JP2000182014A - Ic card manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance productivity and mass productivity, to further enhance energy conservation and cost effectiveness by shortening manufacturing cycle time and to simultaneously enhance merchandise characteristics by improving product quality and uniformity. SOLUTION: An IC card manufacturing device 1 is provided with laminated base material holding parts 2a... consisting of upper holding parts 3... and lower holding part 4a... to seal laminated base materials M by sandwiching them from both sides, a deaerating part 5 to deaerate the inside of the laminated base material holding part 2a..., a preheating press part 6 to raise the temperature of the laminated base material holding parts 2a... which are deaerated by sandwiching the laminated base materials M by preheating temperature Tf lower than normal heating temperature Ts, a thermo-compression bonding press part 7 to perform thermo-compression bonding to the laminated base material holding parts 2a... transmitted from the preheating press part 6 by the normal heating temperature Ts and a cooling press part 8 to cool the laminated base material holding parts 2a... transmitted from the thermo-compression bonding part 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a thin non-contact IC.
The present invention relates to an IC card manufacturing apparatus suitable for use in manufacturing a card.

[0002]

2. Description of the Related Art In general, a thin non-contact IC card incorporating an electronic component such as an IC chip is known. FIG. 7 shows a laminated base material used when manufacturing this type of IC card.
An exploded view of a state where only one card is cut is shown. In the figure, P is an IC chip Pi and an antenna Pa
The electronic component P is sandwiched between a pair of upper and lower sheet materials Sa and Sb. In this case, each sheet material Sa, Sb is composed of a resin sheet (polyethylene terephthalate or the like) La, Lb and nonwoven fabrics Ta, Tb disposed on the back side thereof. Ba and Bb indicate adhesives applied to the back surfaces of the resin sheets La and Lb. When manufacturing an IC card, usually, as shown in FIG. 2, a laminated base material M in which a plurality of IC cards (generally, n × m) are continuously sewn into one is used. Laminated substrate M
Was thermocompression-bonded by an IC card manufacturing apparatus, and then cut to manufacture a target IC card.

FIG. 8 shows a typical conventional IC card manufacturing apparatus 100. The IC card manufacturing apparatus 100 includes a lower press board 101 and an upper press board 102. The lower press board 101 is attached to a base 104 via a heat insulating plate 103, and the upper press board 102 is moved up and down via a heat insulating plate 105. It is attached to the body 106. Thereby, the lower press board 10
1 is a fixed side, and the upper press board 102 is a movable side.
Further, inside the lower press platen 101, a heater 107 for heating is provided.
And a water jacket 108 for water cooling, and a heater 109 for heating inside the upper press platen 102.
And water cooling water jackets 110 are provided. Further, the base portion 104 is provided with a cylindrical lower chamber portion 111 covering the periphery of the lower press platen 101, and the elevating body portion 1 is provided.
Reference numeral 06 denotes an upper chamber portion 1 covering the periphery of the upper press platen 102.
12 are provided. The lower chamber portion 111 and the upper chamber portion 112 are fitted when the upper press platen 102 is lowered, and constitute a chamber 113 in which the inside is sealed. On the other hand, reference numeral 114 denotes a deaeration port provided in the upper chamber section 112. By connecting a deaeration device (not shown) (a vacuum pump or the like) to the deaeration port 114, the inside of the chamber 113 is deaerated. Can be. Reference numeral 115 denotes the upper chamber unit 1
12 is a sealing material.

According to such an IC card manufacturing apparatus 100, the laminated base material M is set on the lower press board 101. After lowering the elevating body 106, the inside of the chamber 113 is evacuated, and the laminated base M is heated by the lower press platen 101 and the upper press plate 102 heated by energizing the heaters 107 ... and 109 ... When pressurized, the laminated base material M is thermocompression-bonded in a state where bubbles contained therein are removed.
Thereafter, the energization of the heaters 107 and 109 is stopped, and cooling water flows through the water cooling water jackets 108 and 110 to cool the laminated base material M.

[0005]

In the case of manufacturing this kind of IC card having a thin and flexible property, the influence of the heating and pressurizing conditions upon the thermocompression bonding of the laminated base material M on the production quality. For example, if the heating control is not performed properly, the flatness of the product will be impaired due to warpage or distortion, and if the pressure control is not performed properly, delamination or partial peeling will occur. For example, it becomes easy to cause deterioration in quality and variation, and further, deterioration in commerciality.

For this reason, in the conventional IC card manufacturing apparatus 100 described above, the lower press board 101 and the upper press board 102
By having both heating and cooling steps
Although the continuity of the heating control and the pressure control was ensured, the production cycle time until the production of one laminated base material M was increased, and the productivity and mass productivity were poor, and the energy consumption was increased. However, there is a problem that energy saving and economic efficiency are inferior.

If the heating step and the cooling step are performed in different steps, such a problem can be solved. However, as described above, when the heating step is shifted to the cooling step,
Since the heating state and the pressurized state are released, the quality and the quality are reduced, and further, the commercial value is reduced.

The present invention has solved the problems existing in the prior art as described above. By shortening the manufacturing cycle time, productivity and mass productivity can be improved, and energy saving and economy can be improved. At the same time, by improving the quality and homogeneity, it is possible to significantly improve the merchantability.
The purpose is to provide a C card manufacturing device.

[0009]

SUMMARY OF THE INVENTION According to the present invention, an electronic component P such as an IC chip Pi is formed of a sheet material S.
When the IC card manufacturing apparatus 1 for manufacturing an IC card by thermocompression bonding the laminated base material M sandwiched between a and Sb to form an IC card, the upper sandwiching portions 3 for sandwiching and sealing the laminated base material M from both sides. The laminated base material holding portion 2a composed of the lower holding portions 4a.
, And a deaeration section 5 for deaerating the inside of the laminated base material holding section 2a, and a laminated base material holding section 2 deaerated with the laminated base material M interposed therebetween.
are heated at a preheating temperature Tf lower than the regular heating temperature Ts, and the laminated base material holding portions 2a sent from the preheating press unit 6 are thermocompressed at the regular heating temperature Ts. It is characterized by comprising a thermocompression pressing section 7 and a cooling press section 8 for cooling the laminated base material holding sections 2a sent from the thermocompression pressing section 7.

[0010] Thus, the heating control and the pressurization control for the laminated base material M are accurately and independently performed by the different preheating press units 6, the thermocompression press units 7, and the cooling press units 8 independently. At this time, the laminated base material M is sandwiched on both sides by the upper clamping part 3 and the lower clamping part 4a, and is accommodated in the sealed laminated base material clamping parts 2a. Since the inside of the sandwiching portions 2a is degassed by the degassing portion 5, even if the laminated base material M moves between the press portions 6, 7, 8, continuity of the heating state and the pressurized state is ensured.
That is, the heat retention and the pressure retention for the laminated base material M are ensured.

According to a preferred embodiment, the upper holding portions 3 and the lower holding portions 4a are provided with positioning portions 10 for positioning when the upper holding portions 3 are overlapped with the lower holding portions 4a. . The upper holding portion 3 includes a holding surface portion 11p that is larger than the upper surface of the laminated base material M and overlaps with the upper surface of the laminated base material M, and has a groove-shaped absorbing surface portion 11a bulging upward along an outer edge of the holding surface portion 11p. A plate 11 and an upper frame portion 12 which are integrally provided on an outer edge portion 11v of the upper plate portion 11 to be in close contact with the lower holding portions 4a..., And the lower holding portions 4a (4b, 4c, 4d) A clamping surface portion 13 that is larger than the lower surface and overlaps with the lower surface of the laminated base material M
p and a lower plate portion 13 having a groove-shaped absorbing surface portion 13a bulging downward along the outer edge of the holding surface portion 13p.
And the lower frame portion 14 which is provided integrally with the outer edge portion 13v of the lower plate portion 13 so as to be in close contact with the upper holding portion 3 side.
It consists of. In this case, a drive shaft portion 16 that can be controlled in rotation and ascending and descending by the drive portion 15 is provided, protrudes radially from the drive shaft portion 16, and is disposed at 90 ° intervals around the drive shaft portion 16 in the circumferential direction. In addition to the four lower holding portions 4a, 4b, 4c, 4d provided, four upper holding portions 3 corresponding to the respective lower holding portions 4a are provided. on the other hand,
Preheating press part 6, thermocompression press part 7, and cooling press part 8
Are arranged at 90 ° intervals in the circumferential direction around the drive shaft portion 16. In this case, the preheating press section 6 includes lower holding sections 4a.
And a movable press platen 6m provided with a preheating heater 17 provided therein and provided with a preheating heater 19 provided below the lower holding portions 4a and raised and lowered by a lifting portion 18. And a thermocompression press section 7
Is a heating heater 20 disposed above the lower holding portions 4a.
, And a movable press platen 7m which is disposed below the lower holding portions 4a and has a built-in heating heater 22 which is moved up and down by an elevating unit 21. The cooling press unit 8 further comprises: , A fixed press platen 8c having a water jacket 23 for water cooling disposed above the lower holding portions 4a.
And a movable press platen 8m disposed below the lower holding portions 4a and having a water cooling water jacket 25 that is raised and lowered by the lifting and lowering portion 24. On the other hand, a position 180 ° opposite to the thermocompression pressing section 7 about the drive shaft section 16 is defined as a carry-in / out position Xio. In this carry-in / out position Xio, the upper holding portions 3 are held or released, and Upper holding part 3 held
, The upper holding portion elevating mechanism 26 for raising and lowering the upper holding portions 3... Is moved from the cooling press section 8 to the carry-in / out position Xio when the upper holding portions 3. Unloading and unloading position Xi
o is provided with a loading / unloading mechanism 27 for loading the laminated base material M before manufacturing. Further, the deaeration section 5 is provided with an air supply function for supplying air into the laminated base material holding sections 2a sent from the cooling press section 8 to the carry-in / out position Xio.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments according to the present invention will be described below in detail with reference to the drawings.

First, the configuration of an IC card manufacturing apparatus 1 according to the present embodiment will be described with reference to FIGS.

The IC card manufacturing apparatus 1 includes a manufacturing apparatus main body 30.
Is provided. The manufacturing apparatus main body 30 includes a lower support portion 31 provided at a lower portion and an upper support portion 32 provided at an upper portion.
1 and the upper support portion 32 are connected by a plurality of upright support portions 33. A drive section 15 is provided on the lower support section 31, and a drive shaft section 16 between the drive section 15 and the upper support section 32, which is capable of rotation control and elevation control by the drive section 15.
And a support plate 34 is provided at an intermediate portion of the drive shaft portion 16. The support plate 34 is formed in a cross shape in a plan view, and the lower end portions 4a, 4b, 4
c and 4d are fixed. As a result, the four lower holding portions 4
a, 4b, 4c and 4d project radially from the support board 34 and are arranged at 90 ° intervals around the drive shaft 16 in the circumferential direction. In addition, four upper holding portions 3 formed as a single unit
, And each of the lower holding portions 4a, 4b, 4c, 4d is combined with each of the upper holding portions 3,.
a, 2b, 2c, and 2d.

FIGS. 1 and 2 show a laminated base material holding portion 2a (2
b, 2c, and 2d are the same). The laminated base material holding portion 2a includes an upper holding portion 3 and a lower holding portion 4a,
When the upper holding part 3 overlaps the lower holding part 4a, the inside becomes the laminated base material holding part 2a whose inside is sealed.

The upper holding portion 3 has an upper frame portion 12 formed in a rectangular frame shape, and a groove portion 12s is provided on an outer surface of the upper frame portion 12. In addition, the upper plate portion 11 includes a holding surface portion 11p that is larger than the upper surface and overlaps with the upper surface of the laminated base material M, and a groove-shaped absorbing surface portion 11a bulging upward along an outer edge of the holding surface portion 11p. The outer edge 11v of the upper plate 11 is attached to the lower surface of the upper frame 12 by fasteners 41 such as screws. The upper plate portion 11 can be made of stainless steel having a certain thickness, and the thickness is within 3 mm, preferably 1 m
m] is optimal. Note that a seal member 42 is fixed to the outer edge portion 11v located below the lower surface of the upper frame portion 12.

On the other hand, the lower holding portion 4a is basically configured similarly to the upper holding portion 3. That is, the lower frame portion 14 having a rectangular frame shape, the holding surface portion 13p that is larger than the lower surface overlapping the lower surface of the laminated base material M, and the groove bulging downward along the outer edge of the holding surface portion 13p. A lower plate portion 13 provided with an absorption surface portion 13a having a rectangular shape is provided. An outer edge portion 13v of the lower plate portion 13 is attached to the upper surface of the lower frame portion 14 by fasteners 43 such as screws. The lower plate portion 13 may be made of stainless steel or the like having the same constant thickness as the upper plate portion 11. Note that a seal member 44 is fixed to the outer edge portion 13v located above the upper surface of the lower frame portion 14.

Further, a deaeration port 5o is provided in the absorption surface portion 13a, and the deaeration port 5o is connected to a deaerator (such as a vacuum pump) 5m via a ventilation pipe 5p. In this case, degassing device 5m
Is disposed inside the driving section 15, and the ventilation pipe 5 p is connected to the driving shaft section 1.
6 is connected to a degassing device 5m via a rotary joint. Thereby, a deaeration section 5 for deaeration of the inside of the laminated base material holding sections 2a is formed. Further, the deaeration section 5 is provided with an air supply function of supplying air to the inside of the laminated base material holding sections 2a by switching control of a switching valve connected to the ventilation pipe 5p.

Further, positioning portions 10 for positioning the upper holding portion 3 and the lower holding portion 4a when the upper holding portion 3 is overlaid on the lower holding portion 4a are provided at a plurality of positions of the upper holding portion 3 and the lower holding portion 4a. One positioning portion 10 (the same applies to other portions) includes a positioning pin 45 projecting upward from the lower frame portion 14 and a positioning hole 46 provided in the upper frame portion 12.

The laminated base material holding portion 2a thus configured
When the laminated base material M is set on the lower plate portion 13 of the lower holding portion 4a and the upper holding portion 3 is overlaid thereon, the positioning pin 45 is inserted into the positioning hole 46 and the upper holding portion 3 is Accurate positioning of the sandwiching portion 4a and prevention of misalignment are achieved, and the upper frame portion 12 and the lower frame portion 14 are in close contact with each other via the sealing members 42 and 44. For this reason, the holding surface portion 11
In this state, the positions and intervals of p and 13p are
p and 13p are set so as to be appropriately pressed against both surfaces of the laminated base material M, respectively.

On the other hand, the driving unit 15 is
Three press units, that is, a preheat press unit 6, a thermocompression press unit 7, and a cooling press unit 8 are disposed so as to surround the (drive shaft unit 16). In this case, each press section 6,7,
Numerals 8 are arranged at 90 ° intervals in the circumferential direction around the drive shaft 16.

The preheating press section 6 has a fixed press panel section 6c fixed to the lower surface of the upper support section 32 via the heat insulating plate 51, and is moved up and down by the elevating section 18 fixed to the upper surface section of the lower support section 31. It has a movable press board 6m. The fixed press platen 6c and the movable press platen 6m incorporate preheating heaters 17 and 19, respectively. The elevating unit 18 has four elevating cylinders (hydraulic cylinders) 18c.
The movable press platen 6m is connected to the movable rods of the lifting cylinders 18c via the heat insulating plate 52. The preheating press section 6 applies the preheating temperature Tf lower than the regular heating temperature Ts to the delaminated laminated base material holding sections 2a containing the laminated base material M and pressurizing the laminated base material M. It has the function of raising the temperature at the preheating temperature.

On the other hand, the thermocompression pressing section 7 has a fixed press panel 7c fixed to the lower surface of the upper support 32 via a heat insulating plate 53, and the elevating section 21 fixed to the upper surface of the lower support 31. And a movable press platen 7m that moves up and down. And the fixed press board 7c and the movable press board 7m
Have built-in heaters 20 and 22, respectively. The lifting unit 21 includes four lifting cylinders (hydraulic cylinders).
, And the movable press platen 7m is connected to the movable rod of the lifting cylinder 21c via an insulating plate 54. The thermocompression pressing section 7 has a function of applying the regular heating temperature Ts to the laminated base material holding sections 2a... Sent from the preheating press section 6 to pressurize the laminated base material M.

Further, the cooling press section 8 has a fixed press panel section 8c fixed to the lower surface section of the upper support section 32 via the heat insulating plate 55, and the elevating section 24 fixed to the upper surface section of the lower support section 31. It has a movable press board 8m that moves up and down. Then, the fixed press board 8c and the movable press board 8m
Are provided with water cooling water jackets 23 and 25, respectively. The lifting unit 24 includes four lifting cylinders (hydraulic cylinders) 24c..., And the movable press platen 8m is connected to a movable rod of the lifting cylinders 24c. The cooling press section 8 presses the laminated substrate holding sections 2a sent from the thermocompression pressing section 7 while pressing the laminated substrate M
It has the function of cooling.

On the other hand, the manufacturing apparatus main body 30 is provided with an upper holding portion elevating mechanism 26. The upper holding portion elevating mechanism 26 is disposed above a position (a carry-in / out position Xio) 180 ° opposite to the thermocompression pressing unit 7 around the drive shaft unit 16. That is,
The upper holding portion elevating mechanism 26 includes a support bracket 61 fixed to a side surface of the upper support portion 32.
The lifting cylinder (hydraulic cylinder) 62 is fixed downward, and a chuck mechanism 63 is attached to the distal end (lower end) of the movable rod of the lifting cylinder 62. Numerals 64 are guide portions for guiding the chuck mechanism 63 when ascending and descending. This upper holding portion elevating mechanism 26
Has a function of holding or releasing the holding of the upper holding portions 3 located at the carry-in / out position Xio, and raising and lowering the held upper holding portions 3.

When the upper holding portions 3... Are raised by the upper holding portion elevating mechanism 26 adjacent to the main body 30 of the manufacturing apparatus, the stacks after the production are sent from the cooling press portion 8 to the carry-in / out position Xio. A carry-in / out mechanism 27 for carrying out the base material M and carrying in the laminated base material M before manufacturing to the carry-in / out position Xio is provided. The loading / unloading mechanism 27 includes a pair of separated rail portions 71a,
71b. Each of the rail portions 71a, 71b is horizontally supported by a plurality of support portions 72, and is disposed above the lower holding portions 4a and below the raised upper holding portion 3. As a result, the upper holding portion 3 is connected to the rail portions 71a and 71b.
You can go up and down through the space. The rails 71a and 71b are loaded with a transport unit 73 including a plurality of suction disks 74 ... 75 capable of sucking or releasing suction of the laminated base material M by negative pressure. The transport section 73 moves along the rail sections 71a and 71b and stops at a position preset by the control section. In this case, a plurality of suction plates 74 arranged on the front side
.. Are sucked out of the laminated base material M after production from the lower holding portions 4a and carried out, and a plurality of suction plates 75 arranged on the rear side.
Has a function of adsorbing the laminated base material M before production and carrying it onto the lower holding portions 4a.

On the other hand, at a position below the rail portions 71a and 71b and apart from the carry-in / out position Xio, a carry-in conveyor 76 is provided.
Is provided with a base sheet supply unit 77 for supplying a continuous base sheet Mo of the laminated base material M, and a cutter unit 78 for cutting the base sheet Mo supplied from the base sheet supply unit 77 to a predetermined length. Is attached. Further, the rail 71
a, 71b, and a position on the side of the carry-in / out position Xio adjacent to the carry-in conveyor 76, the manufactured laminated base material M
A stocker unit 79 that accommodates the storage device is provided.

Next, the operation of the IC card manufacturing apparatus 1 according to this embodiment will be described with reference to the drawings and the flowchart shown in FIG.

First, a continuous base sheet Mo is supplied from a base sheet supply section 77 to a fixed position through a cutter section 78 (step S1). Thereby, the predetermined position of the base sheet Mo is cut by the cutter unit 78, and the laminated base material M is obtained (Step S2). Then, the laminated base material M is transported to a specified position by the carry-in conveyor 76, that is, to the center between the rail portions 71a and 71b.

On the other hand, the transport section 73 includes rail sections 71a, 71a.
Since it is on standby at the suction loading position (the virtual line position in FIG. 4) that has receded along b, the stacked base material M on the loading conveyor 76 is sucked by the suction boards 75 on the rear side. Then, when the transport section 73 is advanced along the rail sections 71a and 71b and moved to the suction release carrying-in position (the solid line position in FIG. 4), the suction is released and the lower holding section positioned below is used. In this case, the laminated base material M is placed on the holding surface portion 13p of the lower holding portion 4d (Step S3). At this time, the upper holding portion 3 is lifted by the upper holding portion elevating mechanism 26, that is, is gripped by the chuck mechanism 63 and is lifted by the elevating cylinder 62. The lower holding portion 4d is also at a position raised by the drive shaft portion 16, and the corresponding pre-heat treatment, thermo-compression treatment, and cooling treatment are performed in the press portions 6, 7, and 8, respectively. Therefore, the loading / unloading process of the laminated base material M is performed using the processing time of the manufacturing apparatus main body 30 side. During the movement of the transport unit 73 from the suction carry-in position to the suction release carry-in position, if the front suction plates 74... Reach a position above the lower holding unit 4d (suction carry-out position), they temporarily stop.
The manufactured laminated base material M is sucked by the suction disks 74.

On the other hand, the laminated base material M before production is
If it is placed on the upper side, the transport unit 73 is moved backward, and the chuck mechanism 63 is moved down by the elevating cylinder 62. When the gripping of the upper holding portion 3 is released, the upper holding portion 3 overlaps the lower holding portion 4d (step S4). At this time, the positioning pin 45 is inserted into the positioning hole 46 to accurately position the upper holding portion 3 and the lower holding portion 4d and prevent the displacement, and also, the upper frame portion 12 and the lower frame portion 1 are prevented from shifting.
4 completely adheres via the sealing members 42 and 44. Thereby, the laminated base material holding portion 2d in which the laminated base material M is housed is sealed.

Further, the deaerator 5m is operated to deaerate the inside of the laminated base material holding portion 2d. Thereby, the laminated base material M
Is pressed by the upper and lower sandwiching surface portions 11p and 13p, and bubbles contained in the laminated base material M are completely removed. In particular, the grooved absorbing surface portion 1 is provided on the laminated base material holding portion 2d.
Since the laminations 1a and 13a are provided along the entire circumference of the holding surface portions 11p and 13p, the laminated base material M is uniformly deaerated.

On the other hand, each press part 6,
When all of the pre-heat treatment, thermocompression treatment, and cooling treatment of 7 and 8 are completed, the lifting cylinders 18c, 21c, 24c,
Lowers the movable press platens 6m, 7m, 8m by
Further, the drive shaft unit 16 is lowered by the drive unit 15 and the drive shaft unit 16 is rotated by 90 ° (Step S).
5). Thereby, the laminated base material holding portion 2 d is sent to the preheating press portion 6. In addition, the cooling press part 8 in FIG. 5 has shown the state which the movable press board part and the laminated | substrate base material holding part descend | fall.

Next, the drive shaft section 16 is raised by the drive section 15, and the movable press platen section 6m is further raised by the lifting cylinders 18c (step S6). At the same time, the other movable press plates 7m and 8m are also raised. 5 shows a state in which the preheating press unit 6 in FIG. 5 raises the movable press platen unit and the laminated base material holding unit. As a result, the laminated base material holding portion 2d is fixed to the fixed press plate 6c and the movable press plate 6c.
A pre-heat treatment is performed between m. (Step S7).
That is, the fixed press platen 6c and the movable press platen 6m are preheated by the preheaters 17 and 19, respectively, at a preheating temperature Tf lower than the regular heating temperature Ts, specifically, the sheet material Sa,
Sb (see FIG. 7) is heated to a temperature (for example, around 70 ° C.) immediately before the deformation or welding of Sb (see FIG. 7) starts.
Is heated by the preheating temperature Tf while being pressurized.
At this time, the temperature of the laminated base material M gradually rises through the upper and lower clamping surfaces 11p and 13p. Note that the holding surface portions 11p and 13p
The thermal expansion and plastic deformation of are absorbed by the absorbing surfaces 11a and 13a.

When the set time has elapsed, the movable press platen 6m is lowered, the drive shaft 16 is further lowered, and the drive shaft 16 is rotated by 90 ° (steps S8 and S9). Thereby, the laminated base material holding portion 2d
Is sent to the thermocompression pressing section 7. The set time can be set to the processing time of the thermocompression bonding process in the next step where the processing time is the most important. In this case, the laminated base material M is sandwiched between the upper sandwiching portion 3 and the lower sandwiching portion 4d on both sides, and is accommodated in the sealed laminated base material sandwiching portion 2d. Is degassed by the degassing unit 5, so that even if the laminated base material M moves from the preheating press unit 6 to the thermocompression pressing unit 7, continuity of the heating state and the pressurized state is ensured, that is, Heat retention and pressure retention for the laminated base material M are ensured.

Next, the drive shaft 16 is raised, and the movable press platen 7m is further raised (step S1).
0). At the same time, the other movable press boards 6m and 8m are also raised. As a result, the laminated base material holding portion 2d is sandwiched between the fixed press plate 7c and the movable press plate 7m to perform thermocompression bonding (step S11). That is, the fixed press plate 7c and the movable press plate 7m are heated to the regular heating temperature Ts (for example, around 120 ° C.) by the heaters 20 and 22, respectively, and the laminated base material M is thermocompressed by pressing and heating. I'm sullen. At this time, the thermal expansion and plastic deformation of the sandwiching surface portions 11p and 13p are absorbed by the absorbing surface portions 11a and 13a as in the pre-heat treatment.

Then, the set time (for example, about 20 seconds)
Has elapsed, the movable press platen 7m is lowered, and the drive shaft 16 is further lowered.
Is rotated by 90 ° (steps S12, S13). As a result, the laminated base material holding section 2d is sent to the cooling press section 8. Also in this case, the laminated base material M is sandwiched between the upper and lower clamping parts 3 and 4d on both sides, and is accommodated in the sealed laminated base material clamping part 2d. Since the inside of 2d is degassed by the degassing unit 5, the laminated base material M is moved from the thermocompression pressing unit 7 to the cooling pressing unit 8
, The heat retention and pressure retention for the laminated base material M are ensured.

Next, the drive shaft 16 is raised, and the movable press platen 8m is further raised (step S1).
4). At the same time, the other movable press plates 6m and 7m are also raised. As a result, the laminated base material holding portion 2d is sandwiched between the fixed press plate 8c and the movable press plate 8m to perform a cooling process (step S15). That is, the fixed press board 7
c and the movable press board 7m are cooled by cooling water flowing through the water jackets 23 and 25, respectively, and the laminated base material M is cooled while being pressed. At this time, the shrinkage and plastic deformation of the sandwiching surfaces 11p and 13p are absorbed by the absorbing surfaces 11a and 13a as in the thermocompression bonding process.

When the set time has elapsed, the movable press platen 8m is lowered, the drive shaft 16 is further lowered, and the drive shaft 16 is rotated by 90 ° (steps S16 and S17). Thereby, the laminated base material holding portion 2
d is sent to the carry-in / out position Xio. Note that the set time can be set to the processing time of the thermocompression bonding process in the preceding step where the processing time is the most important.

Next, the drive shaft 16 is raised. After that, in each of the press sections 6, 7, and 8, the movable press plate sections 6m, 7m, and 8m are lifted, and pre-heat treatment, thermocompression treatment, and cooling treatment are performed, respectively. Using the processing time on the side, the laminated substrate M
Is carried out. In this case, first, the switching valve (not shown) is controlled to switch the deaeration section 5 to the air supply function, thereby supplying air to the inside of the laminated base material holding section 2d. Thereby, the deaerated state of the laminated base material holding portion 2d is released, and the laminated base material M is separated from the laminated base material holding portion 2d. On the other hand, the chuck mechanism 63 is lowered by the lifting cylinder 62 of the upper holding part lifting mechanism 26. Then, the upper holding portion 3 at the carry-in / out position Xio is gripped, and the upper holding portion 3 is raised (Step S18). The groove 12s of the frame 12 can be used for gripping the upper holding portion 3.

Next, the transport section 73 is connected to the rail sections 71a, 71a.
b, and the suction pads 74 on the front side
When it reaches the position above d (adsorption and unloading position), it is stopped, and the laminated substrate M after production is adsorbed. Also, go further,
After moving to the suction release carrying-in position (the solid line position in FIG. 4), as described above, the suction by the rear suction plates 75 is released, and the production is carried out on the holding surface portion 13p of the empty lower holding portion 4d. The previous laminated base material M is placed. Thereafter, the transport section 73 is moved backward along the rail sections 71a and 71b, and
.. Reach a position above the stocker section 79 (the suction release carrying-out position), the operation is stopped, and the suction by the suction disks 74 is released. As a result, the laminated base material M after production is stored in the stocker section 79.
To be housed. The transport unit 73 further includes a rail unit 71.
The robot is retracted along the positions a and 71b, and stands by at the suction and carry-in position (the virtual line position in FIG. 4). More than,
This is a production cycle until the production of one laminated base material M is completed, and the same is repeated hereinafter.

The embodiment has been described in detail above.
The present invention is not limited to such an embodiment,
The configuration, shape, quantity, material, numerical value, and the like of the details can be arbitrarily changed, added, or deleted without departing from the gist of the present invention.

For example, the configuration and the material of the laminated base material M (IC card) are not limited to the examples, and can be applied to any type. Further, the frame portions 12 and 14 of the upper holding portions 3 and the lower holding portions 4a may be formed integrally with the plate portions 11 and 13, respectively. Further, the lower holding portion 4a provided in the drive shaft portion 16
.. Show the case where they are integrally fixed, but the lower holding portions 4a are provided so as to be vertically displaceable at a constant height with respect to the drive shaft portion 16, and the respective pressing portions 6, 7, 8 are provided. When the movable press plates 6m, 7m, 8m are individually lowered in the above, the respective movable press plates 6m, 7m, 8m are separated from the respective laminated substrate sandwiching portions 2a,. May be separated from the fixed press plates 6c, 7c, 8c by their own weight or by a spring or the like, so that the processing time in each press 6, 7, 8 can be set independently.

[0044]

As described above, the IC card manufacturing apparatus according to the present invention comprises a laminated base sandwiching portion comprising an upper sandwiching portion and a lower sandwiching portion for sandwiching and sealing the laminated base from both sides, and A degassing section for degassing the inside of the holding section, a preheating press section for raising the temperature of the laminated base material holding section degassed by sandwiching the laminated base material at a preheating temperature lower than the normal heating temperature, and a preheating press section Since a thermocompression press unit for thermocompression bonding the laminated base material holding part sent from a regular heating temperature, and a cooling press unit for cooling the laminated base material holding part sent from the thermocompression pressing part, It has the following remarkable effects.

Since the heating control and the pressurization control for the laminated base material are performed independently and accurately by different preheating press sections, thermocompression press sections, and cooling press sections, productivity is reduced by shortening the manufacturing cycle time. In addition, improvement in mass productivity, and further, energy saving and economic efficiency can be dramatically improved.

At the same time, the laminated base material is accommodated inside the sealed and deaerated laminated base material holding portion,
Since the continuity of the heated state and the pressurized state is ensured, that is, the heat retaining property and the pressure retaining property with respect to the laminated base material are secured, the commercial quality can be remarkably improved by improving the quality and homogeneity.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a laminated base material holding portion in an IC card manufacturing apparatus according to a preferred embodiment of the present invention;

FIG. 2 is a plan view of a laminated base material holding section in the IC card manufacturing apparatus;

FIG. 3 is a partially broken plan view of the IC card manufacturing apparatus;

FIG. 4 is a partial cross-sectional side view of the IC card manufacturing apparatus;

FIG. 5 is a rear view of the IC card manufacturing apparatus;

FIG. 6 is a flowchart for explaining the operation of the IC card manufacturing apparatus in order.

FIG. 7 is an exploded view showing a state in which a laminated base material used for manufacturing an IC card by the IC card manufacturing apparatus is cut by one IC card.

FIG. 8 is a longitudinal sectional view of an IC card manufacturing apparatus according to a conventional technique;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC card manufacturing apparatus 2a ... Laminated | substrate holding part 3 ... Upper holding part 4a ... Lower holding part 5 Deaeration part 6 Preheating press part 6c Fixed press board part 6m Movable press board part 7 Thermocompression press part 7c Fixed press board part 7m movable press panel 8 cooling press 8c fixed press panel 8m movable press panel 10 ... positioning section 11 upper plate section 11p clamping surface section 11a absorption surface section 11v outer rim section 12 upper frame section 13 lower plate section 13p clamping surface section 13a absorption surface section 13v Outer edge part 14 Lower frame part 15 Drive part 16 Drive shaft part 17 Preheating heater 18 Elevating part 19 Preheating heater 20 Heating heater 21 Elevating part 22 Heating heater 23 Water cooling water jacket 24 Elevating part 25 Water cooling water jacket 26 Upper holding part elevating mechanism 27 Loading / unloading mechanism P Electronic component Pi IC chip P Sa Sheet material Sb Sheet material M Laminated substrate Xio Loading / unloading position

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MA14 MA19 NA08 NA09 RA04 RA08 RA18 5B035 AA04 AA05 BA05 BB09 CA01 5F061 AA01 BA07 CA22 DA14 DA16

Claims (12)

[Claims] 1. An IC card manufacturing apparatus for manufacturing an IC card by thermocompression bonding a laminated base material constituted by sandwiching electronic components such as an IC chip between sheet materials, and sealing the laminated base material from both sides. A laminated substrate sandwiching portion comprising an upper sandwiching portion and a lower sandwiching portion, a degassing portion for deaeration of the inside of the laminated substrate sandwiching portion, and the laminated substrate clamping portion degassed by sandwiching the laminated substrate. A preheating press section for raising the temperature by a preheating temperature lower than the normal heating temperature, a thermocompression pressing section for thermocompression bonding the laminated base material holding section sent from the preheating press section at a normal heating temperature, An IC card manufacturing apparatus comprising: a cooling press section for cooling the laminated base material holding section sent from a press bonding section. 2. The IC according to claim 1, wherein said upper holding portion and said lower holding portion have positioning portions for positioning when said upper holding portion is overlapped with said lower holding portion.
Card manufacturing equipment. 3. The upper holding portion includes a holding surface portion that is larger than the upper surface and overlaps an upper surface of the laminated base material, and has a groove-shaped absorbing surface portion bulging upward along an outer edge of the holding surface portion. 2. The IC card manufacturing apparatus according to claim 1, further comprising a plate portion and an upper frame portion provided integrally with an outer edge portion of the upper plate portion so as to be in close contact with the lower holding portion. 4. The lower holding portion has a holding surface portion that is larger than the lower surface overlapping the lower surface of the laminated base material and a groove-shaped absorbing surface portion bulging downward along an outer edge of the holding surface portion. 2. The IC card manufacturing apparatus according to claim 1, further comprising: a plate portion; and a lower frame portion which is provided integrally with an outer edge portion of the lower plate portion to closely contact the upper holding portion. 5. A drive shaft, which is rotatable and vertically movable by a drive unit, protrudes radially from the drive shaft, and is disposed at 90 ° intervals around the drive shaft in the circumferential direction. The IC card manufacturing apparatus according to claim 1, further comprising: four lower holding portions; and four upper holding portions corresponding to the lower holding portions. 6. The apparatus according to claim 1, wherein the preheating press section, the thermocompression pressing section and the cooling press section are arranged at 90 ° intervals in a circumferential direction about the drive shaft section. 2. The IC card manufacturing apparatus according to claim 1. 7. The preheating press section includes a fixed press platen section having a built-in preheating heater disposed above the lower holding section, and a preheating section disposed below the lower holding section and raised and lowered by an elevating section. The IC card manufacturing apparatus according to claim 1, further comprising a movable press plate section having a built-in heater. 8. The thermocompression press section is provided with a fixed press platen having a built-in heater for heating disposed above the lower holding section, and disposed below the lower holding section, and is moved up and down by an elevating section. 7. The IC card manufacturing apparatus according to claim 1, further comprising a movable press platen having a built-in heater. 9. The cooling press section includes a fixed press platen section having a water cooling water jacket disposed above the lower holding section, and a water cooling section disposed below the lower holding section and moving up and down by an elevating section. 7. The IC card manufacturing apparatus according to claim 1, further comprising a movable press plate having a water jacket for use. 10. A position at which the thermocompression pressing portion is 180 ° opposed to the drive shaft portion as a center is a carry-in / out position, and the carry-in / out position holds or releases the upper holding portion, and 2. The IC according to claim 1, further comprising an upper holding portion elevating mechanism for raising and lowering the held upper holding portion.
Card manufacturing equipment. 11. When the upper holding section is raised by the upper holding section elevating mechanism, the manufactured laminated base material sent from the cooling press section to the carry-in / out position is carried out, and the carry-in / out position is provided. 11. The IC card manufacturing apparatus according to claim 1, further comprising a carry-in / out mechanism for carrying the laminated base material before manufacturing. 12. The air supply unit according to claim 1, wherein the deaeration unit has an air supply function for supplying air to the inside of the laminated base material holding unit sent from the cooling press unit to the carry-in / out position.
2. The IC card manufacturing apparatus according to claim 1.