KR20120079204A - Glass - Google Patents

Glass Download PDF

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Publication number
KR20120079204A
KR20120079204A KR1020110000363A KR20110000363A KR20120079204A KR 20120079204 A KR20120079204 A KR 20120079204A KR 1020110000363 A KR1020110000363 A KR 1020110000363A KR 20110000363 A KR20110000363 A KR 20110000363A KR 20120079204 A KR20120079204 A KR 20120079204A
Authority
KR
South Korea
Prior art keywords
glass
hydrofluoric acid
wax
acid solution
react
Prior art date
Application number
KR1020110000363A
Other languages
Korean (ko)
Inventor
공석태
Original Assignee
공석태
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 공석태 filed Critical 공석태
Priority to KR1020110000363A priority Critical patent/KR20120079204A/en
Publication of KR20120079204A publication Critical patent/KR20120079204A/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133302Rigid substrates, e.g. inorganic substrates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

PURPOSE: A glass chamfering method through hydrofluoric acid is provided to effectively and partially cut chamfer part of the glass by using a chemical which can melt the glass. CONSTITUTION: A glass chamfering method through hydrofluoric acid comprises the following steps: covering wax on whole surface of the first external angle processed glass; cleaning wax of the chamfering part with an elastomer pad or a cloth; automatically processing grinding operation by reacting the glass with hydrofluoric acid and melting only the chamfer part. The wax does not react with the hydrofluoric acid. The glass and hydrofluoric acid reaction step comprises the following step; dipping the glass into the fluoric acid solution, or spraying the fluoric acid solution with a spray nozzle.

Description

불산을통한 유리면취방법{glass}Glass chamfering method through Foshan {glass}

lcd유리,평판디스플레이유리,이동단말기 윈도우lcd glass, flat panel display glass, mobile terminal window

현재 평판디스플레이,이동단말기등의 윈도우 소재가 아크릴계통에서 유리로 전이되는단계로서 아크릴은 cnc등으로 쉽게가공되었으나 유리는 다이야몬드휠을사용하여 가공하기때문에 가공이 힘들고 다이야몬드입자의 비산등에 의해 유리표면에 흠집이생겨 불량률이 높고 생산원가가 많이드는등의 문제가 있다Currently, window materials such as flat panel displays and mobile terminals are transferred from acrylic system to glass.Acrylic is easily processed by cnc, but glass is difficult to process because it is processed using diamond wheel, and glass is scattered due to scattering of diamond particles. There are problems such as scratches on the surface, high defect rate and high production cost.

유리가공 공정중 테두리 모서리 부분의 모따기 공정을 다이야몬드 휠로 가공하다보니 다이야몬드 입자에의한 흠집 불량이 많이 나오고 1개씩 가공하다보니 가공비가 많이 드는단점을 보완하기위하여 유리를 녹일수있는 화학약품을 사용하여 모따기부분을 녹이는 방법으로 면취를 하고자한다.As the chamfering process of the edges of the edges of the glass processing process is done with diamond wheels, there are many scratch defects caused by diamond particles and each one is processed so that the chemicals that can melt glass to compensate for the disadvantages of high processing cost I want to chamfer it by melting the chamfer.

면취하고자하는 외각가공한 유리 전체 표면에 왁스를 입힌후 면취하려고하는 모서리부분만 왁스를 고무패드나 천등으로 왁스를 닦아낸후 불산용액에 넣어 불산이 유리표면과 접촉되는 모서리부분만 녹여 면취하고자한다
Wax the entire surface of the outer surface of chamfered glass to be chamfered and wipe the wax only with the rubber pad or cloth, and then put it in hydrofluoric acid solution and dissolve only the edge where the hydrofluoric acid is in contact with the glass surface.

불량률이없이 대량생산 용이하다Easy to mass production without defective rate

1차로 외각가공공정을 거친 유리 전체 표면에 불산에 반응하지않는 왁스를 입힌후 면취하려고하는 모서리부분만 왁스를 고무패드나 천등으로 왁스를 닦아낸후 불산용액에 넣거나 불산용액을 스프레이 노즐등을 통해 분사하게되면 불산이 묻어있지않은 유리표면과 접촉되는 모서리부분만 불산과 유리가 반응하여 자동적으로 면취가 된다Apply wax that does not react with hydrofluoric acid to the entire surface of the glass that has been subjected to the external processing first, and then wipe the wax with a rubber pad or cloth, and then insert the wax into hydrofluoric acid solution or spray the hydrofluoric acid solution through a spray nozzle. In this case, the hydrofluoric acid and the glass react automatically to chamfer only at the edges in contact with the glass surface which does not have any hydrofluoric acid.

Claims (1)

유리가공 공정중 면취공정에있어서
1차로 외각가공공정을 거친 유리 전체 표면에 불산에 반응하지않는 왁스를 입힌후 면취하려고하는 모서리부분만 왁스를 고무패드나 천등으로 왁스를 닦아낸후 불산용액에 넣거나 불산용액을 스프레이 노즐등을 통해 분사하게되면 불산이 묻어있지않은 유리표면과 접촉되는 모서리부분만 불산과 유리가 반응하여 자동적으로 면취가공을 하는 불산을통한 유리모서리 면취방법
In the chamfering process of glass processing
Apply wax that does not react with hydrofluoric acid to the entire surface of the glass that has been subjected to the external processing first, and then wipe the wax with a rubber pad or cloth, and then insert the wax into hydrofluoric acid solution or spray the hydrofluoric acid solution through a spray nozzle. This method is to chamfer the glass edges through Foshan, where the hydrofluoric acid and glass react automatically when only the edges that come into contact with the glass surface that are not buried are automatically chamfered.
KR1020110000363A 2011-01-04 2011-01-04 Glass KR20120079204A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110000363A KR20120079204A (en) 2011-01-04 2011-01-04 Glass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110000363A KR20120079204A (en) 2011-01-04 2011-01-04 Glass

Publications (1)

Publication Number Publication Date
KR20120079204A true KR20120079204A (en) 2012-07-12

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KR1020110000363A KR20120079204A (en) 2011-01-04 2011-01-04 Glass

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015093727A1 (en) * 2013-12-17 2015-06-25 동우화인켐 주식회사 Method for cutting and chamfering tempered glass
WO2015147456A1 (en) * 2014-03-26 2015-10-01 동우화인켐 주식회사 Method for cutting and chamfering tempered glass
KR20150111821A (en) * 2014-03-26 2015-10-06 동우 화인켐 주식회사 Method of cutting and chamfering strengthened glass
WO2018144577A1 (en) * 2017-01-31 2018-08-09 Corning Incorporated Methods for reducing glass sheet edge particles

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015093727A1 (en) * 2013-12-17 2015-06-25 동우화인켐 주식회사 Method for cutting and chamfering tempered glass
WO2015147456A1 (en) * 2014-03-26 2015-10-01 동우화인켐 주식회사 Method for cutting and chamfering tempered glass
KR20150111821A (en) * 2014-03-26 2015-10-06 동우 화인켐 주식회사 Method of cutting and chamfering strengthened glass
WO2018144577A1 (en) * 2017-01-31 2018-08-09 Corning Incorporated Methods for reducing glass sheet edge particles

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