TWI637927B - Method for manufacturing glass substrate, and device for manufacturing glass substrate - Google Patents

Method for manufacturing glass substrate, and device for manufacturing glass substrate Download PDF

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TWI637927B
TWI637927B TW104110556A TW104110556A TWI637927B TW I637927 B TWI637927 B TW I637927B TW 104110556 A TW104110556 A TW 104110556A TW 104110556 A TW104110556 A TW 104110556A TW I637927 B TWI637927 B TW I637927B
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glass substrate
end surface
cooling liquid
grindstone
contact portion
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TW104110556A
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Chinese (zh)
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TW201612131A (en
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豬飼修
鈴木睦規
小林健二
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安瀚視特控股股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10Single-purpose machines or devices
    • B24B7/16Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0076Other grinding machines or devices grinding machines comprising two or more grinding tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

Abstract

本發明之目的在於提供一種可降低對環境施加之負載、且可抑制玻璃基板之表面污染之玻璃基板之製造方法、及玻璃基板之製造裝置。 An object of the present invention is to provide a glass substrate manufacturing method and a glass substrate manufacturing device which can reduce the load applied to the environment and can suppress the surface contamination of the glass substrate.

端面磨削裝置20藉由使倒角磨石40接觸於玻璃基板10之端面11a且使倒角磨石40相對於玻璃基板10相對性地移動而對端面11a進行加工。端面磨削裝置20對倒角磨石40與端面11a之接觸部13供給包含非離子系界面活性劑之水溶液即冷卻液而對接觸部13進行冷卻。端面磨削裝置20使收納倒角磨石40之殼體30之內部空間81相對於外部空間82成為負壓而自內部空間81抽吸冷卻液,藉此抑制冷卻液流出至外部空間82而污染玻璃基板10。又,端面磨削裝置20降低冷卻液之使用量而降低對環境施加之負載。 The end surface grinding device 20 processes the end surface 11 a by bringing the chamfered grindstone 40 into contact with the end surface 11 a of the glass substrate 10 and moving the chamfered grindstone 40 relative to the glass substrate 10. The end surface grinding device 20 supplies the contact portion 13 of the chamfered grindstone 40 and the end surface 11 a with a cooling liquid containing an aqueous solution containing a nonionic surfactant, and cools the contact portion 13. The end surface grinding device 20 makes the internal space 81 of the housing 30 containing the chamfered grindstone 40 negative pressure with respect to the external space 82 and sucks the cooling liquid from the internal space 81, thereby suppressing the cooling liquid from flowing into the external space 82 and contaminating Glass substrate 10. In addition, the end surface grinding device 20 reduces the amount of coolant used and reduces the load applied to the environment.

Description

玻璃基板之製造方法、及玻璃基板之製造裝置 Method for manufacturing glass substrate, and device for manufacturing glass substrate

本發明係關於一種玻璃基板之製造方法、及玻璃基板之製造裝置。 The present invention relates to a method for manufacturing a glass substrate and a device for manufacturing a glass substrate.

液晶顯示器及電漿顯示器等平板顯示器(FPD,flat panel display)之製造中所使用之玻璃基板,藉由例如溢流下拉法而製造。於溢流下拉法中,流入至成形體之上表面之槽中並溢出之熔融玻璃沿著成形體之兩側面流下且於成形體之下端合流,藉此連續地成形玻璃帶。成形之玻璃帶一面被向下方拉伸一面冷卻,其後,進行切斷而獲得特定尺寸之玻璃基板。所獲得之玻璃基板經過端面加工步驟、表面清洗步驟及檢查步驟等後捆包而出貨。 Glass substrates used in the manufacture of flat panel displays (FPDs) such as liquid crystal displays and plasma displays are manufactured by, for example, an overflow down-draw method. In the overflow down-draw method, molten glass that flows into a groove on the upper surface of the formed body and overflows flows down both sides of the formed body and merges at the lower end of the formed body, thereby continuously forming a glass ribbon. The formed glass ribbon is cooled while being stretched downward, and then cut to obtain a glass substrate of a specific size. The obtained glass substrates are packaged and shipped after being subjected to an end surface processing step, a surface cleaning step, and an inspection step.

於將玻璃帶切斷為特定尺寸之玻璃基板之步驟中,一般而言使用利用切割器或雷射之切斷方法。於利用切割器之切斷方法中,於玻璃帶上機械性地形成裂縫而將其切斷。因此,於玻璃基板之切斷面上形成有數μm~100μm左右深度之裂痕。該裂痕導致玻璃基板之機械強度劣化。又,於利用雷射之切斷方法中,利用熱應力於玻璃帶上形成裂縫而將其切斷。因此,玻璃基板之切斷面成為銳利且易於形成缺陷之狀態。存在於玻璃基板之切斷面上之形成有裂痕及銳利之部分的層被稱為脆性破壞層,必須藉由對切斷面進行磨削及研磨而除去。即,為了提高玻璃基板之機械強度,抑制玻璃基板之缺陷之產生且使後步驟之處理變得容易,而進行玻璃基板之端面加工步驟。 In the step of cutting the glass ribbon into a glass substrate of a specific size, a cutting method using a cutter or a laser is generally used. In a cutting method using a cutter, a crack is mechanically formed in a glass ribbon to cut it. Therefore, a crack having a depth of several μm to 100 μm is formed on the cut surface of the glass substrate. This crack causes deterioration of the mechanical strength of the glass substrate. Moreover, in the cutting method using a laser, a crack is formed in a glass ribbon by thermal stress, and it is cut | disconnected. Therefore, the cut surface of the glass substrate becomes sharp and defects are easily formed. A layer having cracks and sharp portions formed on a cut surface of a glass substrate is called a brittle failure layer, and must be removed by grinding and polishing the cut surface. That is, in order to improve the mechanical strength of the glass substrate, suppress the occurrence of defects in the glass substrate, and facilitate the processing in the subsequent steps, the end surface processing step of the glass substrate is performed.

先前,於玻璃基板之端面加工步驟中,進行將玻璃基板之端面(切斷面)之角部倒角之倒角步驟。於倒角步驟中,使旋轉之磨削輪接觸於玻璃基板之端面且使磨削輪相對於玻璃基板而相對性地移動,藉此對玻璃基板之端面進行磨削。磨削輪為鑽石輪等金屬結合劑輪。磨削輪與玻璃基板之端面接觸之部位即接觸部之溫度因摩擦熱而上升。當玻璃基板之端面之溫度因該摩擦熱而上升時,存在端面附近之玻璃變質而對作為製品出貨之玻璃基板之品質造成不良影響的顧慮。因此,先前於倒角步驟中,如專利文獻1(日本專利特公昭62-43834號公報)所揭示般採用如下方法,即對磨削輪與玻璃基板之端面之間之接觸部供給冷卻液,而抑制玻璃基板之端面之溫度上升。 Previously, in the end surface processing step of a glass substrate, a chamfering step of chamfering a corner portion of an end surface (cut surface) of the glass substrate was performed. In the chamfering step, the rotating grinding wheel is brought into contact with the end surface of the glass substrate and the grinding wheel is relatively moved relative to the glass substrate, thereby grinding the end surface of the glass substrate. The grinding wheel is a metal bonding wheel such as a diamond wheel. The temperature at which the grinding wheel is in contact with the end surface of the glass substrate, that is, the contact portion, is increased by frictional heat. When the temperature of the end surface of the glass substrate rises due to the frictional heat, there is a concern that the quality of the glass near the end surface may deteriorate the quality of the glass substrate shipped as a product. Therefore, in the chamfering step, as disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 62-43834), a method has been adopted in which a cooling liquid is supplied to a contact portion between a grinding wheel and an end surface of a glass substrate. On the other hand, the temperature rise of the end surface of the glass substrate is suppressed.

[現有技術文獻] [Prior Art Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本專利特公昭62-43834號公報 [Patent Document 1] Japanese Patent Publication No. 62-43834

於倒角步驟中使用之冷卻液例如為純水及包含有機物之水溶液。包含非離子系界面活性劑作為有機物之水溶液之冷卻性能高於純水。然而,於使用包含非離子系界面活性劑之水溶液作為冷卻液之情形時,自降低對環境施加之負載之目的考慮,較佳為冷卻液之使用量較少。 The cooling liquid used in the chamfering step is, for example, pure water and an aqueous solution containing organic matter. The cooling performance of an aqueous solution containing a non-ionic surfactant as an organic substance is higher than that of pure water. However, in the case where an aqueous solution containing a nonionic surfactant is used as the cooling liquid, it is preferable to use a small amount of the cooling liquid for the purpose of reducing the load applied to the environment.

又,於倒角步驟中,當包含非離子系界面活性劑之冷卻液附著於玻璃基板之表面時,因以下理由而有玻璃基板之品質降低之顧慮。例如於FPD之製造中所使用之玻璃基板,於表面配置黑矩陣、及使紅色(R).綠色(G).藍色(B)之光透過之波長選擇元件即RGB像素而形成有彩色濾光片。黑矩陣阻斷未配置RGB像素之區域之背光源之漏光而防止相互鄰接之RGB像素之混色,藉此提高顯示對比度。然而,當冷 卻液中所含之非離子系界面活性劑殘留於玻璃基板之表面上時,黑矩陣有可能無法充分密接於玻璃基板之表面。因此,要求抑制由倒角步驟中所使用之冷卻液所致之玻璃基板之表面污染。 In addition, in the chamfering step, when a cooling liquid containing a nonionic surfactant is attached to the surface of the glass substrate, there is a concern that the quality of the glass substrate may be lowered for the following reasons. For example, glass substrates used in the manufacture of FPDs have a black matrix on the surface and red (R). Green (G). A color filter is formed by RGB pixels, which are wavelength-selective elements through which blue (B) light passes. The black matrix blocks the leakage of light from the backlight in the area where no RGB pixels are arranged and prevents the color mixing of adjacent RGB pixels, thereby improving the display contrast. However, when cold When the non-ionic surfactant contained in the cooling solution remains on the surface of the glass substrate, the black matrix may not be able to sufficiently adhere to the surface of the glass substrate. Therefore, it is required to suppress the surface contamination of the glass substrate caused by the cooling liquid used in the chamfering step.

本發明之目的在於提供可降低對環境施加之負載、且可抑制玻璃基板之表面污染之玻璃基板之製造方法、及玻璃基板之製造裝置。 An object of the present invention is to provide a glass substrate manufacturing method and a glass substrate manufacturing device which can reduce the load applied to the environment and can suppress the surface contamination of the glass substrate.

本發明之玻璃基板之製造方法係藉由使磨石接觸於玻璃基板之端面且使磨石相對於玻璃基板相對性地移動而對端面進行加工之方法。該玻璃基板之製造方法包括磨削步驟、冷卻步驟、及抽吸步驟。磨削步驟係藉由使收納於殼體中之磨石旋轉,且使旋轉之磨石接觸於端面而對端面進行磨削之步驟。冷卻步驟為如下步驟,即對磨石與端面之接觸部供給包含非離子系界面活性劑之水溶液即冷卻液而對接觸部進行冷卻。抽吸步驟為如下步驟,即藉由使殼體之內部空間相對於殼體之外部空間成為負壓,而自內部空間抽吸冷卻液。殼體具有用以將玻璃基板插入至內部空間之狹縫。 The manufacturing method of the glass substrate of this invention is a method of processing an end surface by making a grindstone contact the end surface of a glass substrate, and moving a grindstone relatively with respect to a glass substrate. The manufacturing method of the glass substrate includes a grinding step, a cooling step, and a suction step. The grinding step is a step of grinding the end surface by rotating the grindstone stored in the housing and bringing the rotating grindstone into contact with the end surface. The cooling step is a step of cooling the contact portion by supplying a cooling liquid, which is an aqueous solution containing a non-ionic surfactant, to the contact portion between the grindstone and the end surface. The suction step is a step of sucking the cooling liquid from the internal space by making the internal space of the housing a negative pressure with respect to the external space of the housing. The casing has a slit for inserting the glass substrate into the internal space.

於該玻璃基板之製造方法中,於使旋轉之磨石接觸於玻璃基板之端面而對端面進行磨削時,對磨石與端面相互接觸之部位即接觸部供給冷卻液而使接觸部之端面之溫度降低。由此,抑制因磨石與端面之間之摩擦熱而使接觸部之端面之溫度上升,從而端面附近之玻璃變質而玻璃基板之品質降低。又,供給至接觸部之冷卻液被自收納磨石之殼體之內部空間抽吸,因此可降低飛散至殼體之外部空間而附著於玻璃基板上之冷卻液之量。因此,抑制由冷卻液所致之玻璃基板之表面污染。又,藉由對自殼體之內部空間抽吸之冷卻液加以回收並進行適當處理,而降低對環境施加之負載。由此,該玻璃基板之製造方法可降低對環境造成之負載,且可抑制玻璃基板之表面污染。 In the manufacturing method of the glass substrate, when the rotating grindstone is brought into contact with the end surface of the glass substrate to grind the end surface, a cooling liquid is supplied to the contact portion where the grindstone and the end surface are in contact with each other to make the end surface of the contact portion The temperature decreases. Accordingly, the temperature of the end surface of the contact portion is prevented from increasing due to the frictional heat between the grindstone and the end surface, so that the glass near the end surface is deteriorated and the quality of the glass substrate is reduced. In addition, since the cooling liquid supplied to the contact portion is sucked from the internal space of the housing containing the grindstone, the amount of the cooling liquid scattered to the external space of the housing and adhering to the glass substrate can be reduced. Therefore, the surface contamination of the glass substrate caused by the cooling liquid is suppressed. In addition, the cooling liquid sucked from the inner space of the casing is recovered and appropriately processed, thereby reducing the load imposed on the environment. Therefore, the manufacturing method of the glass substrate can reduce the load on the environment, and can suppress the surface pollution of the glass substrate.

又,本發明之玻璃基板之製造方法較佳為還包括將於抽吸步驟 中抽吸之冷卻液回收之回收步驟。於冷卻步驟中,使用回收步驟中所回收之冷卻液之至少一部分對接觸部進行冷卻。 In addition, the method for manufacturing a glass substrate of the present invention preferably further includes a suction step. The recovery step of the pumped cooling liquid recovery. In the cooling step, at least a part of the cooling liquid recovered in the recovery step is used to cool the contact portion.

於該玻璃基板之製造方法中,對於供給至接觸部之後被抽吸之冷卻液進行回收,進而再利用所回收之冷卻液,藉此可降低冷卻液之使用量。包含非離子系界面活性劑等有機物之冷卻液若被排出至外部則有對環境造成不良影響之顧慮。因此,較佳為該冷卻液之使用量較少。由此,該玻璃基板之製造方法可降低對環境施加之負載。 In the manufacturing method of the glass substrate, the cooling liquid sucked after being supplied to the contact portion is recovered, and then the recovered cooling liquid is reused, thereby reducing the amount of cooling liquid used. If a cooling liquid containing an organic substance such as a nonionic surfactant is discharged to the outside, there is a concern that it may adversely affect the environment. Therefore, it is preferable that the amount of the cooling liquid used is small. Therefore, the manufacturing method of the glass substrate can reduce the load imposed on the environment.

又,於本發明之玻璃基板之製造方法中,較佳為殼體還包括抽吸內部空間之冷卻液之抽吸口。抽吸口於內部空間中相對於磨石而形成於狹縫之相反側。 Moreover, in the manufacturing method of the glass substrate of this invention, it is preferable that a housing also includes the suction port which sucks the cooling liquid of an internal space. The suction port is formed on the opposite side of the slit from the grinding stone in the internal space.

於該玻璃基板之製造方法中,於供給至接觸部之冷卻液最難以被抽吸之位置,設置自內部空間抽吸冷卻液之抽吸口。因此,抑制於藉由供給至接觸部之冷卻液而將接觸部之端面充分冷卻之前抽吸冷卻液。由此,該玻璃基板之製造方法可有效率地進行玻璃基板之端面之冷卻。 In the manufacturing method of this glass substrate, the suction port which draws a cooling liquid from an internal space is provided in the position where the cooling liquid supplied to a contact part is most difficult to suck. Therefore, the cooling liquid is suppressed from being sucked before the end surface of the contact portion is sufficiently cooled by the cooling liquid supplied to the contact portion. Thus, the method for manufacturing a glass substrate can efficiently cool the end surface of the glass substrate.

又,於本發明之玻璃基板之製造方法中,較佳為於冷卻步驟中,相對於接觸部而於磨石之旋轉方向上游側,藉由將冷卻液按壓於磨石而對接觸部供給冷卻液。 Moreover, in the manufacturing method of the glass substrate of this invention, it is preferable in the cooling process that the contact part is provided on the upstream side of the grinding stone in the rotation direction with respect to the contact part, and the contact part is cooled by pressing the coolant on the grindstone. liquid.

於該玻璃基板之製造方法中,藉由冷卻液所按壓之磨石與端面接觸,而對接觸部供給冷卻液來對端面進行冷卻。由此,不對接觸部直接噴出冷卻液即可對接觸部有效率地供給冷卻液。因此,可降低未供給至接觸部而無助於端面之冷卻之冷卻液之量,因此降低冷卻液之使用量。由此,該玻璃基板之製造方法可降低對環境施加之負載。 In the method for manufacturing a glass substrate, a grinding stone pressed by a cooling liquid is in contact with an end surface, and a cooling liquid is supplied to the contact portion to cool the end surface. Accordingly, the cooling liquid can be efficiently supplied to the contact portion without directly discharging the cooling liquid to the contact portion. Therefore, the amount of the cooling liquid that is not supplied to the contact portion and does not contribute to the cooling of the end surface can be reduced, and thus the amount of the cooling liquid used can be reduced. Therefore, the manufacturing method of the glass substrate can reduce the load imposed on the environment.

又,於本發明之玻璃基板之製造方法中,較佳為於抽吸步驟中,藉由調節狹縫之寬度而控制自外部空間經由狹縫流入至內部空間之氣體之流速。 Moreover, in the manufacturing method of the glass substrate of this invention, it is preferable to control the flow velocity of the gas which flows into an internal space from an external space via a slit by adjusting the width of a slit in a suction process.

於該玻璃基板之製造方法中,例如,可藉由使殼體之狹縫之寬度變窄而增加通過狹縫之氣體之流速。通過狹縫之氣體之流速越大,自殼體之內部空間經由狹縫流出至外部空間之冷卻液之量越降低,因此可使供給至接觸部之冷卻液之量增加。由此,該玻璃基板之製造方法可藉由調節狹縫之寬度而控制能供給至接觸部之冷卻液之量。 In the manufacturing method of the glass substrate, for example, the flow velocity of the gas passing through the slit can be increased by narrowing the width of the slit of the casing. The greater the flow velocity of the gas passing through the slit, the lower the amount of cooling liquid flowing from the internal space of the housing to the external space through the slit, and therefore, the amount of the cooling liquid supplied to the contact portion can be increased. Therefore, the method for manufacturing the glass substrate can control the amount of the cooling liquid that can be supplied to the contact portion by adjusting the width of the slit.

又,於本發明之玻璃基板之製造方法中,較佳為狹縫包括用以夾持玻璃基板之一對毛刷。於抽吸步驟中,藉由調節一對毛刷之間隔而控制自外部空間經由狹縫流入至內部空間之氣體之流速。 In the method for manufacturing a glass substrate of the present invention, it is preferable that the slit includes a pair of brushes for holding the glass substrate. In the suction step, the flow rate of the gas flowing from the external space into the internal space through the slit is controlled by adjusting the interval between the pair of brushes.

於該玻璃基板之製造方法中,例如,藉由使設置於狹縫之一對毛刷之間隔變窄而可增大通過狹縫之氣體之流速。通過狹縫之氣體之流速越大,自殼體之內部空間經由狹縫流出至外部空間之冷卻液之量越降低。若抑制冷卻液向外部空間之流出,則可調整對接觸部之冷卻液之供給量,從而可使供給至接觸部之冷卻液之量增加。由此,該玻璃基板之製造方法可藉由調節一對毛刷之間隔而控制能供給至接觸部之冷卻液之量。 In the method for manufacturing the glass substrate, for example, by narrowing the interval between a pair of brushes provided in one of the slits, the flow velocity of the gas passing through the slits can be increased. The greater the flow velocity of the gas passing through the slit, the lower the amount of cooling liquid flowing from the internal space of the housing to the external space through the slit. If the outflow of the cooling liquid to the external space is suppressed, the supply amount of the cooling liquid to the contact portion can be adjusted, so that the amount of the cooling liquid supplied to the contact portion can be increased. Therefore, the method for manufacturing the glass substrate can control the amount of the cooling liquid that can be supplied to the contact portion by adjusting the interval between the pair of brushes.

又,於本發明之玻璃基板之製造方法中,磨石較佳為為金屬結合劑輪。 Moreover, in the manufacturing method of the glass substrate of this invention, it is preferable that a grindstone is a metal bond wheel.

本發明之玻璃基板之製造裝置係藉由使磨石接觸於玻璃基板之端面且使磨石相對於玻璃基板相對性地移動而對端面進行加工之裝置。該玻璃基板之製造裝置包括磨石、旋轉部、冷卻部、及抽吸部。磨石收納於殼體中。旋轉部為使磨石旋轉之機構。冷卻部為如下機構,即對磨石與端面之接觸部供給包含非離子系界面活性劑之水溶液即冷卻液而對接觸部進行冷卻。抽吸部為如下機構,即,使殼體之內部空間相對於殼體之外部空間成為負壓,而自內部空間抽吸冷卻液。殼體具有用以將玻璃基板插入至內部空間之狹縫。 The manufacturing apparatus of the glass substrate of this invention is an apparatus which processes an end surface by making a grindstone contact the end surface of a glass substrate, and moving a grindstone relatively with respect to a glass substrate. The manufacturing apparatus of this glass substrate includes a grindstone, a rotating part, a cooling part, and a suction part. The grindstone is stored in the case. The rotating part is a mechanism for rotating the grindstone. The cooling section is a mechanism for supplying a cooling liquid, which is an aqueous solution containing a nonionic surfactant, to the contact portion between the grindstone and the end surface, and cooling the contact portion. The suction unit is a mechanism that makes the internal space of the housing a negative pressure with respect to the external space of the housing, and sucks the cooling liquid from the internal space. The casing has a slit for inserting the glass substrate into the internal space.

本發明之玻璃基板之製造方法、及玻璃基板之製造裝置,可降低對環境施加之負載,且可抑制玻璃基板之表面污染。 The method for manufacturing a glass substrate and the device for manufacturing a glass substrate according to the present invention can reduce the load imposed on the environment and can suppress the surface contamination of the glass substrate.

10‧‧‧玻璃基板 10‧‧‧ glass substrate

11a‧‧‧第1端面(端面) 11a‧‧‧1st end face (end face)

11b‧‧‧第1端面(端面) 11b‧‧‧1st end face (end face)

12a‧‧‧第2端面(端面) 12a‧‧‧ 2nd end face (end face)

12b‧‧‧第2端面(端面) 12b‧‧‧ 2nd end face (end face)

13‧‧‧接觸部 13‧‧‧Contact

20‧‧‧端面磨削裝置(玻璃基板之製造裝置) 20‧‧‧face grinding device (manufacturing device for glass substrate)

30‧‧‧殼體 30‧‧‧shell

31‧‧‧狹縫 31‧‧‧Slit

32‧‧‧一對毛刷 32‧‧‧ a pair of brushes

32a‧‧‧毛刷孔 32a‧‧‧hair brush hole

33‧‧‧狹縫上表面 33‧‧‧Slit upper surface

34‧‧‧狹縫下表面 34‧‧‧Slit lower surface

35‧‧‧抽吸管 35‧‧‧ Suction tube

36‧‧‧抽吸口 36‧‧‧ Suction port

40‧‧‧倒角磨石(磨石) 40‧‧‧Chamfered millstone (millstone)

41‧‧‧側面 41‧‧‧ side

42‧‧‧加工槽 42‧‧‧Processing trough

43‧‧‧軸 43‧‧‧axis

50‧‧‧馬達(旋轉部) 50‧‧‧motor (rotary part)

60‧‧‧冷卻液供給裝置(冷卻部) 60‧‧‧Coolant supply device (cooling section)

61‧‧‧冷卻液供給管 61‧‧‧Coolant supply pipe

62‧‧‧冷卻液供給構件 62‧‧‧Coolant supply member

63‧‧‧冷卻液貯存構件 63‧‧‧coolant storage member

64‧‧‧主體 64‧‧‧ Subject

65‧‧‧導入口 65‧‧‧ entrance

66‧‧‧貯存空間 66‧‧‧Storage space

67‧‧‧按壓面 67‧‧‧Pressing surface

68‧‧‧供給口 68‧‧‧ supply port

69‧‧‧冷卻液流路 69‧‧‧coolant flow path

70‧‧‧冷卻液回收裝置(抽吸部) 70‧‧‧ Coolant recovery device (suction section)

71‧‧‧冷卻液抽吸部 71‧‧‧Coolant suction section

72‧‧‧冷卻液回收部 72‧‧‧ Coolant Recovery Department

73‧‧‧冷卻液清洗部 73‧‧‧Coolant cleaning department

74‧‧‧冷卻液貯存部 74‧‧‧ Coolant storage section

75‧‧‧冷卻液排出管 75‧‧‧coolant discharge pipe

76‧‧‧冷卻液再利用管 76‧‧‧ coolant reuse pipe

81‧‧‧內部空間 81‧‧‧Internal space

82‧‧‧外部空間 82‧‧‧External space

101‧‧‧第1倒角加工裝置 101‧‧‧The first chamfering device

102‧‧‧旋轉裝置 102‧‧‧rotating device

103‧‧‧第2倒角加工裝置 103‧‧‧The second chamfering device

104‧‧‧切角裝置 104‧‧‧Chamfering device

111‧‧‧第1鑽石輪 111‧‧‧1st Diamond Wheel

112‧‧‧第2鑽石輪 112‧‧‧2nd Diamond Wheel

113‧‧‧第3鑽石輪 113‧‧‧3rd Diamond Wheel

121‧‧‧第1研磨輪 121‧‧‧The first grinding wheel

122‧‧‧第2研磨輪 122‧‧‧ 2nd grinding wheel

S1~S8‧‧‧步驟 S1 ~ S8‧‧‧ steps

X、Y、Z‧‧‧軸 X, Y, Z‧‧‧ axis

圖1係玻璃基板製造步驟之流程圖。 FIG. 1 is a flowchart of manufacturing steps of a glass substrate.

圖2係用以對端面加工裝置所進行之端面加工步驟進行說明之圖。 FIG. 2 is a diagram for explaining the end surface processing steps performed by the end surface processing apparatus.

圖3係端面磨削裝置之一部分之俯視圖。 Fig. 3 is a plan view of a part of the end surface grinding device.

圖4係自圖3之箭頭IV觀察之端面磨削裝置之側視圖。 FIG. 4 is a side view of the end surface grinding device viewed from the arrow IV in FIG. 3.

圖5係表示端面磨削裝置之整體構成之概略圖。 Fig. 5 is a schematic view showing the overall configuration of an end surface grinding device.

圖6係殼體之外觀圖。 Fig. 6 is an external view of a casing.

圖7係冷卻液供給裝置之剖視圖。 Fig. 7 is a cross-sectional view of a coolant supply device.

參照圖式對作為本發明之實施方式之玻璃基板之製造方法進行說明。本實施方式之玻璃基板之製造方法使用對玻璃基板10之端面進行加工之端面加工裝置100。 The manufacturing method of the glass substrate which is embodiment of this invention is demonstrated with reference to drawings. The manufacturing method of the glass substrate of this embodiment uses the end surface processing apparatus 100 which processes the end surface of the glass substrate 10.

(1)玻璃基板之製造步驟之概要 (1) Outline of manufacturing steps of glass substrate

首先,對藉由端面加工裝置100加工之玻璃基板10之製造步驟進行說明。玻璃基板10用於液晶顯示器、電漿顯示器及有機EL(electroluminescence,電致發光)顯示器等平板顯示器(FPD)之製造。玻璃基板10例如具有0.2mm~0.8mm之厚度,且具有縱680mm~2200mm及橫880mm~2500mm之尺寸。 First, the manufacturing process of the glass substrate 10 processed by the end surface processing apparatus 100 is demonstrated. The glass substrate 10 is used for manufacturing a flat panel display (FPD) such as a liquid crystal display, a plasma display, and an organic EL (electroluminescence) display. The glass substrate 10 has a thickness of, for example, 0.2 mm to 0.8 mm, and has dimensions of 680 mm to 2200 mm in length and 880 mm to 2500 mm in width.

作為玻璃基板10之一例,列舉具有以下(a)~(j)組成之鋁硼矽酸鹽玻璃即玻璃基板。 As an example of the glass substrate 10, the glass substrate which is an aluminoborosilicate glass which has the following (a)-(j) composition is mentioned.

(a)SiO2:50質量%~70質量%;(b)Al2O3:10質量%~25質量%;(c)B2O3:1質量%~18質量%; (d)MgO:0質量%~10質量%;(e)CaO:0質量%~20質量%;(f)SrO:0質量%~20質量%;(g)BaO:0質量%~10質量%;(h)RO:5質量%~20質量%(R為自Mg、Ca、Sr及Ba中選擇之至少1種);(i)R'2O:0質量%~2.0質量%(R'為自Li、Na及K中選擇之至少1種);(j)自SnO2、Fe2O3及CeO2中選擇之至少1種金屬氧化物。 (a) SiO 2 : 50% to 70% by mass; (b) Al 2 O 3 : 10% to 25% by mass; (c) B 2 O 3 : 1% to 18% by mass; (d) MgO : 0% to 10% by mass; (e) CaO: 0% to 20% by mass; (f) SrO: 0% to 20% by mass; (g) BaO: 0% to 10% by mass; (h) ) RO: 5 mass% to 20 mass% (R is at least one selected from Mg, Ca, Sr, and Ba); (i) R ' 2 O: 0 mass% to 2.0 mass% (R' is from Li (Na, K and at least one selected); (j) at least one metal oxide selected from SnO 2 , Fe 2 O 3 and CeO 2 .

再者,具有上述組成之玻璃於未達0.1質量%之範圍容許其他微量成分之存在。 Furthermore, the glass having the above composition allows the presence of other trace components in a range of less than 0.1% by mass.

圖1係表示玻璃基板10之製造步驟之流程圖之一例。玻璃基板10之製造步驟主要包含成形步驟(步驟S1)、板狀裁切步驟(步驟S2)、切斷步驟(步驟S3)、粗面化步驟(步驟S4)、端面加工步驟(步驟S5)、清洗步驟(步驟S6)、檢查步驟(步驟S7)、及捆包步驟(步驟S8)。 FIG. 1 is an example of a flowchart showing the manufacturing steps of the glass substrate 10. The manufacturing steps of the glass substrate 10 mainly include a forming step (step S1), a plate-like cutting step (step S2), a cutting step (step S3), a roughening step (step S4), an end surface processing step (step S5), The washing step (step S6), the inspection step (step S7), and the packing step (step S8).

於成形步驟S1中,自對玻璃原料進行加熱所獲得之熔融玻璃利用溢流下拉法或浮式法連續地成形玻璃帶。成形之玻璃帶一面被以不產生應變及翹曲之方式控制溫度,一面冷卻至玻璃緩冷點以下。 In the forming step S1, the molten glass obtained by heating the glass raw material is continuously formed into a glass ribbon by an overflow down-draw method or a float method. The shaped glass ribbon is cooled to below the slow cooling point of the glass while the temperature is controlled in a way that does not cause strain and warpage.

於板狀裁切步驟S2中,將於成形步驟S1中成形之玻璃帶切斷而獲得具有特定尺寸之原板玻璃。 In the sheet-shaped cutting step S2, the glass ribbon formed in the forming step S1 is cut to obtain an original sheet glass having a specific size.

於切斷步驟S3中,將於板狀裁切步驟S2中所獲得之原板玻璃切斷而獲得製品尺寸之玻璃基板10。 In the cutting step S3, the original glass obtained in the plate-shaped cutting step S2 is cut to obtain a glass substrate 10 having a product size.

於粗面化步驟S4中,進行使於切斷步驟S3中所獲得之玻璃基板10之表面粗糙度增加之粗面化處理。玻璃基板10之粗面化處理為使用例如含有氟化氫之蝕刻液之濕式蝕刻處理。 In the roughening step S4, a roughening process is performed to increase the surface roughness of the glass substrate 10 obtained in the cutting step S3. The roughening treatment of the glass substrate 10 is a wet etching treatment using, for example, an etching solution containing hydrogen fluoride.

於端面加工步驟S5中,對已於粗面化步驟S4中進行粗面化處理 之玻璃基板10之端面進行倒角加工及研磨加工。端面加工步驟S5藉由端面加工裝置100進行。端面之倒角加工為將玻璃基板10之一對主表面與端面之間之角部磨削為R形狀之加工。端面之研磨加工為使已倒角加工之端面之表面粗糙度降低之加工。 In the end surface processing step S5, the roughening processing which has been performed in the roughening step S4 is performed. The end surface of the glass substrate 10 is chamfered and polished. The end surface processing step S5 is performed by the end surface processing apparatus 100. The chamfering of the end surface is a process of grinding the corner between a pair of the main surface of the glass substrate 10 and the end surface into an R shape. The grinding process of the end surface is a process for reducing the surface roughness of the chamfered end surface.

於清洗步驟S6中,對已於端面加工步驟S5中進行端面加工之玻璃基板10進行清洗。於玻璃基板10上附著有於切斷步驟S3及端面加工步驟S5中產生之微小玻璃片、或環境中存在之有機物等異物。藉由玻璃基板10之清洗而將該等異物除去。 In the cleaning step S6, the glass substrate 10 which has been subjected to the end surface processing in the end surface processing step S5 is cleaned. On the glass substrate 10, foreign substances such as minute glass pieces generated in the cutting step S3 and the end surface processing step S5, or organic substances existing in the environment, are attached. These foreign materials are removed by cleaning the glass substrate 10.

於檢查步驟S7中,對已於清洗步驟S6中進行清洗之玻璃基板10進行檢查。具體而言,測定玻璃基板10之形狀而光學性地偵測玻璃基板10之缺陷。玻璃基板10之缺陷例如為存在於玻璃基板10之表面上之傷痕及裂痕、附著於玻璃基板10之表面上之異物、及存在於玻璃基板10之內部之微小氣泡等。 In the inspection step S7, the glass substrate 10 which has been cleaned in the cleaning step S6 is inspected. Specifically, the shape of the glass substrate 10 is measured, and a defect of the glass substrate 10 is optically detected. Defects of the glass substrate 10 are, for example, flaws and cracks existing on the surface of the glass substrate 10, foreign matter adhering to the surface of the glass substrate 10, and fine bubbles existing inside the glass substrate 10.

於捆包步驟S8中,將於檢查步驟S7之檢查中合格之玻璃基板10與用以保護玻璃基板10之間隔紙交替地積層於托板上並捆包。捆包之玻璃基板10出貨至FPD之製造業者等。 In the packing step S8, the glass substrate 10 that passed the inspection in the inspection step S7 and the spacer paper for protecting the glass substrate 10 are alternately laminated on the pallet and packed. The packaged glass substrate 10 is shipped to a manufacturer of FPD and the like.

(2)端面加工步驟之概要 (2) Overview of the end processing steps

其次,說明端面加工裝置100對玻璃基板10之端面進行倒角加工及研磨加工之端面加工步驟S5。圖2係用以說明端面加工裝置100所進行之端面加工步驟S5之圖。玻璃基板10以其主表面與水平面平行之狀態於端面加工裝置100之內部沿特定路徑搬送。 Next, an end surface processing step S5 in which the end surface processing apparatus 100 performs chamfering processing and polishing processing on the end surface of the glass substrate 10 will be described. FIG. 2 is a diagram for explaining the end surface processing step S5 performed by the end surface processing apparatus 100. The glass substrate 10 is transported along the specific path inside the end surface processing apparatus 100 in a state where the main surface is parallel to the horizontal plane.

藉由端面加工裝置100加工之玻璃基板10具有長方形之形狀。玻璃基板10具有一對第1端面11a、11b、及一對第2端面12a、12b。第1端面11a、11b為與玻璃基板10之短邊平行之端面。第2端面12a、12b為與玻璃基板10之長邊平行之端面。 The glass substrate 10 processed by the end surface processing apparatus 100 has a rectangular shape. The glass substrate 10 includes a pair of first end surfaces 11 a and 11 b and a pair of second end surfaces 12 a and 12 b. The first end faces 11 a and 11 b are end faces parallel to the short sides of the glass substrate 10. The second end faces 12 a and 12 b are end faces parallel to the long sides of the glass substrate 10.

端面加工裝置100主要包括第1倒角加工裝置101、旋轉裝置 102、第2倒角加工裝置103、及切角裝置104。第1倒角加工裝置101、旋轉裝置102、第2倒角加工裝置103及切角裝置104依序自玻璃基板10之搬送路徑之上游側向下游側配置。於端面加工裝置100之內部搬送之玻璃基板10依序通過第1倒角加工裝置101、旋轉裝置102、第2倒角加工裝置103及切角裝置104。 The end surface processing device 100 mainly includes a first chamfering processing device 101 and a rotating device. 102, a second chamfering device 103, and a chamfering device 104. The first chamfering device 101, the rotation device 102, the second chamfering device 103, and the chamfering device 104 are sequentially arranged from the upstream side to the downstream side of the conveyance path of the glass substrate 10. The glass substrate 10 conveyed inside the end surface processing device 100 passes through the first chamfering processing device 101, the rotation device 102, the second chamfering processing device 103, and the chamfering device 104 in this order.

首先,第1倒角加工裝置101使用設置於玻璃基板10之搬送路徑兩側之一對第1鑽石輪111,對玻璃基板10之第1端面11a、11b之角部進行倒角。其後,第1倒角加工裝置101使用設置於玻璃基板10之搬送路徑兩側之一對第1研磨輪121,對玻璃基板10之第1端面11a、11b進行研磨。然後,將玻璃基板10搬送至旋轉裝置102。 First, the first chamfering apparatus 101 chamfers the corners of the first end faces 11 a and 11 b of the glass substrate 10 using one pair of first diamond wheels 111 provided on one side of the conveyance path of the glass substrate 10. Thereafter, the first chamfering apparatus 101 polishes the first end faces 11 a and 11 b of the glass substrate 10 using a pair of first grinding wheels 121 provided on one of both sides of the conveyance path of the glass substrate 10. Then, the glass substrate 10 is transferred to the rotation device 102.

其次,旋轉裝置102使玻璃基板10於水平面內旋轉90°。其後,將玻璃基板10搬送至第2倒角加工裝置103。 Next, the rotating device 102 rotates the glass substrate 10 by 90 ° in the horizontal plane. Thereafter, the glass substrate 10 is transferred to the second chamfering apparatus 103.

其次,第2倒角加工裝置103使用設置於玻璃基板10之搬送路徑兩側之一對第2鑽石輪112,對玻璃基板10之第2端面12a、12b之角部進行倒角。其後,第2倒角加工裝置103使用設置於玻璃基板10之搬送路徑兩側之一對第2研磨輪122,對玻璃基板10之第2端面12a、12b進行研磨。然後,將玻璃基板10搬送至切角裝置104。 Next, the second chamfering processing device 103 chamfers the corners of the second end faces 12a, 12b of the glass substrate 10 using a pair of second diamond wheels 112 provided on one side of the conveyance path of the glass substrate 10. Thereafter, the second chamfering apparatus 103 polishes the second end faces 12 a and 12 b of the glass substrate 10 using a pair of second grinding wheels 122 provided on one of both sides of the conveyance path of the glass substrate 10. Then, the glass substrate 10 is transferred to the chamfering device 104.

其次,切角裝置104使用4個第3鑽石輪113,對玻璃基板10之主表面之4個角部進行倒角。然後,將玻璃基板10搬送至清洗步驟S6。 Next, the chamfering device 104 uses four third diamond wheels 113 to chamfer the four corners of the main surface of the glass substrate 10. Then, the glass substrate 10 is conveyed to the cleaning step S6.

第1鑽石輪111、第2鑽石輪112及第3鑽石輪113,例如係利用含有鐵之金屬系結合劑固定有粒度為#400之鑽石研磨粒之金屬結合劑輪。第1鑽石輪111、第2鑽石輪112及第3鑽石輪113亦可為相同種類之輪。 The first diamond wheel 111, the second diamond wheel 112, and the third diamond wheel 113 are, for example, metal bond wheels in which diamond abrasive grains with a particle size of # 400 are fixed by a metal bond containing iron. The first diamond wheel 111, the second diamond wheel 112, and the third diamond wheel 113 may be wheels of the same type.

第1研磨輪121及第2研磨輪122例如係利用含有鐵之金屬系結合劑固定有粒度為#400之碳化矽研磨粒之金屬結合劑輪。第1研磨輪121及第2研磨輪122亦可為相同種類之輪。再者,結合劑亦可為鈷系或銅系之結合材,亦可為樹脂系之結合材。 The first grinding wheel 121 and the second grinding wheel 122 are, for example, metal bonding wheels having silicon carbide abrasive grains having a particle size of # 400 fixed by a metal bonding agent containing iron. The first grinding wheel 121 and the second grinding wheel 122 may be wheels of the same type. The bonding agent may be a cobalt-based or copper-based bonding material, or a resin-based bonding material.

(3)端面磨削裝置之構成 (3) Structure of the face grinding device

其次,說明對玻璃基板10之端面進行倒角加工之端面磨削裝置20。端面磨削裝置20相當於作為本發明之實施方式之玻璃基板之製造裝置。第1倒角加工裝置101具有對玻璃基板10之一對第1端面11a、11b之各者進行倒角加工之一對端面磨削裝置20。同樣地,第2倒角加工裝置103具有對玻璃基板10之一對第2端面12a、12b之各者進行倒角加工之一對端面磨削裝置20。 Next, an end surface grinding device 20 for chamfering the end surface of the glass substrate 10 will be described. The end surface grinding device 20 corresponds to a manufacturing device of a glass substrate as an embodiment of the present invention. The first chamfering device 101 includes a pair of end surface grinding devices 20 that chamfer each of one of the glass substrates 10 to the first end surfaces 11 a and 11 b. Similarly, the second chamfering device 103 includes a pair of end surface grinding devices 20 that chamfer each of one of the glass substrates 10 and the second end surfaces 12 a and 12 b.

圖3係端面磨削裝置20之一部分之俯視圖。圖3中表示進行玻璃基板10之第1端面11a之倒角加工之第1倒角加工裝置101之端面磨削裝置20。圖4係自圖3所示之箭頭IV方向觀察之端面磨削裝置20之側視圖。於圖3、4中,表示殼體30之截面。圖5係表示端面磨削裝置20之整體構成之概略圖。 FIG. 3 is a plan view of a part of the end surface grinding device 20. FIG. 3 shows an end surface grinding device 20 of a first chamfering device 101 that performs chamfering of a first end surface 11 a of a glass substrate 10. FIG. 4 is a side view of the end surface grinding device 20 viewed from the arrow IV direction shown in FIG. 3. 3 and 4 show a cross section of the case 30. FIG. 5 is a schematic view showing the overall configuration of the end surface grinding device 20.

以下,如圖3、4所示般定義X軸、Y軸及Z軸。於與玻璃基板10之主表面平行之水平面上,設定包含X軸及Y軸之二維正交座標系。X軸為與搬送玻璃基板10之方向平行之軸。Y軸為與搬送玻璃基板10之方向正交之軸。Z軸為與包含X軸及Y軸之平面正交之軸。 Hereinafter, the X-axis, Y-axis, and Z-axis are defined as shown in FIGS. 3 and 4. On a horizontal plane parallel to the main surface of the glass substrate 10, a two-dimensional orthogonal coordinate system including an X axis and a Y axis is set. The X axis is an axis parallel to the direction in which the glass substrate 10 is transported. The Y axis is an axis orthogonal to the direction in which the glass substrate 10 is transported. The Z axis is an axis orthogonal to a plane including the X axis and the Y axis.

端面磨削裝置20主要包括殼體30、倒角磨石40、馬達50、冷卻液供給裝置60、冷卻液回收裝置70、及控制部(未圖示)。接下來,對端面磨削裝置20之各構成要素進行說明。以下之說明亦可應用於第2倒角加工裝置103之端面磨削裝置20。 The end surface grinding device 20 mainly includes a housing 30, a chamfered grindstone 40, a motor 50, a coolant supply device 60, a coolant recovery device 70, and a control unit (not shown). Next, each component of the end surface grinding apparatus 20 is demonstrated. The following description is also applicable to the end surface grinding device 20 of the second chamfering processing device 103.

(3-1)殼體 (3-1) Housing

殼體30為由金屬板組裝而成之長方體容器。殼體30固定於第1倒角加工裝置101之內部。殼體30收納倒角磨石40及冷卻液供給裝置60。於殼體30安裝有馬達50。圖6為殼體30之外觀圖。於圖6中省略一對毛刷32,而僅表示一對毛刷32突出之孔即毛刷孔32a。 The case 30 is a rectangular parallelepiped container assembled from a metal plate. The case 30 is fixed inside the first chamfering apparatus 101. The housing 30 houses a chamfered grindstone 40 and a coolant supply device 60. A motor 50 is attached to the casing 30. FIG. 6 is an external view of the casing 30. The pair of fur brushes 32 is omitted in FIG. 6, and only the fur hole 32 a which is a protruding hole of the pair of fur brushes 32 is shown.

殼體30具有狹縫31。狹縫31為形成於殼體30之外表面之與X軸平 行之間隙。狹縫31連通殼體30之內部空間81與殼體30之外部空間82。狹縫31為用以將位於外部空間82之玻璃基板10之第1端面11a插入至內部空間81之間隙。狹縫31為相互對向之狹縫上表面33與狹縫下表面34之間之空間。 The casing 30 has a slit 31. The slit 31 is formed on the outer surface of the case 30 and is parallel to the X axis. Gap between lines. The slit 31 communicates with the internal space 81 of the casing 30 and the external space 82 of the casing 30. The slit 31 is a gap for inserting the first end surface 11 a of the glass substrate 10 located in the external space 82 into the internal space 81. The slit 31 is a space between the slit upper surface 33 and the slit lower surface 34 facing each other.

殼體30具有設置於狹縫31之一對毛刷32。一對毛刷32自狹縫上表面33及狹縫下表面34之各者之毛刷孔32a向Z軸方向突出。毛刷孔32a分別沿X軸及Y軸形成。一對毛刷32之材質例如為尼龍。一對毛刷32夾持插入至狹縫31中之玻璃基板10之端部。又,一對毛刷32抑制下述之冷卻液自內部空間81流出至外部空間82。 The casing 30 includes a pair of fur brushes 32 provided in one of the slits 31. The pair of brushes 32 protrude from the brush hole 32a of each of the slit upper surface 33 and the slit lower surface 34 in the Z-axis direction. The brush holes 32a are formed along the X-axis and the Y-axis, respectively. The material of the pair of brushes 32 is, for example, nylon. A pair of brushes 32 are sandwiched between the ends of the glass substrate 10 inserted into the slit 31. In addition, the pair of bristles 32 suppress the cooling liquid described below from flowing from the internal space 81 to the external space 82.

殼體30之外表面連接有金屬管即抽吸管35。殼體30經由抽吸管35而連接於冷卻液回收裝置70。抽吸管35為安裝於抽吸口36之配管,該抽吸口36為形成於殼體30之外表面之孔。抽吸口36於殼體30之內部空間81,隔著倒角磨石40而於狹縫31之相反側開口。即,於內部空間81,抽吸口36與狹縫31對向。 A suction pipe 35 that is a metal pipe is connected to the outer surface of the casing 30. The casing 30 is connected to the coolant recovery device 70 via a suction pipe 35. The suction pipe 35 is a pipe attached to the suction port 36, which is a hole formed on the outer surface of the casing 30. The suction port 36 is opened in the inner space 81 of the casing 30 on the opposite side of the slit 31 through the chamfered grindstone 40. That is, in the internal space 81, the suction port 36 faces the slit 31.

(3-2)倒角磨石 (3-2) Chamfer millstone

倒角磨石40為用以對玻璃基板10之端面進行倒角加工之磨石。於第1倒角加工裝置101之端面磨削裝置20中,倒角磨石40為第1鑽石輪111。於第2倒角加工裝置103之端面磨削裝置20中,倒角磨石40為第2鑽石輪112。 The chamfering grindstone 40 is a grindstone for chamfering the end surface of the glass substrate 10. In the end face grinding device 20 of the first chamfering processing device 101, the chamfering grindstone 40 is a first diamond wheel 111. In the end face grinding device 20 of the second chamfering processing device 103, the chamfering grindstone 40 is a second diamond wheel 112.

倒角磨石40配置於殼體30之內部空間81。倒角磨石40相對於殼體30而位置固定。倒角磨石40具有圓筒形狀。於倒角磨石40之側面41,沿圓周方向形成有加工槽42。倒角磨石40經由向Z軸方向延伸之軸43而與馬達50連結。軸43貫通殼體30之上表面。 The chamfered grindstone 40 is disposed in the inner space 81 of the casing 30. The chamfered grindstone 40 is fixed in position with respect to the casing 30. The chamfered grindstone 40 has a cylindrical shape. A processing groove 42 is formed on the side surface 41 of the chamfering grindstone 40 along the circumferential direction. The chamfered grindstone 40 is connected to the motor 50 via a shaft 43 extending in the Z-axis direction. The shaft 43 penetrates the upper surface of the casing 30.

倒角磨石40藉由軸43之軸旋轉而繞與Z軸平行之旋轉軸旋轉。藉由玻璃基板10之第1端面11a接觸於旋轉之倒角磨石40之加工槽42之表面(側面41之一部分),而對第1端面11a進行倒角加工。以下,將玻璃 基板10之第1端面11a與倒角磨石40接觸之部位稱為接觸部13。圖3中,玻璃基板10向右側搬送,且倒角磨石40逆時針旋轉。如此,倒角磨石40於接觸部13向與玻璃基板10之搬送方向相反之方向旋轉。 The chamfered grindstone 40 rotates around the rotation axis parallel to the Z axis by the rotation of the axis 43. The first end surface 11a of the glass substrate 10 is brought into contact with the surface (part of the side surface 41) of the processing groove 42 of the rotating chamfering grindstone 40, so that the first end surface 11a is chamfered. Below, the glass A portion where the first end surface 11 a of the substrate 10 contacts the chamfered grindstone 40 is referred to as a contact portion 13. In FIG. 3, the glass substrate 10 is conveyed to the right, and the chamfered grindstone 40 rotates counterclockwise. In this way, the chamfered grindstone 40 is rotated at the contact portion 13 in a direction opposite to the conveyance direction of the glass substrate 10.

(3-3)馬達 (3-3) Motor

馬達50安裝於殼體30之上表面。馬達50經由軸43而與倒角磨石40連結。馬達50為用以使軸43進行軸旋轉而使倒角磨石40繞旋轉軸旋轉之動力源。 The motor 50 is mounted on the upper surface of the casing 30. The motor 50 is connected to the chamfering grindstone 40 via a shaft 43. The motor 50 is a power source for rotating the shaft 43 and rotating the chamfered grindstone 40 around the rotation axis.

(3-4)冷卻液供給裝置 (3-4) Coolant supply device

冷卻液供給裝置60主要包括冷卻液供給管61、冷卻液供給構件62、及冷卻液貯存構件63。冷卻液供給管61為貫通殼體30之配管。冷卻液供給管61將配置於內部空間81之冷卻液供給構件62、配置於外部空間82之冷卻液貯存構件63、及下述之冷卻液回收裝置70相互連接。 The coolant supply device 60 mainly includes a coolant supply pipe 61, a coolant supply member 62, and a coolant storage member 63. The cooling liquid supply pipe 61 is a pipe that passes through the casing 30. The coolant supply pipe 61 connects a coolant supply member 62 arranged in the internal space 81, a coolant storage member 63 arranged in the outer space 82, and a coolant recovery device 70 described below.

冷卻液供給構件62為用以將冷卻液按壓至旋轉之倒角磨石40之側面41之構件。冷卻液為包含非離子系界面活性劑之水溶液。非離子系界面活性劑例如為磺基琥珀酸鹽。包含非離子系界面活性劑之冷卻液由於表面張力小,因此於接觸部13易於進入倒角磨石40之側面41(加工槽42之表面)與玻璃基板10之第1端面11a之間之間隙。冷卻液具有將藉由利用倒角磨石40對第1端面11a之磨削而產生之玻璃微粒子等異物沖走而除去之效果。又,冷卻液具有對易於因摩擦而成為高溫之接觸部13進行冷卻之效果。再者,冷卻液除包含非離子系界面活性劑以外,還可包含氨系成分或甘油等。氨系成分例如為二乙醇氨、三乙醇氨及烷醇氨。 The cooling liquid supply member 62 is a member for pressing the cooling liquid to the side surface 41 of the rotating chamfered grindstone 40. The cooling liquid is an aqueous solution containing a non-ionic surfactant. The non-ionic surfactant is, for example, a sulfosuccinate. Since the coolant containing the non-ionic surfactant has a small surface tension, the contact portion 13 easily enters the gap between the side surface 41 (the surface of the processing groove 42) of the chamfering grindstone 40 and the first end surface 11a of the glass substrate 10. . The cooling liquid has the effect of removing and removing foreign matter such as glass particles generated by grinding the first end surface 11 a by the chamfered grindstone 40. In addition, the cooling liquid has the effect of cooling the contact portion 13 which is liable to become high temperature due to friction. In addition, the cooling liquid may contain an ammonia-based component, glycerin, etc. in addition to the non-ionic surfactant. The ammonia-based components are, for example, diethanol ammonia, triethanol ammonia, and alkanol ammonia.

冷卻液供給構件62相對於接觸部13而於倒角磨石40之旋轉方向上游側,與倒角磨石40鄰接而配置。冷卻液供給構件62相對於倒角磨石40而位置固定。 The coolant supply member 62 is disposed adjacent to the chamfered grindstone 40 on the upstream side in the rotation direction of the chamfered grindstone 40 with respect to the contact portion 13. The coolant supply member 62 is fixed in position with respect to the chamfered grindstone 40.

圖7為冷卻液供給構件62之剖視圖。冷卻液供給構件62主要具有 主體64、導入口65、貯存空間66、按壓面67、及供給口68。導入口65為形成於主體64之外表面且連接有冷卻液供給管61之孔。貯存空間66與導入口65及供給口68連通,且為主體64之內部空間。按壓面67為與倒角磨石40之側面41對向之面。供給口68為形成於按壓面67之孔。於按壓面67與側面41之間形成有稱為冷卻液流路69之狹窄之間隙。冷卻液流路69之寬度、即倒角磨石40之徑向之冷卻液流路69之尺寸,越向倒角磨石40之旋轉方向下游側越小。 FIG. 7 is a cross-sectional view of the coolant supply member 62. The coolant supply member 62 mainly has The main body 64, the introduction port 65, the storage space 66, the pressing surface 67, and the supply port 68. The introduction port 65 is a hole formed on the outer surface of the main body 64 and connected to the cooling liquid supply pipe 61. The storage space 66 communicates with the introduction port 65 and the supply port 68 and is an internal space of the main body 64. The pressing surface 67 is a surface facing the side surface 41 of the chamfered grindstone 40. The supply port 68 is a hole formed in the pressing surface 67. A narrow gap called a coolant flow path 69 is formed between the pressing surface 67 and the side surface 41. The width of the coolant flow path 69, that is, the size of the coolant flow path 69 in the radial direction of the chamfered grindstone 40, decreases toward the downstream side of the chamfered grindstone 40 in the rotation direction.

冷卻液貯存構件63為貯存冷卻液之容器。貯存於冷卻液貯存構件63中之冷卻液於冷卻液供給管61中流動,且通過冷卻液供給構件62之導入口65而流入至貯存空間66。流入至貯存空間66之冷卻液通過供給口68而供給至冷卻液流路69。供給至冷卻液流路69之冷卻液流向倒角磨石40之側面41與倒角磨石40之旋轉方向下游側。冷卻液流路69之截面積越向倒角磨石40之旋轉方向下游側越小,因此於冷卻液流路69中流動之冷卻液之壓力逐漸變高。其結果,於冷卻液流路69中流動之冷卻液被自冷卻液供給構件62之按壓面67向倒角磨石40之側面41按壓。由此,供給至冷卻液流路69之冷卻液確實地流入至形成於側面41之加工槽42。 The cooling liquid storage member 63 is a container for storing a cooling liquid. The cooling liquid stored in the cooling liquid storage member 63 flows in the cooling liquid supply pipe 61 and flows into the storage space 66 through the inlet 65 of the cooling liquid supply member 62. The cooling liquid flowing into the storage space 66 is supplied to the cooling liquid flow path 69 through the supply port 68. The cooling liquid supplied to the cooling liquid flow path 69 flows to the side surface 41 of the chamfered grindstone 40 and the downstream side in the rotation direction of the chamfered grindstone 40. As the cross-sectional area of the coolant flow path 69 decreases toward the downstream side of the chamfered grindstone 40 in the rotation direction, the pressure of the coolant flowing in the coolant flow path 69 gradually increases. As a result, the cooling liquid flowing in the cooling liquid flow path 69 is pressed from the pressing surface 67 of the cooling liquid supply member 62 to the side surface 41 of the chamfered grindstone 40. Thereby, the cooling liquid supplied to the cooling liquid flow path 69 reliably flows into the processing groove 42 formed in the side surface 41.

(3-5)冷卻液回收裝置 (3-5) Coolant recovery device

冷卻液回收裝置70經由抽吸管35而連接於殼體30。冷卻液回收裝置70主要具有冷卻液抽吸部71、冷卻液回收部72、冷卻液清洗部73、及冷卻液貯存部74。 The cooling liquid recovery device 70 is connected to the casing 30 via a suction pipe 35. The coolant recovery device 70 mainly includes a coolant suction section 71, a coolant recovery section 72, a coolant cleaning section 73, and a coolant storage section 74.

冷卻液抽吸部71抽吸殼體30之內部空間81之氣體而使殼體30之內部空間81相對於殼體30之外部空間82成為負壓。冷卻液抽吸部71例如為可抽吸液體及氣體之泵。藉由冷卻液抽吸部71使內部空間81相對於外部空間82成為負壓,藉此產生自外部空間82經由狹縫31而朝向內部空間81之氣體之流動。 The coolant suction portion 71 sucks the gas in the internal space 81 of the casing 30 so that the internal space 81 of the casing 30 becomes a negative pressure with respect to the external space 82 of the casing 30. The cooling liquid suction unit 71 is, for example, a pump capable of sucking liquid and gas. The internal pressure of the internal space 81 relative to the external space 82 is made negative by the coolant suction portion 71, and thereby a gas flow from the external space 82 toward the internal space 81 through the slit 31 is generated.

於倒角磨石40之表面附著有自冷卻液供給構件62供給之冷卻液。附著於倒角磨石40之冷卻液之一部分藉由利用倒角磨石40之旋轉而產生之離心力,而自倒角磨石40之表面飛散。又,於位於與狹縫31對向之位置之倒角磨石40之側面41,大量附著有自冷卻液供給構件62供給之冷卻液。因此,自與狹縫31對向之側面41、及接觸部13向狹縫31飛散大量冷卻液。然而,朝向狹縫31飛散之冷卻液藉由自外部空間82經由狹縫31而朝向內部空間81之氣體之流動,而不會通過狹縫31流出至外部空間82。因此,冷卻液抽吸部71不會使自倒角磨石40之表面飛散之冷卻液流出至外部空間82而是將之預先留存在內部空間81,且可經由殼體30之抽吸口36而抽吸至抽吸管35。即,抽吸管35為藉由冷卻液抽吸部71抽吸之內部空間81之氣體及冷卻液流動之配管。 On the surface of the chamfering grindstone 40, a cooling liquid supplied from a cooling liquid supply member 62 is attached. A part of the cooling liquid adhering to the chamfered grindstone 40 is scattered from the surface of the chamfered grindstone 40 by utilizing the centrifugal force generated by the rotation of the chamfered grindstone 40. In addition, a large amount of the cooling liquid supplied from the cooling liquid supply member 62 is attached to the side surface 41 of the chamfered grindstone 40 located at a position facing the slit 31. Therefore, a large amount of cooling liquid is scattered from the side surface 41 facing the slit 31 and the contact portion 13 toward the slit 31. However, the cooling liquid scattered toward the slit 31 flows through the gas from the outer space 82 through the slit 31 toward the inner space 81 without flowing out to the outer space 82 through the slit 31. Therefore, the cooling liquid suction portion 71 does not allow the cooling liquid scattered from the surface of the chamfering grindstone 40 to flow to the external space 82 but retains it in the internal space 81 in advance, and can pass through the suction port 36 of the housing 30 The suction is performed to the suction pipe 35. That is, the suction pipe 35 is a pipe through which the gas and the cooling liquid in the internal space 81 sucked by the cooling liquid suction unit 71 flow.

冷卻液回收部72為自藉由冷卻液抽吸部71抽吸之氣體與冷卻液之混合物分離氣體而回收冷卻液之分離器。 The cooling liquid recovery unit 72 is a separator that separates the gas from the mixture of the gas and the cooling liquid sucked by the cooling liquid suction unit 71 to recover the cooling liquid.

冷卻液清洗部73為用以將藉由冷卻液回收部72回收之冷卻液中所包含之異物除去之機構。於回收之冷卻液中有時混入有玻璃之微小片等異物。冷卻液清洗部73例如為設置於回收之冷卻液流動之流路上之過濾器。 The coolant cleaning unit 73 is a mechanism for removing foreign substances contained in the coolant recovered by the coolant recovery unit 72. Foreign matter such as glass flakes may be mixed in the recovered cooling liquid. The coolant cleaning unit 73 is, for example, a filter provided on a flow path through which the recovered coolant flows.

冷卻液貯存部74為貯存藉由冷卻液清洗部73除去了異物之冷卻液之容器。冷卻液貯存部74具有用以將貯存之冷卻液排出之冷卻液排出管75。又,冷卻液貯存部74經由冷卻液再利用管76而連接於冷卻液貯存構件63。貯存於冷卻液貯存部74中之冷卻液於冷卻液再利用管76中流動而供給至冷卻液貯存構件63,進而,於冷卻液供給管61中流動而供給至冷卻液供給構件62以供再利用。 The cooling liquid storage section 74 is a container that stores a cooling liquid from which foreign matter has been removed by the cooling liquid cleaning section 73. The cooling liquid storage section 74 includes a cooling liquid discharge pipe 75 for discharging the stored cooling liquid. The coolant storage section 74 is connected to the coolant storage member 63 via a coolant reuse pipe 76. The cooling liquid stored in the cooling liquid storage section 74 flows through the cooling liquid reuse pipe 76 and is supplied to the cooling liquid storage member 63, and further flows through the cooling liquid supply pipe 61 and is supplied to the cooling liquid supply member 62 for re-recycling. use.

(3-6)控制部 (3-6) Control section

控制部為控制端面磨削裝置20之電腦。例如,控制部控制馬達50及冷卻液回收裝置70。其次,對控制部之控制例進行說明。 The control unit is a computer that controls the end surface grinding device 20. For example, the control unit controls the motor 50 and the coolant recovery device 70. Next, a control example of the control unit will be described.

控制部調節馬達50之輸出而控制倒角磨石40之旋轉速度。又,控制部調節冷卻液回收裝置70之冷卻液抽吸部71之輸出,而控制通過狹縫31之氣體之流速、或藉由冷卻液回收部72回收而貯存於冷卻液貯存部74中之冷卻液之量。 The control unit adjusts the output of the motor 50 to control the rotation speed of the chamfered grindstone 40. In addition, the control unit adjusts the output of the cooling liquid suction unit 71 of the cooling liquid recovery device 70, and controls the flow rate of the gas passing through the slit 31, or the gas stored in the cooling liquid storage unit 74 by the cooling liquid recovery unit 72 The amount of coolant.

(4)端面加工裝置之動作 (4) Operation of the end surface processing device

其次,說明藉由第1倒角加工裝置101之一對端面磨削裝置20對玻璃基板10之第1端面11a、11b進行倒角加工之步驟。以下之說明亦可應用於藉由第2倒角加工裝置103之一對端面磨削裝置20而對玻璃基板10之第2端面12a、12b進行倒角加工之步驟。 Next, a description will be given of a step of chamfering the first end faces 11 a and 11 b of the glass substrate 10 by the pair of end face grinding devices 20 using one of the first chamfering devices 101. The following description can also be applied to the step of chamfering the second end faces 12 a and 12 b of the glass substrate 10 by one of the second chamfering devices 103 and the end face grinding device 20.

已於粗面化步驟S4進行表面處理之玻璃基板10,於端面加工裝置100之內部沿X軸搬送。於搬送之前,預先以玻璃基板10之第1端面11a、11b與X軸平行之方式調節玻璃基板10之方向。又,一對端面磨削裝置20之位置預先根據玻璃基板10之尺寸而進行調節。 The glass substrate 10 that has been surface-treated in the roughening step S4 is transported along the X axis inside the end surface processing apparatus 100. Before the transfer, the direction of the glass substrate 10 is adjusted in advance so that the first end faces 11 a and 11 b of the glass substrate 10 are parallel to the X axis. The positions of the pair of end surface grinding devices 20 are adjusted in advance according to the size of the glass substrate 10.

於玻璃基板10沿X軸搬送之過程中,玻璃基板10之第1端面11a、11b插入至端面磨削裝置20之狹縫31。包含插入至狹縫31中之第1端面11a、11b之玻璃基板10之端部由一對毛刷32夾持。 While the glass substrate 10 is being transported along the X axis, the first end surfaces 11 a and 11 b of the glass substrate 10 are inserted into the slits 31 of the end surface grinding device 20. An end portion of the glass substrate 10 including the first end surfaces 11 a and 11 b inserted into the slit 31 is held by a pair of brushes 32.

其後,於玻璃基板10沿X軸搬送之過程中,玻璃基板10之第1端面11a、11b於接觸部13與端面磨削裝置20之倒角磨石40接觸而進行倒角加工。於接觸部13中,玻璃基板10之主表面與第1端面11a、11b之間之角部藉由倒角磨石40之加工槽42之表面磨削而倒角為R形狀。 Thereafter, while the glass substrate 10 is being transported along the X axis, the first end surfaces 11 a and 11 b of the glass substrate 10 are brought into contact with the chamfering grindstone 40 of the end surface grinding device 20 at the contact portion 13 to perform chamfering. In the contact portion 13, the corner portion between the main surface of the glass substrate 10 and the first end faces 11 a and 11 b is ground by the surface of the processing groove 42 of the chamfering grindstone 40 to be chamfered into an R shape.

又,於接觸部13中,藉由利用冷卻液供給裝置60供給至加工槽42之冷卻液對玻璃基板10之第1端面11a、11b進行冷卻。其後,冷卻液藉由冷卻液回收裝置70回收。回收之冷卻液之至少一部分被再利用於對玻璃基板10之第1端面11a、11b進行冷卻。 In the contact portion 13, the first end faces 11 a and 11 b of the glass substrate 10 are cooled by a cooling liquid supplied to the processing tank 42 by the cooling liquid supply device 60. Thereafter, the cooling liquid is recovered by the cooling liquid recovery device 70. At least a part of the recovered cooling liquid is reused to cool the first end faces 11 a and 11 b of the glass substrate 10.

(5)特徵 (5) Features

(5-1) (5-1)

本實施方式之端面加工裝置100包括用以對玻璃基板10之第1端面11a進行倒角加工之端面磨削裝置20。端面磨削裝置20使旋轉之倒角磨石40之側面41(加工槽42之表面)接觸於玻璃基板10之第1端面11a,且使倒角磨石40相對於玻璃基板10相對性地移動,藉此對第1端面11a進行倒角加工。 The end surface processing device 100 according to this embodiment includes an end surface grinding device 20 for chamfering the first end surface 11 a of the glass substrate 10. The end surface grinding device 20 makes the side surface 41 (the surface of the processing groove 42) of the rotating chamfering grindstone 40 contact the first end surface 11 a of the glass substrate 10, and relatively moves the chamfering grindstone 40 relative to the glass substrate 10. Thus, the first end surface 11a is chamfered.

於使用金屬結合劑輪即倒角磨石40之第1端面11a之倒角加工中,第1端面11a之溫度因倒角磨石40與玻璃基板10之間之摩擦熱而上升。當第1端面11a成為高溫時,有第1端面11a附近之玻璃變質而使作為最終製品之玻璃基板10的品質降低之顧慮。 In the chamfering process using the metal bonding wheel, that is, the first end face 11 a of the chamfered grindstone 40, the temperature of the first end face 11 a rises due to the frictional heat between the chamfered grindstone 40 and the glass substrate 10. When the first end surface 11a becomes a high temperature, there is a concern that the glass near the first end surface 11a is deteriorated and the quality of the glass substrate 10 as a final product may be reduced.

然而,端面磨削裝置20可對倒角磨石40之側面41(加工槽42之表面)與玻璃基板10之第1端面11a相互接觸之部位即接觸部13供給冷卻液,而抑制第1端面11a之溫度上升。冷卻液為包含非離子系界面活性劑之水溶液。該冷卻液與純水相比表面張力較小,因此亦可容易地進入接觸部13之微小間隙中。因此,該冷卻液與純水相比冷卻性能較高。 However, the end surface grinding device 20 can supply coolant to the contact portion 13 which is a portion where the side surface 41 (the surface of the processing groove 42) of the chamfered grindstone 40 and the first end surface 11 a of the glass substrate 10 contact each other, thereby suppressing the first end surface. The temperature of 11a rises. The cooling liquid is an aqueous solution containing a non-ionic surfactant. This cooling liquid has a smaller surface tension than pure water, and therefore can easily enter a small gap of the contact portion 13. Therefore, this cooling liquid has higher cooling performance than pure water.

又,端面磨削裝置20可藉由冷卻液回收裝置70之冷卻液抽吸部71而使殼體30之內部空間81相對於殼體30之外部空間82成為負壓。由此,產生自外部空間82經由狹縫31而朝向內部空間81之氣體之流動。因此,被按壓至倒角磨石40之側面41且藉由離心力而自側面41及接觸部13向狹縫31飛散之冷卻液,不會通過狹縫31流出至外部空間82。若冷卻液流出至外部空間82,則有冷卻液附著於玻璃基板10之主表面而玻璃基板10之品質降低之顧慮。例如,於玻璃基板10用於FPD之製造之情形時,若冷卻液中所包含之非離子系界面活性劑殘留於玻璃基板10之主表面上,則有黑矩陣無法充分密接於玻璃基板10之主表面之顧慮。然而,端面磨削裝置20可防止冷卻液流出至外部空間82,因此可抑制因冷卻液中所包含之非離子系界面活性劑而污染玻璃基板10之主 表面。 Moreover, the end surface grinding device 20 can make the internal space 81 of the case 30 into a negative pressure with respect to the external space 82 of the case 30 by the coolant suction portion 71 of the coolant recovery device 70. As a result, a gas flow from the outer space 82 to the inner space 81 via the slit 31 is generated. Therefore, the cooling liquid pressed to the side surface 41 of the chamfering grindstone 40 and scattered from the side surface 41 and the contact portion 13 to the slit 31 by the centrifugal force does not flow out to the external space 82 through the slit 31. If the cooling liquid flows out into the external space 82, there is a concern that the cooling liquid adheres to the main surface of the glass substrate 10 and the quality of the glass substrate 10 is reduced. For example, in the case where the glass substrate 10 is used in the production of FPD, if the non-ionic surfactant contained in the cooling liquid remains on the main surface of the glass substrate 10, a black matrix cannot sufficiently adhere to the glass substrate 10. Major concerns. However, the end surface grinding device 20 can prevent the cooling liquid from flowing out to the external space 82, and can therefore prevent the glass substrate 10 from being contaminated by the non-ionic surfactant contained in the cooling liquid. surface.

(5-2) (5-2)

又,於端面磨削裝置20中,供給至接觸部13之冷卻液不會流出至外部空間82,而是藉由冷卻液回收裝置70自內部空間81抽吸而回收。回收之冷卻液被除去異物並再次供給至接觸部13。即,端面磨削裝置20可回收用於玻璃基板10之第1端面11a之冷卻之冷卻液,進而可再利用所回收之冷卻液之一部分。因此,端面磨削裝置20可降低冷卻液之使用量。包含非離子系界面活性劑等有機物之冷卻液當被排出至外部時有對環境造成不良影響之顧慮。又,有因包含有機物之冷卻液之飛散而產生設置有端面磨削裝置20之設施內之環境污染的問題或端面磨削裝置20之維護管理成本增加之問題。因此,較佳為冷卻液之使用量較少。由此,端面磨削裝置20藉由冷卻液回收裝置70回收冷卻液以供再利用,藉此可降低冷卻液之使用量,且可降低對環境施加之負載。 In the end surface grinding device 20, the cooling liquid supplied to the contact portion 13 does not flow out into the external space 82, but is recovered by sucking the cooling liquid recovery device 70 from the internal space 81. The recovered coolant is removed from the foreign matter and supplied to the contact portion 13 again. That is, the end surface grinding device 20 can recover the cooling liquid used for cooling the first end surface 11 a of the glass substrate 10, and can reuse a part of the recovered cooling liquid. Therefore, the end surface grinding device 20 can reduce the amount of coolant used. When a cooling liquid containing an organic substance such as a nonionic surfactant is discharged to the outside, there is a concern that it may adversely affect the environment. In addition, there is a problem of environmental pollution in a facility in which the end surface grinding device 20 is installed due to the scattering of a cooling liquid containing organic matter, or a problem that the maintenance management cost of the end surface grinding device 20 increases. Therefore, it is preferable that the amount of the cooling liquid is small. Thus, the end surface grinding device 20 recovers the cooling liquid for reuse by the cooling liquid recovery device 70, thereby reducing the amount of cooling liquid used and reducing the load imposed on the environment.

(5-3) (5-3)

又,於端面磨削裝置20中,抽吸殼體30之內部空間81之冷卻液之抽吸口36隔著倒角磨石40而於狹縫31之相反側開口。即,抽吸口36設置於距接觸部13最遠之位置,換言之設置於供給至接觸部13之冷卻液最難以被抽吸之位置。因此,供給至接觸部13之冷卻液於將接觸部13上之玻璃基板10的第1端面11a充分冷卻之前,被抑制自內部空間81抽吸至抽吸口36。由此,端面磨削裝置20可有效地利用冷卻液進行玻璃基板10之第1端面11a之冷卻。 Moreover, in the end surface grinding device 20, the suction port 36 for sucking the cooling liquid in the internal space 81 of the casing 30 is opened on the opposite side of the slit 31 through the chamfering grindstone 40. That is, the suction port 36 is provided at a position farthest from the contact portion 13, in other words, at a position where the cooling liquid supplied to the contact portion 13 is most difficult to be sucked. Therefore, the cooling liquid supplied to the contact portion 13 is suppressed from being sucked from the internal space 81 to the suction port 36 before the first end surface 11 a of the glass substrate 10 on the contact portion 13 is sufficiently cooled. Accordingly, the end surface grinding device 20 can effectively cool the first end surface 11 a of the glass substrate 10 using a cooling liquid.

(5-4) (5-4)

又,於端面磨削裝置20中,冷卻液供給裝置60藉由冷卻液供給構件62而將冷卻液按壓至倒角磨石40之側面41,藉此對接觸部13供給冷卻液而對玻璃基板10之第1端面11a進行冷卻。如此,冷卻液供給裝 置60不直接對接觸部13噴出冷卻液即可對接觸部13供給冷卻液。因此,冷卻液供給裝置60可降低不供給至接觸部13而無助於第1端面11a之冷卻之冷卻液之量,從而可降低冷卻液之使用量。由此,端面磨削裝置20可降低對環境施加之負載。 In the end surface grinding device 20, the cooling liquid supply device 60 presses the cooling liquid to the side surface 41 of the chamfered grindstone 40 by the cooling liquid supply member 62, thereby supplying the cooling liquid to the contact portion 13 to the glass substrate. The first end surface 11a of 10 is cooled. In this way, the coolant supply device The setting 60 can supply the cooling liquid to the contact portion 13 without directly discharging the cooling liquid to the contact portion 13. Therefore, the cooling liquid supply device 60 can reduce the amount of the cooling liquid that is not supplied to the contact portion 13 and does not contribute to the cooling of the first end surface 11a, so that the amount of the cooling liquid used can be reduced. Thereby, the end surface grinding apparatus 20 can reduce the load imposed on the environment.

(6)變化例 (6) Variations

以上,對本發明之玻璃基板之製造方法進行了說明,但本發明並不限定於上述實施方式,亦可於不脫離本發明之主旨之範圍實施各種改良及變更。 As mentioned above, although the manufacturing method of the glass substrate of this invention was demonstrated, this invention is not limited to the said embodiment, Various improvements and changes can be implemented in the range which does not deviate from the meaning of this invention.

(6-1)變化例A (6-1) Modification A

於實施方式中,端面磨削裝置20之殼體30具有設置於狹縫31之間之一對毛刷32。一對毛刷32夾持插入至狹縫31中之玻璃基板10之端部。一對毛刷32自狹縫上表面33及狹縫下表面34之各者向Z軸方向突出。 In the embodiment, the casing 30 of the end surface grinding device 20 has a pair of brushes 32 disposed between the slits 31. A pair of brushes 32 are sandwiched between the ends of the glass substrate 10 inserted into the slit 31. The pair of brushes 32 protrude from each of the slit upper surface 33 and the slit lower surface 34 in the Z-axis direction.

然而,端面磨削裝置20亦可具有用以調節自狹縫上表面33及狹縫下表面34之各者突出之一對毛刷32之長度之機構。於該情形時,端面磨削裝置20之控制部可調節一對毛刷32之長度而控制一對毛刷32之間隔。一對毛刷32配置於狹縫上表面33與狹縫下表面34之間之空間。因此,藉由調節一對毛刷32之長度,控制部可控制自殼體30之外部空間82經由狹縫31流入至殼體30之內部空間81之氣體之流速。 However, the end surface grinding device 20 may have a mechanism for adjusting the length of one pair of the brushes 32 protruding from each of the upper slit surface 33 and the lower slit surface 34. In this case, the control section of the end surface grinding device 20 can adjust the length of the pair of brushes 32 and control the interval between the pair of brushes 32. A pair of fur brushes 32 are arranged in a space between the slit upper surface 33 and the slit lower surface 34. Therefore, by adjusting the length of the pair of brushes 32, the control unit can control the flow velocity of the gas flowing from the outer space 82 of the casing 30 into the inner space 81 of the casing 30 through the slit 31.

於冷卻液回收裝置70之冷卻液抽吸部71之抽吸力為固定之情形時,若使一對毛刷32之間隔變狹,則通過狹縫31之氣體之流速增加。通過狹縫31之氣體之流速越大,則自內部空間81經由狹縫31流出至外部空間82之冷卻液之量越減少,因此可使供給至接觸部13之冷卻液之量增加。又,若使一對毛刷32之間隔變狹,則自倒角磨石40向狹縫31飛散且流出至外部空間82之冷卻液之量減少,因此可使供給至接觸部13之冷卻液之量增加。 When the suction force of the cooling liquid suction unit 71 of the cooling liquid recovery device 70 is fixed, if the interval between the pair of brushes 32 is narrowed, the flow velocity of the gas passing through the slit 31 is increased. The greater the flow velocity of the gas passing through the slit 31, the smaller the amount of the cooling liquid flowing from the internal space 81 to the external space 82 through the slit 31, and therefore, the amount of the cooling liquid supplied to the contact portion 13 can be increased. In addition, if the distance between the pair of brushes 32 is narrowed, the amount of the cooling liquid that is scattered from the chamfered grindstone 40 toward the slit 31 and flows out to the external space 82 can be reduced, so that the cooling liquid supplied to the contact portion 13 can be made. The amount increases.

由此,本變化例之端面磨削裝置20藉由根據玻璃基板10之厚度或冷卻液抽吸部71之抽吸力適當調節一對毛刷32的間隔,而可使供給至接觸部13之冷卻液之量增加。 As a result, the end surface grinding device 20 of this modified example can adjust the interval between the pair of brushes 32 by appropriately adjusting the thickness of the glass substrate 10 or the suction force of the cooling liquid suction portion 71, so that it can be supplied to the contact portion 13. The amount of coolant is increased.

又,本變化例之端面磨削裝置20亦可具有用以調節狹縫31之間隔之機構,而代替具有用以調節一對毛刷32之長度之機構。於該情形時,端面磨削裝置20可藉由調節狹縫31之間隔而調節一對毛刷32之間隔。 The end surface grinding device 20 of the present modification may have a mechanism for adjusting the interval between the slits 31 instead of a mechanism for adjusting the length of the pair of brushes 32. In this case, the end surface grinding device 20 can adjust the interval between the pair of brushes 32 by adjusting the interval between the slits 31.

(6-2)變化例B (6-2) Modification B

變化例A之端面磨削裝置20可藉由適當調節一對毛刷32之間隔,而使可供給至接觸部13之冷卻液之量增加。然而,端面磨削裝置20之殼體30亦可不具有設置於狹縫31之間之一對毛刷32。於該情形時,殼體30亦可具有用以調節狹縫31之間隔之機構。 The end surface grinding device 20 of the modification A can increase the amount of the cooling liquid that can be supplied to the contact portion 13 by appropriately adjusting the interval between the pair of bristles 32. However, the housing 30 of the end surface grinding device 20 may not have a pair of fur brushes 32 provided between the slits 31. In this case, the housing 30 may also have a mechanism for adjusting the interval of the slits 31.

於本變化例中,與變化例A同樣地,端面磨削裝置20之控制部可藉由調節狹縫31之間隔,而控制自殼體30之外部空間82經由狹縫31而流入至殼體30之內部空間81之氣體之流速。 In this modified example, similarly to the modified example A, the control section of the end surface grinding device 20 can control the flow from the external space 82 of the casing 30 into the casing through the slit 31 by adjusting the interval between the slits 31. The flow velocity of the gas in the internal space 81 of 30.

於冷卻液回收裝置70之冷卻液抽吸部71之抽吸力為固定之情形時,若使狹縫31之間隔變狹,則通過狹縫31之氣體之流速增加。通過狹縫31之氣體之流速越大,則自內部空間81經由狹縫31流出至外部空間82之冷卻液之量越減少,因此可使供給至接觸部13之冷卻液之量增加。又,若使狹縫31之間隔變狹,則自倒角磨石40向狹縫31飛散且流出至外部空間82之冷卻液之量減少,因此可使供給至接觸部13之冷卻液之量增加。 When the suction force of the cooling liquid suction unit 71 of the cooling liquid recovery device 70 is fixed, if the interval between the slits 31 is narrowed, the flow velocity of the gas passing through the slit 31 is increased. The greater the flow velocity of the gas passing through the slit 31, the smaller the amount of the cooling liquid flowing from the internal space 81 to the external space 82 through the slit 31, and therefore, the amount of the cooling liquid supplied to the contact portion 13 can be increased. In addition, if the interval between the slits 31 is narrowed, the amount of the cooling liquid that is scattered from the chamfered grindstone 40 toward the slit 31 and flows out to the external space 82 can be reduced, so that the amount of the cooling liquid supplied to the contact portion 13 can be made increase.

由此,本變化例之端面磨削裝置20可藉由根據玻璃基板10之厚度或冷卻液抽吸部71之抽吸力適當調節狹縫31之間隔,而使可供給至接觸部13之冷卻液之量增加。 Therefore, the end surface grinding device 20 of this modification can appropriately adjust the interval of the slits 31 according to the thickness of the glass substrate 10 or the suction force of the cooling liquid suction portion 71, so that the cooling that can be supplied to the contact portion 13 can be performed. The amount of fluid increases.

(6-3)變化例C (6-3) Modification C

實施方式之端面磨削裝置20使用可將冷卻液按壓至倒角磨石40之側面41之冷卻液供給構件62,而對接觸部13供給冷卻液。然而,端面磨削裝置20亦可對倒角磨石40之側面41或接觸部13直接噴出冷卻液而對接觸部13供給冷卻液。 The end surface grinding device 20 according to the embodiment uses a cooling liquid supply member 62 capable of pressing the cooling liquid against the side surface 41 of the chamfered grindstone 40 to supply the cooling liquid to the contact portion 13. However, the end surface grinding device 20 may directly spray the cooling liquid on the side surface 41 or the contact portion 13 of the chamfered grindstone 40 and supply the cooling liquid to the contact portion 13.

(6-4)變化例D (6-4) Modification D

於實施方式中,端面加工裝置100包括用以對玻璃基板10之端面11a、11b、12a、12b進行磨削之倒角磨石40。倒角磨石40為鑽石輪,但亦可為樹脂結合輪。樹脂結合輪例如為利用具有柔軟性及彈性之樹脂系之結合劑固定有通常使用之研磨粒之磨削輪。研磨粒之粒度例如為由JIS(Japanese Industrial Standards,日本工業標準)R6001-1987規定之#300~#500左右。即便於使用樹脂結合輪之情形時,端面加工裝置100亦可對玻璃基板10之端面11a、11b、12a、12b進行磨削而進行倒角加工。 In the embodiment, the end surface processing apparatus 100 includes a chamfering grindstone 40 for grinding the end surfaces 11 a, 11 b, 12 a, and 12 b of the glass substrate 10. The chamfered grindstone 40 is a diamond wheel, but may be a resin-bonded wheel. The resin bonding wheel is, for example, a grinding wheel in which abrasive grains generally used are fixed with a resin-based bonding agent having flexibility and elasticity. The particle size of the abrasive grains is, for example, about # 300 to # 500 prescribed by JIS (Japanese Industrial Standards) R6001-1987. Even when it is convenient to use a resin-bonded wheel, the end surface processing apparatus 100 may grind the end surfaces 11 a, 11 b, 12 a, and 12 b of the glass substrate 10 to perform chamfering.

Claims (8)

一種玻璃基板之製造方法,其係藉由使磨石接觸於玻璃基板之端面且使上述磨石相對於上述玻璃基板相對性地移動而對上述端面進行加工者,且包括:磨削步驟,係藉由使收納於殼體中之上述磨石旋轉且使旋轉之上述磨石接觸於上述端面而對上述端面進行磨削;冷卻步驟,係對上述磨石與上述端面之接觸部供給包含非離子系界面活性劑之水溶液即冷卻液而對上述接觸部進行冷卻;及抽吸步驟,係藉由使上述殼體之內部空間相對於上述殼體之外部空間成為負壓,而自上述內部空間抽吸上述冷卻液;且上述殼體具有用以將上述玻璃基板插入至上述內部空間之狹縫。A method for manufacturing a glass substrate is a method for processing the end surface by contacting a grindstone with the end surface of the glass substrate and moving the grindstone relative to the glass substrate, and includes a grinding step. Grinding the end surface by rotating the grindstone stored in the housing and contacting the rotating grindstone to the end surface; the cooling step is to supply non-ion to the contact portion between the grindstone and the end surface. The surfactant is an aqueous solution of a surfactant, which cools the contact portion; and a suction step is performed by making the internal space of the casing into a negative pressure relative to the external space of the casing, and pumping from the internal space. The cooling liquid is sucked; and the casing has a slit for inserting the glass substrate into the internal space. 如請求項1之玻璃基板之製造方法,其還包括將於上述抽吸步驟中抽吸之上述冷卻液回收之回收步驟,且於上述冷卻步驟中,使用上述回收步驟中所回收之上述冷卻液之至少一部分而對上述接觸部進行冷卻。For example, the method for manufacturing a glass substrate according to claim 1, further comprising a recovery step of recovering the cooling liquid sucked in the suction step, and using the cooling liquid recovered in the recovery step in the cooling step. The contact portion is cooled by at least a part of the contact portion. 如請求項1或2之玻璃基板之製造方法,其中上述殼體還具有抽吸上述內部空間之上述冷卻液之抽吸口,且上述抽吸口於上述內部空間相對於上述磨石而形成於上述狹縫之相反側。The manufacturing method of the glass substrate according to claim 1 or 2, wherein the casing further has a suction port for sucking the cooling liquid in the internal space, and the suction port is formed in the internal space with respect to the grinding stone. Opposite side of the slit. 如請求項1或2之玻璃基板之製造方法,其中於上述冷卻步驟中,相對於上述接觸部而於上述磨石之旋轉方向上游側,藉由將上述冷卻液按壓至上述磨石而對上述接觸部供給上述冷卻液。The method for manufacturing a glass substrate according to claim 1 or 2, wherein in the cooling step, the contact with the contact portion is located upstream of the grinding stone in the direction of rotation, and the cooling liquid is pressed against the grinding stone to the above The contact portion supplies the cooling liquid. 如請求項1或2之玻璃基板之製造方法,其中於上述抽吸步驟中,藉由調節上述狹縫之寬度而控制自上述外部空間經由上述狹縫流入至上述內部空間之氣體之流速。The method for manufacturing a glass substrate according to claim 1 or 2, wherein in the suction step, a flow rate of a gas flowing from the external space to the internal space through the slit is controlled by adjusting a width of the slit. 如請求項1或2之玻璃基板之製造方法,其中上述狹縫具有夾持上述玻璃基板之一對毛刷,且於上述抽吸步驟中,藉由調節上述一對毛刷之間隔而控制自上述外部空間經由上述狹縫流入至上述內部空間之氣體之流速。For example, the method for manufacturing a glass substrate according to claim 1 or 2, wherein the slit has a pair of brushes holding one of the glass substrates, and in the suction step, the self-control is controlled by adjusting the interval between the pair of brushes. The flow velocity of the gas flowing into the internal space from the external space through the slit. 如請求項1或2之玻璃基板之製造方法,其中上述磨石為金屬結合劑輪。The method for manufacturing a glass substrate according to claim 1 or 2, wherein the grinding stone is a metal bonding wheel. 一種玻璃基板之製造裝置,其係使磨石接觸於玻璃基板之端面且使上述磨石相對於上述玻璃基板相對性地移動而對上述端面進行加工者,且包括:磨石,其收納於殼體中;旋轉部,其使上述磨石旋轉;冷卻部,其對上述磨石與上述端面之接觸部供給包含非離子系界面活性劑之水溶液即冷卻液而對上述接觸部進行冷卻;及抽吸部,其使上述殼體之內部空間相對於上述殼體之外部空間成為負壓而自上述內部空間抽吸上述冷卻液;且上述殼體具有用以將上述玻璃基板插入至上述內部空間之狹縫。A manufacturing device for a glass substrate is a person who makes a grinding stone contact the end surface of the glass substrate and moves the grinding stone relatively to the glass substrate to process the end surface, and includes a grinding stone stored in a shell A rotating part that rotates the grindstone; a cooling part that supplies the contact portion between the grindstone and the end surface with a cooling solution containing an aqueous solution containing a non-ionic surfactant to cool the contact portion; and A suction unit that makes the internal space of the housing a negative pressure relative to the external space of the housing and sucks the cooling liquid from the internal space; and the housing has a mechanism for inserting the glass substrate into the internal space. Slit.
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