited as long as it is a tempered glass known in the art, but in a preferred embodiment, the depth of the reinforcing layer is 10 μm to 200 μm, and in another embodiment, 40 μm to It may be 200 μm, and in another embodiment, it may be 120 μm to 200 μm.

In another aspect of the present invention, the tempered glass to which the cutting and chamfering method of the present invention can be applied may have a Vickers hardness of 600 to 700 kgf/mm ² , preferably 650 to 690 kgf/mm ² .

In another aspect of the present invention, the tempered glass to which the cutting and chamfering method of the present invention can be applied may have a Young's modulus of 60 to 90 GPa, preferably 65 to 85 GPa.

In the present invention, an infrared laser is used to cut the tempered glass.

An infrared laser commonly used in the art is not particularly limited, and for example, the wavelength may be 800 to 1,100 nm. If the wavelength of the laser is less than 800 nm, the cutting time of the tempered glass increases, leading to an increase in the size of the chipping area and damage to the tempered glass.If it exceeds 1,100 nm, it is not possible to cut before cutting due to the occurrence of high temperature thermal energy. When the electrode stack for a touch panel is formed, the pattern may be damaged, and since a separate cooling device and a cooling process are further required, there is a problem in that process efficiency is deteriorated.

The laser has a pulse width of 1 ps to 20 ps (pico second). If the pulse width is less than 1ps, it is impossible to cut the tempered glass, and if it exceeds 20ps, there is a problem of increasing the size of the chipping and breaking the tempered glass.

In addition, the laser is irradiated with an output of 4 W to 75 W, and if the power is less than 4 W, the tempered glass cannot be cut, and if it exceeds 75 W, the size of the chipping area increases and the tempered glass is damaged. there is a problem.

If necessary, before the cutting process of the present invention is performed, the tempered glass may form a protective resin film on at least one surface. By forming the protective resin film, it is possible to prevent damage to the glass surface due to fragments or the like generated during the cutting process.

In this aspect, the tempered glass to be cut in the present invention may be formed in advance with an electrode laminate for a touch panel on one surface thereof. Rather than individually forming an electrode stack for a touch panel on the unit window cover substrate, a touch panel electrode stack is formed in advance at the place to be cut into the unit window cover substrate of the ledger tempered glass substrate before being cut into the unit window cover substrate. After that, performing the cutting process can double the productivity. Therefore, if an electrode laminate for a touch panel is formed on a tempered glass substrate to be cut, it is preferable to form a protective resin film in order to prevent damage to the electrode before the cutting process.

As the protective resin film, a protective resin film used in the art may be used without particular limitation. For example, a pressure-sensitive adhesive may be applied to one side of a polymer film and then attached to the tempered glass, or a curable resin composition may be applied to one side of the tempered glass and then cured.

In the case of attaching the protective resin film, the protective resin film of the portion to be cut (cutting line) may be removed before the cutting process, but the cutting process may be performed without removing.

If necessary, the process of forming and removing the protective resin film may be performed even after the cutting process. For example, after the thermal chamfering process, a process of forming and removing a protective resin film may be performed.

As described above, the tempered glass that has undergone the cutting process of the present invention is in a state in which the strength is remarkably lowered, fine cracks exist on the cut surface, and the cut surface is sharp, so a chamfering process is required.

Accordingly, the present invention provides a chamfering method that can be continuously performed following the cutting method of the present invention described above.

The chamfering method of the present invention is carried out by bringing a heat source into contact with the cut surface of the tempered glass.

In the tempered glass, the state of the cut surface or the physical properties of the tempered glass may be remarkably changed according to the specific conditions of the cutting process. Accordingly, the present invention is a chamfering method capable of recovering the strength reduced by the cutting process, removing fine cracks, and effectively processing the cut surface following the cutting method of the present invention described above. Provides a method of chamfering by.

The temperature of the heat source is greater than or equal to the slow cooling point of the tempered glass and less than the evaporation point.

As shown in FIG. 5, when the tempered glass is heated to a temperature equal to or higher than an annealing point, the tempered glass is changed into a supercooled liquid or liquid phase. Due to the low thermal conductivity of the tempered glass, the temperature difference between the outside and the inside occurs severely when heated.If the tempered glass is cooled while it is heated above the slow cooling point, a volume difference according to the temperature difference occurs, and accordingly, internal stress occurs. , A region having a temperature equal to or higher than the slow cooling point is separated to a predetermined depth in the form of a strip. If the temperature of the heat source is higher than the evaporation point of the tempered glass, the process itself is impossible.

The slow cooling point and the evaporation point may vary depending on the tempered glass, and the temperature range is not limited and may be adjusted to suit the tempered glass. For example, the specific temperature range may be 700°C to 1,700°C, but is not limited thereto.

Preferably, the temperature of the heat source may be greater than or equal to the softening point of the tempered glass and less than the evaporation point. When the tempered glass is cooled while the tempered glass is heated above the softening point, the volume difference between the region having a temperature above the softening point and the cooled portion is remarkably large. Accordingly, a large internal stress is generated, so that a region having a temperature equal to or higher than the softening point can be easily separated in a strip shape to a predetermined depth. The softening point and the evaporation point may vary depending on the tempered glass, and the temperature range is not limited and may be adjusted to suit the tempered glass. A specific temperature range may be, for example, 850°C to 1,700°C, but is not limited thereto. When the heat source temperature exceeds 1700°C, the upper limit of the temperature is preferably 1700°C or less because the heat source may be damaged by the oxidation reaction.

The cross-section where the heated portion is separated from the cut surface in the form of a strip is shown in FIGS. 2 and 3 in an even surface, and is the same as the actual cross-section of FIG. 6. However, when the volume change occurs in a small amount, the internal stress generated does not exceed the energy bonded between the substances, so that the shape deformation occurs rather than the occurrence of cracks, and the shape becomes hardened as the viscosity increases. In such a case, an even cross section is not obtained, and a shape as shown in Fig. 7 is obtained.

When the heat source having a temperature range according to the present invention is brought into contact with the cut surface of the tempered glass, due to the characteristics of the glass having a low heat transfer rate, thermal stress is generated at the cut surface, and the portion to a predetermined depth is separated from the heat source contact part. By the chamfering method according to the present invention, the elongation of the tempered glass, which is significantly lowered by the cutting process, can be significantly increased to 0.4% or more. In addition, it is possible to obtain a more uniform surface than the mechanical chamfering method or the laser method of the above-described prior patent, and the chamfering processing time can be significantly reduced.

The heat source is in contact with the cut surface of the tempered glass in ^{an area of 0.001 to 2.5 mm 2.}

If the contact area is ^{less than 0.001 mm 2, the} chamfered surface may be rough and the chamfered shape may be uneven, and ^{if it exceeds 2.5 mm 2} , shape change may occur due to excessive melting of the glass.

According to one embodiment of the present invention, the heat source may be in point contact or line contact with the cut surface of the tempered glass.

In the present specification, point contact or line contact includes a case where two objects geometrically meet at a point and a line, as well as a case where point or line contact is made. For example, when a conical heat source is brought into contact with the edge of the cut surface of the tempered glass, geometrically, the heat source and the edge meet at one point, and when the flat heat source is brought into contact with the edge of the cut surface, the heat source and the edge are mathematically They meet at the additional line, but mathematically, the point or line does not have an area. However, in practice, the contact is made with a predetermined area, and the point contact or line contact in the present invention includes such a case.

When the heat source is in point contact or line contact with the edge of the cut surface of the tempered glass, the contact area is 0.001 to 1 mm ² . If the contact area is ^{less than 0.001 mm 2, the} chamfered surface may be rough and the chamfered shape may be uneven, and ^{if it exceeds 1 mm 2} , shape change may occur due to excessive melting of the glass.

Further, the heat source may be in surface contact with the cut surface of the tempered glass. In the present specification, the surface contact refers to a case where surface contact is made even when geometrically interpreted.

In the case of not being the edge of the cut surface, for example, when chamfering is performed in a direction parallel to the cut surface as shown in ③ of FIG. 4, the heat source may be in surface contact with the cut surface of the tempered glass.

When the heat source is in surface contact with the cut surface of the tempered glass, the contact area is 0.01 to 2.5 mm ² . If the contact area is ^{less than 0.01mm 2, the} chamfered surface may be rough and the chamfered shape may be uneven, and ^{if it exceeds 2.5mm 2} , shape change may occur due to excessive melting of the glass.

In the present invention, preferably, the tempered glass may be rapidly cooled after the heat source contacts.

In FIG. 5, when the tempered glass is slowly cooled at a temperature above the slow cooling point, the volume change is larger than the case of rapid cooling, but in the case of slow cooling, the bonding energy between the components of the tempered glass acts sufficiently, so that the thermal stress cannot exceed the bonding energy. I can. However, in the case of rapid cooling, the volume change is small, but when the thermal stress occurs due to the volume change, the binding energy does not sufficiently act by the rapid cooling, and the heated portion can be easily separated in the form of a strip.

Quenching may be performed, for example, by performing the chamfering step at room temperature (eg, 15 to 30°C). When the heat source is brought into contact with the edge of the cut surface of the tempered glass, the portion is heated, but if the heat source moves and leaves the portion, the heated portion may be exposed to room temperature and rapidly cooled.

The heat source in contact with the cut surface moves along the portion to be chamfered, and the moving speed is 5 to 300 mm/sec. If the moving speed is less than 5 mm/sec, the protective layer is damaged, the cutting amount increases, and the shape change may occur due to excessive melting of the glass, and if it exceeds 300 mm/sec, the chamfering surface may be rough and the chamfer shape may be uneven. have.

In the chamfering method of the present invention, a material that can be used as a heat source is not particularly limited as long as it is a material capable of transmitting the temperature of the above-described heat source without deformation. For example, a ceramic material may be used, but the present invention is not limited thereto.

In addition, in the chamfering method of the present invention, a means for controlling pressure or controlling a position of a tempered glass or a heat source may be additionally applied in order to achieve a stable chamfering quality.

The chamfering method according to the present invention is a method of processing the upper and lower corners of the cut surface inclined, and FIG. 1 shows a schematic cross-sectional view (a) and a front view (b) of the chamfered cut surface.

In the method of processing the upper and lower corners of the cut surface inclined as shown in FIG. 1, if the final shape is inclined at the upper and lower corners, there are special restrictions on the detailed conditions such as the specific order or number of contacting the heat source, the angle of inclination, etc. There is no.

For a more specific example, as an embodiment of the present invention, it may be performed by contacting a heat source with an upper edge portion and a lower edge portion of the cut surface. As schematically illustrated in FIG. 2, the heat source may be in contact with the upper edge portion (①) and the lower edge portion (②) of the cut surface to form an inclined surface.

In another embodiment of the present invention, after contacting the heat source with the upper and lower corners of the cut surface, it may be performed by contacting the heat source in a direction parallel to the cut surface. This embodiment is a case where there are many tempered glass portions to be removed by the chamfering method, and may be adopted if necessary. Figure 2 schematically shows the chamfering method of this embodiment. Referring to FIG. 2, first, a heat source is brought into contact with the upper edge of the cut surface to form an inclined surface up to a predetermined portion (①). Next, the heat source is brought into contact with the upper edge of the cut surface to form an inclined surface up to a predetermined portion (②). Subsequently, by contacting the heat source in a direction parallel to the cut surface to remove the glass to the required part (③), the final cross-sectional shape can be obtained.

In addition, in the embodiment of the present invention, the order of chamfering processing may be changed, and thus chamfering processing may be performed in a different order from the order shown in FIG. 2. For example, it may be performed in the order of No. ②, No. ①, and No. ③, or may be performed in the order of No. ③, No. ②, and No. ①, but is not limited thereto.

When the processing of the inclined surface of the cut surface by the heat source as described above is completed, a reinforcing process of the cut surface surface may be further performed if necessary. The laser cutting method of the present invention can evenly form the cut surface, but can have a more uniform surface and excellent strength through such a reinforcing process.

The reinforcing process according to the present invention may include a method of polishing the cut surface with a polishing wheel or etching the cut surface with an etching solution containing hydrofluoric acid.

First, the method of polishing with a polishing wheel is a method of polishing the cut surface more evenly by contacting the rotating polishing wheel with the cut surface after finishing processing of the inclined surface by a heat source. As a result, the cut surface is reinforced by polishing fine cracks or the like existing on the surface.

The polishing wheel may be a wheel made of abrasive particles such as cerium oxide. It is preferable that the size of the abrasive particles is 5 μm or less in terms of sufficiently exhibiting the effect of reinforcing the cut surface. The smaller the size of the abrasive particles is, the higher the polishing precision is, and thus it is preferable. Therefore, the lower limit is not particularly limited, but considering the process time, etc., about 0.01 μm may be used.

The rotational speed of the polishing wheel is not particularly limited and may be appropriately selected so that the cut surface is sufficiently polished to obtain a desired level of strength, and may be, for example, 1,000 to 10,000 rpm.

Next, the method of etching using hydrofluoric acid is a method of etching the surface portion of the cut surface by applying an etching solution containing hydrofluoric acid to the cut surface. When the cut surface is etched with an etching solution containing hydrofluoric acid, the cut surface is etched to show an embossed pattern, and the surface is reinforced.

The etchant containing hydrofluoric acid is an aqueous hydrofluoric acid solution, and components known in the art as free etching components such as hydrochloric acid, nitric acid, and sulfuric acid may be further included in addition to hydrofluoric acid.

The time for etching the cut surface with an etching solution containing hydrofluoric acid is not particularly limited, but etching between 30 seconds to 10 minutes may increase the strength without excessively etching the cut surface .

The temperature of the etching solution containing hydrofluoric acid is not particularly limited, but is preferably 20 to 50°C, for example. If the temperature is lower than 20°C, the processing time may be lengthened and etching may be insufficiently performed. If the temperature is higher than 50°C, the processing time may be shortened, but etching may proceed unevenly.

The etching solution containing hydrofluoric acid may be applied to the cut surface in a manner known in the art, such as spraying onto the cut surface or immersing the cut surface in the etching solution.

Hereinafter, preferred embodiments are presented to aid the understanding of the present invention, but these examples are only illustrative of the present invention, and do not limit the scope of the appended claims, and examples within the scope and spirit of the present invention It is obvious to those skilled in the art that various changes and modifications are possible, and it is natural that such modifications and modifications fall within the appended claims.

Example 1-5 and Comparative example 1-4

After forming a protective resin film on the surface of a tempered glass (reinforced layer depth: 20-25 μm, Vickers hardness: 649 kgf/mm ² , Young's modulus: 71.5 GPa), laser was irradiated under the conditions shown in Table 1 below, and cut Whether it is listed in Table 1.

division Output(W) Wavelength(nm) Pulse width (ps) Cutting or not Chipping Size(㎛) Example 1 4 1064 10 possible 0-50 Example 2 40 1064 10 possible 0-50 Example 3 75 1064 10 possible 0-50 Example 4 40 1064 One possible 0-50 Example 5 40 1064 20 possible 0-50 Comparative Example 1 3 1064 10 Impossible - Comparative Example 2 77 1064 10 damage - Comparative Example 3 40 1064 21 possible More than 150 Comparative Example 4 40 1064 0.8 Impossible -

Referring to Table 1, Examples 1 to 5 performed according to the cutting method conditions of the present invention were all capable of cutting the tempered glass, and showed a Chipping Size of 50 μm or less.

However, in the comparative examples out of the conditions of the present invention, cutting was impossible or the tempered glass was broken during cutting. In addition, even if cutting was possible, the chipping size was large.

Example 6-11 and Comparative example 5-12

After forming a protective resin film on the surface of tempered glass (reinforced layer depth: 20~25㎛, Vickers hardness: 649 kgf/mm ² , Young's modulus: 71.5 GPa, slow cooling point 613℃, softening point 852℃, evaporation point exceeding 1700℃) , After cutting with a laser under the conditions described in Table 2 below, a conical heat source was chamfered by contacting the edge of the cut surface of the tempered glass under the conditions described in Table 2 below at room temperature, and chamfered by contacting in a direction parallel to the cut surface. . Table 2 shows whether chamfering is possible and the measured elongation. The elongation was judged as an average value of 50 or more tempered glass sheets.

Elongation is an index to evaluate the strength. Two support spans are installed in the lower part of the tempered glass substrate and spaced apart from the center of the substrate. The distance (crosshead displacement) from the point touching the window substrate to the point where the window substrate is broken was measured and calculated according to Equation 1 below.

[Equation 1]

Elongation (%) = (6Tδ)/s ²

(Wherein, T is the thickness of the window substrate (mm), δ is the crosshead displacement (mm), and s is the distance between the support spans (mm)).

division Cutting process Chamfering process
(Slope machining) Heat source contact area
(mm ² ) Slope formation Elongation Print
(W) wavelength
(nm) Pulse width
(ps) Heat source temperature
(℃) Contact transfer
speed
(mm/sec) Edge contact Vertical contact to the cut surface Example 6 40 1064 10 1200 5 0.1~0.15 0.1~0.5 formation 0.842 Example 7 40 1064 10 1200 300 0.05~0.1 0.05~0.1 0.792 Example 8 40 1064 10 900 150 0.005~0.01 1~1.5 0.981 Example 9 40 1064 10 1700 150 0.3~0.5 0.01~0.05 0.824 Example 10 40 1064 10 1200 150 0.5~1 2~2.5 0.897 Example 11 40 1064 10 700 150 0.001~0.01 0.01~0.02 formation
unrest 0.315 Comparative Example 5 40 1064 10 500 150 0.05~0.1 0.5~1 formation
Impossible 0.211 Comparative Example 6 40 1064 10 1200 3 0.1~0.2 1~1.5 0.197 Comparative Example 7 40 1064 10 1200 500 0.5~0.8 1.5~2 0.187 Comparative Example 8 40 1064 10 1200 150 More than 0.0
~less than 0.001 More than 0
Less than ~0.01 0.098 Comparative Example 9 40 1064 10 1200 150 More than 0.0
~less than 0.001 Over 2.5~3 0.124 Comparative Example 10 40 1064 10 1200 150 1~1.5 More than 2.5
~3 0.112 Comparative Example 11 40 1064 10 1200 150 More than 0.0
Less than 0.001 0.1~0.5 0.195 Comparative Example 12 40 1064 10 1200 150 0.5~1 More than 2.5
~3 0.255

Referring to Table 2, Examples 6 to 10 performed according to the conditions of the chamfering method of the present invention all exhibited a high elongation of 0.4% or more.

The cut surface of Example 6 is shown in FIG. 6, and referring to this, it can be seen that chamfering was evenly performed.

In the case of Example 11, chamfering was performed with a heat source having a temperature equal to or higher than the slow cooling point and lower than the softening point, so that some areas were separated in a strip shape and some areas were not, so that a cut surface was formed as shown in FIG. 8.

However, the comparative examples out of the conditions of the present invention did not form an inclined surface, and the elongation was also less than 0.4%.

Example 12-16

After forming a protective resin film on the surface of tempered glass (reinforced layer depth: 20~25㎛, Vickers hardness: 649 kgf/mm ² , Young's modulus: 71.5 GPa, slow cooling point 613℃, softening point 852℃, evaporation point exceeding 1700℃) , After laser cutting under the conditions described in Table 3 below, a heat source in the shape of a cone was contacted with the edge of the cut surface of the tempered glass under the conditions described in Table 3 below at room temperature to process the inclined surface, and then the cutting surface was polished and reinforced with a polishing wheel. . Table 3 shows the measured elongation of the tempered glass after polishing. The elongation was judged by an average value of 50 or more tempered glass sheets.

division Cutting process Chamfering (inclined surface processing) Heat source contact area
(mm ² ) Reinforcement
(Polishing wheel) Elongation Print
(W) wavelength
(nm) Pulse width
(ps) Heat source
Temperature
(℃) contact
transfer
speed
(mm/sec) Corner
contact On the cut surface
Vertical contact Wheel particles
Size
(㎛) Example 12 40 1064 10 1200 150 0.05~0.1 0.5~1 One 0.912 Example 13 40 1064 10 1200 150 0.05~0.1 0.5~1 3 0.813 Example 14 40 1064 10 1200 150 0.05~0.1 0.5~1 4 0.981 Example 15 40 1064 10 1200 150 0.05~0.1 0.5~1 7 0.487 Example 16 40 1064 10 1200 150 0.05~0.1 0.5~1 10 0.535

Referring to Table 3, it can be seen that the elongation further increases when the cut surface is polished using a polishing wheel having a particle size of 5 μm or less. However, Examples 15 and 16 out of the preferred range of the present invention did not have an increase in elongation greater than that of other examples.

Example 17-26

After forming a protective resin film on the surface of tempered glass (reinforced layer depth: 20~25㎛, Vickers hardness: 649 kgf/mm ² , Young's modulus: 71.5 GPa, slow cooling point 613℃, softening point 852℃, evaporation point exceeding 1700℃) , After cutting with a laser under the conditions described in Table 4 below, a conical heat source is contacted with the edge of the cut surface of the tempered glass under the conditions described in Table 4 below at room temperature to process the inclined surface, and then reinforced by etching the cut surface with an aqueous hydrofluoric acid solution. I did.

Table 4 shows the elongation measured for the tempered glass after the reinforcement was completed. The elongation was judged as an average value of 50 or more tempered glass sheets.

division Cutting process Chamfering (inclined surface processing) Heat source contact area
(mm ² ) Reinforcement
(Etch reinforcement) Elongation Print
(W) wavelength
(nm) Pulse width
(ps) Heat source temperature
(℃) contact
transfer
speed
(mm/sec) Edge contact Vertical contact to the cut surface Example 17 40 1064 10 1200 5 0.1~0.15 0.1~0.5 Etching time: 3 minutes
Etching temperature:
28-30℃ 0.817 Example 18 40 1064 10 1200 300 0.05~0.1 0.05~0.1 0.914 Example 19 40 1064 10 1700 150 0.3~0.5 0.01~0.05 0.889 Example 20 40 1064 10 1200 150 0.5~1 2~2.5 0.966 Example 21 40 1064 10 1200 5 0.1~0.15 0.1~0.5 Etching time: 20 seconds
Etching temperature:
28-30℃ 0.411 Example 22 40 1064 10 1200 300 0.05~0.1 0.05~0.1 0.431 Example 23 40 1064 10 1700 150 0.3~0.5 0.01~0.05 0.474 Example 24 40 1064 10 1200 150 0.5~1 2~2.5 0.395

Referring to Table 4, it can be seen that the elongation is further increased in the examples in which the cut surface is reinforced by etching the cut surface with an etching solution containing hydrofluoric acid. However, when the etching time and temperature of the etchant are slightly out of the preferred range of the present invention, it can be seen that the increase in the elongation is not large. For reference, it was confirmed that excessive etching proceeded when the etching time was 10 minutes or longer.

Claims (14)

Cutting a tempered glass having ^{a Vickers hardness of 600 to 700 kgf/mm 2} by irradiating an infrared laser having a pulse width of 1 ps to 20 ps and an output of 4 W to 75 W; And
A step of chamfering the cut surface by contacting the cut surface of the tempered glass with a heat source having a temperature equal to or less than the evaporation point of the tempered glass with ^{an area of 0.001 to 2.5 mm 2} and then moving at a moving speed of 5 to 300 mm/sec. Including,
When the heat source is in point contact or line contact with the cut surface of the tempered glass, the contact area is 0.001 to 1 mm ^2, and the contact area is 0.01 to 2.5 mm ² in the case of surface contact, cutting and chamfering the tempered glass.
delete delete The method of claim 1, wherein the temperature of the heat source is not less than a softening point and less than a vaporization point of the tempered glass.
The method of claim 1, wherein the laser has a wavelength of 800 to 1,100 nm.
The method for cutting and chamfering a tempered glass according to claim 1, wherein a protective resin film is formed on at least one surface of the tempered glass before the cutting step.
delete The method of claim 1, wherein the chamfering is performed at room temperature.
The method according to claim 1, wherein the chamfering is performed by causing the edge portion of the cut surface to be separated from the heat source contact portion to a predetermined depth due to thermal stress.
The method of claim 1, wherein the upper and lower edges of the cut surface are processed to be inclined by contact with the heat source.
The method of claim 10, wherein the method of cutting and chamfering tempered glass is performed by contacting a heat source with an upper edge portion and a lower edge portion of the cut surface.
The method of claim 10, wherein the heat source is brought into contact with the upper and lower corners of the cut surface and then the heat source is contacted in a direction parallel to the cut surface.
The method of claim 1, further comprising the step of polishing the cut surface by contacting the rotating polishing wheel with the cut surface after contacting the heat source.
The method of claim 1, further comprising applying an etching composition containing hydrofluoric acid to the cut surface after contacting the heat source.

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