TWI655995B - Method for manufacturing glass plate and grinding device for glass plate - Google Patents

Method for manufacturing glass plate and grinding device for glass plate Download PDF

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TWI655995B
TWI655995B TW104110565A TW104110565A TWI655995B TW I655995 B TWI655995 B TW I655995B TW 104110565 A TW104110565 A TW 104110565A TW 104110565 A TW104110565 A TW 104110565A TW I655995 B TWI655995 B TW I655995B
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magnetic field
field forming
forming member
magnetic flux
magnetic
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TW104110565A
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TW201545838A (en
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板倉慧
三隅寶
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日商安瀚視特控股股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent

Abstract

本發明之目的在於提供一種可提高玻璃板之端面研磨效率之玻璃板之製造方法、及玻璃板之研磨裝置。 An object of the present invention is to provide a method for manufacturing a glass plate and a polishing device for a glass plate, which can improve the efficiency of polishing the end surface of a glass plate.

於玻璃板之製造方法中,使由第1磁場形成構件22及第2磁場形成構件23所形成之磁場保持之研磨漿料24,與第1磁場形成構件22及第2磁場形成構件23一併繞旋轉軸21旋轉,於該狀態下,使玻璃板92之端部92a接觸研磨漿料24,而對端部92a進行研磨。利用磁通集中構件25,使自第1磁場形成構件22朝向第2磁場形成構件23之磁通集中,從而增加磁通密度。磁通集中構件25係安裝於第1磁場形成構件22及第2磁場形成構件23上之磁性體。使玻璃板92之端部92a,接觸藉由磁通集中構件25而磁通密度增加之空間所保持之研磨漿料24。 In the method for manufacturing a glass plate, the polishing slurry 24 held by the magnetic field formed by the first magnetic field forming member 22 and the second magnetic field forming member 23 is combined with the first magnetic field forming member 22 and the second magnetic field forming member 23 Rotating around the rotation axis 21, in this state, the end portion 92a of the glass plate 92 is brought into contact with the polishing slurry 24, and the end portion 92a is polished. The magnetic flux concentration member 25 concentrates the magnetic flux from the first magnetic field forming member 22 toward the second magnetic field forming member 23, thereby increasing the magnetic flux density. The magnetic flux concentration member 25 is a magnetic body attached to the first magnetic field forming member 22 and the second magnetic field forming member 23. The end portion 92 a of the glass plate 92 is brought into contact with the polishing slurry 24 held in the space where the magnetic flux density is increased by the magnetic flux concentration member 25.

Description

玻璃板之製造方法、及玻璃板之研磨裝置 Method for manufacturing glass plate and grinding device for glass plate

本發明係關於一種玻璃板之製造方法、及玻璃板之研磨裝置。 The invention relates to a method for manufacturing a glass plate and a grinding device for a glass plate.

玻璃板於製造工序中會被切斷成所需之尺寸。例如,液晶顯示器、電漿顯示器等平板顯示器用玻璃基板、觸控用玻璃基板、及保護用玻璃基板等之製造工序包含如下工序,即,於稱為母玻璃之大型玻璃板上形成劃線而進行切斷。玻璃板之切斷面上通常會形成細微裂痕或非常鋒利之邊緣。為了除去形成於該切斷面之邊緣,而進行切斷面之倒角。例如,以截面成為R形狀之方式,對切斷面進行倒角。經倒角後之切斷面進而藉由使用研磨輪之研磨加工而被精加工成鏡面狀。 The glass sheet is cut to the required size during the manufacturing process. For example, the manufacturing processes of flat-panel display glass substrates such as liquid crystal displays and plasma displays, touch-control glass substrates, and protective glass substrates include the following steps: forming a scribe line on a large glass plate called mother glass, and Cut off. Microscopic cracks or very sharp edges usually form on the cut surface of the glass plate. In order to remove the edge formed on the cut surface, the cut surface is chamfered. For example, the cut surface is chamfered so that the cross section becomes an R shape. The chamfered cut surface is further finished into a mirror-like shape by grinding using a grinding wheel.

於專利文獻1(國際公開第2012/067587號公報)中,揭示有一種於玻璃板之端面研磨加工中使用磁性流體之技術。使用磁性流體之研磨加工中,係於一對磁鐵之間保持含研磨粒之磁性流體,使玻璃板之端面接觸磁性流體,於該狀態下,使玻璃板之端面與磁性流體相對移動,藉此對玻璃板之端面進行研磨。利用磁性流體之研磨加工中,係使磁性流體追隨被加工物之形狀而進行研磨加工,因此,對被加工物之損傷相對較少。因此,於玻璃板之端面之研磨加工中使用保持磁性流體之研磨輪之情形時,與使用含金剛石研磨粒之研磨輪之研磨加工相比,能獲得更平滑之端面。 Patent Document 1 (International Publication No. 2012/067587) discloses a technique of using a magnetic fluid in an end surface polishing process of a glass plate. In the grinding process using magnetic fluid, the magnetic fluid containing abrasive particles is maintained between a pair of magnets, and the end face of the glass plate is brought into contact with the magnetic fluid. In this state, the end face of the glass plate and the magnetic fluid are relatively moved, thereby The end surface of the glass plate is ground. In the grinding process using a magnetic fluid, the magnetic fluid is subjected to the grinding process following the shape of the workpiece, so the damage to the workpiece is relatively small. Therefore, when a grinding wheel holding a magnetic fluid is used in the grinding process of the end face of the glass plate, a smoother end face can be obtained compared to the grinding process using a grinding wheel containing diamond abrasive grains.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]國際公開第2012/067587號公報 [Patent Document 1] International Publication No. 2012/067587

但,於保持磁性流體之先前研磨輪中,一對磁鐵周圍之空間內存在之磁通之密度較低,磁性流體之保持力不充分。因此,先前之研磨輪有如下問題:玻璃板之端面研磨效率較低,為了獲得所需品質之端面,要花費非常長之時間。因此,要求提高研磨輪之一對磁鐵周圍之空間內存在之磁通之密度,增加磁性流體之保持力,以提高玻璃板之研磨效率。 However, in the previous grinding wheel that held the magnetic fluid, the density of the magnetic flux existing in the space around the pair of magnets was low, and the holding force of the magnetic fluid was insufficient. Therefore, the conventional grinding wheel has the following problems: the grinding efficiency of the end surface of the glass plate is low, and it takes a very long time to obtain the end surface of the required quality. Therefore, it is required to increase the density of the magnetic flux existing in the space around the magnet in one of the grinding wheels and increase the holding force of the magnetic fluid to improve the grinding efficiency of the glass plate.

本發明之目的在於提供一種可提高玻璃板之端面研磨效率之玻璃板之製造方法、及玻璃板之研磨裝置。 An object of the present invention is to provide a method for manufacturing a glass plate and a polishing device for a glass plate, which can improve the efficiency of polishing the end surface of a glass plate.

本發明之玻璃板之製造方法中,使被第1磁場形成構件及第2磁場形成構件所形成之磁場保持之磁性體研磨粒,與第1磁場形成構件及第2磁場形成構件一併繞旋轉軸旋轉,於該狀態下使玻璃板之端部接觸磁性體研磨粒,從而對端部進行研磨。該玻璃板之製造方法中,利用磁通集中構件,使自第1磁場形成構件朝向第2磁場形成構件之磁通集中,從而增加磁通之密度。磁通集中構件係安裝於第1磁場形成構件及第2磁場形成構件上之磁性體。該玻璃板之製造方法係使玻璃板之端部,接觸被利用磁通集中構件而磁通密度增加之空間保持之磁性體研磨粒。 In the manufacturing method of the glass plate of the present invention, the magnetic abrasive grains held by the magnetic field formed by the first magnetic field forming member and the second magnetic field forming member are rotated together with the first magnetic field forming member and the second magnetic field forming member. The shaft is rotated, and the end portion of the glass plate is brought into contact with the magnetic abrasive grains in this state, thereby polishing the end portion. In this glass plate manufacturing method, a magnetic flux concentration member is used to concentrate the magnetic flux from the first magnetic field forming member toward the second magnetic field forming member, thereby increasing the density of the magnetic flux. The magnetic flux concentration member is a magnetic body attached to the first magnetic field forming member and the second magnetic field forming member. The manufacturing method of the glass plate is such that the end portion of the glass plate is brought into contact with magnetic abrasive grains held in a space where the magnetic flux density is increased by a magnetic flux concentration member.

該玻璃板之製造方法係如下方法,即,使玻璃板之端面接觸繞旋轉軸旋轉之磁性體研磨粒而進行研磨。磁性體研磨粒係被第1磁場形成構件及第2磁場形成構件所形成之磁場保持。磁通集中構件設為,於保持磁性體研磨粒之空間之至少一部分空間內使磁通集中,從而增加磁通之密度。於利用磁通集中構件而磁通密度增加之空間內,第1磁場形 成構件及第2磁場形成構件之磁性體研磨粒之保持力較其他空間內之保持力大。磁性體研磨粒之保持力越高,於玻璃板之端面已接觸磁性體研磨粒之情形時,磁性體研磨粒便越難以移動。藉此,因旋轉之磁性體研磨粒而施加於玻璃板端面之研磨壓力變高,玻璃板之端面研磨能力亦變高。因此,該玻璃板之製造方法可提高玻璃板之端面研磨效率。 The manufacturing method of this glass plate is a method which grinds by making the end surface of a glass plate contact the magnetic abrasive grain which rotates about a rotation axis. The magnetic abrasive particles are held by a magnetic field formed by the first magnetic field forming member and the second magnetic field forming member. The magnetic flux concentrating member is configured to increase the density of the magnetic flux by concentrating the magnetic flux in at least a part of the space holding the magnetic abrasive particles. In a space where the magnetic flux density is increased by using a magnetic flux concentration member, the first magnetic field shape The holding force of the magnetic abrasive particles of the forming member and the second magnetic field forming member is larger than the holding force in other spaces. The higher the holding force of the magnetic abrasive particles, the harder it is for the magnetic abrasive particles to move when the end face of the glass plate has been in contact with the magnetic abrasive particles. Thereby, the grinding pressure applied to the end face of the glass plate by the rotating magnetic abrasive particles becomes high, and the end face grinding ability of the glass plate also becomes high. Therefore, the manufacturing method of the glass plate can improve the polishing efficiency of the end surface of the glass plate.

又,該玻璃板之製造方法較佳為,於第1磁場形成構件與第2磁場形成構件之間之空間、以及第1磁場形成構件及第2磁場形成構件之、旋轉軸之徑向外側之空間的至少一個空間內,磁通之密度因磁通集中構件而增加。 The method of manufacturing the glass plate is preferably a space between the first magnetic field forming member and the second magnetic field forming member, and the first magnetic field forming member and the second magnetic field forming member, radially outward of the rotation axis. In at least one of the spaces, the magnetic flux density increases due to the magnetic flux concentration member.

該玻璃板之製造方法中,以磁力線通過磁通集中構件之中之方式設置磁通集中構件,該磁力線自第1磁場形成構件朝向第2磁場形成構件,且通過磁性體研磨粒所保持之空間。藉此,於與玻璃板端面接觸之磁性體研磨粒所保持之空間內,磁通之密度增加。因此,該玻璃板之製造方法可提高玻璃板之端面研磨效率。 In the manufacturing method of the glass plate, a magnetic flux concentrating member is provided so that the magnetic flux lines pass through the magnetic flux concentrating members, the magnetic flux lines go from the first magnetic field forming member toward the second magnetic field forming member, and the space held by the magnetic abrasive particles . As a result, the density of the magnetic flux increases in the space held by the magnetic abrasive particles in contact with the end face of the glass plate. Therefore, the manufacturing method of the glass plate can improve the polishing efficiency of the end surface of the glass plate.

又,該玻璃板之製造方法較佳為,第2磁場形成構件相對於第1磁場形成構件所處一側之相反側之空間、以及第1磁場形成構件相對於第2磁場形成構件所處一側之相反側之空間的至少一個空間內,磁通之密度因磁通集中構件而增加。 Moreover, it is preferable that the manufacturing method of the glass plate is such that a space on the opposite side of the second magnetic field forming member from the side on which the first magnetic field forming member is located and where the first magnetic field forming member is located on the second magnetic field forming member In at least one of the spaces on the opposite side, the density of the magnetic flux is increased by the magnetic flux concentration member.

該玻璃板之製造方法中,以磁力線通過磁通集中構件之中之方式設置磁通集中構件,該磁力線自第1磁場形成構件朝向第2磁場形成構件,且通過磁性體研磨粒所保持之空間。藉此,於與玻璃板端面接觸之磁性體研磨粒所保持之空間內,磁通之密度增加。因此,該玻璃板之製造方法可提高玻璃板之端面研磨效率。 In the manufacturing method of the glass plate, a magnetic flux concentrating member is provided so that the magnetic flux lines pass through the magnetic flux concentrating members, the magnetic flux lines go from the first magnetic field forming member toward the second magnetic field forming member, and the space held by the magnetic abrasive particles . As a result, the density of the magnetic flux increases in the space held by the magnetic abrasive particles in contact with the end face of the glass plate. Therefore, the manufacturing method of the glass plate can improve the polishing efficiency of the end surface of the glass plate.

本發明之玻璃板之研磨裝置具備旋轉軸、第1磁場形成構件、第2磁場形成構件、磁性體研磨粒、及磁通集中構件。第1磁場形成構件連 結於旋轉軸,且繞旋轉軸旋轉。第2磁場形成構件連結於旋轉軸,且繞旋轉軸旋轉。磁性體研磨粒係被第1磁場形成構件及第2磁場形成構件所形成之磁場保持。磁通集中構件係安裝於第1磁場形成構件及第2磁場形成構件上之磁性體。磁通集中構件使自第1磁場形成構件朝向第2磁場形成構件之磁通集中,從而增加磁通之密度。被利用磁通集中構件而磁通密度增加之空間保持之磁性體研磨粒,與第1磁場形成構件及第2磁場形成構件一併繞旋轉軸旋轉,於該狀態下與玻璃板之端部接觸,而對端部進行研磨。 A polishing device for a glass plate according to the present invention includes a rotating shaft, a first magnetic field forming member, a second magnetic field forming member, magnetic abrasive particles, and a magnetic flux concentration member. First magnetic field forming member Knot on the rotation axis and rotate around the rotation axis. The second magnetic field forming member is connected to the rotation axis and rotates around the rotation axis. The magnetic abrasive particles are held by a magnetic field formed by the first magnetic field forming member and the second magnetic field forming member. The magnetic flux concentration member is a magnetic body attached to the first magnetic field forming member and the second magnetic field forming member. The magnetic flux concentration member concentrates the magnetic flux from the first magnetic field forming member toward the second magnetic field forming member, thereby increasing the density of the magnetic flux. The magnetic abrasive grains held by the space where the magnetic flux concentration member is used to increase the magnetic flux density are rotated together with the first magnetic field forming member and the second magnetic field forming member about a rotation axis, and in this state are in contact with the ends of the glass plate While grinding the ends.

又,該玻璃板之研磨裝置較佳為,磁通集中構件於第1磁場形成構件與第2磁場形成構件之間之空間、以及第1磁場形成構件及第2磁場形成構件之、旋轉軸之徑向外側之空間的至少一個空間內,使磁通之密度增加。 The polishing device for the glass plate is preferably a space between the first magnetic field forming member and the second magnetic field forming member, and a rotation axis of the first magnetic field forming member and the second magnetic field forming member. The magnetic flux density is increased in at least one of the radially outer spaces.

又,該玻璃板之研磨裝置較佳為,磁通集中構件至少安裝於第1磁場形成構件及第2磁場形成構件之、旋轉軸之徑向外側,且具有磁通集中槽。磁通集中槽係如下槽,即,於磁通集中構件之旋轉軸之徑向外側之表面,與旋轉軸之中心軸成直角。 In the polishing device for the glass plate, it is preferable that the magnetic flux concentration member is installed at least on the radially outer side of the rotation axis of the first magnetic field formation member and the second magnetic field formation member, and has a magnetic flux concentration groove. The magnetic flux concentration groove is a groove whose surface on the radially outer side of the rotation axis of the magnetic flux concentration member is at a right angle to the center axis of the rotation axis.

該玻璃板之研磨裝置中,玻璃板之端面與被形成於磁通集中構件之磁通集中槽之內側空間保持之磁性體研磨粒接觸,而進行研磨。磁通集中構件以使磁通集中槽之內側空間之磁通密度增加之方式設置。 In this glass plate polishing device, the end surface of the glass plate is brought into contact with magnetic abrasive grains held in the inner space of the magnetic flux concentration groove formed in the magnetic flux concentration member to perform polishing. The magnetic flux concentration member is provided so that the magnetic flux density of the space inside the magnetic flux concentration groove is increased.

又,該玻璃板之研磨裝置較佳為,磁通集中構件進而於旋轉軸之中心軸方向安裝於第1磁場形成構件及第2磁場形成構件之各個上。 In the polishing device for the glass plate, it is preferable that the magnetic flux concentrating member is further mounted on each of the first magnetic field forming member and the second magnetic field forming member in a center axis direction of the rotation axis.

該玻璃板之研磨裝置中,以磁力線通過磁通集中構件之中之方式設置磁通集中構件,該磁力線自第1磁場形成構件朝向第2磁場形成構件,且通過磁通集中槽。藉此,磁通集中槽中之磁通之密度增加。因此,該玻璃板之製造裝置可提高玻璃板之端面研磨效率。再者,磁通集中構件亦可設置於第1磁場形成構件與第2磁場形成構件之間。 In the polishing device of the glass plate, a magnetic flux concentration member is provided so that the magnetic flux lines pass through the magnetic flux concentration members. The magnetic flux lines pass from the first magnetic field forming member toward the second magnetic field forming member and pass through the magnetic flux concentration groove. Thereby, the density of the magnetic flux in the magnetic flux concentration groove is increased. Therefore, the glass plate manufacturing device can improve the grinding efficiency of the end surface of the glass plate. The magnetic flux concentration member may be provided between the first magnetic field forming member and the second magnetic field forming member.

又,該玻璃板之研磨裝置較佳為,第1磁場形成構件於旋轉軸之中心軸方向上與第2磁場形成構件鄰接。 In the polishing device for the glass plate, it is preferable that the first magnetic field forming member is adjacent to the second magnetic field forming member in a central axis direction of the rotation axis.

又,該玻璃板之研磨裝置較佳為,第1磁場形成構件及第2磁場形成構件具有尺寸相同之圓筒形狀。又,第1磁場形成構件及第2磁場形成構件之中心軸較佳位於旋轉軸之中心軸上。又,磁通集中槽之位於旋轉軸之徑向最內側之點、與旋轉軸之中心軸之間的距離,較佳為等於第1磁場形成構件及第2磁場形成構件之外徑。 In the polishing device for the glass plate, the first magnetic field forming member and the second magnetic field forming member preferably have a cylindrical shape having the same size. The center axes of the first magnetic field forming member and the second magnetic field forming member are preferably located on the center axis of the rotation axis. The distance between the magnetic flux concentration groove located at the innermost point in the radial direction of the rotation axis and the center axis of the rotation axis is preferably equal to the outer diameters of the first magnetic field forming member and the second magnetic field forming member.

該玻璃板之研磨裝置中,沿旋轉軸之中心軸觀察之情形時,磁通集中槽之最深之點位於與第1磁場形成構件及第2磁場形成構件之外周面相同之位置上。 In the polishing device of this glass plate, when viewed along the center axis of the rotation axis, the deepest point of the magnetic flux concentration groove is located at the same position as the outer peripheral surfaces of the first magnetic field forming member and the second magnetic field forming member.

又,該玻璃板之研磨裝置較佳為,磁通集中構件使磁通集中槽之內側空間之磁通之密度增加。 In the polishing device for the glass plate, it is preferable that the magnetic flux concentration member increases the density of the magnetic flux in the space inside the magnetic flux concentration groove.

本發明之玻璃板之製造方法、及玻璃板之研磨裝置可提高玻璃板之端面研磨效率。 The glass plate manufacturing method and the glass plate grinding device of the present invention can improve the end surface grinding efficiency of the glass plate.

10‧‧‧研磨裝置 10‧‧‧ Grinding device

12‧‧‧搬送機構 12‧‧‧ transfer agency

14‧‧‧研磨機構 14‧‧‧ Grinding mechanism

20‧‧‧研磨輪 20‧‧‧ grinding wheel

21‧‧‧旋轉軸 21‧‧‧rotation axis

21a‧‧‧旋轉軸之中心軸 21a‧‧‧center axis of rotation axis

22‧‧‧第1磁場形成構件 22‧‧‧ the first magnetic field forming member

22a‧‧‧第1中心構件 22a‧‧‧The first center member

22b‧‧‧第1圓環狀磁鐵 22b‧‧‧The first ring magnet

22c‧‧‧第1上部磁場形成面 22c‧‧‧The first upper magnetic field forming surface

22d‧‧‧第1下部磁場形成面 22d‧‧‧The first lower magnetic field forming surface

23‧‧‧第2磁場形成構件 23‧‧‧Second magnetic field forming member

23a‧‧‧第2中心構件 23a‧‧‧ 2nd central member

23b‧‧‧第2圓環狀磁鐵 23b‧‧‧2nd ring magnet

23c‧‧‧第2上部磁場形成面 23c‧‧‧The second upper magnetic field forming surface

23d‧‧‧第2下部磁場形成面 23d‧‧‧The second lower magnetic field forming surface

24‧‧‧研磨漿料(磁性體研磨粒) 24‧‧‧Grinding slurry (magnetic abrasive particles)

24a‧‧‧漿料面 24a‧‧‧Slurry surface

25‧‧‧磁通集中構件 25‧‧‧ magnetic flux concentration component

25a‧‧‧上部集中構件 25a‧‧‧ Upper Concentrated Member

25b‧‧‧下部集中構件 25b‧‧‧ Lower central component

25c‧‧‧第1側部集中構件 25c‧‧‧ 1st side concentrated member

25d‧‧‧第2側部集中構件 25d‧‧‧ 2nd side concentrated member

25e‧‧‧第1側面 25e‧‧‧Side 1

25f‧‧‧第1傾斜面 25f‧‧‧The first slope

25g‧‧‧第2側面 25g‧‧‧The second side

25h‧‧‧第2傾斜面 25h‧‧‧2nd inclined surface

26‧‧‧磁通集中槽 26‧‧‧ magnetic flux concentration groove

27‧‧‧磁通集中空間 27‧‧‧ magnetic flux concentration space

90‧‧‧熔融玻璃 90‧‧‧ molten glass

91‧‧‧玻璃帶 91‧‧‧glass ribbon

92‧‧‧玻璃板 92‧‧‧ glass plate

92a‧‧‧玻璃板之端面(玻璃板之端部) 92a‧‧‧End of glass plate (end of glass plate)

100‧‧‧玻璃板製造裝置 100‧‧‧ glass plate manufacturing equipment

101‧‧‧熔解裝置 101‧‧‧ melting device

102‧‧‧澄清裝置 102‧‧‧clarification device

103‧‧‧攪拌裝置 103‧‧‧mixing device

104‧‧‧成形裝置 104‧‧‧forming device

105‧‧‧切斷裝置 105‧‧‧ cutting device

120‧‧‧研磨輪 120‧‧‧ grinding wheel

121‧‧‧旋轉軸 121‧‧‧rotation axis

122‧‧‧第1磁場形成構件 122‧‧‧ the first magnetic field forming member

122a‧‧‧第1中心構件 122a‧‧‧The first center member

122b‧‧‧第1圓環狀磁鐵 122b‧‧‧The first ring magnet

123‧‧‧第2磁場形成構件 123‧‧‧Second magnetic field forming member

123a‧‧‧第2中心構件 123a‧‧‧The second center member

123b‧‧‧第2圓環狀磁鐵 123b‧‧‧ 2nd ring magnet

124‧‧‧研磨漿料 124‧‧‧ ground slurry

125‧‧‧間隔件 125‧‧‧ spacer

126‧‧‧磁場形成槽 126‧‧‧ Magnetic field forming groove

127‧‧‧槽空間 127‧‧‧Slot space

220‧‧‧研磨輪 220‧‧‧ grinding wheel

221‧‧‧旋轉軸 221‧‧‧rotation axis

222‧‧‧第1磁場形成構件 222‧‧‧The first magnetic field forming member

222a‧‧‧第1中心構件 222a‧‧‧The first center member

222b‧‧‧第1圓環狀磁鐵 222b‧‧‧The first ring magnet

223‧‧‧第2磁場形成構件 223‧‧‧Second magnetic field forming member

223a‧‧‧第2中心構件 223a‧‧‧ 2nd central member

223b‧‧‧第2圓環狀磁鐵 223b‧‧‧ 2nd ring magnet

224‧‧‧研磨漿料 224‧‧‧Grinding slurry

226‧‧‧磁場形成槽 226‧‧‧ Magnetic field forming groove

227‧‧‧槽空間 227‧‧‧Slot space

320‧‧‧研磨輪 320‧‧‧ grinding wheel

321‧‧‧旋轉軸 321‧‧‧rotation axis

322‧‧‧第1磁場形成構件 322‧‧‧ the first magnetic field forming member

322a‧‧‧第1中心構件 322a‧‧‧The first center member

322b‧‧‧第1圓環狀磁鐵 322b‧‧‧The first ring magnet

323‧‧‧第2磁場形成構件 323‧‧‧Second magnetic field forming member

323a‧‧‧第2中心構件 323a‧‧‧ 2nd central member

323b‧‧‧第2圓環狀磁鐵 323b‧‧‧2nd ring magnet

324‧‧‧研磨漿料 324‧‧‧Grinding slurry

325‧‧‧磁通集中構件325 325‧‧‧magnetic flux concentration member

325c‧‧‧第1側部集中構件 325c‧‧‧The first side concentrated member

325d‧‧‧第2側部集中構件 325d‧‧‧ 2nd side concentrated member

326‧‧‧磁場形成槽 326‧‧‧ magnetic field forming groove

327‧‧‧磁通集中空間 327‧‧‧ magnetic flux concentration space

420‧‧‧研磨輪 420‧‧‧Grinding wheel

421‧‧‧旋轉軸 421‧‧‧rotation axis

422‧‧‧第1磁場形成構件 422‧‧‧The first magnetic field forming member

422a‧‧‧第1中心構件 422a‧‧‧The first center member

422b‧‧‧第1圓環狀磁鐵 422b‧‧‧The first ring magnet

423‧‧‧第2磁場形成構件 423‧‧‧Second magnetic field forming member

423a‧‧‧第2中心構件 423a‧‧‧2nd central component

423b‧‧‧第2圓環狀磁鐵 423b‧‧‧2nd ring magnet

424‧‧‧研磨漿料 424‧‧‧Grinding slurry

425‧‧‧磁通集中構件 425‧‧‧ magnetic flux concentration component

425a‧‧‧上部集中構件 425a‧‧‧upper central component

425b‧‧‧下部集中構件 425b‧‧‧Lower central component

425c‧‧‧第1側部集中構件 425c‧‧‧The first side concentrated member

425d‧‧‧第2側部集中構件 425d‧‧‧ 2nd side concentrated member

425e‧‧‧中間構件 425e‧‧‧Intermediate member

425f‧‧‧第1側面 425f‧‧‧1st side

425g‧‧‧第1傾斜面 425g‧‧‧1st inclined surface

425h‧‧‧第2側面 425h‧‧‧Side 2

425i‧‧‧第2傾斜面 425i‧‧‧ 2nd inclined surface

426‧‧‧磁通集中槽 426‧‧‧ magnetic flux concentration groove

427‧‧‧磁通集中空間 427‧‧‧ magnetic flux concentration space

520‧‧‧研磨輪 520‧‧‧Grinding wheel

521‧‧‧旋轉軸 521‧‧‧rotation axis

522‧‧‧第1磁場形成構件 522‧‧‧The first magnetic field forming member

522a‧‧‧第1中心構件 522a‧‧‧The first center member

522b‧‧‧第1圓環狀磁鐵 522b‧‧‧The first ring magnet

523‧‧‧第2磁場形成構件 523‧‧‧Second magnetic field forming member

523a‧‧‧第2中心構件 523a‧‧‧ 2nd central member

523b‧‧‧第2圓環狀磁鐵 523b‧‧‧2nd ring magnet

524‧‧‧研磨漿料 524‧‧‧Grinding slurry

525‧‧‧磁通集中構件 525‧‧‧ magnetic flux concentration component

525c‧‧‧第1側部集中構件 525c‧‧‧The first side concentrated member

525d‧‧‧第2側部集中構件 525d‧‧‧Second side concentrated member

525e‧‧‧中間構件 525e‧‧‧Intermediate member

525f‧‧‧第1側面 525f‧‧‧1st side

525g‧‧‧第1傾斜面 525g‧‧‧1st inclined surface

525h‧‧‧第2側面 525h‧‧‧The second side

525i‧‧‧第2傾斜面 525i‧‧‧ 2nd inclined surface

526‧‧‧磁通集中槽 526‧‧‧ magnetic flux concentration groove

527‧‧‧磁通集中空間 527‧‧‧ magnetic flux concentration space

S10~S80‧‧‧步驟 S10 ~ S80‧‧‧step

圖1係本實施形態之玻璃板之製造方法之流程圖。 FIG. 1 is a flowchart of a method for manufacturing a glass plate according to this embodiment.

圖2係自圖1之熔解工序進行至切斷工序為止之裝置之模式圖。 Fig. 2 is a schematic diagram of the device from the melting step to the cutting step in Fig. 1.

圖3係研磨裝置之概略圖。 Fig. 3 is a schematic view of a polishing apparatus.

圖4係研磨輪之外觀圖。 Figure 4 is an external view of a grinding wheel.

圖5係研磨輪之剖視圖。 Fig. 5 is a sectional view of a grinding wheel.

圖6係研磨輪之剖視圖之一部分。 Fig. 6 is a part of a sectional view of a grinding wheel.

圖7係表示研磨輪所形成之磁場之圖。 Fig. 7 is a diagram showing a magnetic field formed by a grinding wheel.

圖8係作為第1比較例之研磨輪之剖視圖。 Fig. 8 is a sectional view of a grinding wheel as a first comparative example.

圖9係表示作為第1比較例之研磨輪所形成之磁場之圖。 FIG. 9 is a diagram showing a magnetic field generated by a grinding wheel as a first comparative example.

圖10係作為第2比較例之研磨輪之剖視圖。 Fig. 10 is a cross-sectional view of a polishing wheel as a second comparative example.

圖11係表示作為第2比較例之研磨輪所形成之磁場之圖。 FIG. 11 is a diagram showing a magnetic field generated by a grinding wheel as a second comparative example.

圖12係變化例A之研磨輪之剖視圖。 FIG. 12 is a sectional view of a grinding wheel according to a modified example A. FIG.

圖13係表示變化例A之研磨輪所形成之磁場之圖。 FIG. 13 is a diagram showing a magnetic field generated by a grinding wheel of a modified example A. FIG.

圖14係變化例B之研磨輪之剖視圖。 FIG. 14 is a sectional view of a grinding wheel according to a modified example B. FIG.

圖15係變化例B之研磨輪之剖視圖之一部分。 FIG. 15 is a part of a cross-sectional view of a grinding wheel according to Modification B. FIG.

圖16係表示變化例B之研磨輪所形成之磁場之圖。 FIG. 16 is a diagram showing a magnetic field generated by a grinding wheel according to a modification B. FIG.

圖17係變化例C之研磨輪之剖視圖。 FIG. 17 is a sectional view of a grinding wheel according to a modification C. FIG.

圖18係變化例C之研磨輪之剖視圖之一部分。 FIG. 18 is a part of a cross-sectional view of a grinding wheel of Modification C. FIG.

圖19係表示變化例C之研磨輪所形成之磁場之圖。 FIG. 19 is a diagram showing a magnetic field generated by a grinding wheel of Modification C. FIG.

圖20係變化例D之研磨輪之剖視圖。 FIG. 20 is a sectional view of a grinding wheel according to a modification D. FIG.

圖21係變化例E之研磨輪之剖視圖之一部分。 FIG. 21 is a part of a sectional view of a grinding wheel according to a modification E. FIG.

圖22係變化例F之研磨輪之剖視圖之一部分。 FIG. 22 is a part of a cross-sectional view of a grinding wheel of Modification F. FIG.

圖23係變化例G之研磨輪之剖視圖之一部分。 FIG. 23 is a part of a sectional view of a grinding wheel according to a modification G. FIG.

一面參照圖式,一面對作為本發明之實施形態之玻璃板之製造方法進行說明。本實施形態之玻璃板之製造方法包含如下方法,即,對使用溢流下拉法製造之玻璃板之端面進行研磨。 A method for manufacturing a glass plate as an embodiment of the present invention will be described with reference to the drawings. The manufacturing method of the glass plate of this embodiment includes the method of grinding the end surface of the glass plate manufactured using the overflow down-draw method.

(1)玻璃板之製造方法之概要 (1) Outline of manufacturing method of glass plate

首先,對玻璃板之製造方法之概要進行說明。利用該製造方法製造之玻璃板被用作液晶顯示器、電漿顯示器及有機EL顯示器等平板顯示器(FPD)用玻璃基板、觸控用玻璃基板、太陽能電池面板用玻璃基板、及保護用玻璃基板等。玻璃板具有如0.2mm~0.8mm之厚度,且具有縱680mm~2200mm及橫880mm~2500mm之尺寸。玻璃板具有例如以下組成(a)~(j)。 First, the outline of the manufacturing method of a glass plate is demonstrated. The glass plate manufactured by this manufacturing method is used as a glass substrate for a flat panel display (FPD) such as a liquid crystal display, a plasma display, and an organic EL display, a touch glass substrate, a glass substrate for a solar cell panel, and a protective glass substrate. . The glass plate has a thickness of, for example, 0.2 mm to 0.8 mm, and has dimensions of 680 mm to 2200 mm in length and 880 mm to 2500 mm in width. The glass plate has, for example, the following compositions (a) to (j).

(a)SiO2:50質量%~70質量%、(b)Al2O3:10質量%~25質量%、 (c)B2O3:5質量%~18質量%、(d)MgO:0質量%~10質量%、(e)CaO:0質量%~20質量%、(f)SrO:0質量%~20質量%、(g)BaO:0質量%~10質量%、(h)RO:5質量%~20質量%(R係自Mg、Ca、Sr及Ba中選擇之至少1種)、(i)R'2O:0質量%~2.0質量%(R'係自Li、Na及K中選擇之至少1種)、(j)自SnO2、Fe2O3及CeO2選擇之至少1種金屬氧化物。 (a) SiO 2 : 50% to 70% by mass, (b) Al 2 O 3 : 10% to 25% by mass, (c) B 2 O 3 : 5% to 18% by mass, (d) MgO : 0% to 10% by mass, (e) CaO: 0% to 20% by mass, (f) SrO: 0% to 20% by mass, (g) BaO: 0% to 10% by mass, (h ) RO: 5 mass% to 20 mass% (R is at least one selected from Mg, Ca, Sr, and Ba), (i) R ' 2 O: 0 mass% to 2.0 mass% (R' is from Li (Na, K and at least one selected), (j) at least one metal oxide selected from SnO 2 , Fe 2 O 3 and CeO 2 .

其次,對使用溢流下拉法之玻璃板之製造工序進行說明。圖1係表示玻璃板之製造工序之流程圖之一例。玻璃板之製造工序主要包含熔解工序(步驟S10)、澄清工序(步驟S20)、攪拌工序(步驟S30)、成形工序(步驟S40)、緩冷工序(步驟S50)、切斷工序(步驟S60)、研削工序(步驟S70)、及研磨工序(步驟S80)。圖2係自熔解工序S10進行至切斷工序S60為止之玻璃板製造裝置100之模式圖。玻璃板製造裝置100包括熔解裝置101、澄清裝置102、攪拌裝置103、成形裝置104、及切斷裝置105。 Next, the manufacturing process of the glass plate using an overflow down-draw method is demonstrated. FIG. 1 is an example of a flowchart showing a manufacturing process of a glass plate. The glass plate manufacturing process mainly includes a melting step (step S10), a clarification step (step S20), a stirring step (step S30), a forming step (step S40), a slow cooling step (step S50), and a cutting step (step S60). , A grinding step (step S70), and a polishing step (step S80). FIG. 2 is a schematic diagram of the glass plate manufacturing apparatus 100 from the melting step S10 to the cutting step S60. The glass plate manufacturing apparatus 100 includes a melting apparatus 101, a clarifying apparatus 102, a stirring apparatus 103, a forming apparatus 104, and a cutting apparatus 105.

於熔解工序S10中,藉由熔解裝置101,利用燃燒器等加熱器件將玻璃原料熔解,產生1500℃~1600℃之高溫之熔融玻璃90。玻璃原料係以可實質上獲得所需組成之玻璃之方式進行製備。此處,所謂「實質上」,係指於小於0.1質量%之範圍內,允許其他微量成分之存在。 In the melting step S10, the glass raw material is melted by a melting device 101 using a heating device such as a burner, and a molten glass 90 having a high temperature of 1500 ° C to 1600 ° C is generated. The glass raw material is prepared in such a manner that a glass having a desired composition can be substantially obtained. Here, "substantially" means that the presence of other trace components is allowed in a range of less than 0.1% by mass.

於澄清工序S20中,藉由澄清裝置102,使於熔解工序S10中產生之熔融玻璃90進一步升溫,藉此進行熔融玻璃90之澄清。於澄清裝置102中,熔融玻璃90之溫度上升至1600℃~1750℃,較佳上升至1650℃~1700℃。於澄清裝置102中,熔融玻璃90所含之O2、CO2及SO2之微小氣泡吸收因玻璃原料所含之SnO2等澄清劑之還原產生之O2而成長,浮上熔融玻璃90之液面而消失。 In the clarification step S20, the clarification device 102 is used to further increase the temperature of the molten glass 90 generated in the melting step S10, thereby clarifying the molten glass 90. In the clarification device 102, the temperature of the molten glass 90 is raised to 1600 ° C to 1750 ° C, preferably to 1650 ° C to 1700 ° C. In the clarification device 102, the micro-bubbles of O 2 , CO 2 and SO 2 contained in the molten glass 90 grow due to O 2 generated by reduction of clarifying agents such as SnO 2 contained in the glass raw material, and the liquid of the molten glass 90 floats on Disappeared.

於攪拌工序S30中,藉由攪拌裝置103,對於澄清工序S20經過澄清之熔融玻璃90進行攪拌,實現化學均質化及熱均質化。於攪拌裝置103中,熔融玻璃90一面朝鉛垂方向流動,一面繞軸旋轉之攪拌器攪拌,並自設於攪拌裝置103底部之流出口被送往下游工序。又,於攪拌工序S30中,富氧化鋯之熔融玻璃90等、具有與熔融玻璃90之平均比重不同之比重之玻璃成分自攪拌裝置103中被除去。 In the stirring step S30, the molten glass 90 that has been clarified in the clarification step S20 is stirred by the stirring device 103 to achieve chemical homogenization and thermal homogenization. In the stirring device 103, the molten glass 90 is stirred while rotating around the axis while flowing in the vertical direction, and is sent to the downstream process from the outflow port provided at the bottom of the stirring device 103. In the stirring step S30, glass components such as zirconia-rich molten glass 90 and the like having a specific gravity different from the average specific gravity of the molten glass 90 are removed from the stirring device 103.

於成形工序S40中,藉由成形裝置104,利用溢流下拉法自於攪拌工序S30中攪拌後之熔融玻璃90成形玻璃帶91。具體而言,自成形單元上部溢出並分流之熔融玻璃90,沿成形單元之側壁流向下方,並於成形單元之下端合流,藉此連續地成形玻璃帶91。熔融玻璃90在流入成形工序S40之前,被冷卻至適於利用溢流下拉法成形之溫度、例如1200℃。 In the forming step S40, the glass ribbon 91 is formed from the molten glass 90 that has been stirred in the stirring step S30 by the forming apparatus 104 using the overflow down-draw method. Specifically, the molten glass 90 overflowing and shunting from the upper part of the forming unit flows downward along the side wall of the forming unit and merges at the lower end of the forming unit, thereby continuously forming the glass ribbon 91. Before flowing into the forming step S40, the molten glass 90 is cooled to a temperature suitable for forming by the overflow down-draw method, for example, 1200 ° C.

於緩冷工序S50中,對利用成形裝置104在成形工序S40中連續產生之玻璃帶91,以不產生應變及翹曲之方式一面進行溫度控制,一面緩冷至緩冷點以下。 In the slow cooling step S50, the temperature of the glass ribbon 91 continuously generated in the forming step S40 by the forming device 104 is controlled so as not to cause strain and warping, and the temperature is gradually cooled to below the slow cooling point.

於切斷工序S60中,藉由切斷裝置105,將於緩冷工序S50中緩冷至室溫之玻璃帶91每隔特定長度切斷。切換玻璃帶91時,於玻璃帶91上形成刻劃線,使拉伸應力集中於刻劃線而割斷玻璃帶91。形成刻劃線通常使用藉由使用金剛石切割器而機械形成之方法、及利用雷射加熱與急冷而使初始龜裂行進之方法。於切斷工序S60中,進而將每隔特定長度切斷之玻璃帶91切斷成特定之尺寸,從而獲得玻璃板92。 In the cutting step S60, the glass ribbon 91, which is gradually cooled to room temperature in the slow cooling step S50, is cut by the cutting device 105 every predetermined length. When the glass ribbon 91 is switched, a score line is formed on the glass ribbon 91 so that the tensile stress is concentrated on the score line and the glass ribbon 91 is cut. To form the score line, a method using a diamond cutter to mechanically form it, and a method using laser heating and rapid cooling to advance the initial crack are generally used. In the cutting process S60, the glass ribbon 91 cut | disconnected every predetermined length is further cut | disconnected to specific size, and the glass plate 92 is obtained.

於研削工序S70中,研削於切斷工序S60中獲得之玻璃板92之角部,對玻璃板92之端面進行倒角。於切斷工序S60中切斷之玻璃板92之端面與主表面之間之角部,形成有非常鋒利之邊緣。於研削工序S70中,使用金剛石輪等對玻璃板92之角部進行研削,藉此除去形成於角部之邊緣。藉由研削而被倒角之玻璃板92之端面之截面形狀為R形狀。 In the grinding step S70, the corners of the glass plate 92 obtained in the cutting step S60 are ground, and the end faces of the glass plate 92 are chamfered. In the corner between the end surface and the main surface of the glass plate 92 cut in the cutting step S60, a very sharp edge is formed. In the grinding step S70, a corner portion of the glass plate 92 is ground using a diamond wheel or the like, thereby removing the edge formed at the corner portion. The cross-sectional shape of the end surface of the glass plate 92 chamfered by grinding is an R shape.

於研削工序S70中,以玻璃板92之端面之加工寬度處於特定範圍內之方式,對玻璃板92之端面進行研削。加工寬度係玻璃板92被倒角之端面之最外端、和端面與主表面之交界之間之距離的最大值。於倒角加工時,玻璃板92之端面自金剛石輪等承受之力會自端面之最外端起,朝著端面與主表面之交界而逐漸變小。因此,於加工寬度過大之情形時,玻璃板92之端面與主表面之交界附近之區域有可能研削不充分,無法均勻地加工端面。另一方面,於加工寬度過小之情形時,形成於玻璃板92之角部之邊緣有可能除去不充分。於將玻璃板92之厚度設為t之情形時,加工寬度之上述特定範圍較佳為1/50t~t,更較佳為1/20t~1/2t,進而較佳為1/10t~1/3t。又,於研削工序S70中,以玻璃板92之端面之算術平均粗糙度Ra為0.1μm~0.2μm之方式,對玻璃板92之端面進行研削。 In the grinding step S70, the end surface of the glass plate 92 is ground so that the processing width of the end surface of the glass plate 92 is within a specific range. The processing width is the maximum value of the distance between the outermost end of the chamfered end face of the glass plate 92 and the boundary between the end face and the main surface. During the chamfering process, the force endured by the end face of the glass plate 92 from the diamond wheel or the like will gradually decrease from the outermost end of the end face toward the boundary between the end face and the main surface. Therefore, when the processing width is too large, the area near the boundary between the end surface of the glass plate 92 and the main surface may be insufficiently ground, and the end surface may not be processed uniformly. On the other hand, when the processing width is too small, the edges formed at the corners of the glass plate 92 may be insufficiently removed. When the thickness of the glass plate 92 is set to t, the above-mentioned specific range of the processing width is preferably 1 / 50t to t, more preferably 1 / 20t to 1 / 2t, and further preferably 1 / 10t to 1 / 3t. In the grinding step S70, the end surface of the glass plate 92 is ground so that the arithmetic average roughness Ra of the end surface of the glass plate 92 is 0.1 μm to 0.2 μm.

於研削工序S70被倒角之玻璃板92之端面上,形成有包含被稱為微裂痕或水平裂痕之微小裂痕之層。該層被稱為加工變質層或脆弱破壞層。若形成加工變質層,則玻璃板92之端面之破壞強度降低。於研削工序S70中,以加工變質層之厚度小於3μm之方式,對玻璃板92之端面進行研削。 On the end surface of the chamfered glass plate 92 in the grinding step S70, a layer including microcracks called microcracks or horizontal cracks is formed. This layer is called the process metamorphic layer or the fragile failure layer. When the processed deterioration layer is formed, the breaking strength of the end face of the glass plate 92 is reduced. In the grinding step S70, the end face of the glass plate 92 is ground so that the thickness of the processed metamorphic layer is less than 3 μm.

更具體而言,研削工序S70包含第1研削工序及第2研削工序。於第1研削工序中,係使用利用金屬結合劑加固之研削輪(金屬結合劑金剛石輪等)。於第2研削工序中,係使用利用樹脂結合劑加固之研削輪(樹脂結合劑金剛石輪等)。於第2研削工序中,係使用硬度及剛性較第1研削工序中使用之研削輪低之研削輪。於第1研削工序中,短時間內形成玻璃板92之端面所需之R形狀。於第2研削工序中,以使玻璃板92之端面之形狀齊整且端面之表面粗糙度變小之方式,於短時間內進行加工。 More specifically, the grinding process S70 includes a first grinding process and a second grinding process. In the first grinding step, a grinding wheel (metal bonding diamond wheel, etc.) reinforced with a metal bonding agent is used. In the second grinding step, a grinding wheel (resin-bonded diamond wheel, etc.) reinforced with a resin binder is used. In the second grinding step, a grinding wheel having a lower hardness and rigidity than the grinding wheel used in the first grinding step is used. In the first grinding step, an R shape required for the end surface of the glass plate 92 is formed in a short time. In the second grinding step, processing is performed in a short time so that the shape of the end surface of the glass plate 92 is uniform and the surface roughness of the end surface is reduced.

於研磨工序S80中,對於研削工序S70中被倒角之玻璃板92之端面 進行研磨。研磨工序S80之目的為,進而除去加工變質層,提高玻璃板92之端面之破壞強度。 In the grinding step S80, the end face of the chamfered glass plate 92 in the grinding step S70 Grind. The purpose of the polishing step S80 is to further remove the processing-deteriorated layer and improve the breaking strength of the end surface of the glass plate 92.

於研磨工序S80之後,進行玻璃板92之清洗工序及檢查工序。最終,將玻璃板92捆包,向FPD製造業者等出貨。FPD製造業者於玻璃板92之表面形成TFT等半導體元件,而製造FPD。 After the polishing step S80, a cleaning step and an inspection step of the glass plate 92 are performed. Finally, the glass plates 92 are packed and shipped to FPD manufacturers and the like. The FPD manufacturer manufactures a FPD by forming a semiconductor element such as a TFT on the surface of the glass plate 92.

(2)研磨工序之詳細情形 (2) Details of the grinding process

其次,對於研磨工序S80中進行之玻璃板92之端面92a之研磨處理進行說明。於研磨工序S80中,利用研磨裝置10對玻璃板92之端面92a進行研磨。圖3係研磨裝置10之概略圖。研磨裝置10一面搬送玻璃板92,一面對沿玻璃板92之長邊之一對端面92a進行研磨。 Next, the polishing process of the end surface 92a of the glass plate 92 performed in the polishing process S80 is demonstrated. In the polishing step S80, the end surface 92 a of the glass plate 92 is polished by the polishing device 10. FIG. 3 is a schematic view of the polishing apparatus 10. The polishing device 10 grinds the end surface 92 a while conveying the glass plate 92 while facing one of the long sides of the glass plate 92.

如圖3所示,研磨裝置10主要具備搬送機構12及研磨機構14。搬送機構12沿玻璃板92之長邊搬送玻璃板92。搬送機構12使用輸送帶及真空浮板等搬送玻璃板92。真空浮板係如下裝置:向玻璃板92之下側表面吹拂空氣,且自玻璃板92之下側空間抽吸空氣,藉此使玻璃板92穩定地懸浮。研磨機構14以與玻璃板92之一對端面92a分別對向之方式,設置於玻璃板92之兩側。研磨機構14具有研磨輪20。研磨機構14朝向玻璃板92之端面92a擠壓旋轉中之研磨輪20,對玻璃板92之端面92a進行研磨。於圖3中,玻璃板92之搬送方向、及研磨輪20之旋轉方向係用箭頭表示。 As shown in FIG. 3, the polishing apparatus 10 mainly includes a transport mechanism 12 and a polishing mechanism 14. The conveyance mechanism 12 conveys the glass plate 92 along the long side of the glass plate 92. The conveyance mechanism 12 conveys the glass plate 92 using a conveyor belt, a vacuum float plate, or the like. The vacuum floating plate is a device that blows air toward the lower surface of the glass plate 92 and sucks air from the space below the glass plate 92 to suspend the glass plate 92 stably. The polishing mechanism 14 is disposed on both sides of the glass plate 92 so as to face the one end surface 92 a of the glass plate 92 respectively. The polishing mechanism 14 includes a polishing wheel 20. The polishing mechanism 14 presses the grinding wheel 20 in rotation toward the end surface 92 a of the glass plate 92 to polish the end surface 92 a of the glass plate 92. In FIG. 3, the conveyance direction of the glass plate 92 and the rotation direction of the grinding wheel 20 are indicated by arrows.

(2-1)研磨輪之構成 (2-1) Structure of grinding wheel

其次,對研磨輪20之構成進行說明。於以下說明中,「搬送方向」係指玻璃板92之長邊方向、即玻璃板92之端面92a之長度方向,且係指搬送機構12搬送玻璃板92之方向。「寬度方向」係指沿玻璃板92之表面之方向,且係指與搬送方向正交之方向。「鉛垂方向」係指與玻璃板92之表面正交之方向。於圖式中,搬送方向係用「y軸」表示,寬度方向係用「x軸」表示,鉛垂方向係用「z軸」表示。將與鉛垂方向正交之 平面稱為「水平面」。玻璃板92之表面與水平面平行。 Next, the structure of the grinding wheel 20 is demonstrated. In the following description, the "conveying direction" refers to the long-side direction of the glass plate 92, that is, the longitudinal direction of the end surface 92a of the glass plate 92, and the direction in which the glass plate 92 is conveyed by the conveyance mechanism 12. The "width direction" refers to a direction along the surface of the glass plate 92, and refers to a direction orthogonal to the conveyance direction. The “vertical direction” refers to a direction orthogonal to the surface of the glass plate 92. In the drawing, the conveying direction is indicated by the "y-axis", the width direction is indicated by the "x-axis", and the vertical direction is indicated by the "z-axis". Will be orthogonal to the vertical direction The plane is called the "horizontal plane". The surface of the glass plate 92 is parallel to the horizontal plane.

研磨輪20用於對玻璃板92之端面92a進行研磨。圖4係研磨輪20之外觀圖。圖5係以包含旋轉軸21之中心軸21a之xz平面切斷研磨輪20後之剖視圖。圖5中,作為參考,示出研磨輪20要研磨之玻璃板92之端部。如圖5所示,玻璃板92之端面92a被倒角成R形狀。研磨輪20主要具備旋轉軸21、第1磁場形成構件22、第2磁場形成構件23、研磨漿料24、及磁通集中構件25。 The polishing wheel 20 is used to polish the end surface 92 a of the glass plate 92. FIG. 4 is an external view of the grinding wheel 20. FIG. 5 is a cross-sectional view of the grinding wheel 20 after the grinding wheel 20 is cut along the xz plane including the central axis 21 a of the rotation axis 21. In FIG. 5, for reference, the end of the glass plate 92 to be ground by the grinding wheel 20 is shown. As shown in FIG. 5, the end surface 92 a of the glass plate 92 is chamfered into an R shape. The polishing wheel 20 mainly includes a rotation shaft 21, a first magnetic field forming member 22, a second magnetic field forming member 23, a polishing slurry 24, and a magnetic flux concentration member 25.

(2-1-1)旋轉軸 (2-1-1) Rotary shaft

旋轉軸21係用於使研磨輪20旋轉之軸。研磨輪20繞旋轉軸21之中心軸21a而旋轉。中心軸21a與鉛垂方向平行。如圖3所示,研磨輪20之旋轉方向係使玻璃板92在與玻璃板92之搬送方向相反之方向上移動之方向。旋轉軸21以磁通不集中於旋轉軸21之方式,利用SUS304等非磁性體之不鏽鋼鋼材成形。以下,將旋轉軸21之直徑方向、即與旋轉軸21之中心軸21a正交之方向稱為「徑向」。又,關於徑向之直線上之2點,將距離中心軸21a較長之1點所處一側稱為「徑向外側」,將距離中心軸21a較短之1點所處一側稱為「徑向內側」。 The rotation shaft 21 is a shaft for rotating the grinding wheel 20. The grinding wheel 20 rotates about the central axis 21 a of the rotation axis 21. The central axis 21a is parallel to the vertical direction. As shown in FIG. 3, the rotation direction of the grinding wheel 20 is a direction which moves the glass plate 92 in the direction opposite to the conveyance direction of the glass plate 92. The rotating shaft 21 is formed by using a non-magnetic stainless steel material such as SUS304 so that the magnetic flux is not concentrated on the rotating shaft 21. Hereinafter, the diameter direction of the rotating shaft 21, that is, the direction orthogonal to the central axis 21a of the rotating shaft 21 is referred to as "radial direction". Regarding the two points on the radial straight line, the side on which one point is longer from the central axis 21a is referred to as "radial outer side", and the side on which one point is shorter from the central axis 21a is referred to as "radial outer side". "Radial inside".

旋轉軸21連接於旋轉軸驅動部(未圖示),且以所需之旋轉速度繞中心軸21a旋轉。旋轉軸21連接於旋轉軸移動機構(未圖示),以相對於玻璃板92之端面92a接近或背離之方式移動。 The rotating shaft 21 is connected to a rotating shaft driving unit (not shown) and rotates around the central shaft 21a at a required rotation speed. The rotating shaft 21 is connected to a rotating shaft moving mechanism (not shown), and moves so as to approach or depart from the end surface 92 a of the glass plate 92.

(2-1-2)第1磁場形成構件 (2-1-2) First magnetic field forming member

如圖5所示,第1磁場形成構件22包括第1中心構件22a、及第1圓環狀磁鐵22b。第1中心構件22a係具有沿鉛垂方向形成之貫通孔之圓柱形狀之構件。第1中心構件22a以磁通不集中於第1中心構件22a之方式,利用SUS304等非磁性體之不鏽鋼鋼材成形。旋轉軸21貫通第1中心構件22a之貫通孔。第1中心構件22a固定於旋轉軸21。第1圓環狀磁鐵22b係具有沿鉛垂方向形成之貫通孔之圓柱形狀之構件。第1中心構件22a 嵌入於第1圓環狀磁鐵22b之貫通孔。第1圓環狀磁鐵22b係永久磁鐵及電磁鐵等磁鐵,於鉛垂方向上被磁化,上側為N極且下側為S極。以下,將第1圓環狀磁鐵22b之上表面稱為第1上部磁場形成面22c,將第1圓環狀磁鐵22b之下表面稱為第1下部磁場形成面22d。 As shown in FIG. 5, the first magnetic field forming member 22 includes a first center member 22 a and a first ring-shaped magnet 22 b. The first center member 22a is a cylindrical member having a through hole formed in the vertical direction. The first center member 22a is formed from a non-magnetic stainless steel material such as SUS304 so that the magnetic flux is not concentrated on the first center member 22a. The rotation shaft 21 penetrates a through hole of the first center member 22a. The first center member 22 a is fixed to the rotation shaft 21. The first annular magnet 22b is a cylindrical member having a through hole formed in the vertical direction. First center member 22a The through hole is fitted in the first annular magnet 22b. The first ring-shaped magnet 22b is a magnet such as a permanent magnet and an electromagnet, and is magnetized in the vertical direction. The upper side is the N pole and the lower side is the S pole. Hereinafter, the upper surface of the first annular magnet 22b is referred to as a first upper magnetic field formation surface 22c, and the lower surface of the first annular magnet 22b is referred to as a first lower magnetic field formation surface 22d.

(2-1-3)第2磁場形成構件 (2-1-3) The second magnetic field forming member

如圖5所示,第2磁場形成構件23包括第2中心構件23a、及第2圓環狀磁鐵23b。第2中心構件23a係具有沿鉛垂方向形成之貫通孔之圓柱形狀之構件。第2中心構件23a以磁通不集中於第2中心構件23a之方式,利用SUS304等非磁性體之不鏽鋼鋼材成形。旋轉軸21貫通第2中心構件23a之貫通孔。第2中心構件23a固定於旋轉軸21。第2圓環狀磁鐵23b係具有沿鉛垂方向形成之貫通孔之圓柱形狀之構件。第2中心構件23a嵌入於第2圓環狀磁鐵23b之貫通孔。第2圓環狀磁鐵23b係永久磁鐵及電磁鐵等磁鐵,於鉛垂方向上被磁化,上側為N極且下側為S極。以下,將第2圓環狀磁鐵23b之上表面稱為第2上部磁場形成面23c,將第2圓環狀磁鐵23b之下表面稱為第2下部磁場形成面23d。 As shown in FIG. 5, the second magnetic field forming member 23 includes a second center member 23 a and a second ring-shaped magnet 23 b. The second center member 23a is a cylindrical member having a through hole formed in the vertical direction. The second center member 23a is formed by using a non-magnetic stainless steel material such as SUS304 so that the magnetic flux is not concentrated on the second center member 23a. The rotation shaft 21 penetrates a through hole of the second center member 23a. The second center member 23 a is fixed to the rotation shaft 21. The second annular magnet 23b is a cylindrical member having a through hole formed in the vertical direction. The second center member 23a is fitted into the through hole of the second ring-shaped magnet 23b. The second ring-shaped magnet 23b is a magnet such as a permanent magnet and an electromagnet, and is magnetized in the vertical direction. The upper side is the N pole and the lower side is the S pole. Hereinafter, the upper surface of the second annular magnet 23b is referred to as a second upper magnetic field formation surface 23c, and the lower surface of the second annular magnet 23b is referred to as a second lower magnetic field formation surface 23d.

第1磁場形成構件22具有與第2磁場形成構件23相同之尺寸。如圖5所示,第1磁場形成構件22設於第2磁場形成構件23之鉛垂方向上方。第1磁場形成構件22與第2磁場形成構件23鄰接。即,第1下部磁場形成面22d與第2上部磁場形成面23c接觸。 The first magnetic field forming member 22 has the same size as the second magnetic field forming member 23. As shown in FIG. 5, the first magnetic field forming member 22 is provided above the vertical direction of the second magnetic field forming member 23. The first magnetic field forming member 22 is adjacent to the second magnetic field forming member 23. That is, the first lower magnetic field formation surface 22d is in contact with the second upper magnetic field formation surface 23c.

第1磁場形成構件22及第2磁場形成構件23在它們周圍之空間內形成磁場。藉此,研磨輪20可以在其周圍之空間內形成磁場。再者,第1磁場形成構件22之第1圓環狀磁鐵22b、及第2磁場形成構件23之第2圓環狀磁鐵23b均可為上側係S極且下側係N極之磁鐵。 The first magnetic field forming member 22 and the second magnetic field forming member 23 form a magnetic field in a space around them. Thereby, the grinding wheel 20 can form a magnetic field in the space around it. In addition, the first ring-shaped magnet 22b of the first magnetic field forming member 22 and the second ring-shaped magnet 23b of the second magnetic field forming member 23 may be magnets having S poles on the upper side and N poles on the lower side.

(2-1-4)研磨漿料 (2-1-4) grinding slurry

研磨漿料24係磁性體研磨粒與液體之混合物。研磨漿料24被藉由研磨輪20形成之磁場保持。 The polishing slurry 24 is a mixture of magnetic abrasive particles and a liquid. The polishing slurry 24 is held by a magnetic field formed by the polishing wheel 20.

磁性體研磨粒係用於研磨玻璃板92等脆性材料之研磨粒。磁性體研磨粒例如包括氧化鐵及鐵氧體等磁性體之粒子。於使用鐵氧體作為磁性體研磨粒之情形時,不需要用於防止氧化之添加物、或用於防止氧化之添加物之使用量減少,因此,可以抑制磁性體研磨粒之經時變質。 The magnetic abrasive grains are abrasive grains used for grinding a brittle material such as a glass plate 92. The magnetic abrasive particles include, for example, magnetic particles such as iron oxide and ferrite. When ferrite is used as the magnetic abrasive particles, the amount of additives used to prevent oxidation or the amount of additives used to prevent oxidation is not required to be reduced. Therefore, the deterioration of the magnetic abrasive particles with time can be suppressed.

與磁性體研磨粒混合之液體例如為水、烴、酯類、醚類及氟化氫。與磁性體研磨粒混合之液體亦可為以水為主成分且添加有烴、酯類、醚類及氟化氫等之液體。與磁性體研磨粒混合之液體較佳為水。藉由使用水,可以抑制玻璃板92在研磨處理中之研磨漿料24之溫度上升。 The liquid mixed with the magnetic abrasive particles is, for example, water, hydrocarbons, esters, ethers, and hydrogen fluoride. The liquid mixed with the magnetic abrasive particles may be a liquid containing water as a main component and added with hydrocarbons, esters, ethers, hydrogen fluoride, and the like. The liquid mixed with the magnetic abrasive particles is preferably water. By using water, an increase in the temperature of the polishing slurry 24 of the glass plate 92 during the polishing process can be suppressed.

為了抑制磁性體研磨粒之凝結,亦可於研磨漿料24中添加0.5wt%以下之界面活性劑。界面活性劑例如為脂肪酸酯。又,為了抑制研磨漿料24之組成變化,亦可於研磨漿料24中添加小於3.0wt%之丙二醇。 In order to suppress the coagulation of magnetic abrasive particles, a surfactant of 0.5 wt% or less may be added to the polishing slurry 24. The surfactant is, for example, a fatty acid ester. In addition, in order to suppress the composition change of the polishing slurry 24, less than 3.0 wt% of propylene glycol may be added to the polishing slurry 24.

研磨漿料24之磁性體研磨粒例如使用BASF公司製之羰基鐵粉。羰基鐵粉為圓球狀,具有直徑1μm~8μm之粒度分佈。研磨漿料24係藉由於該磁性體研磨粒中適當地混合界面活性劑、防銹劑、潤濕劑、增黏劑及水而作成。又,亦可於研磨漿料24中進而混合氧化鈰、氧化鋁及氧化矽等非磁性漿料,以提高研磨力。 As the magnetic abrasive grains of the polishing slurry 24, for example, a carbonyl iron powder manufactured by BASF is used. Carbonyl iron powder is spherical and has a particle size distribution with a diameter of 1 μm to 8 μm. The polishing slurry 24 is prepared by appropriately mixing a surfactant, a rust inhibitor, a wetting agent, a tackifier, and water in the magnetic abrasive particles. In addition, a non-magnetic slurry such as cerium oxide, aluminum oxide, and silicon oxide may be further mixed with the polishing slurry 24 to increase the polishing power.

磁性體研磨粒較佳為,最大磁通密度為1.0T以上,最大磁導率為3.0H/m以上。於研磨漿料24所含之磁性體研磨粒之濃度小於85%之情形時,較佳為最大磁通密度為1.3T以上,最大磁導率為3.3H/m以上,更較佳為最大磁通密度為1.6T以上。 The magnetic abrasive particles preferably have a maximum magnetic flux density of 1.0 T or more and a maximum magnetic permeability of 3.0 H / m or more. In the case where the concentration of the magnetic abrasive particles contained in the polishing slurry 24 is less than 85%, the maximum magnetic flux density is preferably 1.3 T or more, the maximum magnetic permeability is 3.3 H / m or more, and the maximum magnetic flux is more preferable. The flux density is above 1.6T.

(2-1-5)磁通集中構件 (2-1-5) Magnetic flux concentration member

如圖5所示,磁通集中構件25包括上部集中構件25a、下部集中構件25b、第1側部集中構件25c、及第2側部集中構件25d。構成磁通集中構件25之各構件係利用SUS430等強磁性體之軟鐵鋼成形。再者,構成磁通集中構件25之各構件亦可具有較高之剛性,且利用其他材質之強 磁性體成形。又,於與研磨漿料24之磁性體研磨粒混合之液體為水之情形時,磁通集中構件25較佳利用不鏽鋼等不易生銹之材質成形。第1磁場形成構件22及第2磁場形成構件23除了旋轉軸21向鉛垂方向突出之部分以外,被磁通集中構件25覆蓋。被磁通集中構件25覆蓋之第1磁場形成構件22及第2磁場形成構件23具有旋轉軸21沿鉛垂方向貫通之圓柱形狀。磁通集中構件25固定於旋轉軸21。圖6係將圖5所示之研磨輪20之剖視圖之徑向外側之端部放大後之圖。於圖6中,省略了研磨漿料24及玻璃板92。 As shown in FIG. 5, the magnetic flux concentration member 25 includes an upper concentration member 25 a, a lower concentration member 25 b, a first side concentration member 25 c, and a second side concentration member 25 d. Each member constituting the magnetic flux concentration member 25 is formed of soft iron steel made of ferromagnetic material such as SUS430. In addition, each member constituting the magnetic flux concentration member 25 may have high rigidity, and use the strength of other materials. Magnetic body molding. When the liquid mixed with the magnetic abrasive particles of the polishing slurry 24 is water, the magnetic flux concentration member 25 is preferably formed from a material that is not easily rusted, such as stainless steel. The first magnetic field forming member 22 and the second magnetic field forming member 23 are covered by a magnetic flux concentration member 25 except for a portion where the rotation shaft 21 projects in the vertical direction. The first magnetic field forming member 22 and the second magnetic field forming member 23 covered with the magnetic flux concentration member 25 have a cylindrical shape in which the rotation shaft 21 penetrates in the vertical direction. The magnetic flux concentration member 25 is fixed to the rotation shaft 21. FIG. 6 is an enlarged view of the radially outer end of the cross-sectional view of the grinding wheel 20 shown in FIG. 5. In FIG. 6, the polishing slurry 24 and the glass plate 92 are omitted.

上部集中構件25a以覆蓋至少第1圓環狀磁鐵22b之上表面(N極)之方式設置。下部集中構件25b以覆蓋至少第2圓環狀磁鐵23b之下表面(S極)之方式設置。第1側部集中構件25c覆蓋第1磁場形成構件22之外周面。第2側部集中構件25d覆蓋第2磁場形成構件23之外周面。如圖5所示,上部集中構件25a、下部集中構件25b、第1側部集中構件25c及第2側部集中構件25d之徑向外側之端部在徑向上全部位於相同位置。如圖6所示,第1側部集中構件25c之上表面與上部集中構件25a之徑向外側之下表面接觸,第2側部集中構件25d之下表面與下部集中構件25b之徑向外側之上表面接觸。 The upper concentrating member 25a is provided so as to cover at least the upper surface (N pole) of the first ring-shaped magnet 22b. The lower concentrating member 25b is provided so as to cover at least the lower surface (S-pole) of the second ring-shaped magnet 23b. The first side concentrated member 25 c covers the outer peripheral surface of the first magnetic field forming member 22. The second side concentrated member 25 d covers the outer peripheral surface of the second magnetic field forming member 23. As shown in FIG. 5, the radially outer ends of the upper concentrated member 25 a, the lower concentrated member 25 b, the first side concentrated member 25 c, and the second side concentrated member 25 d are all located at the same position in the radial direction. As shown in FIG. 6, the upper surface of the first side concentrated member 25c is in contact with the radially outer lower surface of the upper concentrated member 25a, and the lower surface of the second side concentrated member 25d and the radially outer lower surface of the lower concentrated member 25b are in contact with each other. The upper surface is in contact.

如圖6所示,第1側部集中構件25c具有第1側面25e、及第1傾斜面25f。第1側面25e係第1側部集中構件25c之外周面。第1傾斜面25f係自第1側面25e之下端朝向徑向內側而朝鉛垂方向下方傾斜之平面。第1傾斜面25f之最靠徑向內側之點與第1磁場形成構件22之外周面之下端一致。 As shown in FIG. 6, the first side concentrated member 25 c includes a first side surface 25 e and a first inclined surface 25 f. The first side surface 25e is the outer peripheral surface of the first side concentrated member 25c. The first inclined surface 25f is a plane inclined downward in the vertical direction from the lower end of the first side surface 25e toward the radially inner side. The point on the radially innermost side of the first inclined surface 25f coincides with the lower end of the outer peripheral surface of the first magnetic field forming member 22.

如圖6所示,第2側部集中構件25d具有第2側面25g、及第2傾斜面25h。第2側面25g係第2側部集中構件25d之外周面。第2傾斜面25h係自第2側面25g之上端朝向徑向內側而朝鉛垂方向上方傾斜之平面。第2傾斜面25h之最靠徑向內側之點與第2磁場形成構件23之外周面之上端 一致。 As shown in FIG. 6, the second side concentrated member 25 d has a second side surface 25 g and a second inclined surface 25 h. The second side surface 25g is an outer peripheral surface of the second side portion concentrating member 25d. The second inclined surface 25h is a plane inclined upward in the vertical direction from the upper end of the second side surface 25g toward the radially inner side. The point on the radially innermost side of the second inclined surface 25h and the upper end of the outer peripheral surface of the second magnetic field forming member 23 Consistent.

第1磁場形成構件22沿鉛垂方向而與第2磁場形成構件23鄰接。因此,第1側部集中構件25c之第1傾斜面25f之最靠徑向內側之點與第2側部集中構件25d之第2傾斜面25h之最靠徑向內側之點一致。結果,如圖6所示,於磁通集中構件25之外周面形成有磁通集中槽26。磁通集中槽26係包括第1傾斜面25f及第2傾斜面25h之V字型之槽。磁通集中槽26之內側空間、即第1傾斜面25f與第2傾斜面25h之間之空間係磁通集中空間27。磁通集中空間27係作為研磨輪20所形成之磁場之通量即磁通集中之空間。利用包含磁場容易通過之強磁性體之磁通集中構件25,將磁場導向所需之方向,藉此作為表示磁場之假像線即磁力線之閉迴路之磁路。磁通集中空間27係包含磁路之一部分之空間。 The first magnetic field forming member 22 is adjacent to the second magnetic field forming member 23 in the vertical direction. Therefore, the point radially inward of the first inclined surface 25f of the first side concentrated member 25c coincides with the point radially inward of the second inclined surface 25h of the second side concentrated member 25d. As a result, as shown in FIG. 6, a magnetic flux concentration groove 26 is formed on the outer peripheral surface of the magnetic flux concentration member 25. The magnetic flux concentration groove 26 is a V-shaped groove including a first inclined surface 25f and a second inclined surface 25h. The space inside the magnetic flux concentration groove 26, that is, the space between the first inclined surface 25f and the second inclined surface 25h is a magnetic flux concentration space 27. The magnetic flux concentration space 27 is a space where the magnetic flux formed by the grinding wheel 20 is the magnetic flux concentration. A magnetic flux concentrating member 25 containing a ferromagnetic body that is easy to pass through the magnetic field is used to direct the magnetic field in a desired direction, thereby serving as a magnetic circuit of a closed loop that is a ghost line representing the magnetic field, that is, a magnetic field line. The magnetic flux concentration space 27 is a space containing a part of the magnetic circuit.

磁通集中空間27之最靠徑向內側之點和第1磁場形成構件22與第2磁場形成構件23之間之接觸面之最靠徑向外側之點一致。研磨漿料24藉由研磨輪20所形成之磁場而被保持於磁通集中空間27。 The most radially inward point of the magnetic flux concentration space 27 coincides with the most radially outward point of the contact surface between the first magnetic field forming member 22 and the second magnetic field forming member 23. The polishing slurry 24 is held in the magnetic flux concentration space 27 by a magnetic field formed by the polishing wheel 20.

再者,構成磁通集中構件25之各構件亦可一體地成形。例如,上部集中構件25a與第1側部集中構件25c可作為一體構件而成形,且下部集中構件25b與第2側部集中構件25d亦可作為一體構件而成形。 In addition, each member constituting the magnetic flux concentration member 25 may be integrally formed. For example, the upper concentrated member 25a and the first side concentrated member 25c may be formed as an integrated member, and the lower concentrated member 25b and the second side concentrated member 25d may be formed as an integrated member.

(2-2)研磨輪所形成之磁場 (2-2) Magnetic field formed by the grinding wheel

圖7係將圖5所示之研磨輪20之剖視圖之徑向外側之端部放大後之圖。於圖7中,記載有作為表示研磨輪20之第1磁場形成構件22及第2磁場形成構件23所形成之磁場之假像線之磁力線。於圖7中,省略了研磨漿料24及玻璃板92。再者,於圖7中,為了使磁力線醒目,而省略圖5及圖6所示之影線。 FIG. 7 is an enlarged view of the radially outer end of the cross-sectional view of the grinding wheel 20 shown in FIG. 5. In FIG. 7, magnetic field lines are described as false image lines representing magnetic fields formed by the first magnetic field forming member 22 and the second magnetic field forming member 23 of the grinding wheel 20. In FIG. 7, the polishing slurry 24 and the glass plate 92 are omitted. In addition, in FIG. 7, in order to make the magnetic field lines stand out, the hatched lines shown in FIGS. 5 and 6 are omitted.

於圖7中,表示有自第1磁場形成構件22之第1圓環狀磁鐵22b之N極,朝向第2磁場形成構件23之第2圓環狀磁鐵23b之S極之磁力線。於圖7中,表示有如下磁力線,即,例如自第1磁場形成構件22之第1上部 磁場形成面22c出發,繞過第1磁場形成構件22及第2磁場形成構件23之徑向外側之空間,並到達第2磁場形成構件23之第2下部磁場形成面23d。 In FIG. 7, magnetic lines of force from the N pole of the first ring-shaped magnet 22 b of the first magnetic field forming member 22 toward the S pole of the second ring-shaped magnet 23 b of the second magnetic field forming member 23 are shown. In FIG. 7, magnetic field lines are shown, for example, from the first upper portion of the first magnetic field forming member 22. The magnetic field formation surface 22 c departs from the radially outer space of the first magnetic field formation member 22 and the second magnetic field formation member 23 and reaches the second lower magnetic field formation surface 23 d of the second magnetic field formation member 23.

磁通集中構件25使研磨漿料24保持之磁通集中空間27之磁通密度增加。具體而言,上部集中構件25a以形成自第1上部磁場形成面22c向上方流出(放出)之磁力線,朝徑向外側穿過上部集中構件25a之磁路之方式,導引磁力線。上部集中構件25a抑制自第1上部磁場形成面22c向上方流出之磁力線漏出至上部集中構件25a上方之空間。第1側部集中構件25c以形成被上部集中構件25a導引之磁力線穿過第1側部集中構件25c而朝向磁通集中空間27之磁路之方式,導引磁力線。第1側部集中構件25c抑制被上部集中構件25a導引之磁力線漏出至第1側部集中構件25c之徑向外側之空間。第2側部集中構件25d以形成被第1側部集中構件25c導引之磁力線穿過第2側部集中構件25d而朝向下部集中構件25b之磁路之方式,導引磁力線。第2側部集中構件25d抑制被第1側部集中構件25c導引之磁力線漏出至第2側部集中構件25d之徑向外側之空間。下部集中構件25b以形成被第2側部集中構件25d導引之磁力線朝徑向內側穿過下部集中構件25b之磁路之方式,導引磁力線。下部集中構件25b抑制被第2側部集中構件25d導引之磁力線漏出至下部集中構件25b下方之空間。 The magnetic flux concentration member 25 increases the magnetic flux density of the magnetic flux concentration space 27 held by the polishing slurry 24. Specifically, the upper concentrated member 25a guides the magnetic force lines so as to form magnetic lines of force that flow out (release) from the first upper magnetic field forming surface 22c and pass through the magnetic path of the upper concentrated member 25a radially outward. The upper concentrating member 25a suppresses the leakage of magnetic lines of force flowing upward from the first upper magnetic field forming surface 22c to the space above the upper concentrating member 25a. The first side concentrated member 25c guides the magnetic force lines such that the magnetic lines of force guided by the upper concentrated member 25a pass through the first side concentrated members 25c and face the magnetic flux concentration space 27. The first side concentrated member 25c prevents the magnetic lines of force guided by the upper concentrated member 25a from leaking out to a space radially outside the first side concentrated member 25c. The second side concentrated member 25d guides the magnetic lines of force so that the magnetic lines of force guided by the first side concentrated members 25c pass through the second side concentrated members 25d and face the lower concentrated member 25b. The second side concentrated member 25d suppresses leakage of magnetic lines of force guided by the first side concentrated member 25c to a space radially outside the second side concentrated member 25d. The lower concentrated member 25b guides the magnetic lines of force so that the magnetic lines of force guided by the second side concentrated member 25d pass through the magnetic path of the lower concentrated member 25b radially inward. The lower concentrated member 25b suppresses the magnetic lines of force guided by the second side concentrated member 25d from leaking to the space below the lower concentrated member 25b.

因此,如圖7所示,磁通集中構件25能夠將自第1上部磁場形成面22c朝上方流出之磁力線之一部分,不漏出至研磨輪20周圍之空間地,導引至第2下部磁場形成面23d。藉此,可形成漏出磁通較少之磁路。若對比設置磁通集中構件25且磁力線流出至磁通集中構件25之情形、與不設置磁通集中構件25而磁力線流出至周圍空間之情形,前者使磁場通過包含磁場(磁力線)容易通過之強磁性體之磁通集中構件25,藉此向空間漏出之磁通變少,形成磁動勢強之磁路。另一方面,後者會 使磁場向周圍空間漏出,因此與前者相比,形成磁動勢弱之磁路。因此,自第1上部磁場形成面22c出發,通過作為強磁性體之磁通集中構件25後到達第2下部磁場形成面23d之磁力線所表示之磁路之漏出磁通較小。所以,自第1上部磁場形成面22c朝上方流出之磁力線所表示之磁力、與通過磁通集中空間27之磁力線所表示之磁力之差較小。因此,藉由將磁通集中構件25安裝於第1磁場形成構件22及第2磁場形成構件23,具有使磁通集中空間27、即第1磁場形成構件22及第2磁場形成構件23周圍之空間之磁通密度增加之效果。 Therefore, as shown in FIG. 7, the magnetic flux concentration member 25 can guide a part of the magnetic field lines flowing upward from the first upper magnetic field formation surface 22 c to the second lower magnetic field formation without leaking to the space around the grinding wheel 20. Face 23d. Thereby, a magnetic circuit with less leakage magnetic flux can be formed. Comparing the case where the magnetic flux concentration member 25 is provided and the magnetic flux lines flow out to the magnetic flux concentration member 25 and the case where the magnetic flux concentration member 25 is not provided and the magnetic flux lines flow to the surrounding space, the former allows the magnetic field to pass through the included magnetic field (magnetic field lines). The magnetic flux concentration member 25 of the magnetic body reduces the amount of magnetic flux leaking into the space, and forms a magnetic circuit with a strong magnetomotive force. On the other hand, the latter will Since the magnetic field is leaked to the surrounding space, compared with the former, a magnetic circuit with weak magnetomotive force is formed. Therefore, starting from the first upper magnetic field formation surface 22c, the leakage magnetic flux in the magnetic circuit indicated by the magnetic field lines passing through the magnetic flux concentration member 25 as a ferromagnetic body and reaching the second lower magnetic field formation surface 23d is small. Therefore, the difference between the magnetic force indicated by the magnetic force lines flowing upward from the first upper magnetic field formation surface 22c and the magnetic force indicated by the magnetic force lines passing through the magnetic flux concentration space 27 is small. Therefore, by attaching the magnetic flux concentrating member 25 to the first magnetic field forming member 22 and the second magnetic field forming member 23, the magnetic flux concentrating space 27 is provided to surround the first magnetic field forming member 22 and the second magnetic field forming member 23. The effect of increasing the magnetic flux density in space.

研磨漿料24係被利用磁通集中構件25而磁通密度增加之磁通集中空間27之磁場保持。研磨漿料24填滿磁通集中槽26。如圖5所示,被磁通集中空間27保持之研磨漿料24具有漿料面24a。漿料面24a係填滿磁通集中槽26之研磨漿料24之徑向外側之表面。磁通集中空間27之磁通密度越高,則磁通集中空間27之磁場之強度越高,因此,研磨漿料24所含之磁性體研磨粒自磁通集中空間27之磁場承受之力之大小變得越高。即,由第1磁場形成構件22及第2磁場形成構件23形成之磁場保持研磨漿料24之力於磁通集中空間27中因磁通集中構件25而增大。因此,磁通集中構件25可提高研磨輪20對研磨漿料24之保持力。 The polishing slurry 24 is held by the magnetic field of the magnetic flux concentration space 27 in which the magnetic flux density is increased by the magnetic flux concentration member 25. The polishing slurry 24 fills the magnetic flux concentration groove 26. As shown in FIG. 5, the polishing slurry 24 held by the magnetic flux concentration space 27 has a slurry surface 24a. The slurry surface 24 a is a radially outer surface of the polishing slurry 24 which fills the magnetic flux concentration groove 26. The higher the magnetic flux density of the magnetic flux concentration space 27, the higher the intensity of the magnetic field of the magnetic flux concentration space 27. Therefore, the magnetic abrasive particles contained in the polishing slurry 24 are subjected to the force of the magnetic field from the magnetic flux concentration space 27. The size becomes higher. In other words, the magnetic field holding force of the polishing slurry 24 formed by the first magnetic field forming member 22 and the second magnetic field forming member 23 in the magnetic flux concentration space 27 is increased by the magnetic flux concentration member 25. Therefore, the magnetic flux concentration member 25 can increase the holding force of the polishing wheel 20 on the polishing slurry 24.

(2-3)研磨裝置之動作 (2-3) Operation of the grinding device

對於研磨工序S80中,研磨裝置10研磨玻璃板92之端面92a之工序進行說明。首先,利用搬送機構12來搬送端部被倒角成R形狀之玻璃板92。沿搬送方向被搬送之玻璃板92逐漸靠近研磨機構14之研磨輪20。亦可以一對研磨輪20之位置與玻璃板92之寬度吻合之方式,預先設置研磨機構14。又,研磨機構14亦可利用感測器等,偵測玻璃板92之端面92a已十分接近研磨輪20、或玻璃板92之端面92a已接觸研磨輪20,然後使以旋轉軸21之中心軸21a為中心而旋轉之研磨輪20朝向玻璃板92之端面92a移動。結果,如圖5所示,玻璃板92之端面92a自漿料面 24a插入研磨漿料24之中。於玻璃板92之端面92a插入研磨漿料24之中之狀態下,利用搬送機構12沿搬送方向搬送玻璃板92。藉此,於玻璃板92之端面92a接觸研磨漿料24之狀態下,旋轉中之研磨輪20與玻璃板92之端面92a沿搬送方向而相對移動。玻璃板92之端面92a與和研磨輪20一併旋轉之研磨漿料24所含之磁性體研磨粒碰撞而進行研磨。再者,亦可不沿搬送方向移動玻璃板92,而係使研磨輪20沿搬送方向移動,讓旋轉中之研磨輪20與玻璃板92之端面92a沿搬送方向相對移動。又,亦可沿搬送方向移動玻璃板92及研磨輪20兩者,使旋轉中之研磨輪20與玻璃板92之端面92a沿搬送方向相對移動。 In the polishing step S80, a step of polishing the end surface 92a of the glass plate 92 by the polishing device 10 will be described. First, the glass plate 92 whose edges are chamfered into an R shape is transported by the transport mechanism 12. The glass plate 92 conveyed in the conveyance direction gradually approaches the grinding wheel 20 of the grinding mechanism 14. The grinding mechanism 14 may be provided in advance so that the position of the pair of grinding wheels 20 matches the width of the glass plate 92. In addition, the grinding mechanism 14 may also use a sensor or the like to detect that the end surface 92a of the glass plate 92 is very close to the grinding wheel 20, or that the end surface 92a of the glass plate 92 has contacted the grinding wheel 20, and then set the center axis of the rotation axis 21 The grinding wheel 20 which rotates around 21a is moved toward the end surface 92a of the glass plate 92. As a result, as shown in FIG. 5, the end surface 92 a of the glass plate 92 is from the slurry surface. 24a is inserted into the polishing slurry 24. In a state where the end surface 92 a of the glass plate 92 is inserted into the polishing slurry 24, the glass plate 92 is transported in the transport direction by the transport mechanism 12. With this, in a state where the end surface 92a of the glass plate 92 is in contact with the polishing slurry 24, the rotating grinding wheel 20 and the end surface 92a of the glass plate 92 are relatively moved in the conveying direction. The end surface 92a of the glass plate 92 collides with the magnetic abrasive grains contained in the polishing slurry 24 which rotates with the grinding wheel 20, and grinds. Moreover, instead of moving the glass plate 92 in the conveying direction, the grinding wheel 20 may be moved in the conveying direction, and the rotating grinding wheel 20 and the end surface 92a of the glass plate 92 may be relatively moved in the conveying direction. Moreover, you may move both the glass plate 92 and the grinding wheel 20 in a conveyance direction, and may relatively move the grinding wheel 20 and the end surface 92a of the glass plate 92 in a conveyance direction in rotation.

於研削工序S70中被研削之玻璃板92之端面92a上,形成有包含被稱為微裂痕或水平裂痕之微小裂痕之層。該層被稱為加工變質層或脆弱破壞層,具有小於3μm之厚度。於研削工序S70中,進行上述第1研削工序及第2研削工序,控制玻璃板92之端面92a之品質。研磨輪20對玻璃板92之端面92a進行研磨,除去端面92a之加工變質層或脆弱破壞層。研磨輪20較佳以玻璃板92之端面92a之算術平均粗糙度Ra變成例如10nm以下之方式,研磨玻璃板92之端面92a。 A layer including microcracks called microcracks or horizontal cracks is formed on the end surface 92a of the glass plate 92 to be ground in the grinding step S70. This layer is called a process deterioration layer or a fragile damage layer, and has a thickness of less than 3 μm. In the grinding step S70, the above-mentioned first grinding step and second grinding step are performed to control the quality of the end surface 92a of the glass plate 92. The grinding wheel 20 grinds the end surface 92a of the glass plate 92, and removes the processed deterioration layer or the fragile damage layer of the end surface 92a. The polishing wheel 20 preferably grinds the end surface 92a of the glass plate 92 such that the arithmetic average roughness Ra of the end surface 92a of the glass plate 92 becomes, for example, 10 nm or less.

(3)特徵 (3) Features

本實施形態之玻璃板之製造方法包含研磨工序S80,該研磨工序S80係使利用溢流下拉法製造之玻璃板92之端面92a與旋轉之研磨漿料24接觸而進行研磨。含有作為磁性體研磨粒之研磨粒之研磨漿料24利用第1磁場形成構件22及第2磁場形成構件23所形成之磁場,而被保持於形成於磁通集中構件25之外周面之磁通集中槽26內側之磁通集中空間27。於磁通集中空間27,第1磁場形成構件22及第2磁場形成構件23所形成之磁場保持研磨漿料24之力因磁通集中構件25而增大。磁通集中構件25抑制自第1磁場形成構件22之第1上部磁場形成面22c朝上方流出之磁力線,於到達第2磁場形成構件23之第2下部磁場形成面23d 之前,漏出至研磨輪20周圍之空間。即,磁通集中構件25構成自第1上部磁場形成面22c朝第2下部磁場形成面23d流動之磁力線之磁路之一部分。磁通集中構件25藉由將該磁力線導引至磁通集中空間27,來抑制磁通集中空間27之磁通密度降低。因此,藉由將磁通集中構件25安裝於第1磁場形成構件22及第2磁場形成構件23,而具有增加磁通集中空間27之磁通密度之效果。 The manufacturing method of the glass plate of this embodiment includes a polishing step S80. The polishing step S80 is performed by contacting the end surface 92a of the glass plate 92 manufactured by the overflow down-draw method with the rotating polishing slurry 24 and polishing. The polishing slurry 24 containing abrasive grains as magnetic abrasive grains is held at a magnetic flux formed on the outer peripheral surface of the magnetic flux concentration member 25 by a magnetic field formed by the first magnetic field forming member 22 and the second magnetic field forming member 23. The magnetic flux concentration space 27 inside the concentration groove 26. In the magnetic flux concentration space 27, the force of the magnetic field holding polishing slurry 24 formed by the first magnetic field formation member 22 and the second magnetic field formation member 23 is increased by the magnetic flux concentration member 25. The magnetic flux concentration member 25 suppresses magnetic lines of force flowing upward from the first upper magnetic field forming surface 22c of the first magnetic field forming member 22, and reaches the second lower magnetic field forming surface 23d of the second magnetic field forming member 23 Previously, it leaked into the space around the grinding wheel 20. That is, the magnetic flux concentrating member 25 constitutes a part of the magnetic circuit of the magnetic field lines flowing from the first upper magnetic field forming surface 22c to the second lower magnetic field forming surface 23d. The magnetic flux concentration member 25 guides the magnetic flux lines to the magnetic flux concentration space 27 to suppress a decrease in the magnetic flux density of the magnetic flux concentration space 27. Therefore, mounting the magnetic flux concentration member 25 on the first magnetic field formation member 22 and the second magnetic field formation member 23 has the effect of increasing the magnetic flux density of the magnetic flux concentration space 27.

如此,磁通集中空間27係利用磁通集中構件25而磁通密度降低得到抑制之空間,因此,該磁通集中空間27係研磨漿料24之保持力較高之空間。保持研磨漿料24之研磨輪20、及玻璃板92之端面92a係沿搬送方向而相對移動,所以,研磨漿料24之保持力越高,於端面92a接觸研磨漿料24之情形時,研磨漿料24所含之研磨粒越難以移動。而且,研磨漿料24所含之研磨粒越難以移動,研磨粒對端面92a施加之壓力越高,因此,研磨輪20對玻璃板92之端面92a之研磨能力越高。因此,本實施形態之玻璃板之製造方法使用磁通集中構件25來增加對玻璃板92之端面92a進行研磨之研磨漿料24之保持力,藉此可提高玻璃板92之端面92a之研磨效率。又,本實施形態之玻璃板之製造方法能夠局部地提高磁通集中空間27之磁通密度,因此,即便連續地加工玻璃板92之端面92a,亦可抑制研磨漿料24自磁通集中槽26流出及分散。 As described above, the magnetic flux concentration space 27 is a space in which a decrease in magnetic flux density is suppressed by the magnetic flux concentration member 25. Therefore, the magnetic flux concentration space 27 is a space with a high holding force of the polishing slurry 24. The grinding wheel 20 holding the polishing slurry 24 and the end surface 92a of the glass plate 92 are relatively moved along the conveying direction. Therefore, the higher the holding force of the polishing slurry 24 is, the more polishing is performed when the end surface 92a contacts the polishing slurry 24. The more difficult it is to move the abrasive particles contained in the slurry 24. In addition, the more difficult it is to move the abrasive particles contained in the polishing slurry 24, the higher the pressure exerted by the abrasive particles on the end surface 92a, and therefore, the higher the grinding ability of the polishing wheel 20 to the end surface 92a of the glass plate 92. Therefore, the manufacturing method of the glass plate of this embodiment uses the magnetic flux concentration member 25 to increase the holding force of the polishing slurry 24 that grinds the end surface 92a of the glass plate 92, thereby improving the polishing efficiency of the end surface 92a of the glass plate 92 . In addition, the manufacturing method of the glass plate of this embodiment can locally increase the magnetic flux density of the magnetic flux concentration space 27. Therefore, even if the end surface 92a of the glass plate 92 is continuously processed, the polishing slurry 24 can be suppressed from the magnetic flux concentration groove. 26 outflow and dispersion.

其次,為了說明增加磁通集中空間27之磁通密度之磁通集中構件25之效果,而說明本實施形態之研磨輪20之兩個比較例。圖8係作為第1比較例之研磨輪120之剖視圖。圖9表示作為第1比較例之研磨輪120之剖視圖之一部分,且係表示研磨輪120所形成之磁場之圖。圖10係作為第2比較例之研磨輪220之剖視圖。圖11表示作為第2比較例之研磨輪220之剖視圖之一部分,且係表示研磨輪220所形成之磁場之圖。圖9及圖11中,省略了研磨漿料124、224及玻璃板92。再者,於圖9及圖11中,為了使磁力線醒目,省略了影線。 Next, in order to explain the effect of the magnetic flux concentration member 25 that increases the magnetic flux density of the magnetic flux concentration space 27, two comparative examples of the grinding wheel 20 of this embodiment will be described. FIG. 8 is a sectional view of the grinding wheel 120 as a first comparative example. FIG. 9 shows a part of a sectional view of the grinding wheel 120 as a first comparative example, and is a diagram showing a magnetic field formed by the grinding wheel 120. FIG. 10 is a cross-sectional view of a grinding wheel 220 as a second comparative example. FIG. 11 shows a part of a cross-sectional view of the grinding wheel 220 as a second comparative example, and is a diagram showing a magnetic field formed by the grinding wheel 220. In FIGS. 9 and 11, the polishing slurries 124 and 224 and the glass plate 92 are omitted. In addition, in FIGS. 9 and 11, hatching is omitted in order to make the magnetic field lines stand out.

於第1比較例中,研磨輪120主要具備旋轉軸121、第1磁場形成構件122、第2磁場形成構件123、研磨漿料124、及間隔件(spacer)125。旋轉軸121、第1磁場形成構件122、第2磁場形成構件123及研磨漿料124分別與本實施形態之旋轉軸21、第1磁場形成構件22、第2磁場形成構件23及研磨漿料24相同,因此省略說明。第1磁場形成構件122具有第1中心構件122a、及第1圓環狀磁鐵122b。第2磁場形成構件123具有第2中心構件123a、及第2圓環狀磁鐵123b。間隔件125係不鏽鋼鋼板,被夾在第1磁場形成構件122與第2磁場形成構件123之間,且被旋轉軸121貫通。間隔件125具有形成有被旋轉軸121貫通之孔之圓柱形狀。間隔件125之外周面較第1磁場形成構件122及第2磁場形成構件123之外周面更靠徑向內側。因此,研磨輪120具有第1磁場形成構件122與第2磁場形成構件123之間之縫隙即磁場形成槽126。磁場形成槽126係第1磁場形成構件122之第1圓環狀磁鐵122b、與第2磁場形成構件123之第2圓環狀磁鐵123b之間之空間。研磨漿料124被保持於磁場形成槽126之內側之槽空間127。 In the first comparative example, the polishing wheel 120 mainly includes a rotation shaft 121, a first magnetic field forming member 122, a second magnetic field forming member 123, a polishing slurry 124, and a spacer 125. The rotating shaft 121, the first magnetic field forming member 122, the second magnetic field forming member 123, and the polishing slurry 124 are respectively different from the rotating shaft 21, the first magnetic field forming member 22, the second magnetic field forming member 23, and the polishing slurry 24 of this embodiment. The description is the same, so the description is omitted. The first magnetic field forming member 122 includes a first center member 122a and a first ring-shaped magnet 122b. The second magnetic field forming member 123 includes a second center member 123a and a second ring-shaped magnet 123b. The spacer 125 is a stainless steel plate, which is sandwiched between the first magnetic field forming member 122 and the second magnetic field forming member 123 and is penetrated by the rotation shaft 121. The spacer 125 has a cylindrical shape formed with a hole penetrated by the rotation shaft 121. The outer peripheral surface of the spacer 125 is located radially inward of the outer peripheral surfaces of the first magnetic field forming member 122 and the second magnetic field forming member 123. Therefore, the polishing wheel 120 has a magnetic field forming groove 126 that is a gap between the first magnetic field forming member 122 and the second magnetic field forming member 123. The magnetic field forming groove 126 is a space between the first annular magnet 122b of the first magnetic field forming member 122 and the second annular magnet 123b of the second magnetic field forming member 123. The polishing slurry 124 is held in a groove space 127 inside the magnetic field forming groove 126.

如圖9所示,於第1比較例中,自第1圓環狀磁鐵122b之上表面朝上方流出之磁力線,通過第1磁場形成構件122及第2磁場形成構件123之徑向外側之空間,並到達第2圓環狀磁鐵123b之下表面。於槽空間127,自第2圓環狀磁鐵123b之上表面朝上方流出之磁力線朝向第1圓環狀磁鐵122b之下表面流動。 As shown in FIG. 9, in the first comparative example, the magnetic field lines flowing upward from the upper surface of the first ring-shaped magnet 122 b pass through the space radially outward of the first magnetic field forming member 122 and the second magnetic field forming member 123. And reach the lower surface of the second ring-shaped magnet 123b. In the slot space 127, magnetic lines of force flowing upward from the upper surface of the second annular magnet 123b flow toward the lower surface of the first annular magnet 122b.

如圖9所示,於第1比較例中,磁力線隔著第1磁場形成構件122及第2磁場形成構件123而流出至槽空間127之相反側之空間。因此,向該相反側之空間漏出之磁通變大,所以,槽空間127之磁通密度較小。因此,槽空間127之磁通密度較本實施形態之磁通集中空間27之磁通密度小。 As shown in FIG. 9, in the first comparative example, the magnetic field lines flow out to a space on the opposite side of the slot space 127 via the first magnetic field forming member 122 and the second magnetic field forming member 123. Therefore, the magnetic flux leaked into the space on the opposite side becomes large, and therefore, the magnetic flux density of the slot space 127 is small. Therefore, the magnetic flux density of the slot space 127 is smaller than the magnetic flux density of the magnetic flux concentration space 27 of this embodiment.

於第2比較例中,研磨輪220主要具備旋轉軸221、第1磁場形成構 件222、第2磁場形成構件223、及研磨漿料224。旋轉軸221及研磨漿料224分別與本實施形態之旋轉軸21及研磨漿料24相同,因此省略說明。第1磁場形成構件222具有第1中心構件222a、及第1圓環狀磁鐵222b。第2磁場形成構件223具有第2中心構件223a、及第2圓環狀磁鐵223b。第1圓環狀磁鐵222b具有自其外周面朝徑向內側向鉛垂方向下方傾斜之傾斜面。第2圓環狀磁鐵223b具有自其外周面朝徑向內側向鉛垂方向上方傾斜之傾斜面。第1圓環狀磁鐵222b及第2圓環狀磁鐵223b各自之傾斜面與本實施形態之第1傾斜面25f及第2傾斜面25h同樣地,形成作為V字型之槽之磁場形成槽226。磁場形成槽226係第1圓環狀磁鐵222b與第2圓環狀磁鐵223b之間之空間。研磨漿料224被保持於作為磁場形成槽226內側之空間之槽空間227。 In the second comparative example, the grinding wheel 220 mainly includes a rotating shaft 221 and a first magnetic field forming mechanism. The material 222, the second magnetic field forming member 223, and the polishing slurry 224. The rotation shaft 221 and the polishing slurry 224 are the same as the rotation shaft 21 and the polishing slurry 24 in this embodiment, respectively, and therefore description thereof is omitted. The first magnetic field forming member 222 includes a first center member 222a and a first ring-shaped magnet 222b. The second magnetic field forming member 223 includes a second center member 223a and a second ring-shaped magnet 223b. The first ring-shaped magnet 222b has an inclined surface inclined downward from the outer peripheral surface toward the inside in the radial direction and downward in the vertical direction. The second ring-shaped magnet 223b has an inclined surface that is inclined upward in the vertical direction from the outer peripheral surface toward the radially inner side. The inclined surfaces of the first annular magnet 222b and the second annular magnet 223b are the same as the first inclined surface 25f and the second inclined surface 25h of this embodiment, and a magnetic field forming groove 226 is formed as a V-shaped groove. . The magnetic field forming groove 226 is a space between the first annular magnet 222b and the second annular magnet 223b. The polishing slurry 224 is held in a groove space 227 which is a space inside the magnetic field forming groove 226.

如圖11所示,於第2比較例中,自第1圓環狀磁鐵222b之上表面朝上方流出之磁力線,通過第1磁場形成構件222及第2磁場形成構件223之徑向外側之空間,並到達第2圓環狀磁鐵223b之下表面。於槽空間227,自第2圓環狀磁鐵223b之上表面朝上方流出之磁力線朝向第1圓環狀磁鐵222b之下表面流動。 As shown in FIG. 11, in the second comparative example, the magnetic field lines flowing upward from the upper surface of the first ring-shaped magnet 222 b pass through the space radially outward of the first magnetic field forming member 222 and the second magnetic field forming member 223. And reach the lower surface of the second ring-shaped magnet 223b. In the slot space 227, magnetic lines of force flowing upward from the upper surface of the second annular magnet 223b flow toward the lower surface of the first annular magnet 222b.

如圖11所示,於第2比較例中,磁力線隔著第1磁場形成構件222及第2磁場形成構件223而流出至槽空間227之相反側之空間。因此,漏出至該相反側之空間之磁通變大,所以槽空間227之磁通密度較小。因此,槽空間227之磁通密度較本實施形態之磁通集中空間27之磁通密度小。 As shown in FIG. 11, in the second comparative example, the magnetic field lines flow out to a space on the opposite side of the slot space 227 via the first magnetic field forming member 222 and the second magnetic field forming member 223. Therefore, the magnetic flux leaking to the space on the opposite side becomes large, so the magnetic flux density of the slot space 227 is small. Therefore, the magnetic flux density of the slot space 227 is smaller than the magnetic flux density of the magnetic flux concentration space 27 of this embodiment.

根據以上說明,第1比較例及第2比較例之、未被強磁性體覆蓋之研磨輪120、220與本實施形態之研磨輪20相比,研磨漿料24保持之空間之磁通密度較低,研磨漿料24之保持力較小。於本實施形態中,為了增加研磨漿料24保持之磁通集中空間27之至少一部分之磁通密度,而設置有磁通集中構件25。因此,本實施形態之研磨裝置10使用作為 強磁性體之磁通集中構件25,來增加對玻璃板92之端面92a進行研磨之研磨漿料24之保持力,藉此可提高玻璃板92之端面92a之研磨效率。 According to the above description, compared with the grinding wheels 20 of this embodiment, the grinding wheels 120 and 220 of the first and second comparative examples that are not covered by a ferromagnetic body have a higher magnetic flux density in the space held by the grinding slurry 24. Low, the holding force of the polishing slurry 24 is small. In this embodiment, a magnetic flux concentration member 25 is provided in order to increase the magnetic flux density of at least a part of the magnetic flux concentration space 27 held by the polishing slurry 24. Therefore, the polishing apparatus 10 of this embodiment is used as The magnetic flux concentration member 25 of the ferromagnetic body increases the holding force of the polishing slurry 24 that polishes the end surface 92a of the glass plate 92, thereby improving the polishing efficiency of the end surface 92a of the glass plate 92.

(4)變化例 (4) Variations

以上,對本實施形態之玻璃板之製造方法進行了說明,但本發明並不限定於上述實施形態,於不脫離本發明之主旨之範圍內,可以實施各種改良及變更。 As mentioned above, although the manufacturing method of the glass plate of this embodiment was demonstrated, this invention is not limited to the said embodiment, Various improvement and change can be implemented in the range which does not deviate from the meaning of this invention.

(4-1)變化例A (4-1) Modification A

如圖5所示,本實施形態之磁通集中構件25包括上部集中構件25a、下部集中構件25b、第1側部集中構件25c、及第2側部集中構件25d。但,磁通集中構件25亦可不具有上部集中構件25a及下部集中構件25b。 As shown in FIG. 5, the magnetic flux concentration member 25 of this embodiment includes an upper concentration member 25 a, a lower concentration member 25 b, a first side concentration member 25 c, and a second side concentration member 25 d. However, the magnetic flux concentration member 25 may not include the upper concentration member 25a and the lower concentration member 25b.

圖12係本變化例之研磨輪320之剖視圖。圖13係研磨輪320之剖視圖之一部分,且係表示研磨輪320所形成之磁場之圖。於圖13中,省略了研磨漿料324及玻璃板92。再者,於圖13中,為了使磁力線醒目,而省略了影線。 FIG. 12 is a cross-sectional view of a grinding wheel 320 according to this modification. FIG. 13 is a part of a sectional view of the grinding wheel 320, and is a diagram showing a magnetic field formed by the grinding wheel 320. In FIG. 13, the polishing slurry 324 and the glass plate 92 are omitted. Note that in FIG. 13, hatching is omitted in order to make the magnetic field lines stand out.

於本變化例中,研磨輪320主要具備旋轉軸321、第1磁場形成構件322、第2磁場形成構件323、研磨漿料324、及磁通集中構件325。旋轉軸321、第1磁場形成構件322、第2磁場形成構件323及研磨漿料324分別與本實施形態之旋轉軸21、第1磁場形成構件22、第2磁場形成構件23及研磨漿料24相同,因此省略說明。第1磁場形成構件322具有第1中心構件322a、及第1圓環狀磁鐵322b。第2磁場形成構件323具有第2中心構件323a、及第2圓環狀磁鐵323b。磁通集中構件325包括第1側部集中構件325c、及第2側部集中構件325d。即,磁通集中構件325具有自本實施形態之磁通集中構件25中除去上部集中構件25a及下部集中構件25b後之構成。如圖12所示,磁通集中構件325具有作為形成於外周面之V字型之槽之磁場形成槽326。研磨漿料324被保持於作為磁場 形成槽326內側之空間之磁通集中空間327。 In this modification, the grinding wheel 320 mainly includes a rotation shaft 321, a first magnetic field forming member 322, a second magnetic field forming member 323, a polishing slurry 324, and a magnetic flux concentration member 325. The rotating shaft 321, the first magnetic field forming member 322, the second magnetic field forming member 323, and the polishing slurry 324 are respectively different from the rotating shaft 21, the first magnetic field forming member 22, the second magnetic field forming member 23, and the polishing slurry 24 of this embodiment. The description is the same, so the description is omitted. The first magnetic field forming member 322 includes a first center member 322a and a first ring-shaped magnet 322b. The second magnetic field forming member 323 includes a second center member 323a and a second ring-shaped magnet 323b. The magnetic flux concentration member 325 includes a first side concentration member 325c and a second side concentration member 325d. That is, the magnetic flux concentrating member 325 has a configuration in which the upper concentrating member 25a and the lower concentrating member 25b are removed from the magnetic flux concentrating member 25 of this embodiment. As shown in FIG. 12, the magnetic flux concentration member 325 includes a magnetic field forming groove 326 that is a V-shaped groove formed on the outer peripheral surface. The polishing slurry 324 is held as a magnetic field A magnetic flux concentration space 327 is formed in a space inside the groove 326.

如圖13所示,於本變化例中,自第1圓環狀磁鐵322b之上表面向上方流出之磁力線之一部分,依次通過第1側部集中構件325c、磁通集中空間327及第2側部集中構件325d,並到達第2圓環狀磁鐵323b之下表面。通過磁通集中空間327之磁力線,會通過作為覆蓋研磨輪320之一部分之強磁性體之磁通集中構件325。因此,磁通集中構件325將自第1圓環狀磁鐵322b之上表面朝第2圓環狀磁鐵323b之下表面流動之磁力線導引至磁通集中空間327,所以,磁通集中空間327之磁通密度變大。即,藉由將磁通集中構件325安裝於第1磁場形成構件322及第2磁場形成構件323,具有增加磁通集中空間327之磁通密度,並增加磁通集中空間327對研磨漿料324之保持力之效果。 As shown in FIG. 13, in this modification, a part of the magnetic field lines flowing upward from the upper surface of the first annular magnet 322 b passes through the first side concentrated member 325 c, the magnetic flux concentrated space 327, and the second side in this order. The part concentrating member 325d reaches the lower surface of the second ring-shaped magnet 323b. The magnetic field lines passing through the magnetic flux concentration space 327 pass through the magnetic flux concentration member 325 which is a ferromagnetic body covering a part of the grinding wheel 320. Therefore, the magnetic flux concentration member 325 guides the magnetic flux lines flowing from the upper surface of the first annular magnet 322b to the lower surface of the second annular magnet 323b to the magnetic flux concentration space 327. Therefore, the magnetic flux concentration space 327 The magnetic flux density becomes larger. That is, by attaching the magnetic flux concentration member 325 to the first magnetic field formation member 322 and the second magnetic field formation member 323, the magnetic flux concentration space 327 is increased, and the magnetic flux concentration space 327 is added to the polishing slurry 324. Effect of holding power.

因此,本變化例之玻璃板之製造方法使用磁通集中構件325來增加對玻璃板92之端面92a進行研磨之研磨漿料324之保持力,藉此可提高玻璃板92之端面92a之研磨效率。 Therefore, the manufacturing method of the glass plate of this modification uses the magnetic flux concentration member 325 to increase the holding force of the polishing slurry 324 that grinds the end surface 92a of the glass plate 92, thereby improving the polishing efficiency of the end surface 92a of the glass plate 92 .

(4-2)變化例B (4-2) Modification B

如圖5所示,本實施形態之磁通集中構件25包括上部集中構件25a、下部集中構件25b、第1側部集中構件25c、及第2側部集中構件25d。但,磁通集中構件25亦可更具有間隔件,該間隔件被夾在第1磁場形成構件22與第2磁場形成構件23之間。 As shown in FIG. 5, the magnetic flux concentration member 25 of this embodiment includes an upper concentration member 25 a, a lower concentration member 25 b, a first side concentration member 25 c, and a second side concentration member 25 d. However, the magnetic flux concentration member 25 may further include a spacer which is sandwiched between the first magnetic field forming member 22 and the second magnetic field forming member 23.

圖14係本變化例之研磨輪420之剖視圖。圖15係研磨輪420之剖視圖之一部分。圖16係研磨輪420之剖視圖之一部分,且係表示研磨輪420所形成之磁場之圖。於圖15及圖16中,省略了研磨漿料424及玻璃板92。再者,於圖16中,為了使磁力線醒目,而省略了影線。 FIG. 14 is a sectional view of a grinding wheel 420 according to this modification. FIG. 15 is a part of a sectional view of the grinding wheel 420. FIG. 16 is a part of a sectional view of the grinding wheel 420, and is a diagram showing a magnetic field formed by the grinding wheel 420. In FIGS. 15 and 16, the polishing slurry 424 and the glass plate 92 are omitted. Note that in FIG. 16, hatching is omitted in order to make the magnetic field lines stand out.

於本變化例中,研磨輪420主要具備旋轉軸421、第1磁場形成構件422、第2磁場形成構件423、研磨漿料424、及磁通集中構件425。旋轉軸421及研磨漿料424分別與本實施形態之旋轉軸21及研磨漿料24相 同,因此省略說明。第1磁場形成構件422具有第1中心構件422a、及第1圓環狀磁鐵422b。第2磁場形成構件423具有第2中心構件423a、及第2圓環狀磁鐵423b。磁通集中構件425包括上部集中構件425a、下部集中構件425b、第1側部集中構件425c、及第2側部集中構件425d。磁通集中構件425在第1側部集中構件425c與第2側部集中構件425d之間具有中間構件425e。中間構件425e係不鏽鋼等鋼板,被夾在第1磁場形成構件422與第2磁場形成構件423之間,且被旋轉軸421貫通。中間構件425e具有形成有被旋轉軸421貫通之孔之圓柱形狀。中間構件425e之外周面在徑向上位於與第1磁場形成構件422及第2磁場形成構件423之外周面相同之位置上。再者,位於第1側部集中構件425c與第2側部集中構件425d之間之中間構件425e較佳為強磁性體,亦可與第1側部集中構件425c及第2側部集中構件425d之至少一個一體成形。 In this modification, the grinding wheel 420 mainly includes a rotation shaft 421, a first magnetic field forming member 422, a second magnetic field forming member 423, a polishing slurry 424, and a magnetic flux concentration member 425. The rotation shaft 421 and the polishing slurry 424 are in phase with the rotation shaft 21 and the polishing slurry 24 of this embodiment, respectively. The description is omitted here. The first magnetic field forming member 422 includes a first center member 422a and a first ring-shaped magnet 422b. The second magnetic field forming member 423 includes a second center member 423a and a second ring-shaped magnet 423b. The magnetic flux concentration member 425 includes an upper concentration member 425a, a lower concentration member 425b, a first side concentration member 425c, and a second side concentration member 425d. The magnetic flux concentration member 425 includes an intermediate member 425e between the first side concentration member 425c and the second side concentration member 425d. The intermediate member 425e is a steel plate such as stainless steel, is sandwiched between the first magnetic field forming member 422 and the second magnetic field forming member 423, and is penetrated by the rotation shaft 421. The intermediate member 425e has a cylindrical shape in which a hole penetrated by the rotation shaft 421 is formed. The outer peripheral surface of the intermediate member 425e is located at the same position as the outer peripheral surfaces of the first magnetic field forming member 422 and the second magnetic field forming member 423 in the radial direction. Furthermore, the intermediate member 425e located between the first side concentrated member 425c and the second side concentrated member 425d is preferably a ferromagnetic body, and may also be the first side concentrated member 425c and the second side concentrated member 425d At least one of them is integrally formed.

第1側部集中構件425c具有第1側面425f、及第1傾斜面425g。第1側面425f係第1側部集中構件425c之外周面。第1傾斜面425g係自第1側面425f之下端朝向徑向內側而向鉛垂方向下方傾斜之平面。第1傾斜面425g之最靠徑向內側之點和中間構件425e之外周面之上端與下端之間之中間的點一致。 The first side concentrated member 425c has a first side surface 425f and a first inclined surface 425g. The first side surface 425f is an outer peripheral surface of the first side concentrated member 425c. The first inclined surface 425g is a plane inclined downward in the vertical direction from the lower end of the first side surface 425f toward the radially inner side. The point on the radially innermost side of the first inclined surface 425g coincides with the middle point between the upper end and the lower end of the outer peripheral surface of the intermediate member 425e.

第2側部集中構件425d具有第2側面425h、及第2傾斜面425i。第2側面425h係第2側部集中構件425d之外周面。第2傾斜面425i係自第2側面425h之上端朝徑向內側而向鉛垂方向上方傾斜之平面。第2傾斜面425i之最靠徑向內側之點和中間構件425e之外周面之上端與下端之間之中間的點一致。 The second side concentrated member 425d has a second side surface 425h and a second inclined surface 425i. The second side surface 425h is an outer peripheral surface of the second side concentrated member 425d. The second inclined surface 425i is a plane inclined upward in the vertical direction from the upper end of the second side surface 425h toward the radially inner side. The point on the radially innermost side of the second inclined surface 425i coincides with the middle point between the upper end and the lower end of the outer peripheral surface of the intermediate member 425e.

第1側部集中構件425c之第1傾斜面425g之最靠徑向內側之點與第2側部集中構件425d之第2傾斜面425i之最靠徑向內側之點一致。結果,如圖15所示,於磁通集中構件425之外周面形成作為V字型之槽之磁通集中槽426。研磨漿料424被保持於作為磁場形成槽426內側之空間 之磁通集中空間427。 The point radially inward of the first inclined surface 425g of the first side concentrated member 425c coincides with the point radially inward of the second inclined surface 425i of the second side concentrated member 425d. As a result, as shown in FIG. 15, a magnetic flux concentration groove 426 is formed as a V-shaped groove on the outer peripheral surface of the magnetic flux concentration member 425. The polishing slurry 424 is held in a space inside the magnetic field forming groove 426. The magnetic flux concentration space 427.

如圖16所示,於本變化例中,自第1圓環狀磁鐵422b之上表面朝上方流出之磁力線之一部分,依次通過上部集中構件425a、第1側部集中構件425c、磁通集中空間427、第2側部集中構件425d及下部集中構件425b,並到達第2圓環狀磁鐵423b之下表面。又,自第2圓環狀磁鐵423b之上表面朝上方流出之磁力線通過中間構件425e,並到達第1圓環狀磁鐵422b之下表面。通過磁通集中空間427之磁力線,會通過作為覆蓋研磨輪420之強磁性體之磁通集中構件425。因此,磁通集中構件425設為形成自第1圓環狀磁鐵422b之上表面朝第2圓環狀磁鐵423b之下表面流動之磁力線之磁路。磁通集中構件425藉由將該磁力線導引至磁通集中空間427,而增加磁通集中空間427之磁通密度。即,藉由將磁通集中構件425安裝於第1磁場形成構件422及第2磁場形成構件423,而具有增加磁通集中空間427之磁通密度,並增加磁通集中空間427對研磨漿料424之保持力之效果。 As shown in FIG. 16, in this modification, a part of the magnetic field lines flowing upward from the upper surface of the first ring-shaped magnet 422 b passes through the upper concentrated member 425 a, the first side concentrated member 425 c, and the magnetic flux concentration space in this order. 427. The second side concentrated member 425d and the lower concentrated member 425b reach the lower surface of the second annular magnet 423b. Further, the magnetic field lines flowing upward from the upper surface of the second annular magnet 423b pass through the intermediate member 425e and reach the lower surface of the first annular magnet 422b. The magnetic field lines passing through the magnetic flux concentration space 427 pass through the magnetic flux concentration member 425 as a ferromagnetic body covering the grinding wheel 420. Therefore, the magnetic flux concentrating member 425 is formed as a magnetic circuit of magnetic lines of force flowing from the upper surface of the first annular magnet 422b to the lower surface of the second annular magnet 423b. The magnetic flux concentration member 425 guides the magnetic flux lines to the magnetic flux concentration space 427 to increase the magnetic flux density of the magnetic flux concentration space 427. That is, by attaching the magnetic flux concentration member 425 to the first magnetic field formation member 422 and the second magnetic field formation member 423, the magnetic flux density of the magnetic flux concentration space 427 is increased, and the magnetic flux concentration space 427 is added to the polishing slurry. Effect of holding power of 424.

因此,本變化例之玻璃板之製造方法使用磁通集中構件425來增加對玻璃板92之端面92a進行研磨之研磨漿料424之保持力,藉此可提高玻璃板92之端面92a之研磨效率。 Therefore, the manufacturing method of the glass plate of this modification uses the magnetic flux concentration member 425 to increase the holding force of the polishing slurry 424 that grinds the end surface 92a of the glass plate 92, thereby improving the polishing efficiency of the end surface 92a of the glass plate 92 .

(4-3)變化例C (4-3) Modification C

如圖5所示,本實施形態之磁通集中構件25包括上部集中構件25a、下部集中構件25b、第1側部集中構件25c、及第2側部集中構件25d。但,磁通集中構件25亦可更具有被第1磁場形成構件22與第2磁場形成構件23夾著之間隔件,且不具有上部集中構件25a及下部集中構件25b。 As shown in FIG. 5, the magnetic flux concentration member 25 of this embodiment includes an upper concentration member 25 a, a lower concentration member 25 b, a first side concentration member 25 c, and a second side concentration member 25 d. However, the magnetic flux concentration member 25 may further include a spacer sandwiched between the first magnetic field forming member 22 and the second magnetic field forming member 23, and may not include the upper concentrated member 25a and the lower concentrated member 25b.

圖17係本變化例之研磨輪520之剖視圖。圖18係研磨輪520之剖視圖之一部分。圖19係研磨輪520之剖視圖之一部分,且係表示研磨輪520所形成之磁場之圖。於圖18及圖19中,省略了研磨漿料524及玻璃板 92。再者,於圖19中,為了使磁力線醒目,而省略了影線。研磨輪520具有使變化例A之研磨輪320、與變化例B之研磨輪420組合而成之構成。 FIG. 17 is a sectional view of a grinding wheel 520 according to this modification. FIG. 18 is a part of a sectional view of the grinding wheel 520. FIG. 19 is a part of a sectional view of the grinding wheel 520, and is a diagram showing a magnetic field formed by the grinding wheel 520. In FIGS. 18 and 19, the polishing slurry 524 and the glass plate are omitted. 92. Note that in FIG. 19, hatching is omitted to make the magnetic field lines stand out. The polishing wheel 520 has a configuration in which the polishing wheel 320 of the modified example A and the polishing wheel 420 of the modified example B are combined.

於本變化例中,研磨輪520主要具備旋轉軸521、第1磁場形成構件522、第2磁場形成構件523、研磨漿料524、及磁通集中構件525。旋轉軸521及研磨漿料524分別與本實施形態之旋轉軸21及研磨漿料24相同,因此省略說明。第1磁場形成構件522具有第1中心構件522a、及第1圓環狀磁鐵522b。第2磁場形成構件523具有第2中心構件523a、及第2圓環狀磁鐵523b。磁通集中構件525包括第1側部集中構件525c、及第2側部集中構件525d。即,磁通集中構件525具有如下構成:在本實施形態之磁通集中構件25上追加中間構件525e,且除去上部集中構件25a及下部集中構件25b。中間構件525e係不鏽鋼等鋼板,被夾在第1磁場形成構件522與第2磁場形成構件523之間,且被旋轉軸521貫通。中間構件525e具有形成有被旋轉軸521貫通之孔之圓柱形狀。中間構件525e之外周面在徑向上位於與第1磁場形成構件522及第2磁場形成構件523之外周面相同之位置上。再者,位於第1側部集中構件525c與第2側部集中構件525d之間之中間構件525e較佳為強磁性體,亦可與第1側部集中構件525c及第2側部集中構件525d之至少一個一體成形。 In this modification, the grinding wheel 520 mainly includes a rotation shaft 521, a first magnetic field forming member 522, a second magnetic field forming member 523, a polishing slurry 524, and a magnetic flux concentration member 525. The rotation shaft 521 and the polishing slurry 524 are respectively the same as the rotation shaft 21 and the polishing slurry 24 in this embodiment, and therefore descriptions thereof are omitted. The first magnetic field forming member 522 includes a first center member 522a and a first ring-shaped magnet 522b. The second magnetic field forming member 523 includes a second center member 523a and a second ring-shaped magnet 523b. The magnetic flux concentration member 525 includes a first side concentration member 525c and a second side concentration member 525d. That is, the magnetic flux concentrating member 525 has a configuration in which an intermediate member 525e is added to the magnetic flux concentrating member 25 of this embodiment, and the upper and lower concentrating members 25a and 25b are removed. The intermediate member 525e is a steel plate such as stainless steel, is sandwiched between the first magnetic field forming member 522 and the second magnetic field forming member 523, and is penetrated by the rotation shaft 521. The intermediate member 525e has a cylindrical shape in which a hole penetrated by the rotation shaft 521 is formed. The outer peripheral surface of the intermediate member 525e is located at the same position as the outer peripheral surfaces of the first magnetic field forming member 522 and the second magnetic field forming member 523 in the radial direction. Furthermore, the intermediate member 525e located between the first side concentrated member 525c and the second side concentrated member 525d is preferably a ferromagnetic body, and may be the same as the first side concentrated member 525c and the second side concentrated member 525d. At least one of them is integrally formed.

第1側部集中構件525c具有第1側面525f、及第1傾斜面525g。第1側面525f係第1側部集中構件525c之外周面。第1傾斜面525g係自第1側面525f之下端朝徑向內側而向鉛垂方向下方傾斜之平面。第1傾斜面525g之最靠徑向內側之點和中間構件525e之外周面之上端與下端之中間的點一致。 The first side concentrated member 525c has a first side surface 525f and a first inclined surface 525g. The first side surface 525f is an outer peripheral surface of the first side concentrated member 525c. The first inclined surface 525g is a plane inclined downward from the lower end of the first side surface 525f toward the inside in the radial direction and downward in the vertical direction. The point on the radially innermost side of the first inclined surface 525g coincides with the point between the upper end and the lower end of the outer peripheral surface of the intermediate member 525e.

第2側部集中構件525d具有第2側面525h、及第2傾斜面525i。第2側面525h係第2側部集中構件525d之外周面。第2傾斜面525i係自第2側面525h之上端朝徑向內側而向鉛垂方向上方傾斜之平面。第2傾斜面 525i之最靠徑向內側之點和中間構件525e之外周面之上端與下端之中間的點一致。 The second side concentrated member 525d has a second side surface 525h and a second inclined surface 525i. The second side surface 525h is an outer peripheral surface of the second side concentrated member 525d. The second inclined surface 525i is a plane inclined upward in the vertical direction from the upper end of the second side surface 525h toward the radially inner side. 2nd inclined surface The point on the radially innermost side of 525i coincides with the point between the upper end and the lower end of the outer peripheral surface of the intermediate member 525e.

第1側部集中構件525c之第1傾斜面525g之最靠徑向內側之點與第2側部集中構件525d之第2傾斜面525i之最靠徑向內側之點一致。結果,如圖18所示,於磁通集中構件525之外周面形成作為V字型之槽之磁通集中槽526。研磨漿料524被保持於作為磁場形成槽526內側之空間之磁通集中空間527。 The point on the radially innermost side of the first inclined surface 525g of the first side concentrated member 525c coincides with the point on the radially innermost side of the second inclined surface 525i of the second side concentrated member 525d. As a result, as shown in FIG. 18, a magnetic flux concentration groove 526 is formed as a V-shaped groove on the outer peripheral surface of the magnetic flux concentration member 525. The polishing slurry 524 is held in a magnetic flux concentration space 527 which is a space inside the magnetic field forming groove 526.

如圖19所示,於本變化例中,自第1圓環狀磁鐵522b之上表面朝上方流出之磁力線之一部分,依次通過第1側部集中構件525c、磁通集中空間527及第2側部集中構件525d,並到達第2圓環狀磁鐵523b之下表面。又,自第2圓環狀磁鐵523b之上表面朝上方流出之磁力線通過中間構件525e,並到達第1圓環狀磁鐵522b之下表面。通過磁通集中空間527之磁力線,會通過作為覆蓋研磨輪520之一部分之強磁性體之磁通集中構件525。因此,磁通集中構件525設為形成自第1圓環狀磁鐵522b之上表面朝第2圓環狀磁鐵523b之下表面流動之磁力線之磁路。磁通集中構件525藉由將該磁力線導引至磁通集中空間527,而增加磁通集中空間527之磁通密度。即,藉由將磁通集中構件525安裝於第1磁場形成構件522及第2磁場形成構件523,而具有增加磁通集中空間527之磁通密度,並增加磁通集中空間527對研磨漿料524之保持力之效果。 As shown in FIG. 19, in this modification, a part of the magnetic field lines flowing upward from the upper surface of the first annular magnet 522b passes through the first side concentrated member 525c, the magnetic flux concentrated space 527, and the second side in this order. The part concentrating member 525d reaches the lower surface of the second ring-shaped magnet 523b. Furthermore, the magnetic field lines flowing upward from the upper surface of the second annular magnet 523b pass through the intermediate member 525e and reach the lower surface of the first annular magnet 522b. The magnetic field lines passing through the magnetic flux concentration space 527 pass through the magnetic flux concentration member 525 which is a ferromagnetic body covering a part of the grinding wheel 520. Therefore, the magnetic flux concentrating member 525 is formed as a magnetic circuit of magnetic lines of force flowing from the upper surface of the first annular magnet 522b to the lower surface of the second annular magnet 523b. The magnetic flux concentration member 525 increases the magnetic flux density of the magnetic flux concentration space 527 by guiding the magnetic field lines to the magnetic flux concentration space 527. That is, by mounting the magnetic flux concentration member 525 on the first magnetic field formation member 522 and the second magnetic field formation member 523, the magnetic flux concentration of the magnetic flux concentration space 527 is increased, and the magnetic flux concentration space 527 is added to the polishing slurry Effect of holding power of 524.

因此,本變化例之玻璃板之製造方法使用磁通集中構件525來提高對玻璃板92之端面92a進行研磨之研磨漿料524之保持力,藉此可提高玻璃板92之端面92a之研磨效率。 Therefore, the manufacturing method of the glass plate of this modification uses the magnetic flux concentrating member 525 to improve the holding force of the polishing slurry 524 for polishing the end surface 92a of the glass plate 92, thereby improving the polishing efficiency of the end surface 92a of the glass plate 92 .

(4-4)變化例D (4-4) Modification D

本實施形態之磁通集中構件25具有上部集中構件25a、及下部集中構件25b。如圖5所示,上部集中構件25a覆蓋第1中心構件22a之上表面、及第1圓環狀磁鐵22b之上表面兩者,且下部集中構件25b覆蓋第2 中心構件23a之下表面、及第2圓環狀磁鐵23b之下表面兩者。但,上部集中構件25a亦可不覆蓋第1中心構件22a之上表面,且下部集中構件25b亦可不覆蓋第2中心構件23a之下表面。 The magnetic flux concentration member 25 of this embodiment includes an upper concentration member 25a and a lower concentration member 25b. As shown in FIG. 5, the upper concentrated member 25a covers both the upper surface of the first center member 22a and the upper surface of the first ring-shaped magnet 22b, and the lower concentrated member 25b covers the second Both the lower surface of the center member 23a and the lower surface of the second annular magnet 23b. However, the upper concentrated member 25a may not cover the upper surface of the first center member 22a, and the lower concentrated member 25b may not cover the lower surface of the second center member 23a.

圖20係本變化例之研磨輪20之剖視圖。於圖20中,除了上部集中構件25a及下部集中構件25b以外之構成要素與本實施形態相同。上部集中構件25a只覆蓋第1磁場形成構件22之第1圓環狀磁鐵22b之上表面、及第1側部集中構件25c之上表面。下部集中構件25b只覆蓋第2磁場形成構件23之第2圓環狀磁鐵23b之下表面、及第2側部集中構件25d之下表面。 FIG. 20 is a cross-sectional view of a grinding wheel 20 according to this modification. In FIG. 20, the constituent elements other than the upper concentrated member 25a and the lower concentrated member 25b are the same as the present embodiment. The upper concentrated member 25a covers only the upper surface of the first ring-shaped magnet 22b of the first magnetic field forming member 22 and the upper surface of the first side concentrated member 25c. The lower concentrated member 25b covers only the lower surface of the second ring-shaped magnet 23b of the second magnetic field forming member 23 and the lower surface of the second side concentrated member 25d.

於本變化例中,與本實施形態之圖6同樣地,通過磁通集中空間27之磁力線,會通過作為覆蓋研磨輪20之一部分之強磁性體之磁通集中構件25。因此,藉由將磁通集中構件25安裝於第1磁場形成構件22及第2磁場形成構件23,而具有增加磁通集中空間27之磁通密度,並增加磁通集中空間27對研磨漿料24之保持力之效果。 In this modification, as in FIG. 6 of the present embodiment, the magnetic field lines passing through the magnetic flux concentration space 27 pass through the magnetic flux concentration member 25 that is a ferromagnetic body covering a part of the grinding wheel 20. Therefore, by mounting the magnetic flux concentration member 25 on the first magnetic field formation member 22 and the second magnetic field formation member 23, the magnetic flux density of the magnetic flux concentration space 27 is increased, and the magnetic flux concentration space 27 is increased to the polishing slurry. 24 retention effect.

因此,本變化例之玻璃板之製造方法使用磁通集中構件25來提高對玻璃板92之端面92a進行研磨之研磨漿料24之保持力,藉此可提高玻璃板92之端面92a之研磨效率。 Therefore, the manufacturing method of the glass plate of this modification uses the magnetic flux concentrating member 25 to improve the holding force of the polishing slurry 24 that grinds the end surface 92a of the glass plate 92, thereby improving the polishing efficiency of the end surface 92a of the glass plate 92 .

再者,可將本變化例之上部集中構件25a及下部集中構件25b應用於變化例A~C。 Furthermore, the upper concentrated member 25a and the lower concentrated member 25b of this modification can be applied to the modifications A to C.

又,第1中心構件22a及第2中心構件23a亦可為一體構件,第1圓環狀磁鐵22b及第2圓環狀磁鐵23b亦可為一體構件。 The first center member 22a and the second center member 23a may be integrated members, and the first ring-shaped magnet 22b and the second ring-shaped magnet 23b may be integrated members.

(4-5)變化例E (4-5) Modification E

本實施形態之磁通集中構件25具有第1側部集中構件25c、及第2側部集中構件25d。於磁通集中構件25之外周面,形成有作為V字型之槽之磁通集中槽26。但,亦可於磁通集中構件25之外周面,形成V字型以外之形狀之槽。 The magnetic flux concentrating member 25 of this embodiment includes a first side concentrated member 25c and a second side concentrated member 25d. A magnetic flux concentration groove 26 is formed on the outer peripheral surface of the magnetic flux concentration member 25 as a V-shaped groove. However, a groove other than a V-shape may be formed on the outer peripheral surface of the magnetic flux concentration member 25.

圖21相當於本實施形態之圖6,係本變化例之研磨輪20之剖視圖之一部分。於圖21中,除了第1側部集中構件25c及第2側部集中構件25d以外之構成要素與本實施形態相同。 FIG. 21 corresponds to FIG. 6 in this embodiment, and is a part of a cross-sectional view of the grinding wheel 20 in this modification. In FIG. 21, the components other than the first side concentrated member 25c and the second side concentrated member 25d are the same as those of the present embodiment.

第1側部集中構件25c具有第1側面25e、及第1彎曲面25f。第1側面25e係第1側部集中構件25c之外周面。第1彎曲面25f係自第1側面25e之下端朝徑向內側而向鉛垂方向下方彎曲之面。第1彎曲面25f之最靠徑向內側之點與第1磁場形成構件22之外周面之下端一致。 The first side concentrated member 25c includes a first side surface 25e and a first curved surface 25f. The first side surface 25e is the outer peripheral surface of the first side concentrated member 25c. The first curved surface 25f is a surface curved downward from the lower end of the first side surface 25e toward the inside in the radial direction and downward in the vertical direction. The point on the radially innermost side of the first curved surface 25f coincides with the lower end of the outer peripheral surface of the first magnetic field forming member 22.

第2側部集中構件25d具有第2側面25g、及第2彎曲面25h。第2側面25g係第2側部集中構件25d之外周面。第2彎曲面25h係自第2側面25g之上端朝徑向內側向鉛垂方向上方彎曲之面。第2彎曲面25h之最靠徑向內側之點與第2磁場形成構件23之外周面之上端一致。 The second side concentrated member 25d has a second side surface 25g and a second curved surface 25h. The second side surface 25g is an outer peripheral surface of the second side portion concentrating member 25d. The second curved surface 25h is a surface that is curved upward from the upper end of the second side surface 25g toward the inside in the radial direction and upward in the vertical direction. The point on the radially innermost side of the second curved surface 25h coincides with the upper end of the outer peripheral surface of the second magnetic field forming member 23.

如圖21所示,第1側部集中構件25c之第1彎曲面25f之最靠徑向內側之點與第2側部集中構件25d之第2彎曲面25h之最靠徑向內側之點一致。結果,如圖21所示,於磁通集中構件25之外周面,形成有磁通集中槽26。磁通集中槽26係包括第1彎曲面25f及第2彎曲面25h之槽。作為磁通集中槽26內側之空間之磁通集中空間27係保持研磨漿料24之空間。 As shown in FIG. 21, the point closest to the radially inner side of the first curved surface 25f of the first side concentrated member 25c coincides with the point closest to the radially inner side of the second curved surface 25h of the second side concentrated member 25d. . As a result, as shown in FIG. 21, a magnetic flux concentration groove 26 is formed on the outer peripheral surface of the magnetic flux concentration member 25. The magnetic flux concentration groove 26 is a groove including a first curved surface 25f and a second curved surface 25h. The magnetic flux concentration space 27 which is a space inside the magnetic flux concentration groove 26 is a space for holding the polishing slurry 24.

於本變化例中,與本實施形態之圖6同樣地,通過磁通集中空間27之磁力線,會通過作為覆蓋研磨輪20之一部分之強磁性體之磁通集中構件25。因此,藉由將磁通集中構件25安裝於第1磁場形成構件22及第2磁場形成構件23,而具有增加磁通集中空間27之磁通密度,並增加磁通集中空間27對研磨漿料24之保持力之效果。 In this modification, as in FIG. 6 of the present embodiment, the magnetic field lines passing through the magnetic flux concentration space 27 pass through the magnetic flux concentration member 25 that is a ferromagnetic body covering a part of the grinding wheel 20. Therefore, by mounting the magnetic flux concentration member 25 on the first magnetic field formation member 22 and the second magnetic field formation member 23, the magnetic flux density of the magnetic flux concentration space 27 is increased, and the magnetic flux concentration space 27 is increased to the polishing slurry. 24 retention effect.

因此,本變化例之玻璃板之製造方法使用磁通集中構件25來提高對玻璃板92之端面92a進行研磨之研磨漿料24之保持力,藉此可提高玻璃板92之端面92a之研磨效率。 Therefore, the manufacturing method of the glass plate of this modification uses the magnetic flux concentrating member 25 to improve the holding force of the polishing slurry 24 that grinds the end surface 92a of the glass plate 92, thereby improving the polishing efficiency of the end surface 92a of the glass plate 92 .

再者,可以將本變化例之第1側部集中構件25c及第2側部集中構件 25d應用於變化例A~D。 Furthermore, the first side concentrated member 25c and the second side concentrated member of the present modification can be combined. 25d is applied to variations A to D.

(4-6)變化例F (4-6) Modification F

本實施形態之磁通集中構件25具有第1側部集中構件25c、及第2側部集中構件25d。於磁通集中構件25之外周面形成有作為V字型之槽之磁通集中槽26。磁通集中槽26之最靠徑向內側之點位於第1磁場形成構件22及第2磁場形成構件23之外周面上。但,磁通集中槽26之最靠徑向內側之點亦可不位於第1磁場形成構件22及第2磁場形成構件23之外周面上。 The magnetic flux concentrating member 25 of this embodiment includes a first side concentrated member 25c and a second side concentrated member 25d. A magnetic flux concentration groove 26 is formed on the outer peripheral surface of the magnetic flux concentration member 25 as a V-shaped groove. The most radially inward point of the magnetic flux concentration groove 26 is located on the outer peripheral surfaces of the first magnetic field forming member 22 and the second magnetic field forming member 23. However, the most radially inward point of the magnetic flux concentration groove 26 may not be located on the outer peripheral surfaces of the first magnetic field forming member 22 and the second magnetic field forming member 23.

圖22相當於本實施形態之圖6,係本變化例之研磨輪20之剖視圖之一部分。於圖22中,除了第1側部集中構件25c及第2側部集中構件25d以外之構成要素與本實施形態相同。 FIG. 22 corresponds to FIG. 6 of the present embodiment, and is a part of a cross-sectional view of the grinding wheel 20 according to this modification. In FIG. 22, the constituent elements other than the first side concentrated member 25c and the second side concentrated member 25d are the same as those of the present embodiment.

第1側部集中構件25c具有第1側面25e、及第1傾斜面25f。第1側面25e係第1側部集中構件25c之外周面。第1傾斜面25f係自第1側面25e之下端朝徑向內側向鉛垂方向下方傾斜之平面。第1傾斜面25f之最靠徑向內側之點之位置較第1磁場形成構件22之外周面之下端更靠徑向外側。 The first side concentrated member 25c includes a first side surface 25e and a first inclined surface 25f. The first side surface 25e is the outer peripheral surface of the first side concentrated member 25c. The first inclined surface 25f is a plane inclined downward from the lower end of the first side surface 25e toward the inside in the radial direction and downward in the vertical direction. The point of the first inclined surface 25f that is closest to the radially inner side is further radially outward than the lower end of the outer peripheral surface of the first magnetic field forming member 22.

第2側部集中構件25d具有第2側面25g、及第2傾斜面25h。第2側面25g係第2側部集中構件25d之外周面。第2傾斜面25h係自第2側面25g之上端朝徑向內側向鉛垂方向上方傾斜之平面。第2傾斜面25h之最靠徑向內側之點之位置較第2磁場形成構件23之外周面之上端更靠徑向外側。 The second side concentrated member 25d has a second side surface 25g and a second inclined surface 25h. The second side surface 25g is an outer peripheral surface of the second side portion concentrating member 25d. The second inclined surface 25h is a plane inclined upward from the upper end of the second side surface 25g toward the inside in the radial direction and upward in the vertical direction. The position of the second inclined surface 25h closest to the radially inner side is further radially outward from the upper end of the outer peripheral surface of the second magnetic field forming member 23.

如圖22所示,第1側部集中構件25c之第1傾斜面25f之最靠徑向內側之點與第2側部集中構件25d之第2傾斜面25h之最靠徑向內側之點一致。結果,如圖22所示,於磁通集中構件25之外周面形成有磁通集中槽26。磁通集中槽26之最靠徑向內側之點之位置較第1磁場形成構件22及第2磁場形成構件23之外周面更靠徑向外側。作為磁通集中槽26內側 之空間之磁通集中空間27,係保持研磨漿料24之空間。 As shown in FIG. 22, the point closest to the radially inner side of the first inclined surface 25f of the first side concentrated member 25c coincides with the point positioned most radially inward of the second inclined surface 25h of the second side concentrated member 25d . As a result, as shown in FIG. 22, a magnetic flux concentration groove 26 is formed on the outer peripheral surface of the magnetic flux concentration member 25. The position of the magnetic flux concentration groove 26 that is closest to the radially inner side is further radially outward than the outer peripheral surfaces of the first magnetic field forming member 22 and the second magnetic field forming member 23. Inside the magnetic flux concentration groove 26 The magnetic flux concentration space 27 in this space is a space for holding the polishing slurry 24.

於本變化例中,與本實施形態之圖6同樣地,通過磁通集中空間27之磁力線,會通過作為覆蓋研磨輪20之強磁性體之磁通集中構件25。因此,藉由將磁通集中構件25安裝於第1磁場形成構件22及第2磁場形成構件23,而具有增加磁通集中空間27之磁通密度,並增加磁通集中空間27對研磨漿料24之保持力之效果。 In this modification, as in FIG. 6 of the present embodiment, the magnetic field lines passing through the magnetic flux concentration space 27 pass through the magnetic flux concentration member 25 as a ferromagnetic body covering the grinding wheel 20. Therefore, by mounting the magnetic flux concentration member 25 on the first magnetic field formation member 22 and the second magnetic field formation member 23, the magnetic flux density of the magnetic flux concentration space 27 is increased, and the magnetic flux concentration space 27 is increased to the polishing slurry. 24 retention effect.

因此,本變化例之玻璃板之製造方法使用磁通集中構件25來提高對玻璃板92之端面92a進行研磨之研磨漿料24之保持力,藉此可提高玻璃板92之端面92a之研磨效率。 Therefore, the manufacturing method of the glass plate of this modification uses the magnetic flux concentrating member 25 to improve the holding force of the polishing slurry 24 that grinds the end surface 92a of the glass plate 92, thereby improving the polishing efficiency of the end surface 92a of the glass plate 92 .

再者,可以將本變化例之第1側部集中構件25c及第2側部集中構件25d應用於變化例A~E。 Furthermore, the first side concentrated member 25c and the second side concentrated member 25d of this modification can be applied to the modifications A to E.

(4-7)變化例G (4-7) Modification G

變化例B之磁通集中構件425具有第1側部集中構件425c、及第2側部集中構件425d。於磁通集中構件425之外周面,形成有作為V字型之槽之磁通集中槽426。磁通集中槽426之最靠徑向內側之點位於第1磁場形成構件422及第2磁場形成構件423之外周面上。但,磁通集中槽426之最靠徑向內側之點亦可不位於第1磁場形成構件422及第2磁場形成構件423之外周面上。 The magnetic flux concentration member 425 of the modification B includes a first side concentration member 425c and a second side concentration member 425d. A magnetic flux concentration groove 426 is formed on the outer peripheral surface of the magnetic flux concentration member 425 as a V-shaped groove. The most radially inward point of the magnetic flux concentration groove 426 is located on the outer peripheral surfaces of the first magnetic field forming member 422 and the second magnetic field forming member 423. However, the most radially inward point of the magnetic flux concentration groove 426 may not be located on the outer peripheral surfaces of the first magnetic field forming member 422 and the second magnetic field forming member 423.

圖23相當於變化例B之圖15,係本變化例之研磨輪420之剖視圖之一部分。於圖23中,除了第1側部集中構件425c及第2側部集中構件425d以外之構成要素與變化例B相同。 FIG. 23 corresponds to FIG. 15 of the modified example B, and is a part of a sectional view of the grinding wheel 420 of the modified example. In FIG. 23, the components other than the first side concentrated member 425 c and the second side concentrated member 425 d are the same as those of the modified example B.

第1側部集中構件425c具有第1側面425f、及第1傾斜面425g。第1側面425f係第1側部集中構件425c之外周面。第1傾斜面425g係自第1側面425f之下端朝徑向內側向鉛垂方向下方傾斜之平面。第1傾斜面425g之最靠徑向內側之點之位置較第1磁場形成構件422之外周面之下端更靠徑向內側。 The first side concentrated member 425c has a first side surface 425f and a first inclined surface 425g. The first side surface 425f is an outer peripheral surface of the first side concentrated member 425c. The first inclined surface 425g is a plane inclined downward from the lower end of the first side surface 425f toward the inside in the radial direction and downward in the vertical direction. The point of the first inclined surface 425g closest to the radially inner side is located radially inward of the lower end of the outer peripheral surface of the first magnetic field forming member 422.

第2側部集中構件425d具有第2側面425h、及第2傾斜面425i。第2側面425h係第2側部集中構件425d之外周面。第2傾斜面425i係自第2側面425h之上端朝徑向內側向鉛垂方向上方傾斜之平面。第2傾斜面425i之最靠徑向內側之點之位置較第2磁場形成構件423之外周面之上端更靠徑向內側。 The second side concentrated member 425d has a second side surface 425h and a second inclined surface 425i. The second side surface 425h is an outer peripheral surface of the second side concentrated member 425d. The second inclined surface 425i is a plane inclined upward in the vertical direction from the upper end of the second side surface 425h toward the radially inner side. The position of the second inclined surface 425i that is closest to the radially inner side is further radially inward than the upper end of the outer peripheral surface of the second magnetic field forming member 423.

如圖23所示,第1側部集中構件425c之第1傾斜面425g之最靠徑向內側之點與第2側部集中構件425d之第2傾斜面425i之最靠徑向內側之點一致。結果,如圖23所示,於磁通集中構件425之外周面形成有磁通集中槽426。磁通集中槽426係包括第1傾斜面425g及第2傾斜面425i之槽。磁通集中槽426之最靠徑向內側之點之位置較第1磁場形成構件422及第2磁場形成構件423之外周面更靠徑向內側。作為磁通集中槽426內側之空間之磁通集中空間427,係保持研磨漿料424之空間。 As shown in FIG. 23, the point closest to the radially inner side of the first inclined surface 425g of the first side concentrated member 425c coincides with the point closest to the radially inner side of the second inclined surface 425i of the second side concentrated member 425d. . As a result, as shown in FIG. 23, a magnetic flux concentration groove 426 is formed on the outer peripheral surface of the magnetic flux concentration member 425. The magnetic flux concentration groove 426 is a groove including a first inclined surface 425g and a second inclined surface 425i. The position of the magnetic flux concentration groove 426 that is most radially inward is radially inward of the outer peripheral surfaces of the first magnetic field forming member 422 and the second magnetic field forming member 423. The magnetic flux concentration space 427 which is a space inside the magnetic flux concentration groove 426 is a space for holding the polishing slurry 424.

於本變化例中,與變化例B之圖15同樣地,通過磁通集中空間427之磁力線,會通過作為覆蓋研磨輪420之強磁性體之磁通集中構件425。因此,藉由將磁通集中構件425安裝於第1磁場形成構件422及第2磁場形成構件423,而具有增加磁通集中空間427之磁通密度,並增加磁通集中空間427對研磨漿料424之保持力之效果。 In this modification, as in FIG. 15 of modification B, the magnetic field lines passing through the magnetic flux concentration space 427 pass through the magnetic flux concentration member 425 as a ferromagnetic body covering the grinding wheel 420. Therefore, by mounting the magnetic flux concentration member 425 on the first magnetic field formation member 422 and the second magnetic field formation member 423, the magnetic flux density of the magnetic flux concentration space 427 is increased, and the magnetic flux concentration space 427 is added to the polishing slurry. Effect of holding power of 424.

因此,本變化例之玻璃板之製造方法使用磁通集中構件425來提高對玻璃板92之端面92a進行研磨之研磨漿料424之保持力,藉此可提高玻璃板92之端面92a之研磨效率。 Therefore, the manufacturing method of the glass plate of this modification uses the magnetic flux concentrating member 425 to improve the holding force of the polishing slurry 424 that grinds the end surface 92a of the glass plate 92, thereby improving the polishing efficiency of the end surface 92a of the glass plate 92 .

再者,可以將本變化例之第1側部集中構件425c及第2側部集中構件425d同樣地應用於變化例C。 The first side concentrated member 425c and the second side concentrated member 425d of the present modification can be similarly applied to the modification C.

(4-8)變化例H (4-8) Modification H

本實施形態之研磨裝置10對玻璃板92之端面92a進行研磨。但,研磨裝置10亦可對金屬板及陶瓷板等其他板狀物品之端面進行研磨。 The polishing apparatus 10 of this embodiment polishes the end surface 92a of the glass plate 92. However, the polishing device 10 may polish the end surfaces of other plate-shaped articles such as metal plates and ceramic plates.

(5)實施例 (5) Examples

其次,對本實施形態之玻璃板之製造方法之實施例進行說明。 Next, an example of the manufacturing method of the glass plate of this embodiment is demonstrated.

[實施例1] [Example 1]

使用具備本實施形態之研磨輪20之研磨裝置10,對玻璃板92之端面92a進行研磨。然後,測定研磨輪20研磨端面92a時之、端面92a之最靠徑向內側之點之磁通密度。 The end surface 92a of the glass plate 92 is ground using the grinding apparatus 10 provided with the grinding wheel 20 of this embodiment. Then, when the grinding wheel 20 grinds the end surface 92a, the magnetic flux density at the point most radially inward of the end surface 92a is measured.

而且,對圖8所示之第1比較例之研磨輪120、圖10所示之第2比較例之研磨輪220、圖12所示之變化例A之研磨輪320、圖14所示之變化例B之研磨輪420、圖17所示之變化例C之研磨輪520,亦分別進行相同之測定。 The grinding wheel 120 of the first comparative example shown in FIG. 8, the grinding wheel 220 of the second comparative example shown in FIG. 10, the grinding wheel 320 of the modified example A shown in FIG. 12, and the changes shown in FIG. 14. The same measurement was performed on the grinding wheel 420 of Example B and the grinding wheel 520 of Modification C shown in FIG. 17 respectively.

本實施例使用之全體研磨輪中,第1磁場形成構件及第2磁場形成構件之外徑為125mm、內徑為90mm、鉛垂方向之尺寸為10mm。 In the entire grinding wheel used in this example, the first magnetic field forming member and the second magnetic field forming member have an outer diameter of 125 mm, an inner diameter of 90 mm, and a vertical dimension of 10 mm.

下表表示本實施例之測定結果。測定之磁通密度之單位為特斯拉(T)。如表所示,確認使用本實施形態之研磨輪20時測定之磁通密度之值最高。又,確認使用本實施形態之研磨輪20、變化例A之研磨輪320、變化例B之研磨輪420及變化例C之研磨輪520時測定之磁通密度之值,較使用第1比較例之研磨輪120及第2比較例之研磨輪220時測定之磁通密度之值高。 The following table shows the measurement results of this example. The unit of the measured magnetic flux density is Tesla (T). As shown in the table, it was confirmed that the value of the magnetic flux density measured when the grinding wheel 20 of this embodiment was used was the highest. In addition, it was confirmed that the values of the magnetic flux density measured when using the grinding wheel 20 of this embodiment, the grinding wheel 320 of modification A, the grinding wheel 420 of modification B, and the grinding wheel 520 of modification C were compared with those of the first comparative example. The grinding wheel 120 and the grinding wheel 220 of the second comparative example have high magnetic flux density values measured at the time.

[實施例2] [Example 2]

使用具備變化例B之研磨輪420之研磨裝置10,對玻璃板92之端面 92a進行研磨。然後,測定研磨輪420研磨端面92a時之、端面92a之最靠徑向內側之點之磁通密度。 The polishing device 10 provided with the polishing wheel 420 of the modification B is used to face the end surface of the glass plate 92 92a is ground. Then, when the grinding wheel 420 grinds the end surface 92a, the magnetic flux density at the point most radially inward of the end surface 92a is measured.

而且,對像變化例F及變化例G之研磨輪那樣,最內點之徑向之位置與研磨輪420不同之多種研磨輪,分別進行相同之測定。此處,所謂「最內點」,係指形成於研磨輪420之磁通集中構件425之外周面之磁通集中槽426之最靠徑向內側之點。 In addition, like the grinding wheels of the modified examples F and G, the same measurement is performed on a plurality of kinds of grinding wheels whose radial positions of the innermost points are different from the grinding wheels 420. Here, the “innermost point” refers to a point on the radially innermost side of the magnetic flux concentration groove 426 formed on the outer peripheral surface of the magnetic flux concentration member 425 of the grinding wheel 420.

最內點之徑向之位置係以基準點之徑向之位置為基準而進行測定。此處,所謂「基準點」,係指第1磁場形成構件422及第2磁場形成構件423之外周面上之點。如變化例F之圖22所示,於最內點較基準點更靠徑向外側之情形時,最內點之徑向之位置定義為具有正值。如變化例G之圖23所示,於最內點較基準點更靠徑向內側之情形時,最內點之徑向之位置定義為具有負值。 The radial position of the innermost point is measured based on the radial position of the reference point. Here, the "reference point" refers to a point on the outer peripheral surface of the first magnetic field forming member 422 and the second magnetic field forming member 423. As shown in FIG. 22 of Modification F, when the innermost point is radially outward from the reference point, the radial position of the innermost point is defined as having a positive value. As shown in FIG. 23 of the modified example G, when the innermost point is radially inward of the reference point, the radial position of the innermost point is defined as having a negative value.

又,最內點之徑向之位置係將基準點之徑向之位置設為零而測定。例如,於最內點之徑向之位置為「+1mm」之情形時,最內點位於自基準點朝徑向外側移動1mm之位置上,於最內點之徑向之位置為「-1mm」之情形時,最內點位於自基準點朝徑向內側移動1mm之位置上。 The radial position of the innermost point is measured by setting the radial position of the reference point to zero. For example, when the radial position of the innermost point is "+ 1mm", the innermost point is located at a position that moves 1mm from the reference point to the radially outer side, and the radial position of the innermost point is "-1mm" In the case of "", the innermost point is located at a position that moves 1 mm radially inward from the reference point.

本實施例使用之全體研磨輪中,第1磁場形成構件及第2磁場形成構件之外徑為125mm、內徑為90mm、鉛垂方向之尺寸為10mm。 In the entire grinding wheel used in this example, the first magnetic field forming member and the second magnetic field forming member have an outer diameter of 125 mm, an inner diameter of 90 mm, and a vertical dimension of 10 mm.

下表表示本實施例之測定結果。測定之磁通密度之單位為特斯拉(T)。如表所示,確認使用最內點之徑向之位置為0mm之研磨輪、即本變化例B之研磨輪420時測定之磁通密度之值最高。 The following table shows the measurement results of this example. The unit of the measured magnetic flux density is Tesla (T). As shown in the table, it was confirmed that the value of the magnetic flux density measured when using the grinding wheel with a radial position of 0 mm at the innermost point, that is, the grinding wheel 420 of this modification B, was the highest.

[實施例3] [Example 3]

使用本實施形態之研磨輪20對玻璃板92之端面92a進行多次研磨,並測定研磨後之端面92a之算術平均粗糙度Ra。 The end surface 92a of the glass plate 92 is repeatedly polished using the grinding wheel 20 of this embodiment, and the arithmetic average roughness Ra of the end surface 92a after the polishing is measured.

又,使用第1比較例之研磨輪120對玻璃板92之端面92a進行多次研磨,並測定研磨後之端面92a之算術平均粗糙度Ra。 In addition, the end surface 92a of the glass plate 92 was repeatedly polished using the polishing wheel 120 of the first comparative example, and the arithmetic average roughness Ra of the end surface 92a after polishing was measured.

本實施例使用之全體研磨輪中,第1磁場形成構件及第2磁場形成構件之外徑為125mm、內徑為90mm、鉛垂方向之尺寸為10mm。又,本實施例中使用之玻璃板92之厚度為0.5mm,研磨輪之旋轉速度為每分鐘2000轉,玻璃板92之搬送速度為每分鐘2400mm。 In the entire grinding wheel used in this example, the first magnetic field forming member and the second magnetic field forming member have an outer diameter of 125 mm, an inner diameter of 90 mm, and a vertical dimension of 10 mm. In addition, the thickness of the glass plate 92 used in this embodiment is 0.5 mm, the rotation speed of the grinding wheel is 2000 revolutions per minute, and the conveying speed of the glass plate 92 is 2400 mm per minute.

下表表示本實施例之測定結果。於使用第1比較例之研磨輪120對玻璃板92之端面92a進行研磨之情形時,對端面92a研磨6次之後,端面92a之算術平均粗糙度Ra變成10nm。另一方面,於使用本實施形態之研磨輪20對玻璃板92之端面92a進行研磨之情形時,對端面92a研磨2次之後,端面92a之算術平均粗糙度Ra變成10nm。 The following table shows the measurement results of this example. When the end surface 92a of the glass plate 92 is ground using the grinding wheel 120 of the first comparative example, the end surface 92a is polished six times, and the arithmetic average roughness Ra of the end surface 92a becomes 10 nm. On the other hand, when the end surface 92a of the glass plate 92 is polished using the grinding wheel 20 of this embodiment, after the end surface 92a is polished twice, the arithmetic average roughness Ra of the end surface 92a becomes 10 nm.

根據以上說明,於本實施例中,藉由2次研磨加工便可使端面92a之算術平均粗糙度Ra變成10nm以下,可以自端面92a除去裂痕(微裂痕或水平裂痕)。 Based on the above description, in this embodiment, the arithmetic average roughness Ra of the end surface 92a can be reduced to 10 nm or less by two grinding operations, and cracks (microcracks or horizontal cracks) can be removed from the end surface 92a.

再者,研磨加工前之端面92a係藉由以下步驟而獲得。首先,藉由使用切斷輪之機械刻劃將玻璃板92切斷成特定尺寸。其次,對玻璃板 92之切斷面即端面92a,使用金屬結合劑金剛石輪進行研削加工。藉此,於短時間內形成端面92a所需之形狀。其次,使用樹脂結合劑金剛石輪對對端面92a進行研削加工。藉此,進行使端面92a之形狀齊整且端面92a之表面粗糙度變小之加工。藉由上述工序,最終獲得加工變質層小於3μm之端面92a。 The end surface 92a before the grinding process is obtained by the following steps. First, the glass plate 92 is cut into a specific size by mechanical scribing using a cutting wheel. Secondly, for glass plates The cutting surface 92, that is, the end surface 92a, is ground using a metal bonding diamond wheel. Thereby, a desired shape of the end surface 92a is formed in a short time. Next, the end surface 92a is ground using a resin-bonded diamond wheel pair. Thereby, the process of making the shape of the end surface 92a uniform and making the surface roughness of the end surface 92a small is performed. Through the above steps, an end face 92a having a processed deteriorated layer of less than 3 μm is finally obtained.

再者,於這些實施例中,使用本實施形態之研磨輪20,對利用雷射切斷之玻璃板92之端面92a進行研磨。利用雷射切斷之玻璃板92之端面92a具有截面大致為直角之角部。另一方面,利用研磨輪20研磨加工後之端面92a具有截面為R形狀之角部,獲得R形狀之曲率半徑小於10μm之端面92a。 In these examples, the grinding wheel 20 of this embodiment is used to polish the end surface 92a of the glass plate 92 cut by laser. The end surface 92a of the glass plate 92 cut by a laser has a corner portion having a substantially right-angled cross section. On the other hand, the end surface 92a after being grinded by the grinding wheel 20 has a corner portion having an R-shaped cross section, and an end surface 92a having an R-shaped curvature radius of less than 10 μm is obtained.

Claims (10)

一種玻璃板之製造方法,其係包含第1磁場形成構件以及第2磁場形成構件,使由上述第1磁場形成構件以及上述第2磁場形成構件所形成之磁場保持之磁性體研磨粒,與上述第1磁場形成構件以及上述第2磁場形成構件一併繞旋轉軸旋轉,於該狀態下,使玻璃板之端部接觸上述磁性體研磨粒,而對上述端部進行研磨,上述第1磁場形成構件以及上述第2磁場形成構件係包含供上述旋轉軸貫通之上表面及下表面、以及位於上述旋轉軸周圍之側面之圓筒形狀之磁鐵,且沿上述旋轉軸磁化,上述端部係於形成於上述側面之研磨空間內被研磨,上述第1磁場形成構件以及上述第2磁場形成構件於上述上表面、上述下表面及上述側面安裝有磁通集中構件,該等磁通集中構件係將自上述上表面或上述下表面流出之磁力線導入上述研磨空間之磁性體。A manufacturing method of a glass plate, comprising a magnetic abrasive grain containing a first magnetic field forming member and a second magnetic field forming member, and holding a magnetic field formed by the first magnetic field forming member and the second magnetic field forming member, and The first magnetic field forming member and the second magnetic field forming member rotate together about a rotation axis. In this state, the ends of the glass plate are brought into contact with the magnetic abrasive grains, the ends are polished, and the first magnetic field is formed. The member and the second magnetic field forming member include a cylindrical magnet in which the rotation shaft penetrates the upper and lower surfaces and a side surface around the rotation shaft, and is magnetized along the rotation shaft. The end portion is formed in The first magnetic field forming member and the second magnetic field forming member are ground in the grinding space on the side surface, and magnetic flux concentration members are mounted on the upper surface, the lower surface, and the side surfaces. The magnetic lines of force flowing from the upper surface or the lower surface are introduced into the magnetic body of the grinding space. 如請求項1之玻璃板之製造方法,其中上述第1磁場形成構件與上述第2磁場形成構件之間之空間、以及上述第1磁場形成構件及上述第2磁場形成構件之上述旋轉軸之徑向外側之空間的至少一個空間內,上述磁通之密度因上述磁通集中構件而增加。The method for manufacturing a glass plate according to claim 1, wherein a space between the first magnetic field forming member and the second magnetic field forming member, and a diameter of the rotation axis of the first magnetic field forming member and the second magnetic field forming member. In at least one of the outward spaces, the density of the magnetic flux is increased by the magnetic flux concentration member. 如請求項2之玻璃板之製造方法,其中上述第2磁場形成構件相對於上述第1磁場形成構件所處一側之相反側之空間、以及上述第1磁場形成構件相對於上述第2磁場形成構件所處一側之相反側之空間的至少一個空間內,上述磁通之密度因上述磁通集中構件而增加。The method for manufacturing a glass plate according to claim 2, wherein the space of the second magnetic field forming member opposite to the side on which the first magnetic field forming member is located, and the first magnetic field forming member is formed with respect to the second magnetic field. In at least one of the spaces on the opposite side of the member, the magnetic flux density increases due to the magnetic flux concentration member. 一種玻璃板之研磨裝置,其具備:旋轉軸;第1磁場形成構件,其連結於上述旋轉軸,且繞上述旋轉軸旋轉;第2磁場形成構件,其連結於上述旋轉軸,且繞上述旋轉軸旋轉;磁性體研磨粒,其由上述第1磁場形成構件及上述第2磁場形成構件所形成之磁場保持;及磁通集中構件,其係安裝於上述第1磁場形成構件及上述第2磁場形成構件上之磁性體,使自上述第1磁場形成構件朝向上述第2磁場形成構件之磁通集中,從而增加上述磁通之密度;且由藉由上述磁通集中構件而上述磁通之密度增加之空間保持之上述磁性體研磨粒,與上述第1磁場形成構件及上述第2磁場形成構件一併繞上述旋轉軸旋轉,於該狀態下與玻璃板之端部接觸而對上述端部進行研磨。A polishing device for a glass plate, comprising: a rotating shaft; a first magnetic field forming member connected to the rotating shaft and rotating around the rotating shaft; and a second magnetic field forming member connected to the rotating shaft and rotating around the rotating shaft Shaft rotation; magnetic abrasive grains held by the magnetic field formed by the first magnetic field forming member and the second magnetic field forming member; and a magnetic flux concentration member mounted on the first magnetic field forming member and the second magnetic field Forming a magnetic body on the member to concentrate the magnetic flux from the first magnetic field forming member toward the second magnetic field forming member, thereby increasing the density of the magnetic flux; and the density of the magnetic flux by the magnetic flux concentration member The magnetic abrasive particles held in the increased space are rotated about the rotation axis together with the first magnetic field forming member and the second magnetic field forming member, and in this state contact the end portion of the glass plate to perform the end portion. Grinding. 如請求項4之玻璃板之研磨裝置,其中上述磁通集中構件於上述第1磁場形成構件與上述第2磁場形成構件之間之空間、以及上述第1磁場形成構件及上述第2磁場形成構件之上述旋轉軸之徑向外側之空間的至少一個空間內,使上述磁通之密度增加。The polishing device for a glass plate according to claim 4, wherein the magnetic flux concentration member is in a space between the first magnetic field forming member and the second magnetic field forming member, and the first magnetic field forming member and the second magnetic field forming member. The density of the magnetic flux is increased in at least one of the spaces radially outside the rotation axis. 如請求項4或5之玻璃板之研磨裝置,其中上述磁通集中構件至少安裝於上述第1磁場形成構件及上述第2磁場形成構件之上述旋轉軸之徑向外側,且具有磁通集中槽,上述磁通集中槽係於上述磁通集中構件之上述旋轉軸之徑向外側之表面中與上述旋轉軸之中心軸成直角之槽。The grinding device for a glass plate according to claim 4 or 5, wherein the magnetic flux concentration member is installed at least radially outward of the rotation axis of the first magnetic field formation member and the second magnetic field formation member, and has a magnetic flux concentration groove. The magnetic flux concentration groove is a groove that is at a right angle to a central axis of the rotation axis in a surface on a radially outer side of the rotation axis of the magnetic flux concentration member. 如請求項6之玻璃板之研磨裝置,其中上述磁通集中構件進而於上述旋轉軸之中心軸方向安裝於上述第1磁場形成構件及上述第2磁場形成構件之各個上。The polishing device for a glass plate according to claim 6, wherein the magnetic flux concentration member is further mounted on each of the first magnetic field forming member and the second magnetic field forming member in a center axis direction of the rotation axis. 如請求項6之玻璃板之研磨裝置,其中上述第1磁場形成構件於上述旋轉軸之中心軸方向與上述第2磁場形成構件鄰接。The polishing device for a glass plate according to claim 6, wherein the first magnetic field forming member is adjacent to the second magnetic field forming member in a center axis direction of the rotation axis. 如請求項6之玻璃板之研磨裝置,其中上述第1磁場形成構件及上述第2磁場形成構件具有尺寸相同之圓筒形狀,上述第1磁場形成構件及上述第2磁場形成構件之中心軸位於上述旋轉軸之中心軸上,上述磁通集中槽之位於上述旋轉軸之徑向最內側之點、與上述旋轉軸之中心軸之間的距離,等於上述第1磁場形成構件及上述第2磁場形成構件之外徑。For example, the glass plate polishing device according to claim 6, wherein the first magnetic field forming member and the second magnetic field forming member have the same cylindrical shape, and the central axes of the first magnetic field forming member and the second magnetic field forming member are located On the center axis of the rotation axis, the distance between the magnetic flux concentration groove located at the innermost point in the radial direction of the rotation axis and the center axis of the rotation axis is equal to the first magnetic field forming member and the second magnetic field. Form the outer diameter of the component. 如請求項6之玻璃板之研磨裝置,其中上述磁通集中構件使上述磁通集中槽之內側空間之上述磁通之密度增加。The polishing device for a glass plate according to claim 6, wherein the magnetic flux concentration member increases the density of the magnetic flux in an inner space of the magnetic flux concentration groove.
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